Texas Instruments | DS90CF363B 3.3V Prog LVDS Transm 18-Bit FPDLink -65 MHz (Rev. D) | Datasheet | Texas Instruments DS90CF363B 3.3V Prog LVDS Transm 18-Bit FPDLink -65 MHz (Rev. D) Datasheet

Texas Instruments DS90CF363B 3.3V Prog LVDS Transm 18-Bit FPDLink -65 MHz (Rev. D) Datasheet
DS90CF363B
www.ti.com
SNLS180D – JULY 2004 – REVISED APRIL 2013
+3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link -65 MHz
Check for Samples: DS90CF363B
FEATURES
1
•
2
•
•
•
•
•
•
•
•
•
•
•
No Special Start-up Sequence Required
between Clock/Data and /PD Pins. Input Signal
(Clock and Data) can be Applied Either Before
or After the Device is Powered.
Support Spread Spectrum Clocking up to
100KHz Frequency Modulation & Deviations of
±2.5% Center Spread or −5% Down Spread.
"Input Clock Detection" Feature will Pull all
LVDS Pairs to Logic Low when Input Clock is
Missing and when /PD Pin is Logic High.
18 to 68 MHz Shift Clock Support
Best–in–Class Set & Hold Times on TxINPUTs
Tx Power Consumption < 130 mW (typ)
@65MHz Grayscale
40% Less Power Dissipation than BiCMOS
Alternatives
Tx Power-Down Mode < 37μW (typ)
Supports VGA, SVGA, XGA and Dual Pixel
SXGA.
Narrow Bus Reduces Cable Size and Cost
Up to 1.3 Gbps Throughput
Up to 170 Megabytes/sec Bandwidth
•
•
•
•
•
345 mV (typ) Swing LVDS Devices for Low EMI
PLL Requires no External Components
Compatible with TIA/EIA-644 LVDS Standard
Low Profile 48-lead TSSOP Package
Improved Replacement for:
– SN75LVDS84, DS90CF363A
DESCRIPTION
The DS90CF363B transmitter converts 21 bits of
CMOS/TTL data into three LVDS (Low Voltage
Differential Signaling) data streams. A phase-locked
transmit clock is transmitted in parallel with the data
streams over a fourth LVDS link. Every cycle of the
transmit clock 21 bits of input data are sampled and
transmitted. At a transmit clock frequency of 65 MHz,
18 bits of RGB data and 3 bits of LCD timing and
control data (FPLINE, FPFRAME, DRDY) are
transmitted at a rate of 455 Mbps per LVDS data
channel. Using a 65 MHz clock, the data throughput
is 170 Mbytes/sec. The DS90CF363B is fixed as a
Falling edge strobe transmitter and will interoperate
with a Falling edge strobe Receiver (DS90CF366)
without any translation logic.
This chipset is an ideal means to solve EMI and
cable size problems associated with wide, high speed
TTL interfaces.
Block Diagram
Figure 1. DS90CF363B
See Package Number DGG0048A
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2013, Texas Instruments Incorporated
DS90CF363B
SNLS180D – JULY 2004 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
Value
Unit
−0.3 to +4
V
CMOS/TTL Input Voltage
−0.3 to (VCC + 0.3)
V
LVDS Driver Output Voltage
−0.3 to (VCC + 0.3)
V
Supply Voltage (VCC)
LVDS Output Short Circuit
Duration
Continuous
Junction Temperature
+150
°C
Storage Temperature
−65 to +150
°C
+260
°C
1.98
W
Lead Temperature
(Soldering, 4 sec)
Maximum Package Power Dissipation Capacity @ 25°C
DGG-48 (TSSOP) Package:
DS90CF363B
Package Derating:
DS90CF363B
16 mW/°C above +25°C
ESD Rating (HBM, 1.5 kΩ, 100 pF)
ESD Rating (EIAJ, 0Ω, 200 pF)
(1)
7
kV
500
V
Absolute Maximum Ratings are those values beyond which the safety of the device cannot be verified. They are not meant to imply that
the device should be operated at these limits. Electrical Characteristics specify conditions for device operation.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2)
Recommended Operating Conditions
Supply Voltage (VCC)
Operating Free Air Temperature (TA)
Min
Nom
Max
Units
3.0
3.3
3.6
V
−10
+25
+70
°C
200
mVPP
68
MHz
Supply Noise Voltage (VCC)
TxCLKIN frequency
18
Electrical Characteristics (1)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ (2)
Max
Units
CMOS/TTL DC SPECIFICATIONS
VIH
High Level Input Voltage
2.0
VCC
V
VIL
Low Level Input Voltage
GND
0.8
V
VCL
Input Clamp Voltage
ICL = −18 mA
−0.79
−1.5
V
IIN
Input Current
V IN = 0.4V, 2.5V or VCC
+1.8
+10
μA
V IN = GND
−10
0
RL = 100Ω
250
345
μA
LVDS DC SPECIFICATIONS
VOD
Differential Output Voltage
ΔVOD
Change in VOD between complimentary
output states
VOS
Offset Voltage
ΔVOS
Change in VOS between complimentary
output states
IOS
Output Short Circuit Current
(1)
(2)
(3)
2
(3)
1.13
VOUT = 0V, RL = 100Ω
1.25
−3.5
450
mV
35
mV
1.38
V
35
mV
−5
mA
Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground
unless otherwise specified (except VOD and ΔVOD ).
Typical values are given for VCC = 3.3V and T A = +25°C unless specified otherwise.
VOS previously referred as VCM.
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: DS90CF363B
DS90CF363B
www.ti.com
SNLS180D – JULY 2004 – REVISED APRIL 2013
Electrical Characteristics(1) (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
IOZ
Typ (2)
Max
Units
Power Down = 0V,
VOUT = 0V or V CC
±1
±10
μA
RL = 100Ω,
f = 25 MHz
CL = 5 pF,
f = 40 MHz
Worst Case Pattern
f = 65 MHz
(Figure 2 and Figure 5 ) "
Typ " values are given for
V CC = 3.6V and T A =
+25°C, " Max " values are
given for V CC = 3.6V and T
A = −10°C
29
40
mA
34
45
mA
42
55
mA
RL = 100Ω,
f = 25 MHz
CL = 5 pF,
f = 40 MHz
16 Grayscale Pattern
f = 65 MHz
(Figure 3 and Figure 5 ) "
Typ " values are given for
V CC = 3.6V and T A =
+25°C, " Max " values are
given for V CC = 3.6V and T
A = −10°C
28
40
mA
32
45
mA
39
50
mA
Power Down = Low
Driver Outputs in TRI-STATE under
Power Down Mode
11
150
μA
Parameter
Conditions
Output TRI-STATE Current
Min
TRANSMITTER SUPPLY CURRENT
ICCTW
ICCTG
ICCTZ
Transmitter Supply Current
Worst Case
Transmitter Supply Current
16 Grayscale
Transmitter Supply Current
Power Down
Recommended Transmitter Input Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
5
ns
T
50.0
ns
0.5T
0.65T
ns
0.65T
ns
6.0
ns
TCIT
TxCLK IN Transition Time (Figure 6 )
TCIP
TxCLK IN Period (Figure 7 )
14.7
TCIH
TxCLK IN High Time (Figure 7 )
0.35T
TCIL
TxCLK IN Low Time (Figure 7 )
0.35T
0.5T
TXIT
TxIN, and Power Down pin transition Time
TXPD
Minimum pulse width for Power Down pin signal
1.5
1
us
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
LLHT
LVDS Low-to-High Transition Time (Figure 5 )
0.75
1.4
ns
LHLT
LVDS High-to-Low Transition Time (Figure 5 )
0.75
1.4
ns
TPPos0
Transmitter Output Pulse Position for Bit 0 (Figure 12 ) (1)
−0.20
0
+0.20
ns
TPPos1
Transmitter Output Pulse Position for Bit 1
2.00
2.20
2.40
ns
TPPos2
Transmitter Output Pulse Position for Bit 2
4.20
4.40
4.60
ns
TPPos3
Transmitter Output Pulse Position for Bit 3
6.39
6.59
6.79
ns
TPPos4
Transmitter Output Pulse Position for Bit 4
8.59
8.79
8.99
ns
TPPos5
Transmitter Output Pulse Position for Bit 5
10.70
10.99
11.19
ns
TPPos6
Transmitter Output Pulse Position for Bit 6
12.99
13.19
13.39
ns
(1)
f = 65
MHz
The Minimum and Maximum Limits are based on statistical analysis of the device performance over process, voltage, and temperature
ranges. This parameter is functionality tested only on Automatic Test Equipment (ATE).
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: DS90CF363B
3
DS90CF363B
SNLS180D – JULY 2004 – REVISED APRIL 2013
www.ti.com
Transmitter Switching Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
(1)
Max
Units
−0.25
0
+0.25
ns
3.32
3.57
3.82
ns
TPPos0
Transmitter Output Pulse Position for Bit 0 (Figure 12 )
TPPos1
Transmitter Output Pulse Position for Bit 1
TPPos2
Transmitter Output Pulse Position for Bit 2
6.89
7.14
7.39
ns
TPPos3
Transmitter Output Pulse Position for Bit 3
10.46
10.71
10.96
ns
TPPos4
Transmitter Output Pulse Position for Bit 4
14.04
14.29
14.54
ns
TPPos5
Transmitter Output Pulse Position for Bit 5
17.61
17.86
18.11
ns
TPPos6
Transmitter Output Pulse Position for Bit 6
21.18
21.43
21.68
ns
−0.45
0
+0.45
ns
5.26
5.71
6.16
ns
(1)
f = 40
MHz
Typ
TPPos0
Transmitter Output Pulse Position for Bit 0 (Figure 12 )
TPPos1
Transmitter Output Pulse Position for Bit 1
f=
25MHz
TPPos2
Transmitter Output Pulse Position for Bit 2
10.98
11.43
11.88
ns
TPPos3
Transmitter Output Pulse Position for Bit 3
16.69
17.14
17.59
ns
TPPos4
Transmitter Output Pulse Position for Bit 4
22.41
22.86
23.31
ns
TPPos5
Transmitter Output Pulse Position for Bit 5
28.12
28.57
29.02
ns
TPPos6
Transmitter Output Pulse Position for Bit 6
33.84
34.29
34.74
ns
TSTC
TxIN Setup to TxCLK IN (Figure 7 )
2.5
THTC
TxIN Hold to TxCLK IN (Figure 7 )
0.5
TCCD
TxCLK IN to TxCLK OUT Delay (Figure 8 ) 50% duty cycle input clock is assumed, T
A= −10°C, and 65MHz for " Min ", T A = 70°C, and 25MHz for " Max ", VCC = 3.6V
SSCG
Spread Spectrum Clock support; Modulation frequency with a linear
profile (2)
ns
ns
3.011
f = 25
MHz
100KHz ±
2.5%/−5%
f = 40
MHz
100KHz ±
2.5%/−5%
f = 65
MHz
100KHz ±
2.5%/−5%
6.082
ns
TPLLS
Transmitter Phase Lock Loop Set (Figure 9 )
10
ms
TPDD
Transmitter Power Down Delay (Figure 11 )
100
ns
(2)
Care must be taken to ensure TSTC and THTC are met so input data are sampling correctly. This SSCG parameter only shows the
performance of tracking Spread Spectrum Clock applied to TxCLK IN pin, and reflects the result on TxCLKOUT+ and TxCLK− pins.
AC Timing Diagrams
Figure 2. “Worst Case” Test Pattern
4
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: DS90CF363B
DS90CF363B
www.ti.com
SNLS180D – JULY 2004 – REVISED APRIL 2013
The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern
approximates signal switching needed to produce groups of 16 vertical stripes across the display.
Figure 2 and Figure 3 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Recommended pin to signal mapping. Customer may choose to define differently.
Figure 3. “16 Grayscale” Test Pattern
Figure 4. DS90CF363B (Transmitter) LVDS Output Load
Figure 5. DS90CF363B (Transmitter) LVDS Transition Times
Figure 6. DS90CF363B (Transmitter) Input Clock Transition Time
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: DS90CF363B
5
DS90CF363B
SNLS180D – JULY 2004 – REVISED APRIL 2013
www.ti.com
Figure 7. DS90CF363B (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)
Figure 8. DS90CF363B (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe)
Figure 9. DS90CF363B (Transmitter) Phase Lock Loop Set Time
Figure 10. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs
6
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: DS90CF363B
DS90CF363B
www.ti.com
SNLS180D – JULY 2004 – REVISED APRIL 2013
Figure 11. Transmitter Power Down Delay
Figure 12. Transmitter LVDS Output Pulse Position Measurement
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: DS90CF363B
7
DS90CF363B
SNLS180D – JULY 2004 – REVISED APRIL 2013
www.ti.com
DS90CF363B PIN DESCRIPTIONS — FPD LINK TRANSMITTER
Pin Name
I/O
No.
TxIN
I
21
TTL level input. This includes: 6 Red, 6 Green, 6 Blue, and 3 control lines—FPLINE, FPFRAME and
DRDY (also referred to as HSYNC, VSYNC, Data Enable).
TxOUT+
O
3
Positive LVDS differential data output.
TxOUT−
O
3
Negative LVDS differential data output.
FPSHIFT IN
I
1
TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN.
TxCLK OUT+
O
1
Positive LVDS differential clock output.
TxCLK OUT−
O
1
Negative LVDS differential clock output.
PWR DOWN
I
1
TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power down.
See Applications Information .
VCC
I
4
Power supply pins for TTL inputs.
GND
I
4
Ground pins for TTL inputs.
PLL VCC
I
1
Power supply pin for PLL.
PLL GND
I
2
Ground pins for PLL.
LVDS VCC
I
1
Power supply pin for LVDS outputs.
LVDS GND
I
3
Ground pins for LVDS outputs.
1
No connect
NC
Description
APPLICATIONS INFORMATION
The DS90CF363B are backward compatible with the DS90C363/DS90CF363A and are a pin-for-pin
replacement.
This device may also be used as a replacement for the DS90CF563 (5V, 65MHz) and DS90CF561 (5V, 40MHz)
FPD-Link Transmitters with certain considerations/modifications:
1. Change 5V power supply to 3.3V. Provide this supply to the VCC, LVDS VCC and PLL VCC of the transmitter.
TRANSMITTER INPUT PINS
The DS90CF363B transmitter input and control inputs accept 3.3V LVTTL/LVCMOS levels. They are not 5V
tolerant.
TRANSMITTER INPUT CLOCK/DATA SEQUENCING
The DS90CF363B does not require any special requirement for sequencing of the input clock/data and PD
(PowerDown) signal. The DS90CF363B offers a more robust input sequencing feature where the input clock/data
can be inserted after the release of the PD signal. In the case where the clock/data is stopped and reapplied,
such as changing video mode within Graphics Controller, it is not necessary to cycle the PD signal. However,
there are in certain cases where the PD may need to be asserted during these mode changes. In cases where
the source (Graphics Source) may be supplying an unstable clock or spurious noisy clock output to the LVDS
transmitter, the LVDS Transmitter may attempt to lock onto this unstable clock signal but is unable to do so due
the instability or quality of the clock source. The PD signal in these cases should then be asserted once a stable
clock is applied to the LVDS transmitter. Asserting the PWR DOWN pin will effectively place the device in reset
and disable the PLL, enabling the LVDS Transmitter into a power saving standby mode. However, it is still
generally a good practice to assert the PWR DOWN pin or reset the LVDS transmitter whenever the clock/data is
stopped and reapplied but it is not mandatory for the DS90CF363B.
SPREAD SPECTRUM CLOCK SUPPORT
The DS90CF363B can support Spread Spectrum Clocking signal type inputs. The DS90CF363B outputs will
accurately track Spread Spectrum Clock/Data inputs with modulation frequencies of up to 100KHz (max.)with
either center spread of ±2.5% or down spread -5% deviations.
POWER SOURCES SEQUENCE
In typical applications, it is recommended to have VCC, LVDS VCC and PLL VCC from the same power source with
three separate de-coupling bypass capacitor groups. There is no requirement on which VCC entering the device
first.
8
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: DS90CF363B
DS90CF363B
www.ti.com
SNLS180D – JULY 2004 – REVISED APRIL 2013
Pin Diagram
Figure 13.
Typical Application
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: DS90CF363B
9
DS90CF363B
SNLS180D – JULY 2004 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D
•
10
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
Submit Documentation Feedback
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: DS90CF363B
PACKAGE OPTION ADDENDUM
www.ti.com
17-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DS90CF363BMT/NOPB
ACTIVE
TSSOP
DGG
48
38
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-10 to 70
DS90CF363BMT
DS90CF363BMTX/NOPB
ACTIVE
TSSOP
DGG
48
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
-10 to 70
DS90CF363BMT
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
DS90CF363BMTX/NOPB TSSOP
DGG
48
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
8.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.2
1.6
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90CF363BMTX/NOPB
TSSOP
DGG
48
1000
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertising