Texas Instruments | LMH0202 Dual SMPTE 292M / 259M Serial Digital Cable Driver (Rev. C) | Datasheet | Texas Instruments LMH0202 Dual SMPTE 292M / 259M Serial Digital Cable Driver (Rev. C) Datasheet

Texas Instruments LMH0202 Dual SMPTE 292M / 259M Serial Digital Cable Driver (Rev. C) Datasheet
LMH0202
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SNLS212C – FEBRUARY 2006 – REVISED APRIL 2013
LMH0202 Dual SMPTE 292M / 259M Serial Digital Cable Driver
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FEATURES
DESCRIPTION
•
The LMH0202 Dual SMPTE 292M / 259M serial
digital cable driver is a monolithic, high-speed cable
driver designed for use in SMPTE 292M / 259M serial
digital video and ITU-T G.703 serial digital data
transmission applications. The LMH0202 drives 75Ω
transmission lines (Belden 8281, Belden 1694A or
equivalent) at data rates up to 1.485 Gbps.
1
2
•
•
•
•
•
•
•
•
SMPTE 292M, SMPTE 344M and SMPTE 259M
Compliant
Data Rates to 1.485 Gbps
Dual Differential Inputs
Dual 75Ω Differential Outputs
Two Selectable Slew Rates
Adjustable Output Amplitude
Single 3.3V Supply Operation
Commercial Temperature Range: 0°C to +70°C
Typical Power Consumption: 250 mW in SD
Mode and 300 mW in HD Mode
The LMH0202 provides two selectable slew rates for
SMPTE 259M and SMPTE 292M compliance. The
output voltage swing is adjustable via a single
external resistor.
The LMH0202 offers the flexibility to implement either
dual differential inputs or a single differential input
(externally routed via PCB) to dual differential
outputs. The latter option provides an ideal solution
for DVB-ASI applications where only the non-inverted
outputs are typically used.
APPLICATIONS
•
•
•
•
•
•
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SMPTE 292M, SMPTE 344M, and SMPTE 259M
Serial Digital Interfaces
DVB-ASI Applications
Sonet/SDH and ATM Interfaces
Digital Routers and Switches
Distribution Amplifiers
Buffer Applications
Video Cameras
The LMH0202 is powered from a single 3.3V supply.
Power consumption is typically 250 mW in SD mode
and 300 mW in HD mode.
Connection Diagram
2
3
4
5
6
7
8
SDI1
SDO1
SDI1
SDO1
VEE1
SD/HD1
RREF1
SDI2
SDI2
VEE2
RREF2
LMH0202
1
VCC1
SDO2
SDO2
SD/HD2
VCC2
16
15
14
13
12
11
10
9
Figure 1. 16-Pin TSSOP
See PW Package
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2013, Texas Instruments Incorporated
LMH0202
SNLS212C – FEBRUARY 2006 – REVISED APRIL 2013
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Typical Application
VCC
SD/HD1
1.0 PF
75:
0.1 PF
75:
50:
5.6 nH
75:
Differential
Input
1.0 PF
50:
SDI1
SDO1
SDI1
SDO1
75:
0.1 PF
VCC
Coaxial Cable
4.7 PF
Coaxial Cable
5.6 nH
SD/HD1
RREF1
4.7 PF
75:
75:
LMH0202
750:
VCC
75:
0.1 PF
75:
5.6 nH
1.0 PF
75:
50:
SDI2
SDO2
SDI2
SDO2
75:
Differential
Input
1.0 PF
50:
SD/HD2
RREF2
5.6 nH
4.7 PF
Coaxial Cable
4.7 PF
Coaxial Cable
75:
75:
VCC
0.1 PF
750:
SD/HD2
2
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Product Folder Links: LMH0202
LMH0202
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SNLS212C – FEBRUARY 2006 – REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
−0.5V to 3.6V
Supply Voltage:
−0.3V to VCC+0.3V
Input Voltage (all inputs)
Output Current
28 mA
−65°C to +150°C
Storage Temperature Range
Junction Temperature
+150°C
Lead Temperature (Soldering 4 Sec)
+260°C
Package Thermal Resistance
θJA 16-pin TSSOP
θJC 16-pin TSSOP
+125°C/W
+105°C/W
ESD Rating (HBM)
5 kV
ESD Rating (MM)
250V
(1)
Absolute Maximum Ratings are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of Electrical Characteristics specifies acceptable device operating conditions.
Recommended Operating Conditions
Supply Voltage (VCC – VEE):
3.3V ±5%
Operating Free Air Temperature (TA)
0°C to +70°C
DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2).
Symbol Parameter
VCMIN
Input Common Mode Voltage
VSDI
Input Voltage Swing
Conditions
Output Voltage Swing
Min
SDI1, SDI1,
SDI2, SDI2
1.6 +
VSDI/2
Differential
VCMOUT Output Common Mode Voltage
VSDO
Reference
Single-ended, 75Ω load,
RREF1 = 750Ω 1%,
RREF2 = 750Ω 1%
100
SDO1,
SDO1,
SDO2, SDO2
Single-ended, 75Ω load,
RREF1 = 590Ω 1%,
RREF2 = 590Ω 1%
VSDHD
SD/HD Input Voltage
Min for SD
Max for HD
ISDHD
SD/HD Input Current
ICC
Supply Current
(1)
(2)
(3)
Typ
SD/HD1,
SD/HD2
Max
Units
VCC –
VSDI/2
V
2000
mVP−P
VCC –
VSDO
V
750
800
850
mVP-P
900
1000
1100
mVP-P
2.4
V
0.8
3.7
V
µA
SD/HD1 = 0, SD/HD2 = 0 (3)
90
98
mA
SD/HD1 = 1, SD/HD2 = 1 (3)
76
86
mA
Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
Typical values are stated for VCC = +3.3V and TA = +25°C.
Maximum ICC is measured at VCC = +3.465V and TA = +70°C.
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LMH0202
SNLS212C – FEBRUARY 2006 – REVISED APRIL 2013
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AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1).
Symbol
Parameter
DRSDI
Input Data Rate
tjit
Additive Jitter
Conditions
Output Rise Time, Fall Time
Min
Typ
Max
Units
1485
Mbps
(2)
SDI1, SDI1,
SDI2, SDI2
1.485 Gbps
270 Mbps
tr,tf
Reference
SDO1, SDO1,
SDO2, SDO2
SD/HD1 = 0, SD/HD2 = 0,
20% – 80% (3)
SD/HD1 = 1, SD/HD2 = 1,
20% – 80% (3)
400
26
psP-P
18
psP-P
120
220
ps
560
800
ps
ps
Mismatch in Rise/Fall Time
(2)
30
tOS
Output Overshoot
(2)
8
RLSDO
Output Return Loss
(4)
(1)
(2)
(3)
(4)
4
15
20
%
dB
Typical values are stated for VCC = +3.3V and TA = +25°C.
Specification is ensured by characterization.
Specification is ensured by characterization and verified by test.
Output return loss is dependent on board design. The LMH0202 meets this specification on the SD202 evaluation board from 5 MHz to
1.5 GHz.
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SNLS212C – FEBRUARY 2006 – REVISED APRIL 2013
Table 1. PIN DESCRIPTIONS
Pin #
Name
Description
1
SDI1
Serial data true input.
2
SDI1
Serial data complement input.
3
VEE1
Negative power supply (ground).
4
RREF1
Output driver level control. Connect a resistor to VCC to set output voltage swing.
5
SDI2
Serial data true input.
6
SDI2
Serial data complement input.
7
VEE2
Negative power supply (ground).
8
RREF2
Output driver level control. Connect a resistor to VCC to set output voltage swing.
9
VCC2
Positive power supply (+3.3V).
10
SD/HD2
Output slew rate control. Output rise/fall time complies with SMPTE 292M when low and SMPTE 259M
when high.
11
SDO2
Serial data complement output.
12
SDO2
Serial data true output.
13
VCC1
Positive power supply (+3.3V).
14
SD/HD1
Output slew rate control. Output rise/fall time complies with SMPTE 292M when low and SMPTE 259M
when high.
15
SDO1
Serial data complement output.
16
SDO1
Serial data true output.
DEVICE OPERATION
INPUT INTERFACING
The LMH0202 accepts either differential or single-ended input. The inputs are self-biased, allowing for simple AC
or DC coupling. DC-coupled inputs must be kept within the specified common-mode range. SDI and SDI are selfbiased at approximately 2.1V with VCC = 3.3V. Figure 2 shows the differential input stage for SDI and SDI.
VCC
SDI
SDI
VCC
5 k:
10 k:
80:
10 k:
10 k:
Figure 2. Differential Input Stage for SDI and SDI.
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LMH0202
SNLS212C – FEBRUARY 2006 – REVISED APRIL 2013
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DVB-ASI APPLICATIONS
The dual differential inputs of the LMH0202 may be externally routed to a single differential input as shown in
Figure 3. This provides a solution for DVB-ASI applications where two non-inverted outputs are needed.
LMH0202
1.0 PF
25:
SDI1
50:
SDI1
25:
25:
Differential
Input
1.0 PF
50:
SDI2
SDI2
25:
0.1 PF
Figure 3. Single Differential Input for DVB-ASI
OUTPUT INTERFACING
The LMH0202 uses current mode outputs. Single-ended output levels are 800 mVP-P into 75Ω AC-coupled
coaxial cable (with RREF = 750Ω). Output level is controlled by the value of the resistor connected between the
RREF pin and VCC.
The RREF resistor should be placed as close as possible to the RREF pin. In addition, the copper in the plane
layers below the RREF network should be removed to minimize parasitic capacitance.
OUTPUT SLEW RATE CONTROL
The LMH0202 output rise and fall times are selectable for either SMPTE 259M or SMPTE 292M compliance via
the SD/HD pin. For slower rise and fall times, or SMPTE 259M compliance, SD/HD is set high. For faster rise
and fall times, or SMPTE 292M compliance, SD/HD is set low.
6
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SNLS212C – FEBRUARY 2006 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
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PACKAGE OPTION ADDENDUM
www.ti.com
23-Aug-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
LMH0202MT/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
TSSOP
PW
16
92
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
0 to 70
L202
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
NOTE 3
4.55
8
9
B
0.30
0.19
0.1
C A B
16X
4.5
4.3
NOTE 4
1.2 MAX
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0 -8
0.75
0.50
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
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EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
1
16
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
1
16X (0.45)
16
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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