Texas Instruments | DS90UR916Q 5 - 65 MHz 24-bit Color FPD-Link II Deserializer with Image Enhanceme (Rev. E) | Datasheet | Texas Instruments DS90UR916Q 5 - 65 MHz 24-bit Color FPD-Link II Deserializer with Image Enhanceme (Rev. E) Datasheet

Texas Instruments DS90UR916Q 5 - 65 MHz 24-bit Color FPD-Link II Deserializer with Image Enhanceme (Rev. E) Datasheet
DS90UR916Q
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SNOSB46E – MARCH 2011 – REVISED APRIL 2013
DS90UR916Q 5 - 65 MHz 24-bit Color FPD-Link II Deserializer with Image Enhancement
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FEATURES
DESCRIPTION
•
The DS90UR916Q FPD-Link II deserializer operates
with the DS90UR905Q FPD-Link II serializer to
deliver 24-bit digital video data over a single
differential pair. The DS90UR916Q provides features
designed to enhance image quality at the display.
The high speed serial bus scheme of FPD-Link II
greatly eases system design by eliminating skew
problems between clock and data, reduces the
number of connector pins, reduces the interconnect
size, weight, and cost, and overall eases PCB layout.
In addition, internal DC balanced decoding is used to
support AC-coupled interconnects.
1
2
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
5 – 65 MHz PCLK support (140 Mbps – 1.82
Gbps)
RGB888 + VS, HS, DE Support
Image Enhancement - White Balance LUTs and
Adaptive Hi-FRC Dithering
AC Coupled STP Interconnect Cable up to 10
Meters
@ Speed Link BIST Mode and Reporting Pin
I2C Compatible Serial Control Bus
Power Down Mode Minimizes Power
Dissipation
1.8V or 3.3V Compatible LVCMOS I/O Interface
Automotive Grade Product: AEC-Q100 Grade 2
Qualified
>8 kV HBM and ISO 10605 ESD Rating
FAST Random Ddata Lock; No Reference
Clock Required
Adjustable Input Receiver Equalization
LOCK (Real Time Link Status) Reporting Pin
EMI Minimization on Output Parallel Bus
(SSCG)
Output Slew Control (OS)
Backward Compatible Mode for Operation with
Older Generation Devices
APPLICATIONS
•
•
Automotive Display for Navigation
Automotive Display for Entertainment
The DS90UR916Q Des (deserializer) recovers the
data (RGB) and control signals and extracts the clock
from the serial stream. The Des locks to the incoming
serial data stream without the use of a training
sequence or special SYNC patterns, and does not
require a reference clock. A link status (LOCK) output
signal is provided. The DS90UR916Q is ideally suited
for 24-bit color applications. White balance lookup
tables and adaptive Hi-FRC dithering provide the user
a cost-effective means to enhance display image
quality.
Serial transmission is optimized with user selectable
receiver equalization. EMI is minimized by the use of
low voltage differential signaling, output slew control,
and the Des may be configured to generate Spread
Spectrum Clock and Data on its parallel outputs.
The DS90UR916Qis offered in a 60-pin WQFN
package. It is specified over the automotive AECQ100 grade 2 temperature range of -40°C to +105°C.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2013, Texas Instruments Incorporated
DS90UR916Q
SNOSB46E – MARCH 2011 – REVISED APRIL 2013
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Applications Diagram
VDDn
HOST
Graphics
Processor
RGB Digital Display Interface
VDDn
VDDIO
(1.8V or 3.3V) 1.8V
FPD-Link II
1 Pair / AC Coupled
R[7:0]
G[7:0]
B[7:0]
HS
VS
DE
PCLK
PDB
100 nF
100 nF
DOUT+
RIN+
DOUT-
RIN100 ohm STP Cable
DS90UR905Q
Serializer
DS90UR916Q
Deserializer
CMF
PDB
CONFIG [1:0]
BISTEN
RFB
VODSEL
SCL
DeEmph
SDA
Optional
ID[x]
BISTEN
Optional
VDDIO
1.8V (1.8V or 3.3V)
SCL
SDA
ID[x]
R[7:0]
G[7:0]
B[7:0]
HS
VS
DE
PCLK
RGB Display
QVGA to XGA
24-bit or
18-bit dithered
color depth
LOCK
PASS
STRAP pins
not shown
DAP
DAP
Figure 1.
Block Diagrams
BISTEN
PDB
SCL
SCA
ID[x]
Timing and
Control
24
Output Latch
FRC Dithering 2
RIN-
White Balance LUT
RIN+
FRC Dithering 1
Serial to Parallel
CMF
DC Balance Decoder
SSCG
RGB [7:0]
HS
VS
DE
Error
Detector
PASS
Clock and
Data
Recovery
PCLK
LOCK
STRAP INPUT
CONFIG [1:0]
LF_MODE
OS_PCLK/DATA
OSS_SEL
RFB
EQ [3:0]
OSC_SEL [2:0]
SSC [3:0]
MAPSEL [1:0]
STRAP INPUT
OP_LOW
DS90UR916Q ± DESERIALIZER
Figure 2.
2
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NC
BISTEN
VDDR
PASS/OP_LOW
R[0]/MAP_SEL[0]
R[1]/MAP_SEL[1]
R[2]
VDDIO
R[3]/SSC[0]
R[4]/SSC[1]
R[5]/SSC[2]
R[6]/SSC[3]
R[7]
LOCK
NC
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
DS90UR916Q Pin Diagram
NC
46
30
NC
RES
47
29
VDDL
VDDIR
48
28
G[0]/OSC_SEL[0]
RIN+
49
27
G[1]/OSC_SEL[1]
RIN-
50
26
G[2]/OSC_SEL[2]
CMF
51
25
G[3]
CMLOUTP
52
24
VDDIO
CMLOUTN
53
TOP VIEW
23
G[4]/EQ[0]
VDDCMLO
54
DAP = GND
22
G[5]/EQ[1]
VDDR
55
21
G[6]/EQ[2]
ID[x]
56
20
G[7]/EQ[3]
VDDPR
57
19
B[0]
VDDSC
58
18
B[1]/RFB
PDB
59
17
B[2]/OSS_SEL
NC
60
16
NC
DS90UR916Q
4
5
6
7
8
9
10
11
12
13
14
VDDSC
PCLK
DE
VS
HS
B[7]/CONFIG[0]
B[6]/CONFIG[1]
B[5]/OS_PCLK
B[4]/LF_MODE
VDDIO
B[3]/OS_DATA
NC
15
3
2
SDA
SCL
1
NC
BOLD PIN NAME ± indicates I/O strap
pin associated with output pin
Figure 3. Deserializer - DS90UR916Q — Top View
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DS90UR916Q Deserializer Pin Descriptions (1)
Pin Name
Pin #
I/O, Type
Description
LVCMOS Parallel Interface
R[7:0]
33, 34, 35,
36, 37, 39,
40, 41
I, STRAP,
O, LVCMOS
RED Parallel Interface Data Output Pins (MSB = 7, LSB = 0)
In power-down (PDB = 0), outputs are controlled by the OSS_SEL (See Table 5). These pins
are inputs during power-up (See STRAP Inputs).
G[7:0]
20, 21, 22,
23, 25, 26,
27, 28
I, STRAP,
O, LVCMOS
GREEN Parallel Interface Data Output Pins (MSB = 7, LSB = 0)
In power-down (PDB = 0), outputs are controlled by the OSS_SEL (See Table 5). These pins
are inputs during power-up (See STRAP Inputs).
B[7:0]
9, 10, 11,
12, 14, 17,
18, 19
I, STRAP,
O, LVCMOS
BLUE Parallel Interface Data Output Pins (MSB = 7, LSB = 0)
In power-down (PDB = 0), outputs are controlled by the OSS_SEL (See Table 5). These pins
are inputs during power-up (See STRAP Inputs).
HS
8
O, LVCMOS
Horizontal Sync Output
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 5). Video
control signal pulse width must be 3 PCLKs or longer to be transmitted when the Control
Signal Filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition
pulse when the Control Signal Filter is disabled (CONFIG[1:0] = 00). The signal is limited to 2
transitions per 130 PCLKs.
VS
7
O, LVCMOS
Vertical Sync Output
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 5). Video
control signal is limited to 1 transition per 130 PCLKs. Thus, the minimum pulse width is 130
PCLKs.
DE
6
O, LVCMOS
Data Enable Output
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 5). Video
control signal pulse width must be 3 PCLKs or longer to be transmitted when the Control
Signal Filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition
pulse when the Control Signal Filter is disabled (CONFIG[1:0] = 00). The signal is limited to 2
transitions per 130 PCLKs.
PCLK
5
O, LVCMOS
Pixel Clock Output
In power-down (PDB = 0), output is controlled by the OSS_SEL pin (See Table 5). Strobe
edge set by RFB function.
LOCK
32
O, LVCMOS
LOCK Status Output
LOCK = 1, PLL is Locked, outputs are active LOCK = 0, PLL is unlocked, RGB[7:0], HS, VS,
DE and PCLK output states are controlled by OSS_SEL (See Table 5). May be used as Link
Status or to flag when Video Data is active (ON/OFF).
PASS
42
O, LVCMOS
PASS Output (BIST Mode)
PASS = 1, error free transmission
PASS = 0, one or more errors were detected in the received payload
Route to test point for monitoring, or leave open if unused.
Control and Configuration — STRAP PINS
For a High State, use a 10 kΩ pull up to VDDIO; for a Low State, the IO includes an internal pull down. The STRAP pins are read upon
power-up and set device configuration. Pin Number listed along with shared RGB Output name in square brackets.
CONFIG[1:0]
10 [B6],
9 [B7]
STRAP
I, LVCMOS
w/ pull-down
Operating Modes — Pin or Register Control
These pins determine the DS90UR916’s operating mode and interfacing device.
CONFIG[1:0] = 00: Interfacing to DS90UR905, Control Signal Filter DISABLED
CONFIG[1:0] = 01: Interfacing to DS90UR905, Control Signal Filter ENABLED
CONFIG[1:0] = 10: Interfacing to DS90UR241
CONFIG[1:0] = 11: Interfacing to DS90C241
LF_MODE
12 [B4]
STRAP
I, LVCMOS
w/ pull-down
SSCG Low Frequency Mode — Pin or Register Control
Only required when SSCG is enabled, otherwise LF_MODE condition is a DON’T CARE (X).
LF_MODE = 1, SSCG in low frequency mode (PCLK = 5-20 MHz)
LF_MODE = 0, SSCG in high frequency mode (PCLK = 20-65 MHz)
OS_PCLK
11 [B5]
STRAP
I, LVCMOS
w/ pull-down
PCLK Output Slew Select — Pin or Register Control
OS_PCLK = 1, increased PCLK slew
OS_PCLK = 0, normal (default)
OS_DATA
14 [B3]
STRAP
I, LVCMOS
w/ pull-down
Data Output Slew Select — Pin or Register Control
OS_DATA = 1, increased DATA slew
OS_DATA = 0, normal (default)
(1)
4
1 = HIGH, 0 = LOW.
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DS90UR916Q Deserializer Pin Descriptions(1) (continued)
Pin Name
Pin #
I/O, Type
OP_LOW
42 PASS
STRAP
I, LVCMOS
w/ pull-down
Description
Outputs held Low when LOCK = 1 — Pin or Register Control
NOTE: IT IS NOT RECOMMENDED TO USE ANY OTHER STRAP OPTIONS WITH THIS
STRAP FUNCTION
OP_LOW = 1: all outputs are held LOW during power up until released by programming
OP_LOW release/set register HIGH
NOTE: Before the device is powered up, the outputs are in tri-state.
See Figure 23 and Figure 24.
OP_LOW = 0: all outputs toggle normally as soon as LOCK goes HIGH (default).
OSS_SEL
17 [B2]
STRAP
I, LVCMOS
w/ pull-down
Output Sleep State Select — Pin or Register Control
NOTE: OSS_SEL STRAP CANNOT BE USED IF OP_LOW =1
OSS_SEL is used in conjunction with PDB to determine the state of the outputs when
inactive. (See Table 5).
RFB
18 [B1]
STRAP
I, LVCMOS
w/ pull-down
Pixel Clock Output Strobe Edge Select — Pin or Register Control
RFB = 1, parallel interface data and control signals are strobed on the rising clock edge.
RFB = 0, parallel interface data and control signals are strobed on the falling clock edge.
EQ[3:0]
20 [G7],
21 [G6],
22 [G5],
23 [G4]
STRAP
I, LVCMOS
w/ pull-down
Receiver Input Equalization — Pin or Register Control
(See Table 2).
OSC_SEL[2:0]
26 [G2],
27 [G1],
28 [G0]
STRAP
I, LVCMOS
w/ pull-down
Oscillator Select — Pin or Register Control
(See Table 6 and Table 7).
SSC[3:0]
34 [R6],
35 [R5],
36 [R4],
37 R[3]
STRAP
I, LVCMOS
w/ pull-down
Spread Spectrum Clock Generation (SSCG) Range Select — Pin or Register Control
(See Table 3 and Table 4).
MAP_SEL[1:0]
40 [R1],
41 [R0]
STRAP
I, LVCMOS
w/ pull-down
Bit Mapping Backward Compatibility / DS90UR241 Options — Pin or Register Control
Normal setting to b'00. See (Table 8).
Power Down Mode Input
PDB = 1, Des is enabled (normal operation).
Refer to POWER UP REQUIREMENTS AND PDB PIN in the Applications Information
Section.
PDB = 0, Des is in power-down.
When the Des is in the power-down state, the LVCMOS output state is determined by
Table 5. Control Registers are RESET.
Control and Configuration
PDB
59
I, LVCMOS
w/ pull-down
ID[x]
56
I, Analog
SCL
3
I, LVCMOS
SDA
2
I/O, LVCMOS Serial Control Bus Data Input / Output - Optional
Open Drain SDA requires an external pull-up resistor to VDDIO.
BISTEN
44
I, LVCMOS
w/ pull-down
BIST Enable Input — Optional
BISTEN = 1, BIST is enabled
BISTEN = 0, BIST is disabled
RES
47
I, LVCMOS
w/ pull-down
Reserved - tie LOW
NC
1, 15, 16,
30, 31, 45,
46, 60
Serial Control Bus Device ID Address Select — Optional
Resistor to Ground and 10 kΩ pull-up to 1.8V rail. (See Table 9).
Serial Control Bus Clock Input - Optional
SCL requires an external pull-up resistor to VDDIO.
Not Connected
Leave pin open (float)
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DS90UR916Q Deserializer Pin Descriptions(1) (continued)
Pin Name
Pin #
I/O, Type
Description
FPD-Link II Serial Interface
RIN+
49
I, LVDS
True Input. The input must be AC Coupled with a 100 nF capacitor.
RIN-
50
I, LVDS
Inverting Input. The input must be AC Coupled with a 100 nF capacitor.
CMF
51
I, Analog
Common-Mode Filter
VCM center-tap is a virtual ground which may be ac-coupled to ground to increase receiver
common mode noise immunity. Recommended value is 4.7 μF or higher.
CMLOUTP
52
O, LVDS
Test Monitor Pin — EQ Waveform
NC or connect to test point. Requires Serial Bus Control to enable.
CMLOUTN
53
O, LVDS
Test Monitor Pin — EQ Waveform
NC or connect to test point. Requires Serial Bus Control to enable.
Power and Ground (2)
VDDL
29
Power
Logic Power, 1.8 V ±5%
VDDIR
48
Power
Input Power, 1.8 V ±5%
VDDR
43, 55
Power
RX High Speed Logic Power, 1.8 V ±5%
VDDSC
4, 58
Power
SSCG Power, 1.8 V ±5%
VDDPR
57
Power
PLL Power, 1.8 V ±5%
VDDCMLO
54
Power
RX High Speed Logic Power, 1.8 V ±5%
13, 24, 38
Power
LVCMOS I/O Power, 1.8 V ±5% OR 3.3 V ±10% (VDDIO)
DAP
Ground
DAP is the large metal contact at the bottom side, located at the center of the WQFN
package. Connected to the ground plane (GND) with at least 9 vias.
VDDIO
GND
(2)
6
The VDD (VDDn and VDDIO) supply ramp should be faster than 1.5 ms with a monotonic rise. If slower then 1.5 ms then a capacitor on
the PDB pin is needed to ensure PDB arrives after all the VDD have settled to the recommended operating voltage.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
−0.3V to +2.5V
Supply Voltage – VDDn (1.8V)
−0.3V to +4.0V
Supply Voltage – VDDIO
−0.3V to +(VDDIO + 0.3V)
LVCMOS I/O Voltage
−0.3V to (VDD + 0.3V)
Receiver Input Voltage
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
60L WQFN Package
Maximum Power Dissipation Capacity at
25°C 470mW
470mW
Derate above 25C
1/θJA mW / °C
θJA(based on 9 thermal vias)
24.6 °C/W
θJC(based on 9 thermal vias)
2.8 °C/W
ESD Rating (HBM)
≥±8 kV
ESD Rating (CDM)
≥±1 kV
≥±250 V
ESD Rating (MM)
ESD Rating (ISO10605), RD = 2kΩ, CS = 150pF or RD = 2kΩ, CS = 330pF or RD = 330Ω, CS = 150pF
Air Discharge (RIN+, RIN−)
≥±30 kV
Contact Discharge (RIN+, RIN−)
≥±10 kV
ESD Rating (ISO10605), RD = 330Ω, CS = 330pF
Air Discharge (RIN+, RIN−)
≥±15 kV
Contact Discharge (RIN+, RIN−)
≥±10 kV
ESD Rating (IEC 61000–4–2), RD = 330Ω, CS = 150pF
Air Discharge (RIN+, RIN−)
≥±25 kV
Contact Discharge (RIN+, RIN−)
≥±10 kV
For soldering specifications see product folder at www.ti.com and SNOA549
(1)
(2)
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions
Min
Nom
Max
Units
Supply Voltage (VDDn)
1.71
1.8
1.89
V
LVCMOS Supply Voltage (VDDIO)
1.71
1.8
1.89
V
LVCMOS Supply Voltage (VDDIO)
3.0
3.3
3.6
V
Operating Free Air Temperature (TA)
−40
+25
+105
°C
65
MHz
50
mVP-P
OR
PCLK Clock Frequency
5
Supply Noise (1)
(1)
Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the VDDn (1.8V) supply with
amplitude = 100 mVp-p measured at the device VDDn pins. Bit error rate testing of input to the Ser and output of the Des with 10 meter
cable shows no error when the noise frequency on the Ser is less than 750 kHz. The Des on the other hand shows no error when the
noise frequency is less than 400 kHz.
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Deserializer DC Electrical Characteristics (1) (2) (3)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symb
ol
Parameter
Conditions
Pin/Freq.
Min
Typ
Max
Units
3.3 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 3.0 to 3.6V
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
IIN
Input Current
PDB, BISTEN
VIN = 0V or VDDIO
2.2
VDDIO
V
GND
0.8
V
+15
μA
−15
±1
2.4
VDDIO
GND
VOH
High Level Output
Voltage
IOH = −2 mA, OS_PCLK/DATA = L
R[7:0], G[7:0],
B[7:0], HS, VS,
DE, PCLK, LOCK,
PASS
VOL
Low Level Output
Voltage
IOL = +2 mA, OS_PCLK/DATA = L
R[7:0], G[7:0],
B[7:0], HS, VS,
DE, PCLK, LOCK,
PASS
Output Short Circuit
Current
VDDIO = 3.3V
VOUT = 0V, OS_PCLK/DATA = L/H
PCLK
36
mA
Output Short Circuit
Current
VDDIO = 3.3V
VOUT = 0V
OS_PCLK/DATA = L/H
Des Outputs
37
mA
TRI-STATE® Output
Current
PDB = 0V, OSS_SEL = 0V,
VOUT = 0V or VDDIO
Outputs
IOS
IOZ
V
0.4
V
−15
+15
µA
1.235
VDDIO
V
1.8 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 1.71 to 1.89V
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
IIN
Input Current
VIN = 0V or VDDIO
VOH
High Level Output
Voltage
IOH = −2 mA, OS_PCLK/DATA = L
VOL
Low Level Output
Voltage
IOL = +2 mA, OS_PCLK/DATA = L
Output Short Circuit
Current
VDDIO = 1.8V
VOUT = 0V
OS_PCLK/DATA = L/H
PCLK
18
mA
Output Short Circuit
Current
VDDIO = 1.8V
VOUT = 0V
OS_PCLK/DATA = L/H
Des Outputs
18
mA
IOZ
TRI-STATE® Output
Current
PDB = 0V, OSS_SEL = 0V,
VOUT = 0V or VDDIO
Outputs
VTH
Differential Input
Threshold High Voltage
IOS
VTL
Differential Input
Threshold Low Voltage
VCM
Common Mode Voltage,
Internal VBIAS
IIN
Input Current
RT
Internal Termination
Resistor
(1)
(2)
(3)
8
PDB, BISTEN
GND
−15
VDDIO
R[7:0], G[7:0],
− 0.45
B[7:0], HS, VS,
DE, PCLK, LOCK,
GND
PASS
±1
0.595
V
+15
μA
VDDIO
V
0.45
-15
+15
V
µA
+50
mV
−50
mV
VCM = +1.2V (Internal VBIAS)
RIN+, RINVIN = 0V or VDDIO
1.2
-15
80
100
V
+15
µA
120
Ω
Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground
except VOD, ΔVOD, VTH and VTL which are differential voltages.
Typical values represent most likely parametric norms at VDD = 3.3V, Ta = +25 degC, and at the Recommended Operation Conditions at
the time of product characterization and are not ensured.
The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
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Deserializer DC Electrical Characteristics(1)(2)(3) (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symb
ol
Parameter
Conditions
Pin/Freq.
Min
Typ
Max
Units
CML DRIVER OUTPUT DC SPECIFICATIONS – EQ TEST PORT
VOD
Differential Output
Voltage
RL = 100Ω
VOS
Offset Voltage
Single-ended
RL = 100Ω
RT
Internal Termination
Resistor
CMLOUTP,
CMLOUTN
80
542
mV
1.4
V
100
120
Ω
93
110
mA
33
45
mA
62
75
mA
40
3000
µA
5
50
µA
10
100
µA
SUPPLY CURRENT
IDD1
IDDIO1
Deserializer
Supply Current
(includes load current)
Checker Board Pattern,
OS_PCLK/DATA = H,
EQ = 001,
SSCG=ON,CMLOUTP/N
enabled
CL = 4pF, Figure 4
Deserializer Supply
Current Power Down
PDB = 0V, All other
LVCMOS Inputs = 0V
VDD= 1.89V
VDDIO = 3.6V
VDD= 1.89V
IDDZ
IDDIOZ
All VDD pins
VDDIO=1.89V
VDDIO=1.89V
VDDIO = 3.6V
VDDIO
All VDD pins
VDDIO
Deserializer Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
tRCP
PCLK Output Period
tRDC
PCLK Output Duty Cycle
tCLH
LVCMOS
Low-to-High
Transition Time, Figure 5
tCHL
LVCMOS
High-to-Low
Transition Time, Figure 5
tROS
tROH
Min
Typ
Max
Units
PCLK
Pin/Freq.
15.38
T
200
ns
PCLK
43
50
57
%
SSCG=ON, 5–20MHz
35
59
65
%
SSCG=ON, 20–65MHz
40
53
60
%
SSCG=OFF, 5–65MHz
VDDIO = 1.8V
CL = 4 pF (lumped load)
PCLK/RGB[7:0], HS, VS,
DE
VDDIO = 1.8V
CL = 4 pF (lumped load)
Data Valid after PCLK – Hold
Time, Figure 9
VDDIO = 1.71 to 1.89V or
3.0 to 3.6V
CL = 4 pF (lumped load)
RGB[7:0], HS, VS, DE
Deserializer Lock Time,
Figure 8
tDD
Des Delay - Latency, Figure 6
tDPJ (2)
Des Period Jitter
2.0
ns
1.6
ns
1.5
ns
0.27
0.45
T
0.4
0.55
T
VDDIO = 3.3V
CL = 4 pF (lumped load)
RGB[7:0], HS, VS, DE
Horizontal Blanking Time
ns
PCLK/RGB[7:0], HS, VS,
DE
VDDIO = 1.71 to 1.89V or
3.0 to 3.6V
CL = 4 pF (lumped load)
tDDLT
2.1
VDDIO = 3.3V
CL = 4 pF (lumped load)
Data Valid before PCLK – Set
Up Time, Figure 9
tHBLANK
(1)
(2)
(3)
(4)
Conditions
HS
SSC[3:0] = 0000 (OFF) (1)
SSC[3:0] = 0000 (OFF)
(1)
PCLK = 5 MHz
6
tRCP
3
ms
PCLK = 65MHz
4
ms
SSC[3:0] = ON (1)
PCLK = 5MHz
30
ms
SSC[3:0] = ON (1)
PCLK = 65MHz
6
ms
139*T
140*T
ns
SSC[3:0] = OFF (3) (4)
PCLK = 5 MHz
975
1700
ps
PCLK = 10 MHz
500
1000
ps
PCLK = 65 MHz
550
1250
ps
tPLD and tDDLT is the time required by the serializer and deserializer to obtain lock when exiting power-down state with an active PCLK.
Specification is ensured by design and is not tested in production.
tDPJ is the maximum amount the period is allowed to deviate over many samples.
Specification is ensured by characterization and is not tested in production.
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Deserializer Switching Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
tDCCJ
tRJIT
(2)
Parameter
Des Cycle-to-Cycle Jitter
Des Input Jitter Tolerance,
Figure 11
Conditions
SSC[3:0] = OFF
EQ = OFF,
SSCG = OFF,
PCLK = 65MHz
(4) (5)
Pin/Freq.
Min
Typ
Max
Units
PCLK = 5 MHz
675
1150
ps
PCLK = 10 MHz
375
900
ps
PCLK = 65 MHz
500
1150
for jitter freq < 2MHz
0.9
UI (6)
for jitter freq > 6MHz
0.5
UI
ps
BIST Mode
tPASS
BIST PASS Valid Time,
BISTEN = 1, Figure 12
1
10
ns
SSCG Mode
fDEV
Spread Spectrum Clocking
Deviation Frequency
PCLK = 5 to 65 MHz,
SSC[3:0] = ON
±0.5
±2
%
fMOD
Spread Spectrum Clocking
Modulation Frequency
PCLK = 5 to 65 MHz,
SSC[3:0] = ON
8
100
kHz
(5)
(6)
10
tDCCJ is the maximum amount of jitter between adjacent clock cycles.
UI – Unit Interval is equivalent to one serialized data bit width (1UI = 1 / 28*PCLK). The UI scales with PCLK frequency.
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Recommended Timing for the Serial Control Bus
Over +3.3V supply and temperature ranges unless otherwise specified.
Symbol
fSCL
tLOW
tHIGH
tHD;STA
tSU:STA
tHD;DAT
tSU;DAT
Parameter
SCL Clock Frequency
Conditions
Min
Typ
Max
Units
Standard Mode
>0
100
kHz
Fast Mode
>0
400
kHz
Standard Mode
4.7
us
Fast Mode
1.3
us
Standard Mode
4.0
us
Fast Mode
0.6
us
Hold time for a start or a
repeated start condition,
Figure 13
Standard Mode
4.0
us
Fast Mode
0.6
us
Set Up time for a start or a
repeated start condition,
Figure 13
Standard Mode
4.7
us
Fast Mode
0.6
us
Data Hold Time, Figure 13
Standard Mode
0
3.45
us
Fast Mode
0
0.9
us
SCL Low Period
SCL High Period
Standard Mode
250
ns
Fast Mode
100
ns
Set Up Time for STOP
Condition, Figure 13
Standard Mode
4.0
us
Fast Mode
0.6
us
Bus Free Time Between STOP
and START, Figure 13
Standard Mode
4.7
us
Fast Mode
1.3
tr
SCL & SDA Rise Time,
Figure 13
Standard Mode
1000
ns
Fast Mode
300
ns
tf
SCL & SDA Fall Time,
Figure 13
Standard Mode
300
ns
Fast mode
300
ns
tSU;STO
tBUF
Data Set Up Time, Figure 13
us
DC and AC Serial Control Bus Characteristics
Over 3.3V supply and temperature ranges unless otherwise specified.
Max
Units
VIH
Symbol
Input High Level
Parameter
SDA and SCL
Conditions
Min
2.2
Typ
VDDIO
V
VIL
Input Low Level Voltage
SDA and SCL
GND
0.8
V
VHY
Input Hysteresis
>50
VOL
SDA, IOL = 1.25mA
Iin
SDA or SCL, Vin = VDDIO or GND
SDA, RPU = X, Cb ≤ 400pF
mV
0
0.4
V
-15
+15
µA
tR
SDA RiseTime – READ
40
ns
tF
SDA Fall Time – READ
25
ns
tSU;DAT
Set Up Time — READ
520
ns
tHD;DAT
Hold Up Time — READ
55
ns
tSP
Input Filter
50
ns
Cin
Input Capacitance
<5
pF
SDA or SCL
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AC Timing Diagrams and Test Circuits
VDDIO
PCLK
w/ RFB = L
GND
VDDIO
RGB[n] (odd),
VS, HS
GND
VDDIO
RGB[n] (even),
DE
GND
Figure 4. Checkerboard Data Pattern
VDDIO
80%
20%
GND
tCLH
tCHL
Figure 5. Deserializer LVCMOS Transition Times
START
BIT
STOP START
BIT BIT
STOP
BIT
RIN
(Diff.)
0
1
2
23
SYMBOL N
0
1
2
23
SYMBOL N+1
tDD
PCLK
(RFB = L)
RGB[7:0],
HS, VS, DE
SYMBOL N-2
SYMBOL N-1
SYMBOL N
Figure 6. Deserializer Delay – Latency
1/2 VDDIO
PDB
RIN
(Diff.)
active
"X"
tXZR
PCLK,
RGB[7:0],
DE, HS, VS,
PASS, LOCK
active
Z (TRI-STATE)
Figure 7. Deserializer Disable Time (OSS_SEL = 0)
12
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PDB
2.0V
0.8V
RIN
(Diff.)
'RQ¶W &DUH
tDDLT
LOCK
TRI-STATE
or LOW
Z or L
tRxZ
RGB[7:0],
HS, VS, DE
TRI-STATE or LOW or Pulled Up
PCLK
(RFB = L)
Z or L or PU
TRI-STATE or LOW
OFF
IN LOCK TIME
Z or L
ACTIVE
OFF
Figure 8. Deserializer PLL Lock Times and PDB TRI-STATE Delay(1)
Note: (1) When the Serializer output is at TRI-STATE the Deserializer will lose PLL lock. Resynchronization / Relock must occur before data transfer require
tPLD
VDDIO
PCLK
w/ RFB = H
1/2 VDDIO
GND
RGB[n],
VS, HS, DE
VDDIO
1/2 VDDIO
GND
tROS
tROH
Figure 9. Deserializer Output Data Valid (Setup and Hold) Times with SSCG = Off
VDDIO
PCLK
w/ RFB = H
1/2 VDDIO
GND
RGB[n],
VS, HS, DE
1/2 VDDIO
tROS
1/2 VDDIO
tROH
VDDIO
GND
Figure 10. Deserializer Output Data Valid (Setup and Hold) Times with SSCG = On
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Ideal Data
Bit End
Sampling
Window
Ideal Data Bit
Beginning
RxIN_TOL
Left
VTH
0V
VTL
RxIN_TOL
Right
Ideal Center Position (tBIT/2)
tBIT (1 UI)
tRJIT
= RxIN_TOL (Left + Right)
- tRJIT
Sampling Window = 1 UI
Figure 11. Receiver Input Jitter Tolerance
BISTEN
1/2 VDDIO
tPASS
PASS
(w/ errors)
1/2 VDDIO
Current BIST Test - Toggle on Error
Prior BIST Result
Result Held
Figure 12. BIST PASS Waveform
SDA
tLOW
tf
tHD;STA
tr
tf
tr
tBUF
tSP
SCL
tSU;STA
tHD;STA
tHIGH
tHD;DAT
START
tSU;STO
tSU;DAT
STOP
REPEATED
START
START
Figure 13. Serial Control Bus Timing Diagram
14
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FUNCTIONAL DESCRIPTION
The DS90UR905 / DS90UR916Q chipset transmits and receives 27-bits of data (24-high speed color bits and 3
low speed video control signals) over a single serial FPD-Link II pair operating at 140Mbps to 1.82Gbps. The
serial stream also contains an embedded clock, video control signals and the DC-balance information which
enhances signal quality and supports AC coupling. The pair is intended for use with each other but is backward
compatible with previous generations of FPD-Link II as well.
The Des can attain lock to a data stream without the use of a separate reference clock source, which greatly
simplifies system complexity and overall cost. The Des also synchronizes to the Ser regardless of the data
pattern, delivering true automatic “plug and lock” performance. It can lock to the incoming serial stream without
the need of special training patterns or sync characters. The Des recovers the clock and data by extracting the
embedded clock information, validating and then deserializing the incoming data stream providing a parallel
LVCMOS video bus to the display. White balance LUTs and dithering features are provided to enable display
image enhancement.
The DS90UR905 / DS90UR916Q chipset can operate in 24-bit color depth (with VS,HS,DE encoded in the DCA
bit) or in 18-bit color depth (with VS, HS, DE encoded in DCA or mapped into the high-speed data bits). In 18–bit
color applications, the three video signals maybe sent encoded via the DCA bit (restrictions apply) or sent as
“data bits” along with three additional general purpose signals.
Data Transfer
The DS90UR905 / DS90UR916Q chipset will transmit and receive a pixel of data in the following format: C1 and
C0 represent the embedded clock in the serial stream. C1 is always HIGH and C0 is always LOW. b[23:0]
contain the scrambled RGB data. DCB is the DC-Balanced control bit. DCB is used to minimize the short and
long-term DC bias on the signal lines. This bit determines if the data is unmodified or inverted. DCA is used to
validate data integrity in the embedded data stream and can also contain encoded control (VS,HS,DE). Both
DCA and DCB coding schemes are generated by the Ser and decoded by the Des automatically. Figure 14
illustrates the serial stream per PCLK cycle.
C
1
b
0
b
1
D
C
B
b
2
b
1
2
b
3
b
1
3
b
4
b
1
4
b
5
b
1
5
b
6
b
1
6
b
7
b
1
7
b
8
b
9
b
1
8
b
1
9
b
1
0
b
2
0
b
1
1
b
2
1
D
C
A
b
2
2
b
2
3
C
0
Figure 14. FPD-Link II Serial Stream (905/916)
Des OPERATING MODES AND BACKWARD COMPATIBILITY (CONFIG[1:0])
The DS90UR916Q is also backward compatible with previous generations of FPD-Link II. Configuration modes
are provided for backwards compatibility with the DS90C124 FPD-Link II Generation 1, and also the DS90UR124
FPD-Link II Generation 2 chipset by setting the respective mode with the CONFIG[1:0] pins or control register as
shown in Table 1. The selection also determines whether the Video Control Signal filter feature is enabled or
disabled in Normal mode.
When the DS90UR916 deserializer is configured to operate in backward compatible modes the image
enhancement features (white balance and FRC dithering) are not available.
Table 1. DS90UR916Q Des Modes
CONFIG1
CONFIG0
Mode
Des Device
L
L
Normal Mode, Control Signal Filter disabled
DS90UR905
L
H
Normal Mode, Control Signal Filter enabled
DS90UR905
H
L
Backwards Compatible GEN2
DS90UR241
H
H
Backwards Compatible GEN1
DS90C241
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Video Control Signal Filter
When operating the devices in Normal Mode, the Video Control Signals (DE, HS, VS) have the following
restrictions:
• Normal Mode with Control Signal Filter Enabled:
– DE and HS — Only 2 transitions per 130 clock cycles are transmitted, the transition pulse must be 3
PCLK or longer.
• Normal Mode with Control Signal Filter Disabled:
– DE and HS — Only 2 transitions per 130 clock cycles are transmitted, no restriction on minimum transition
pulse.
• VS — Only 1 transition per 130 clock cycles are transmitted, minimum pulse width is 130 clock cycles.
Video Control Signals are defined as low frequency signals with limited transitions. Glitches of a control signal
can cause a visual display error. This feature allows for the chipset to validate and filter out any high frequency
noise on the control signals. See Figure 15.
PCLK
IN
HS/VS/DE
IN
Latency
PCLK
OUT
HS/VS/DE
OUT
Pulses 1 or 2
PCLKs wide
Filetered OUT
Figure 15. Video Control Signal Filter Waveform
DESERIALIZER Functional Description
The Des converts a single input serial data stream to a wide parallel output bus, and also provides a signal
check for the chipset Built In Self Test (BIST) mode. Several image enhancement features are provided (Note
that these features are not available when operating in backward compatible modes). White balance LUTs allow
the user to define and target the color temperature of the display. Adaptive Hi-FRC dithering enables the
presentation of “true-color” images on an 18–bit color display. The device can be configured via external pins and
strap pins or through the optional serial control bus. The Des features enhance signal quality on the link by
supporting: an equalizer input and also the FPD-Link II data coding that provides randomization, scrambling, and
DC balancing of the data. The Des includes multiple features to reduce EMI associated with display data
transmission. This includes the randomization and scrambling of the data and also the output spread spectrum
clock generation (SSCG) support. The Des features power saving features with a power down mode, and
optional LVCMOS (1.8 V) interface compatibility.
Image Enhancement Features
White Balance
The White Balance feature enables similar display appearance when using LCD’s from different vendors. It
compensates for native color temperature of the display, and adjusts relative intensities of R, G, B to maintain
specified color temperature. Programmable control registers are used to define the contents of three LUTs (8-bit
color value for Red, Green and Blue) for the White Balance Feature. The LUTs map input RGB values to new
output RGB values. There are three LUTs, one LUT for each color. Each LUT contains 256 entries, 8-bits per
entry with a total size of 6144 bits (3 x 256 x 8). All entries are readable and writable. Calibrated values are
loaded into registers through the I2C interface (deserializer is a slave device). This feature may also be applied
to lower color depth applications such as 18–bit (666) and 16–bit (565). White balance is enabled and configured
via serial bus register control.
16
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LUT contents. The user must define and load the contents of the LUT for each color (R,G,B). Regardless of the
color depth being driven (888, 666, 656), the user must always provide contents for 3 complete LUTs - 256
colors x 8 bits x 3 tables. Unused bits - LSBs -shall be set to “0” by the user.
When 24-bit (888) input data is being driven to a 24-bit display, each LUT (R, G and B) must contain 256 unique
8-bit entries. The 8-bit white balanced data is then available at the output of the DS90UR916 deserailizer, and
driven to the display.
When 18-bit (666) input data is being driven to an 18-bit display, the white balance feature may be used in one of
two ways. First, simply load each LUT with 256, 8-bit entries. Each 8-bit entry is a 6-bit value (6 MSBs) with the 2
LSBs set to “00”. Thus as total of 64 unique 6-bit white balance output values are available for each color (R, G
and B). The 6-bit white balanced data is available at the output of the DS90UR916 deserializer, and driven
directly to the display.
Alternatively, with 6-bit input data the user may choose to load complete 8-bit values into each LUT. This mode
of operation provides the user with finer resolution at the LUT output to more closely achieve the desired white
point of the calibrated display. Although 8-bit data is loaded, only 64 unique 8-bit white balance output values are
available for each color (R, G and B). The result is 8-bit white balanced data. Before driving to the output of the
deserializer, the 8-bit data must be reduced to 6-bit with an FRC dithering function. To operate in this mode, the
user must configure the DS90UR916 to enable the FRC2 function.
Examples of the three types of LUT configurations described are shown in Figure 16.
Enabling white balance.The user must load all 3 LUTs prior to enabling the white balance feature. The following
sequence must be followed by the user.
To initialize white balance after power-on:
1. Load contents of all 3 LUTs . This requires a sequential loading of LUTs - first RED, second GREEN, third
BLUE. 256, 8-bit entries must be loaded to each LUT. Page registers must be set to select each LUT.
2. Enable white balance
By default, the LUT data may not be reloaded after initialization at power-on.
An option does exist to allow LUT reloading after power-on and initial LUT loading (as described above). This
option may only be used after enabling the white balance reload feature via the associated serial bus control
register. In this mode the LUTs may be reloaded by the master controller via I2C. This provides the user with the
flexibility to refresh LUTs periodically , or upon system requirements to change to a new set of LUT values. The
host controller loads the updated LUT values via the serial bus interface. There is no need to disable the white
balance feature while reloading the LUT data. Refreshing the white balance to the new set of LUT data will be
seamless - no interruption of displayed data.
It is important to note that initial loading of LUT values requires that all 3 LUTs be loaded sequentially. When
reloading, partial LUT updates may be made. Refer to USING IMAGE ENHANCEMENT FEATURES for a
detailed description of the LUT loading and reloading procedures.
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8-bit in / 8 bit out
Gray level
Entry
0
1
2
3
4
5
6
7
8
9
10
11
6-bit in / 8 bit out
Gray level
Entry
248
249
250
251
252
253
254
255
0
1
2
3
4
5
6
7
8
9
10
11
.
11111000b
N/A
N/A
N/A
11111100b
N/A
N/A
N/A
.
248
249
250
251
252
253
254
255
Data Out
(8-bits)
00000001b
N/A
N/A
N/A
00000110b
N/A
N/A
N/A
00001011b
N/A
N/A
N/A
«
.
00000000b
N/A
N/A
N/A
00000100b
N/A
N/A
N/A
00001000b
N/A
N/A
N/A
«
.
Data Out
(8-bits)
«
11111010b
11111010b
11111011b
11111011b
11111110b
11111101b
11111101b
11111111b
0
1
2
3
4
5
6
7
8
9
10
11
«
248
249
250
251
252
253
254
255
6-bit in / 6 bit out
Gray level
Entry
00000000b
00000001b
00000011b
00000011b
00000110b
00000110b
00000111b
00000111b
00001000b
00001010b
00001001b
00001011b
«
«
.
Data Out
(8-bits)
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.
11111010b
N/A
N/A
N/A
11111111b
N/A
N/A
N/A
Figure 16. White Balance LUT Configurations
Adaptive Hi-FRC Dithering
The Adaptive FRC Dithering Feature delivers product-differentiating image quality. It reduces 24-bit RGB (8 bits
per sub-pixel) to 18-bit RGB (6 bits per sub-pixel), smoothing color gradients, and allowing the flexibility to use
lower cost 18-bit displays. FRC (Frame Rate Control) dithering is a method to emulate “missing” colors on a
lower color depth LCD display by changing the pixel color slightly with every frame. FRC is achieved by
controlling on and off pixels over multiple frames (Temporal). Static dithering regulates the number of on and off
pixels in a small defined pixel group (Spatial). The FRC module includes both Temporal and Spatial methods and
also Hi-FRC. Conventional FRC can display only 16,194,277 colors with 6-bit RGB source. “Hi-FRC” enables full
(16,777,216) color on an 18-bit LCD panel. The “adaptive” FRC module also includes input pixel detection to
apply specific Spatial dithering methods for smoother gray level transitions. When enabled, the lower LSBs of
each RGB output are not active; only 18 bit data (6 bits per R,G and B) are driven to the display. This feature is
enabled via serial bus register control.
Two FRC functional blocks are available, and may be independently enabled. FRC1 precedes the white balance
LUT, and is intended to be used when 24-bit data is being driven to an 18-bit display with a white balance LUT
that is calibrated for an 18-bit data source. The second FRC block, FRC2, follows the white balance block and is
intended to be used when fine adjustment of color temperature is required on an 18-bit color display, or when a
24-bit source drives an 18-bit display with a white balance LUT calibrated for 24-bit source data.
For proper operation of the FRC dithering feature, the user must provide a description of the display timing
control signals. The timing mode, “sync mode” (HS, VS) or “DE only” must be specified, along with the active
polarity of the timing control signals. All this information is entered to DS90UR916 control registers via the serial
bus interface.
Adaptive Hi-FRC dithering consists of several components. Initially, the incoming 8-bit data is expanded to 9-bit
data. This allows the effective dithered result to support a total of 16.7 million colors. The incoming 9-bit data is
evaluated, and one of four possible algorithms is selected. The majority of incoming data sequences are
supported by the default dithering algorithm. Certain incoming data patterns (black/white pixel, full on/off subpixel) require special algorithms designed to eliminate visual artifacts associated with these specific gray level
transitions. Three algorithms are defined to support these critical transitions.
An example of the default dithering algorithm is illustrated in Figure 17. The “1” or “0” value shown in the table
describes whether the 6-bit value is increased by 1 (“1”) or left unchanged (“0”). In this case, the 3 truncated
LSBs are “001”.
18
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Frame = 0, Line = 0
F0L0
Pixel Index
PD1
Pixel Data one
Cell Value 010
R[7:2]+0, G[7:2]+1, B[7:2]+0
LSB=001
three lsb of 9 bit data (8 to 9 for Hi-Frc)
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
F0L0
010
000
000
000
000
000
010
000
F0L1
101
000
000
000
101
000
000
000
R = 4/32
LSB=001
LSB = 001
F0L2
000
000
010
000
010
000
000
000
G = 4/32
F0L3
000
000
101
000
000
000
101
000
B = 4/32
F1L0
000
000
000
000
000
000
000
000
F1L1
000
111
000
000
000
111
000
000
R = 4/32
F1L2
000
000
000
000
000
000
000
000
G = 4/32
F1L3
000
000
000
111
000
000
000
111
B = 4/32
F2L0
000
000
010
000
010
000
000
000
F2L1
000
000
101
000
000
000
101
000
R = 4/32
F2L2
010
000
000
000
000
000
010
000
G = 4/32
F2L3
101
000
000
000
101
000
000
000
B = 4/32
F3L0
000
000
000
000
000
000
000
000
F3L1
000
000
000
111
000
000
000
111
R = 4/32
F3L2
000
000
000
000
000
000
000
000
G = 4/32
F3L3
000
111
000
000
000
111
000
000
B = 4/32
Figure 17. Default FRC Algorithm
Signal Quality Enhancers
Des — Input Equalizer Gain (EQ)
The Des can enable receiver input equalization of the serial stream to increase the eye opening to the Des input.
Note this function cannot be seen at the RxIN+/- input but can be observed at the serial test port (CMLOUTP/N)
enabled via the Serial Bus control registers. The equalization feature may be controlled by the external pin or by
register.
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Table 2. Receiver Equalization Configuration Table
INPUTS
EQ3
EQ2
L
L
Effect
EQ1
EQ0
L
L
H
L
H
H
~3 dB
L
H
L
H
~4.5 dB
L
H
H
H
~6 dB
H
L
L
H
~7.5 dB
H
L
H
H
~9 dB
H
H
L
H
~10.5 dB
H
H
H
H
~12 dB
X
X
X
L
OFF*
~1.5 dB
* Default Setting is EQ = Off
The quality of the equalized signal may be assessed by monitoring the differential eye opening at the
CMLOUTP/N. The Receiver Differential Input Threshold and Input Jitter Tolerance define the acceptable data
eye opening. A differential probe should be used to measure across a 100Ohm termination resistor between the
CMLOUTP/N pins. Figure 18 illustrates the eye opening.
Ideal Data Bit
Beginning
RxIN_TOL -L
Minimum Eye
Width
• VTH - VTL
Ideal Data Bit
End
RxIN_TOL -R
tBIT
(1UI)
Figure 18. CMLOUT Eye Opening
EMI Reduction Features
Output Slew (OS_PCLK/DATA)
The parallel bus outputs (RGB[7:0], VS, HS, DE and PCLK) of the Des feature a selectable output slew. The
DATA ((RGB[7:0], VS, HS, DE) are controlled by strap pin or register bit OS_DATA. The PCLK is controlled by
strap pin or register bit OS_PCLK. When the OS_PCLK/DATA = HIGH, the maximum slew rate is selected.
When the OS_PCLK/DATA = LOW, the minimum slew rate is selected. Use the higher slew rate setting when
driving longer traces or a heavier capacitive load.
Common Mode Filter Pin (CMF) — Optional
The Des provides access to the center tap of the internal termination. A capacitor may be placed on this pin for
additional common-mode filtering of the differential pair. This can be useful in high noise environments for
additional noise rejection capability. A 0.1µF capacitor may be connected to this pin to Ground.
SSCG Generation — Optional
The Des provides an internally generated spread spectrum clock (SSCG) to modulate its outputs. Both clock and
data outputs are modulated. This will aid to lower system EMI. Output SSCG deviations to ±2.0% (4% total) at up
to 35kHz modulations nominally are available. See Table 3. This feature may be controlled by external STRAP
pins or by register.
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Table 3. SSCG Configuration (LF_MODE = L) — Des Output
SSC[3:0] Inputs
LF_MODE = L (20 - 65 MHz)
Result
SSC3
SSC2
SSC1
SSC0
fdev (%)
fmod (kHz)
L
L
L
L
L
L
L
Off
Off
H
±0.5
L
L
H
L
±1.0
L
L
H
H
±1.5
L
H
L
L
±2.0
L
H
L
H
±0.5
L
H
H
L
±1.0
L
H
H
H
±1.5
H
L
L
L
±2.0
H
L
L
H
±0.5
H
L
H
L
±1.0
H
L
H
H
±1.5
H
H
L
L
±2.0
H
H
L
H
±0.5
H
H
H
L
±1.0
H
H
H
H
±1.5
PCLK/2168
PCLK/1300
PCLK/868
PCLK/650
Table 4. SSCG Configuration (LF_MODE = H) — Des Output
SSC[3:0] Inputs
LH_MODE = H (5 - 20 MHz)
Result
SSC3
SSC2
SSC1
SSC0
fdev (%)
fmod (kHz)
L
L
L
L
Off
Off
L
L
L
H
±0.5
L
L
H
L
±1.0
L
L
H
H
±1.5
L
H
L
L
±2.0
L
H
L
H
±0.5
L
H
H
L
±1.0
L
H
H
H
±1.5
H
L
L
L
±2.0
H
L
L
H
±0.5
H
L
H
L
±1.0
H
L
H
H
±1.5
H
H
L
L
±2.0
H
H
L
H
±0.5
H
H
H
L
±1.0
H
H
H
H
±1.5
PCLK/620
PCLK/370
PCLK/258
PCLK/192
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Frequency
fdev(max)
FPCLK+
FPCLK
FPCLK-
fdev(min)
Time
1/fmod
Figure 19. SSCG Waveform
1.8V or 3.3V VDDIO Operation
The Des parallel bus and Serial Bus Interface can operate with 1.8 V or 3.3 V levels (VDDIO) for target (Display)
compatibility. The 1.8 V levels will offer a lower noise (EMI) and also a system power savings.
Power Saving Features
PowerDown Feature (PDB)
The Des has a PDB input pin to ENABLE or POWER DOWN the device. This pin can be controlled by the
system to save power, disabling the Des when the display is not needed. An auto detect mode is also available.
In this mode, the PDB pin is tied High and the Des will enter POWER DOWN when the serial stream stops.
When the serial stream starts up again, the Des will lock to the input stream and assert the LOCK pin and output
valid data. In POWER DOWN mode, the Data and PCLK output states are determined by the OSS_SEL status.
Note – in POWER DOWN, the optional Serial Bus Control Registers are RESET.
Stop Stream SLEEP Feature
The Des will enter a low power SLEEP state when the input serial stream is stopped. A STOP condition is
detected when the embedded clock bits are not present. When the serial stream starts again, the Des will then
lock to the incoming signal and recover the data. Note – in STOP STREAM SLEEP, the optional Serial Bus
Control Registers values are RETAINED.
CLOCK-DATA RECOVERY STATUS FLAG (LOCK) and OUTPUT STATE SELECT (OSS_SEL)
When PDB is driven HIGH, the CDR PLL begins locking to the serial input and LOCK goes from TRI-STATE to
LOW (depending on the value of the OSS_SEL setting). After the DS90UR916Q completes its lock sequence to
the input serial data, the LOCK output is driven HIGH, indicating valid data and clock recovered from the serial
input is available on the parallel bus and PCLK outputs. The PCLK output is held at its current state at the
change from OSC_CLK (if this is enabled via OSC_SEL) to the recovered clock (or vice versa).
If there is a loss of clock from the input serial stream, LOCK is driven Low and the state of the RGB/VS/HS/DE
outputs are based on the OSS_SEL setting (STRAP PIN configuration or register).
Oscillator Output — Optional
The Des provides an optional PCLK output when the input clock (serial stream) has been lost. This is based on
an internal oscillator. The frequency of the oscillator may be selected. This feature may be controlled by the
external pin or by register. See Table 6 and Table 7.
22
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Table 5. OSS_SEL and PDB Configuration — Des Outputs (1)
INPUTS
Serial Input
(1)
OUTPUTS
PDB
OSS_SEL
PCLK
RGB/HS/VS/DE
LOCK
PASS
X
L
X
Z
Z
Z
Z
Static
H
L
L
L
L
L
Static
H
H
Z
Z*
L
L
Active
H
X
Active
Active
H
H
If pin is strapped HIGH, output will be pulled up
Table 6. OSC (Oscillator) Mode — Des Output
INPUTS
OUTPUTS
Embedded PCLK
See
PCLK
(1)
Present
(1)
RGB/HS/VS/DE
LOCK
PASS
OSC Output
L
L
L
Toggling
Active
H
H
Absent and OSC_SEL ≠ 000
PDB
(DES)
RIN
(Diff.)
LOCK
active serial stream
X
H
Z
L
H
L
Z
RGB[7:0],
HS, VS, DE
Z
Z
Z
PCLK*
(DES)
Z
Z
Z
H
PASS
Z
OFF
L
Locking
H
L
Active
C0 or C1 Error
In Bit Stream
(Loss of LOCK)
Z
Active
OFF
CONDITIONS: * RFB = L, and OSS_SEL = H
Figure 20. Des Outputs with Output State Select Low (OSS_SEL = H)
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PDB
(DES)
RIN
(Diff.)
active serial stream
X
H
LOCK
Z
L
H
L
Z
RGB[7:0],
HS, VS, DE
L
L
L
PCLK*
(DES)
L
L
L
PASS
H
L
Z
Locking
OFF
H
L
Active
C0 or C1 Error
In Bit Stream
(Loss of LOCK)
Z
Active
OFF
CONDITIONS: * RFB = L, and OSS_SEL = L
Figure 21. Des Outputs with Output State Select High (OSS_SEL = L)
Table 7. OSC_SEL (Oscillator) Configuration
OSC_SEL[2:0] INPUTS
24
OSC_SEL0
PCLK Oscillator Output
OSC_SEL2
OSC_SEL1
L
L
L
Off – Feature Disabled – Default
L
L
H
50 MHz ±40%
L
H
L
25 MHz ±40%
L
H
H
16.7 MHz ±40%
H
L
L
12.5 MHz ±40%
H
L
H
10 MHz ±40%
H
H
L
8.3 MHz ±40%
H
H
H
6.3 MHz ±40%
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PDB
(DES)
RIN
(Diff.)
LOCK
active serial stream
H
Z
RGB[7:0],
HS, VS, DE
L
PCLK*
(DES)
L
PASS
X
H
L
f
L
Z
L
L
f
L
H
H
Z
OFF
L
Locking
Z
L
Active
C0 or C1 Error
In Bit Stream
(Loss of LOCK)
Active
OFF
CONDITIONS: * RFB = L, OSS_SEL = L , and OSC_SEL not equal to 000.
Figure 22. Des Outputs with Output State High and PCLK Output Oscillator Option Enabled
OP_LOW — Optional
The OP_ LOW feature is used to hold the LVCMOS outputs (except the LOCK output) at a LOW state. This
feature is enabled by setting the OP_LOW strap pin = HIGH, followed by the rising edge of PDB. The user must
toggle the OP_LOW Set/Reset register bit to release the outputs to the normal toggling state. Note that the
release of the outputs can only occur when LOCK is HIGH. When the OP_LOW feature is enabled, anytime
LOCK = LOW, the LVCMOS outputs will toggle to a LOW state again. The OP_ LOW strap pin feature is
assigned to output PASS pin 42.
Restrictions on other straps:
1) Other straps should not be used in order to keep RGB[7:0], HS, VS, DE, and PCLK at a true LOW state. Other
features should be selected thru I2C.
2) OSS_SEL function is not available when O/P_LOW is tied H.
Outputs RGB[7:0], HSYNC, VSYNC, DE, and PCLK are in TRI-STATE before PDB toggles HIGH because the
OP_LOW strap value has not been recognized until the DS90UR916 powers up. Figure 23 shows the user
controlled release of OP_LOW and automatic reset of OP_LOW set on the falling edge of LOCK. Figure 24
shows the user controlled release of OP_LOW and manual reset of OP_LOW set. Note manual reset of
OP_LOW can only occur when LOCK is H.
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PDB
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2.0V
LOCK
OP_ LOW
SET
(Strap pin)
User
controlled
User
controlled
OP_ LOW
RELEASE/SET
(Register)
RGB[7:0],
HS, VS, DE
TRISTATE
ACTIVE
ACTIVE
PCLK
TRISTATE
ACTIVE
ACTIVE
Figure 23. OP_LOW Auto Set
PDB
2.0V
LOCK
OP_LOW
SET
(Strap pin)
User
controlled
User
controlled
OP_ LOW
RELEASE/SET
(Register)
RGB[7:0],
HS, VS, DE
TRISTATE
ACTIVE
PCLK
TRISTATE
ACTIVE
Figure 24. OP_LOW Manual Set/Reset
Pixel Clock Edge Select (RFB)
The RFB pin determines the edge that the data is strobed on. If RFB is High, output data is strobed on the Rising
edge of the PCLK. If RFB is Low, data is strobed on the Falling edge of the PCLK. This allows for interoperability with downstream devices. The Des output does not need to use the same edge as the Ser input. This
feature may be controlled by the external pin or by register.
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Control Signal Filter — Optional
The Des provides an optional Control Signal (VS, HS, DE) filter that monitors the three video control signals and
eliminates any pulses that are 1 or 2 PCLKs wide. Control signals must be 3 pixel clocks wide (in its HIGH or
LOW state, regardless of which state is active). This is set by the CONFIG[1:0] or by the Control Register. This
feature may be controlled by the external pin or by Register.
Low Frequency Optimization (LF_Mode)
This feature may be controlled by the external pin or by Register.
Des — Map Select
This feature may be controlled by the external pin or by Register.
Table 8. Map Select Configuration
INPUTS
Effect
MAPSEL1
MAPSEL0
L
L
Bit 4, Bit 5 on LSB
DEFAULT
L
H
LSB 0 or 1
H
H or L
LSB 0
Strap Input Pins
Configuration of the device maybe done via configuration input pins and the STRAP input pins, or via the Serial
Control Bus. The STRAP input pins share select parallel bus output pins. They are used to load in configuration
values during the initial power up sequence of the device. Only a pull-up on the pin is required when a HIGH is
desired. By default the pad has an internal pull down, and will bias Low by itself. The recommended value of the
pull up is 10 kΩ to VDDIO; open (NC) for Low, no pull-down is required (internal pull-down). If using the Serial
Control Bus, no pull ups are required.
Optional Serial Bus Control
Please see the following section on the optional Serial Bus Control Interface.
Optional BIST Mode
Please see the following section on the chipset BIST mode for details.
Built In Self Test (BIST)
An optional At-Speed Built In Self Test (BIST) feature supports the testing of the high-speed serial link. This is
useful in the prototype stage, equipment production, in-system test and also for system diagnostics. In the BIST
mode only a input clock is required along with control to the Ser and Des BISTEN input pins. The Ser outputs a
test pattern (PRBS7) and drives the link at speed. The Des detects the PRBS7 pattern and monitors it for errors.
A PASS output pin toggles to flag any payloads that are received with 1 to 24 errors. Upon completion of the
test, the result of the test is held on the PASS output until reset (new BIST test or Power Down). A high on PASS
indicates NO ERRORS were detected. A Low on PASS indicates one or more errors were detected. The duration
of the test is controlled by the pulse width applied to the Des BISTEN pin. During the BIST duration the
deserializer data outputs toggle with a checkerboard pattern.
Inter-operability is supported between this FPD-Link II device and all FPD-Link II generations (Gen 1/2/3) — see
respective datasheets for details on entering BIST mode and control.
Sample BIST Sequence
See Figure 25 for the BIST mode flow diagram.
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Step 1: Place the DS90UR905 Ser in BIST Mode by setting Ser BISTEN = H. For the DS90UR905 Ser or
DS99R421 FPD-Link II Ser BIST Mode is enabled via the BISTEN pin. For the DS90C241 Ser or DS90UR241
Ser, BIST mode is enetered by setting all the input data of the device to Low state. A PCLK is required for all the
Ser options. When the Des detects the BIST mode pattern and command (DCA and DCB code) the RGB and
control signal outputs are shut off.
Step 2: Place the DS90UR916Q Des in BIST mode by setting the BISTEN = H. The Des is now in the BIST
mode and checks the incoming serial payloads for errors. If an error in the payload (1 to 24) is detected, the
PASS pin will switch low for one half of the clock period. During the BIST test, the PASS output can be
monitored and counted to determine the payload error rate.
Step 3: To Stop the BIST mode, the Des BISTEN pin is set Low. The Des stops checking the data and the final
test result is held on the PASS pin. If the test ran error free, the PASS output will be High. If there was one or
more errors detected, the PASS output will be Low. The PASS output state is held until a new BIST is run, the
device is RESET, or Powered Down. The BIST duration is user controlled by the duration of the BISTEN signal.
Step 4: To return the link to normal operation, the Ser BISTEN input is set Low. The Link returns to normal
operation.
Figure 26 shows the waveform diagram of a typical BIST test for two cases. Case 1 is error free, and Case 2
shows one with multiple errors. In most cases it is difficult to generate errors due to the robustness of the link
(differential data transmission etc.), thus they may be introduced by greatly extending the cable length, faulting
the interconnect, reducing signal condition enhancements (De-Emphasis, VODSEL, or Rx Equalization).
Normal
Step 1: SER in BIST
BIST
Wait
Step 2: Wait, DES in BIST
BIST
start
Step 3: DES in Normal
Mode - check PASS
BIST
stop
Step 4: SER in Normal
Figure 25. BIST Mode Flow Diagram
BER Calculations
It
•
•
•
is possible to calculate the approximate Bit Error Rate (BER). The following is required:
Pixel Clock Frequency (MHz)
BIST Duration (seconds)
BIST test Result (PASS)
The BER is less than or equal to one over the product of 24 times the PCLK rate times the test duration. If we
assume a 65MHz PCLK, a 10 minute (600 second) test, and a PASS, the BERT is ≤ 1.07 X 10E-12
The BIST mode runs a check on the data payload bits. The LOCK pin also provides a link status. It the recovery
of the C0 and C1 bits does not reconstruct the expected clock signal, the LOCK pin will switch Low. The
combination of the LOCK and At-Speed BIST PASS pin provides a powerful tool for system evaluation and
performance monitoring.
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SER
BISTEN
(SER)
DES Outputs
BISTEN
(DES)
Case 1 - Pass
PCLK
(RFB = L)
RGB[7:0]
HS, VS, DE
DATA
(internal)
PASS
Prior Result
PASS
PASS
X
X
X
FAIL
Prior Result
Normal
Case 2 - Fail
X = bit error(s)
DATA
(internal)
PRBS
BIST
Result
Held
BIST Test
BIST Duration
Normal
Figure 26. BIST Waveforms
Optional Serial Bus Control
The DS90UR916 may also be configured by the use of a serial control bus that is I2C protocol compatible. By
default, the I2C reg_0x00'h is set to 00'h and all configuration is set by control/strap pins. A write of 01'h to
reg_0x00'h will enable/allow configuration by registers; this will override the control/strap pins. Multiple devices
may share the serial control bus since multiple addresses are supported. See Figure 27.
1.8V
10 k
VDDIO
ID[X]
4.7k
HOST
4.7k
RID
SCL
SCL
SDA
SDA
SER
or
DES
To other
Devices
Figure 27. Serial Control Bus Connection
The serial bus is comprised of three pins. The SCL is a Serial Bus Clock Input. The SDA is the Serial Bus Data
Input / Output signal. Both SCL and SDA signals require an external pull up resistor to VDDIO. For most
applications a 4.7 k pull up resistor to VDDIO may be used. The resistor value may be adjusted for capacitive
loading and data rate requirements. The signals are either pulled High, or driven Low.
The third pin is the ID[X] pin. This pin sets one of four possible device addresses. Two different connections are
possible. The pin may be pulled to VDD (1.8V, NOT VDDIO)) with a 10 kΩ resistor; or a 10 kΩ pull up resistor (to
VDD1.8V, NOT VDDIO)) and a pull down resistor of the recommended value to set other three possible addresses
may be used. See Table 9. Do not tie ID[x] directly to VSS.
The Serial Bus protocol is controlled by START, START-Repeated, and STOP phases. A START occurs when
SCL transitions Low while SDA is High. A STOP occurs when SDA transition High while SCL is also HIGH. See
Figure 28.
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SDA
SCL
S
P
START condition, or
START repeat condition
STOP condition
Figure 28. START and STOP Conditions
To communicate with a remote device, the host controller (master) sends the slave address and listens for a
response from the slave. This response is referred to as an acknowledge bit (ACK). If a slave on the bus is
addressed correctly, it Acknowledges (ACKs) the master by driving the SDA bus low. If the address doesn't
match a device's slave address, it Not-acknowledges (NACKs) the master by letting SDA be pulled High. ACKs
also occur on the bus when data is being transmitted. When the master is writing data, the slave ACKs after
every data byte is successfully received. When the master is reading data, the master ACKs after every data
byte is received to let the slave know it wants to receive another data byte. When the master wants to stop
reading, it NACKs after the last data byte and creates a stop condition on the bus. All communication on the bus
begins with either a Start condition or a Repeated Start condition. All communication on the bus ends with a Stop
condition. A READ is shown in Figure 29 and a WRITE is shown in Figure 30.
If the Serial Bus is not required, the three pins may be left open (NC).
Table 9. ID[x] Resistor Value – DS90UR916Q Des
Resistor
RID* kΩ (5% tol)
Address
7'b
Address
8'b
0 appended
(WRITE)
0.47
7b' 111 0001 (h'71)
8b' 1110 0010 (h'E2)
2.7
7b' 111 0010 (h'72)
8b' 1110 0100 (h'E4)
8.2
7b' 111 0011 (h'73)
8b' 1110 0110 (h'E6)
Open
7b' 111 0110 (h'76)
8b' 1110 1100 (h'EC)
*Note: RID ≠ 0 ohm, do not connect directly to VSS (GND), this is not a valid address.
Register Address
Slave Address
S
A
2
A
1
A
0
0
Slave Address
a
c
k
a
c
k
A
2
S
A
1
A
0
Data
1
a
c
k
a
c
k
P
Figure 29. Serial Control Bus — READ
Register Address
Slave Address
S
A
2
A
1
A
0
0
a
c
k
Data
a
c
k
a
c
k
P
Figure 30. Serial Control Bus — WRITE
30
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Table 10. DESERIALIZER — Serial Bus Control Registers
PAGE
ADD
(dec)
ADD
(hex)
0
0
0
0
0
1
2
1
2
Register Name
Des Config 1
Slave ID
Des Features 1
Bit(s)
R/W
Default
(bin)
Function
Description
7
R/W
0
LFMODE
0: 20 to 65 MHz Operation
1: 5 to 20 MHz Operation
6
R/W
0
OS_PCLK
0: Normal PCLK Output Slew
1: Increased PCLK Slew
5
R/W
0
OS_DATA
0: Normal DATA OUTPUT Slew
1: Increased Data Slew
4
R/W
0
RFB
0: Data strobed on Falling edge of PCLK
1: Data strobed on Rising edge of PCLK
3:2
R/W
00
CONFIG
00: Normal Mode, Control Signal Filter
Disabled
01: Normal Mode, Control Signal Filter
Enabled
10: Backwards Compatible (DS90UR241)
11: Backwards Compatible (DS90C241)
1
R/W
0
SLEEP
Note – not the same function as
PowerDown (PDB)
0: normal mode
1: Sleep Mode – Register settings
retained.
0
R/W
0
REG Control
0: Configurations set from control pins /
STRAP pins
1: Configurations set from registers (except
I2C_ID)
7
R/W
0
6:0
R/W
7
R/W
0
OP_LOW
Release/Set
0: set outputs state LOW (except LOCK)
1: release output LOW state, outputs
toggling normally
Note: This register only works during LOCK
= 1.
6
R/W
0
OSS_SEL
Output Sleep State Select
0:PCLK/RGB[7:0]/HS/VS/DE = L, LOCK =
Normal, PASS = H
1:PCLK/RGB[7:0]/HS/VS/DE = Tri-State,
LOCK = Normal, PASS = H
5:4
R/W
00
MAP_SEL
Special for Backwards Compatible Mode
with DS90UR241)
00: bit 4, 5 on LSB
01: LSB zero or one
10: LSB zero
11: LSB zero
3
R/W
0
OP_LOW strap
bypass
0: strap will determine whether OP_LOW
feature is ON or OFF
1: Turns OFF OP_LOW feature
2:0
R/W
00
OSC_SEL
000:
001:
010:
011:
100:
101:
110:
111:
0: Address from ID[X] Pin
1: Address from Register
1110000 ID[X]
Serial Bus Device ID, Four IDs are:
7b '1110 001 (h'71)
7b '1110 010 (h'72)
7b '1110 011 (h'73)
7b '1110 110 (h'76)
All other addresses are Reserved.
OFF
50 MHz ±40%
25 MHz ±40%
16.7 MHz ±40%
12.5 MHz ±40%
10 MHz ±40%
8.3 MHz ±40%
6.3 MHz ±40%
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Table 10. DESERIALIZER — Serial Bus Control Registers (continued)
PAGE
ADD
(dec)
ADD
(hex)
Register Name
Bit(s)
R/W
Default
(bin)
Function
Description
0
3
3
Des Features 2
7:5
R/W
000
EQ Gain
000:
001:
010:
011:
100:
101:
110:
111:
4
R/W
0
EQ Enable
0: EQ = disabled
1: EQ = enabled
3:0
R/W
0000
SSC
IF LF_MODE = 0, then:
000: SSCG OFF
0001: fdev = ±0.5%, fmod = PCLK/2168
0010: fdev = ±1.0%, fmod = PCLK/2168
0011: fdev = ±1.5%, fmod = PCLK/2168
0100: fdev = ±2.0%, fmod = PCLK/2168
0101: fdev = ±0.5%, fmod = PCLK/1300
0110: fdev = ±1.0%, fmod = PCLK/1300
0111: fdev = ±1.5%, fmod = PCLK/1300
1000: fdev = ±2.0%, fmod = PCLK/1300
1001: fdev = ±0.5%, fmod = PCLK/868
1010: fdev = ±1.0%, fmod = PCLK/868
1011: fdev = ±1.5%, fmod = PCLK/868
1100: fdev = ±2.0%, fmod = PCLK/868
1101: fdev = ±0.5%, fmod = PCLK/650
1110: fdev = ±1.0%, fmod = PCLK/650
1111: fdev = ±1.5%, fmod = PCLK/650
IF LF_MODE = 1, then:
000: SSCG OFF
0001: fdev = ±0.5%, fmod = PCLK/620
0010: fdev = ±1.0%, fmod = PCLK/620
0011: fdev = ±1.5%, fmod = PCLK/620
0100: fdev = ±2.0%, fmod = PCLK/620
0101: fdev = ±0.5%, fmod = PCLK/370
0110: fdev = ±1.0%, fmod = PCLK/370
0111: fdev = ±1.5%, fmod = PCLK/370
1000: fdev = ±2.0%, fmod = PCLK/370
1001: fdev = ±0.5%, fmod = PCLK/258
1010: fdev = ±1.0%, fmod = PCLK/258
1011: fdev = ±1.5%, fmod = PCLK/258
1100: fdev = ±2.0%, fmod = PCLK/258
1101: fdev = ±0.5%, fmod = PCLK/192
1110: fdev = ±1.0%, fmod = PCLK/192
1111: fdev = ±1.5%, fmod = PCLK/192
7
R/W
0
Repeater Enable
0: Output CMLOUTP/N = disabled
1: Output CMLOUTP/N = enabled
6:0
R/W
7
R/W
0
Timing mode
select
Select display timing mode
0: DE only mode
1: Sync mode (VS, HS)
6
R/W
0
VS Polarity
0: Active HIGH
1: Active LOW
5
R/W
0
HS Polarity
0: Active HIGH
1: Active LOW
4
R/W
0
DE Polarity
0: Active HIGH
1: Active LOW
3
R/W
0
FRC2 enable
0: FRC2 disabled
1: FRC2 enabled
2
R/W
0
FRC1 enable
0: FRC1 disabled
1: FRC1 enabled
0
Reserved
Reserved
0
0
4
21
4
15
CMLOUT Config
FRC
Configuration
[1:0]
32
0000000 Reserved
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~1.625 dB
~3.25 dB
~4.87 dB
~6.5 dB
~8.125 dB
~9.75 dB
~11.375 dB
~13 dB
Reserved
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Table 10. DESERIALIZER — Serial Bus Control Registers (continued)
PAGE
ADD
(dec)
ADD
(hex)
0
22
16
Register Name
Bit(s)
R/W
Default
(bin)
White Balance
Configuration
[7:6]
R/W
5
4
Function
Description
0
Page Setting
00:
01:
10:
11:
R/W
0
White Balance
Enable
0: WB disabled
1: WB enabled
R/W
0
Reload Enable
0: Reload disabled
1: Reload enabled
[3:0]
Configuration Registers
Red LUT
Green LUT
Blue LUT
0
Reserved
Reserved
1
0255
00 FF
White Balance
Red LUT
[FF:0]
R/W
N/A
Red LUT
256 8–bit entries to be applied to the Red
subpixel data
2
0255
00 FF
White Balance
Green LUT
[FF:0]
R/W
N/A
Green LUT
256 8–bit entries to be applied to the Green
subpixel data
3
0255
00 FF
White Balance
Blue LUT
[FF:0]
R/W
N/A
Blue LUT
256 8–bit entries to be applied to the Blue
subpixel data
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APPLICATIONS INFORMATION
DISPLAY APPLICATION
The DS90UR905/916Q chipset is intended for interface between a host (graphics processor) and a Display. It
supports an 24-bit color depth (RGB888) and up to 1024 X 768 display formats. In a RGB888 application, 24
color bits (R[7:0], G[7:0], B[7:0]), Pixel Clock (PCLK) and three control bits (VS, HS and DE) are supported
across the serial link with PCLK rates from 5 to 65 MHz. The chipset may also be used in 18-bit color
applications. In this application three to six general purpose signals may also be sent from host to display.
The Des is expected to be located close to its target device. The interconnect between the Des and the target
device is typically in the 1 to 3 inch separation range. The input capacitance of the target device is expected to
be in the 5 to 10 pF range. Care should be taken on the PCLK output trace as this signal is edge sensitive and
strobes the data. It is also assumed that the fanout of the Des is one. If additional loads need to be driven, a
logic buffer or mux device is recommended.
TYPICAL APPLICATION CONNECTION
Figure 31 shows a typical application of the DS90UR916Q Des using serial bus control mode for a 65 MHz 24-bit
Color Display Application. The LVDS inputs utilize 100 nF coupling capacitors to the line and the Receiver
provides internal termination. Bypass capacitors are placed near the power supply pins. At a minimum, seven 0.1
µF capacitors and two 4.7 µF capacitors should be used for local device bypassing. System GPO (General
Purpose Output) signals control the PDB and the BISTEN pins. In this application the RRFB pin is tied Low to
strobe the data on the falling edge of the PCLK.
The DS90UR916 will most often be used in serial bus control mode as this is required to enable the image
enhancement features of the device. The schematic illustrates the proper connection of SDA and SCL to the pullup resistors as well as the external resistor network to the ID[x] pin..
The interface to the target display is with 3.3V LVCMOS levels, thus the VDDIO pin is connected to the 3.3 V rail.
A delay cap is placed on the PDB signal to delay the enabling of the device until power is stable.
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DS90UR916Q (DES)
1.8V
VDDL
C14
C11
VDDIO
VDDIO
C8
C3
FB1
VDDSC
C9
VDDPR
VDDIO
C10
C5
FB4
VDDR
C16
FB5
C6
VDDIR
VDDCMLO
C17
FB6
C7
C1
Serial
FPD-Link II
Interface
RIN+
RINCMF
C2
C13
TP_A
TP_B
Host
Control
C15
C12
VDDIO
C4
FB3
FB2
CMLOUTP
CMLOUTN
BISTEN
PDB
C18
R7
R6
R5
R4
R3
R2
R1
R0
G7
G6
G5
G4
G3
G2
G1
G0
LVCMOS
Parallel
Video
Interface
B7
B6
B5
B4
B3
B2
B1
B0
HS
VS
DE
PCLK
LOCK
PASS
1.8V
10k
8
ID[X]
RID
VDDIO
4.7k
NC
RES
DAP (GND)
4.7k
SCL
SDA
C1 - C2 = 0.1 PF (50 WV)
C3 - C13 = 0.1 PF
C14 - C17 = 4.7 PF
C18 = >10 PF
RID (see ID[x] Resistor Value Table)
FB1-FB6: Impedance = 1 k:,
low DC resistance (<1:)
Figure 31. DS90UR916Q Typical Connection Diagram — Pin Control
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POWER UP REQUIREMENTS AND PDB PIN
At power-on, the PDB pin must be LOW. The transition to the HIGH state (normal operating mode) may only
occur after all power supplies are stable and above the minimum recommended operating voltage. All other
LVCMOS inputs must also remain LOW prior to power supplies stabilized at the recommended operating
voltages. Active driving of inputs and the transition of PDB to the HIGH state should be delayed 1usec after
power supplies are stabilized.
TRANSMISSION MEDIA
The Ser/Des chipset is intended to be used in a point-to-point configuration, through a PCB trace, or through
twisted pair cable. The Ser and Des provide internal terminations providing a clean signaling environment. The
interconnect for LVDS should present a differential impedance of 100 Ohms. Use cables and connectors that
have matched differential impedance to minimize impedance discontinuities. Shielded or un-shielded cables may
be used depending upon the noise environment and application requirements.
LIVE LINK INSERTION
The Ser and Des devices support live pluggable applications. The automatic receiver lock to random data “plug &
go” hot insertion capability allows the DS90UR916Q to attain lock to the active data stream during a live insertion
event.
PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS
Circuit board layout and stack-up for the LVDS Ser/Des devices should be designed to provide low-noise power
feed to the device. Good layout practice will also separate high frequency or high-level inputs and outputs to
minimize unwanted stray noise pickup, feedback and interference. Power system performance may be greatly
improved by using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane
capacitance for the PCB power system with low-inductance parasitics, which has proven especially effective at
high frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass
capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the
range of 0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF to 10 uF range. Voltage rating of the
tantalum capacitors should be at least 5X the power supply voltage being used.
Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per
supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power
entry. This is typically in the 50uF to 100uF range and will smooth low frequency switching noise. It is
recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors
connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external
bypass capacitor will increase the inductance of the path.
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size
reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of
these external bypass capacitors, usually in the range of 20-30 MHz. To provide effective bypassing, multiple
capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At
high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing
the impedance at high frequency.
Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not
required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power
pin pairs. In some cases, an external filter many be used to provide clean power to sensitive circuits such as
PLLs.
Use at least a four layer board with a power and ground plane. Locate LVCMOS signals away from the LVDS
lines to prevent coupling from the LVCMOS lines to the LVDS lines. Closely-coupled differential lines of 100
Ohms are typically recommended for LVDS interconnect. The closely coupled lines help to ensure that coupled
noise will appear as common-mode and thus is rejected by the receivers. The tightly coupled lines will also
radiate less.
Information on the WQFN style package is provided in TI Application Note: AN-1187 (SNOA401).
36
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LVDS INTERCONNECT GUIDELINES
See AN-1108 (SNLA008) and AN-905 (SNLA035) for full details.
• Use 100Ω coupled differential pairs
• Use the S/2S/3S rule in spacings
– – S = space between the pair
– – 2S = space between pairs
– – 3S = space to LVCMOS signal
• Minimize the number of Vias
• Use differential connectors when operating above 500Mbps line speed
• Maintain balance of the traces
• Minimize skew within the pair
• Terminate as close to the TX outputs and RX inputs as possible
Additional general guidance can be found in the LVDS Owner’s Manual - available in PDF format from the TI
web site at: www.ti.com/lvds
USING IMAGE ENHANCEMENT FEATURES
The DS90UR916Q offers two FRC dithering blocks and one White Balance lookup table. Depending upon the
color depth of the source data, display and LUT contents, these blocks may be independently enabled or
disabled in various combinations. Refer to Table 11 below for recommendations.
Table 11. Enabling Image Enhancement Features
Source
White Balance LUT
Display
FRC1
FRC2
24-bit
24-bit
24-bit
Disabled
Disabled
24-bit
24-bit
18-bit
Disabled
Enabled
24-bit
18-bit
18-bit
Enabled
Disabled
18-bit
24-bit
24-bit
Disabled
Disabled
18-bit
24-bit
18-bit
Disabled
Enabled
18-bit
18-bit
18-bit
Disabled
Disabled
If the white balance feature is to be used all 3 LUTs must be fully loaded after initial power-up. LUTs must be
loaded sequentially — first Red, second Green, third Blue — and all 256 values must be loaded into each LUT.
After power-up the following procedure must be followed.
1. Power-on (reload = disable by default)
2. Enable WB
3. Set page Register RED
4. Initial RED LUT load (all 256 bytes) '916 will self clear page register
5. Set page Register GREEN
6. Initial GREEN LUT load (all 256 bytes) '916 will self clear page register
7. Set page Register BLUE
8. Initial BLUE LUT load (all 256 bytes) '916 will self clear page register
Once all LUTs are loaded, ‘916 will enable the WB output
To
1.
2.
3.
4.
5.
6.
7.
reload LUT contents, after the initial load at power-up, the following procedure must be followed.
Enable RELOAD
Set appropriate page register (RED, GREEN or BLUE)
Load new LUT values (any sequence, any order, any number)
Load appropriate R, G or B 255 value to clear page register
Set appropriate page register (RED, GREEN or BLUE)
Load new LUT values (any sequence, any order, any number)
Load appropriate R, G or B 255 value to clear page register
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8. Set appropriate page register (RED, GREEN or BLUE)
9. Load new LUT values (any sequence, any order, any number)
10. Load appropriate R, G or B 255 value to clear page register
11. Disable RELOAD
ALTERNATE COLOR / DATA MAPPING
Color Mapped data Pin names are provided to specify a recommended mapping for 24-bit Color Applications.
Seven [7] is assumed to be the MSB, and Zero [0] is assumed to be the LSB. While this is recommended it is not
required. When connecting to earlier generations of FPD-Link II Ser and Des devices, a color mapping review is
recommended to ensure the correct connectivity is obtained. Table 12 provides examples for interfacing to 18-bit
applications with or without the video control signals embedded. The DS90UR916Q Des also provides additional
flexibility with the MAP_SEL feature as well.
Table 12. Alternate Color / Data Mapping — See Text Below
18-bit
RGB
18-bit
RGB
18-bit
RGB
24-bit
RGB
905 Pin
Name
916 Pin
Name
24-bit
RGB
18-bit
RGB
18-bit
RGB
18-bit
RGB
0
LSB R0
GP0
RO
RO
R0
R0
GP0
LSB R0
0
0
R1
GP1
R1
R1
R1
R1
GP1
R1
0
R0
R2
R0
R2
R2
R2
R2
R0
R2
R0
R1
R3
R1
R3
R3
R3
R3
R1
R3
R1
R2
R4
R2
R4
R4
R4
R4
R2
R4
R2
R3
MSB R5
R3
R5
R5
R5
R5
R3
MSB R5
R3
R4
LSB G0
R4
R6
R6
R6
R6
R4
LSB G0
R4
R5
G1
R5
R7
R7
R7
R7
R5
G1
R5
0
G2
GP2
G0
G0
G0
G0
GP2
G2
0
0
G3
GP3
G1
G1
G1
G1
GP3
G3
0
G0
G4
G0
G2
G2
G2
G2
G0
G4
G0
G1
MSB G5
G1
G3
G3
G3
G3
G1
MSB G5
G1
G2
LSB B0
G2
G4
G4
G4
G4
G2
LSB0
G2
G3
B1
G3
G5
G5
G5
G5
G3
B1
G3
G4
B2
G4
G6
G6
G6
G6
G4
B2
G4
G5
B3
G5
G7
G7
G7
G7
G5
B3
G5
0
B4
GP4
B0
B0
B0
B0
GP4
B4
0
0
MSB B5
GP5
B1
B1
B1
B1
GP5
MSB B5
0
B0
HS
B0
B2
B2
B2
B2
B0
HS
B0
B1
VS
B1
B3
B3
B3
B3
B1
VS
B1
B2
DE
B2
B4
B4
B4
B4
B2
DE
B2
B3
GP0
B3
B5
B5
B5
B5
B3
GP0
B3
B4
GP1
B4
B6
B6
B6
B6
B4
GP1
B4
B5
GP2
B5
B7
B7
B7
B7
B5
GP2
B5
HS
GND
HS
HS
HS
HS
HS
HS
GND
HS
VS
GND
VS
VS
VS
VS
VS
VS
GND
VS
DE
GND
DE
DE
DE
DE
DE
DE
GND
Scenario
4
Scenario
3
Scenario
2
Scenario
1
905 Pin
Name
916 Pin
Name
Scenario
1
Scenario
2
Scenario
3
38
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Scenario 4
Scenario 4 supports an 18-bit RGB color mapping and 3 embedded video control signals. All LSBs are set to “0”.
FRC and white balance may be enabled with this scenario.
Scenario 3
Scenario 3 supports an 18-bit RGB color mapping, 3 un-embedded video control signals, and up to three general
purpose signals. This scenario is NOT supported when FRC or white balance are enabled on the DS90UR916.
Scenario 2
Scenario 2 supports an 18-bit RGB color mapping, 3 embedded video control signals, and up to six general
purpose signals. This scenario is NOT supported when FRC or white balance are enabled on the DS90UR916.
Scenario 1
Scenario 1 supports the 24-bit RGB color mapping, along with the 3 embedded video control signals. This is the
native mode for the chipset. FRC and white balance may be enabled with this scenario.
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REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
•
40
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 39
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PACKAGE OPTION ADDENDUM
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18-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DS90UR916QSQ/NOPB
ACTIVE
WQFN
NKB
60
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UR916QSQ
DS90UR916QSQE/NOPB
ACTIVE
WQFN
NKB
60
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UR916QSQ
DS90UR916QSQX/NOPB
ACTIVE
WQFN
NKB
60
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UR916QSQ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DS90UR916QSQ/NOPB
Package Package Pins
Type Drawing
WQFN
NKB
60
DS90UR916QSQE/NOPB WQFN
NKB
DS90UR916QSQX/NOPB WQFN
NKB
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
60
250
178.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
60
2000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90UR916QSQ/NOPB
WQFN
NKB
60
1000
367.0
367.0
38.0
DS90UR916QSQE/NOPB
WQFN
NKB
60
250
210.0
185.0
35.0
DS90UR916QSQX/NOPB
WQFN
NKB
60
2000
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
NKB0060B
VQFN - 0.8 mm max height
SCALE 1.500
PLASTIC QUAD FLATPACK - NO LEAD
9.1
8.9
B
A
PIN 1 INDEX AREA
9.1
8.9
0.8
0.7
C
SEATING PLANE
0.05
0.00
0.08 C
2X 7
6.3 0.1
EXPOSED
THERMAL PAD
SYMM
16
15
31
SYMM
61
2X 7
1
56X 0.5
PIN 1 ID
(0.1) TYP
30
45
60
46
0.7
60X
0.5
60X
0.3
0.2
0.1
0.05
C A B
4214995/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
NKB0060B
VQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 6.3)
SYMM
60X (0.8)
46
60
SEE SOLDER MASK
DETAIL
60X (0.25)
1
45
56X (0.5)
(1.1) TYP
(1.2) TYP
(R0.05) TYP
( 0.2) TYP
VIA
SYMM
61
(0.6) TYP
15
(8.6)
31
16
30
(0.6) TYP
(1.2) TYP
(1.1) TYP
(8.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
OPENING
SOLDER MASK DEFINED
SOLDER MASK DETAILS
4214995/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
NKB0060B
VQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
25X ( 1)
(1.2) TYP
60X (0.8)
60
46
60X (0.25)
1
45
56X (0.5)
(R0.05) TYP
(1.2) TYP
61
SYMM
(8.6)
15
31
30
16
SYMM
(8.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 8X
EXPOSED PAD 61
63% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4214995/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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