Texas Instruments | DS91M125 125 MHz 1:4 M-LVDS Repeater with LVDS Input (Rev. C) | Datasheet | Texas Instruments DS91M125 125 MHz 1:4 M-LVDS Repeater with LVDS Input (Rev. C) Datasheet

Texas Instruments DS91M125 125 MHz 1:4 M-LVDS Repeater with LVDS Input (Rev. C) Datasheet
DS91M125
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SNLS290C – AUGUST 2008 – REVISED APRIL 2013
DS91M125 125 MHz 1:4 M-LVDS Repeater with LVDS Input
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FEATURES
DESCRIPTION
•
The DS91M125 is a 1:4 M-LVDS repeater designed
for driving and distributing clock or data signals to up
to four multipoint networks.
1
2
•
•
•
•
•
•
•
•
DC - 125 MHz / 250 Mbps Low Jitter, Low
Skew, Low Power Operation
Independent Driver Enable Pins
Outputs Conform to TIA/EIA-899 M-LVDS
Standard
Controlled Transition Times Minimize
Reflections
Inputs Conform to TIA/EIA-644-A LVDS
Standard
8 kV ESD on M-LVDS Output Pins Protects
Adjoining Components
Flow-Through Pinout Simplifies PCB Layout
Industrial Operating Temperature Range
(−40°C to +85°C)
Available in a Space Saving SOIC-16 Package
APPLICATIONS
•
•
•
Multidrop / Multipoint Clock and Data
Distribution
High-Speed, Low Power, Short-Reach
Alternative to TIA/EIA-485/422
Clock Distribution in AdvancedTCA (ATCA)
and MicroTCA (μTCA, uTCA) Backplanes
M-LVDS (Multipoint LVDS) is a new family of bus
interface devices based on LVDS technology
specifically designed for multipoint and multidrop
cable and backplane applications. It differs from
standard LVDS in providing increased drive current to
handle double terminations that are required in multipoint applications. Controlled transition times
minimize reflections that are common in multipoint
configurations due to unterminated stubs.
A single DS91M125 channel is a 1:4 repeater that
accepts M-LVDS/LVDS/CML/LVPECL signals and
converts them to M-LVDS signal levels. Each output
has an associated independent driver enable pin. The
DS91M125 input conforms to the LVDS standard.
The DS91M125 has a flow-through pinout for easy
PCB layout. It provides a new alternative for high
speed multipoint interface applications. It is packaged
in a space saving SOIC-16 package.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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DS91M125
SNLS290C – AUGUST 2008 – REVISED APRIL 2013
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Typical Application
Line Card in SLOT 1
Line Card in SLOT N-1
Line Card in SLOT N
M-LVDS Receivers
M-LVDS Receivers
DS91M125
RT
Z0
RT
RT
Z0
RT
RT
Z0
RT
RT
Z0
RT
RT = ZLOADED
BACKPLANE
Connection Diagram
DE0
1
16
B0
DE1
2
15
A0
DE2
3
14
A1
VDD
4
13
B1
GND
5
12
B2
DI+
6
11
A2
DI-
7
10
A3
DE3
8
9
B3
Figure 1. 16-Lead (0.150″ Wide) Molded Small Outline Package, JEDEC
See Package Number D
2
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Logic Diagram
DE0
B0
A0
DE1
B1
A1
DI+
DI-
B2
A2
DE2
B3
A3
DE3
PIN DESCRIPTIONS
Number
Name
I/O, Type
1, 2, 3, 8
DE
I, LVCMOS
Description
6
DI+
I, LVDS
Non-inverting receiver input pin.
7
DI-
I, LVDS
Inverting receiver input pin.
5
GND
Power
10, 11, 14, 15
A
O, M-LVDS
Non-inverting driver output pin.
9, 12, 13, 16
B
O, M-LVDS
Inverting driver output pin.
4
VDD
Power
Driver enable pins: When DE is low, the driver is disabled. When DE is high,
the driver is enabled. There is a 300 kΩ pulldown resistor on each pin.
Ground pin.
Power supply pin, +3.3V ± 0.3V
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2)
−0.3V to +4V
Supply Voltage
−0.3V to (VDD + 0.3V)
LVCMOS Input Voltages
−1.9V to +5.5V
M-LVDS Output Voltages
−0.3V to (VDD + 0.3V)
LVDS Input Voltages
Maximum Package Power Dissipation at +25°C
SOIC Package
2.21W
Derate SOIC Package
Thermal Resistance (4-Layer, 2 oz. Cu, JEDEC)
19.2 mW/°C above +25°C
θJA
52°C/W
θJC
19°C/W
Maximum Junction Temperature
140°C
−65°C to +150°C
Storage Temperature Range
Lead Temperature (Soldering, 4 seconds)
ESD Susceptibility
260°C
HBM (3)
≥ 8 kV
MM (4)
≥ 250V
CDM
(1)
(2)
(3)
(4)
(5)
(5)
≥ 1250V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
Human Body Model, applicable std. JESD22-A114C
Machine Model, applicable std. JESD22-A115-A
Field Induced Charge Device Model, applicable std. JESD22-C101-C
RECOMMENDED OPERATING CONDITIONS
Min
Typ
Max
Units
Supply Voltage, VDD
3.0
3.3
3.6
V
Voltage at M-LVDS Outputs
−1.4
+3.8
V
Voltage at LVDS Inputs
0
VDD
V
LVCMOS Input Voltage High VIH
2.0
VDD
V
LVCMOS Input Voltage Low VIL
0
0.8
V
+85
°C
Operating Free Air Temperature TA
4
−40
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ELECTRICAL CHARACTERISTICS
Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3) (4)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
V
LVCMOS DC Specifications
VIH
High-Level Input Voltage
2.0
VDD
VIL
Low-Level Input Voltage
GND
0.8
V
IIH
High-Level Input Current
VIH = 3.6V
IIL
Low-Level Input Current
VCL
Input Clamp Voltage
-15
±1
15
μA
VIL = 0V
-15
±1
15
μA
IIN = -18 mA
-1.5
480
V
M-LVDS Driver DC Specifications
|VAB|
Differential output voltage magnitude
RL = 50Ω, CL = 5pF
ΔVAB
Change in differential output voltage magnitude
between logic states
See Figure 2and Figure 4
VOS(SS)
Steady-state common-mode output voltage
RL = 50Ω, CL = 5pF
|ΔVOS(SS)|
Change in steady-state common-mode output voltage
between logic states
See Figure 2
and Figure 3
VA(OC)
Maximum steady-state open-circuit output voltage
See Figure 5
VB(OC)
Maximum steady-state open-circuit output voltage
VP(H)
Voltage overshoot, low-to-high level output
mV
−50
0
+50
mV
0.3
1.6
2.1
V
0
+50
mV
0
2.4
V
0
2.4
V
1.2VSS
V
RL = 50Ω, CL = 5pF,CD = 0.5pF
See Figure 7 and Figure 8
(5)
VP(L)
650
−0.2V
Voltage overshoot, high-to-low level output
V
SS
(6)
IOS
Differential short-circuit output current
See Figure 6
IA
Driver output current
VA = 3.8V, VB = 1.2V
IB
Driver output current
-43
43
mA
32
µA
VA = 0V or 2.4V, VB = 1.2V
−20
+20
µA
VA = −1.4V, VB = 1.2V
−32
VB = 3.8V, VA = 1.2V
VB = 0V or 2.4V, VA = 1.2V
−20
VB = −1.4V, VA = 1.2V
−32
−4
IAB
Driver output differential current (IA − IB)
VA = VB, −1.4V ≤ V ≤ 3.8V
IA(OFF)
Driver output power-off current
VA = 3.8V, VB = 1.2V,
DE = 0V
0V ≤ VDD ≤ 1.5V
(1)
(2)
(3)
(4)
(5)
(6)
VA = 0V or 2.4V, VB = 1.2V,
DE = 0V
0V ≤ VDD ≤ 1.5V
−20
VA = −1.4V, VB = 1.2V,
DE = 0V
0V ≤ VDD ≤ 1.5V
−32
µA
32
µA
+20
µA
µA
+4
µA
32
µA
+20
µA
µA
The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD and ΔVOD.
Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
CL includes fixture capacitance and CD includes probe capacitance.
Specification is ensured by characterization and is not tested in production.
Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.
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ELECTRICAL CHARACTERISTICS (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.(1)(2)(3)(4)
Symbol
IB(OFF)
Parameter
Conditions
Driver output power-off current
Min
VB = 3.8V, VA = 1.2V,
DE = 0V
0V ≤ VDD ≤ 1.5V
VB = 0V or 2.4V, VA = 1.2V,
DE = 0V
0V ≤ VDD ≤ 1.5V
−20
VB = −1.4V, VA = 1.2V,
DE = 0V
0V ≤ VDD ≤ 1.5V
−32
Driver output power-off differential current (IA(OFF) −
IB(OFF))
VA = VB, −1.4V ≤ V ≤ 3.8V,
DE = 0V
0V ≤ VDD ≤ 1.5V
−4
CA
Driver output capacitance
VDD = OPEN
CB
Driver output capacitance
CAB
CA/B
IAB(OFF)
Typ
Max
Units
32
µA
+20
µA
µA
+4
µA
7.8
pF
7.8
pF
Driver output differential capacitance
3
pF
Driver output capacitance balance (CA/CB)
1
LVDS Receiver DC Specifications
VIT+
Positive-going differential input voltage threshold
-5
VIT−
Negative-going differential input voltage threshold
VCMR
Common mode voltage range
VID = 100 mV
IIN
Input current
VIN = 3.6V, VDD = 3.6V
CIN
Input capacitance
−100
100
-5
0.05
mV
mV
VDD0.05
V
±1
±10
µA
VIN = 0V, VDD = 3.6V
±1
±10
µA
VDD = OPEN
5
pF
POWER SUPPLY CURRENT
ICCD
Driver Supply Current
RL = 50Ω, DE = VDD
67
78
mA
ICCZ
TRI-STATE Supply Current
DE = GND
21
26
mA
6
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SWITCHING CHARACTERISTICS
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
(1) (2) (3)
Conditions
Min
Typ
Max
Units
DRIVER AC SPECIFICATION
tPLH
Differential Propagation Delay Low to High
RL = 50Ω, CL = 5 pF,
3.0
5.5
8.5
ns
tPHL
Differential Propagation Delay High to Low
CD = 0.5 pF
3.0
5.5
8.5
ns
tSKD1 (tsk(p))
Pulse Skew |tPLHD − tPHLD| (4) (5)
See Figure 7 and Figure 8
65
350
ps
65
400
ps
2.2
2.5
ns
5.5
ns
tSKD2
Channel-to-Channel Skew
tSKD3
Part-to-Part Skew (7) (5)
tSKD4
Part-to-Part Skew (8)
(6) (5)
(5)
tTLH (tr)
Rise Time
tTHL (tf)
Fall Time (5)
tPZH
Enable Time (Z to Active High)
tPZL
tPLZ
tPHZ
Disable Time (Active High to Z)
fMAX
Maximum Operating Frequency (5)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
1.1
2.0
3.0
ns
1.1
2.0
3.0
ns
RL = 50Ω, CL = 5 pF,
6
11
ns
Enable Time (Z to Active Low )
CD = 0.5 pF
6
11
ns
Disable Time (Active Low to Z)
See Figure 9 and Figure 10
6
11
ns
6
11
125
ns
MHz
The ELECTRICAL CHARACTERISTICS tables list ensured specifications under the listed Recommended Operating Conditions except
as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes.
Typical values represent most likely parametric norms for VDD = +3.3V and TA = +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
CL includes fixture capacitance and CD includes probe capacitance.
tSKD1, |tPLHD − tPHLD|, is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
Specification is ensured by characterization and is not tested in production.
tSKD2, Channel-to-Channel Skew, is the difference in propagation delay (tPLHD or tPHLD) among all output channels.
tSKD3, Part-to-Part Skew, is defined as the difference between the minimum and maximum specified differential propagation delays. This
specification applies to devices at the same VDD and within 5°C of each other within the operating temperature range.
tSKD4, Part-to-Part Skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices
over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min|
differential propagation delay.
TEST CIRCUITS AND WAVEFORMS
CL
A
RL/2
DI+
Power Supply
D
Power Supply
DI-
VOS
RL/2
Driver ENABLED
VAB
CL
CL
B
Figure 2. Differential Driver Test Circuit
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A
~ 1.9V
B
~ 1.3V
'VOS(SS)
VOS
VOS(PP)
Figure 3. Differential Driver Waveforms
A
3.32 k:
DI+
Power Supply
D
Power Supply
VTEST
RL
DI-
VAB
3.32 k:
B
Vary VTEST ± 1.0V to 3.4V
Figure 4. Differential Driver Full Load Test Circuit
DI+
A
Power Supply
D
Power Supply
DI-
V = VA or VB
B
1.62 k:
V
Figure 5. Differential Driver DC Open Test Circuit
DI+
A
Power Supply
D
Power Supply
DI-
IOS
B
Vary VTEST ± 1.0V to 3.4V
VTEST
Figure 6. Differential Driver Short-Circuit Test Circuit
8
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CL
A
DI+
Signal Generator
CD
D
DI-
RL
B
50:
Driver ENABLED
50:
CL
Figure 7. Driver Propagation Delay and Transition Time Test Circuit
1.3V
DI+
1.2V
1.2V
DI-
1.1V
tPLH
tPHL
B
VOH
0V (Differential)
0V
VOL
A
VDIFF
VP(H)
VSS
90%
90%
0V
0V
VDIFF = A - B
VP(L)
10%
10%
0 VSS
tTLH
tTHL
Figure 8. Driver Propagation Delays and Transition Time Waveforms
CL
A
Power Supply
RL/2
DI+
D
Power Supply
CD
VOS(SS) TYP
DI-
RL/2
B
DE
Generator
CL
50:
Figure 9. Driver TRI-STATE Delay Test Circuit
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DE
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VDD
VDD /
2
VDD /2
0V
tPHZ
tPZH
~ 0.6V
A-B WHEN DIN = L
50%
50%
0V
0V
A-B WHEN DIN = H
50%
50%
~ 0.6V
tPLZ
tPZL
Figure 10. Driver TRI-STATE Delay Waveforms
10
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TYPICAL PERFORMANCE CHARACTERISTICS
3.4
3.4
f = 125 MHz
DRIVER FALL TIME (10-90%) (ns)
DRIVER RISE TIME (10-90%) (ns)
f = 125 MHz
3.0
VCC = 3.0 V
2.6
2.2
1.8
VCC = 3.6 V
VCC = 3.3 V
1.4
1.0
-50
-10
30
70
110
3.0
VCC = 3.0 V
2.6
2.2
1.8
1.4
1.0
-50
150
-10
TEMPERATURE (°C)
750
600
450
300
f = 1 MHz
VCC = 3.3V
150
TA = 25°C
0
50
75
100
125
f = 125 MHz
VCC = 3.0 V
7.0
6.0
5.0
VCC = 3.6 V
VCC = 3.3 V
4.0
3.0
2.0
-50
-10
30
70
110
150
Figure 14. Driver Propagation Delay (tPLHD) as a Function
of Temperature
8.0
180
VCC = 3.3V
f = 125 MHz
VCC = 3.0 V
7.0
POWER SUPPLY CURRENT (mA)
DRIVER PROPAGATION DELAY (tPHLD) (ns)
150
TEMPERATURE (°C)
Figure 13. Driver Output Signal Amplitude as a Function of
Resistive Load
6.0
5.0
VCC = 3.6 V
VCC = 3.3 V
3.0
2.0
-50
110
8.0
RESISTIVE LOAD (:)
4.0
70
Figure 12. Driver Fall Time as a Function of Temperature
DRIVER PROPAGATION DELAY (tPLHD) (ns)
VOD - DRIVER OUTPUT AMPLITUDE (mV)
900
25
30
TEMPERATURE (°C)
Figure 11. Driver Rise Time as a Function of Temperature
0
VCC = 3.6 V
VCC = 3.3 V
TA = 25°C
150
RL = 50: On all CH)
4 Outputs ON
120
3 Outputs ON
90
2 Outputs ON
60
1 Output ON
30
0
-10
30
70
110
150
0
TEMPERATURE (°C)
25
50
75
100
125
FREQUENCY (MHz)
Figure 15. Driver Propagation Delay (tPHLD) as a Function
of Temperature
Figure 16. Driver Power Supply Current as a Function of
Frequency
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
12
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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PACKAGE OPTION ADDENDUM
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26-Aug-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
DS91M125TMA/NOPB
ACTIVE
SOIC
D
16
48
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS91M125
TMA
DS91M125TMAX/NOPB
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
DS91M125
TMA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
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24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DS91M125TMAX/NOPB
Package Package Pins
Type Drawing
SOIC
D
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
10.3
2.3
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS91M125TMAX/NOPB
SOIC
D
16
2500
367.0
367.0
35.0
Pack Materials-Page 2
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