Texas Instruments | DS90C032B LVDS Quad CMOS Differential Line Receiver (Rev. C) | Datasheet | Texas Instruments DS90C032B LVDS Quad CMOS Differential Line Receiver (Rev. C) Datasheet

Texas Instruments DS90C032B LVDS Quad CMOS Differential Line Receiver (Rev. C) Datasheet
DS90C032B
www.ti.com
SNLS052C – MARCH 1999 – REVISED APRIL 2013
DS90C032B LVDS Quad CMOS Differential Line Receiver
Check for Samples: DS90C032B
FEATURES
DESCRIPTION
•
•
The DS90C032B is a quad CMOS differential line
receiver designed for applications requiring ultra low
power dissipation and high data rates. The device
supports data rates in excess of 155.5 Mbps
(77.7 MHz) and uses Low Voltage Differential
Signaling (LVDS) technology.
1
2
•
•
•
•
•
•
•
•
•
>155.5 Mbps (77.7 MHz) Switching Rates
Accepts Small Swing (350 mV) Differential
Signal Levels
High Impedance LVDS Inputs with Power
Down
Ultra Low Power Dissipation
600 ps Maximum Differential Skew (5V, 25°C)
6.0 ns Maximum Propagation Delay
Industrial Operating Temperature Range
Available in Surface Mount Packaging (SOIC)
Pin Compatible with DS26C32A, MB570 (PECL)
and 41LF (PECL)
Supports OPEN and Terminated Input Failsafe
Conforms to ANSI/TIA/EIA-644 LVDS Standard
The DS90C032B accepts low voltage (350 mV)
differential input signals and translates them to
CMOS (TTL compatible) output levels. The receiver
supports a TRI-STATE function that may be used to
multiplex outputs. The receiver also supports OPEN
Failsafe and terminated (100Ω) input Failsafe with the
addition of external failsafe biasing. Receiver output
will be HIGH for both Failsafe conditions.
The DS90C032B provides power-off high impedance
LVDS inputs. This feature assures minimal loading
effect on the LVDS bus lines when VCC is not
present.
The DS90C032B and companion line driver
(DS90C031B) provide a new alternative to high
power pseudo-ECL devices for high-speed point-topoint interface applications.
Connection Diagram
Functional Diagram
Figure 1. Dual-In-Line Top View
See Package Number D (R-PDSO-G16)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
DS90C032B
SNLS052C – MARCH 1999 – REVISED APRIL 2013
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Table 1. Receiver Truth Table
ENABLES
EN
EN*
L
H
All other combinations of ENABLE inputs
INPUTS
OUTPUT
RIN+ − RIN−
ROUT
X
Z
VID ≥ 0.1V
H
VID ≤ −0.1V
L
Failsafe OPEN or Terminated
H
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
−0.3V to +6V
Supply Voltage (VCC)
−0.3V to +5.8V
Input Voltage (RIN+, RIN−)
Enable Input Voltage
−0.3V to (VCC + 0.3V)
(EN, EN*)
−0.3V to (VCC + 0.3V)
Output Voltage (ROUT)
Maximum Package Power Dissipation at +25°C
1025 mW
Derate Power Dissipation
8.2 mW/°C above +25°C
−65°C to +150°C
Storage Temperature Range
Maximum Lead Temperature, Soldering (4 seconds)
+260°C
Maximum Junction Temperature
ESD Ratings
(1)
+150°C
≥ 2kV
HBM, 1.5 kΩ, 100 pF
EIAJ, 0 Ω, 200 pF
≥ 250V
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the devices should be operated at these limits. “Electrical Characteristics” specifies conditions of device operation.
Recommended Operating Conditions
Min
Typ
Max
Units
Supply Voltage (VCC)
+4.5
+5.0
+5.5
V
Receiver Input Voltage
GND
Operating Free Air Temperature (TA)
−40
2
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+25
2.4
V
+85
°C
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Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (1) (2)
Symbol
Parameter
Conditions
VTH
Differential Input High Threshold
VTL
Differential Input Low Threshold
IIN
Input Current
VOH
Output High Voltage
VOL
Output Low Voltage
RIN+,
RIN−
−100
Typ
Max
Units
+100
mV
mV
−10
±1
+10
μA
−10
±1
+10
μA
IOH = −0.4 mA, VID = +200 mV
3.8
4.9
IOH = −0.4 mA, Input terminated
3.8
4.9
VIN = +2.4V
VIN = 0V
VCC = 5.5V or 0V
IOL = 2 mA, VID = −200 mV
ROUT
(3)
Output Short Circuit Current
Enabled, VOUT = 0V
IOZ
Output TRI-STATE Current
Disabled, VOUT = 0V or VCC
VIH
Input High Voltage
VIL
Input Low Voltage
II
Input Current
VCL
Input Clamp Voltage
ICC
No Load Supply Current, Receivers EN, EN* = VCC or GND, Inputs Open
Enabled
EN, EN* = 2.4 or 0.5, Inputs Open
ICCZ
No Load Supply Current, Receivers
EN = GND, EN* = VCC, Inputs Open
Disabled
(2)
(3)
Min
VCM = +1.2V
IOS
(1)
Pin
V
V
0.07
0.3
V
−15
−60
−100
mA
−10
±1
+10
μA
2.0
EN,
EN*
ICL = −18 mA
V
0.8
V
+10
μA
3.5
10
mA
3.7
11
mA
3.5
10
mA
−10
±1
−1.5
−0.8
VCC
V
Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
unless otherwise specified.
All typicals are given for: VCC = +5.0V, TA = +25°C.
Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted
at a time, do not exceed maximum junction temperature specification.
Switching Characteristics
VCC = +5.0V, TA = +25°C (1) (2) (3)
Min
Typ
Max
Units
tPHLD
Symbol
Differential Propagation Delay High to Low
1.5
3.40
5.0
ns
tPLHD
Differential Propagation Delay Low to High
1.5
3.48
5.0
ns
tSKD
Differential Skew |tPHLD − tPLHD|
0
80
600
ps
tSK1
Channel-to-Channel Skew (4)
0
0.6
1.0
ns
tTLH
Rise Time
0.5
2.0
ns
tTHL
Fall Time
0.5
2.0
ns
tPHZ
Disable Time High to Z
10
15
ns
tPLZ
Disable Time Low to Z
10
15
ns
tPZH
Enable Time Z to High
4
10
ns
tPZL
Enable Time Z to Low
4
10
ns
(1)
(2)
(3)
(4)
Parameter
Conditions
CL = 5 pF, VID = 200 mV,
See Figure 2 and Figure 3
RL = 2 kΩ, CL = 10 pF,
See Figure 4 and Figure 5
All typicals are given for: VCC = +5.0V, TA = +25°C.
Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr and tf (0%–100%) ≤ 1 ns for RIN and tr and tf ≤ 6 ns
for EN or EN*.
CL includes probe and jig capacitance.
Channel-to-Channel Skew is defined as the difference between the propagation delay of one channel and that of the others on the same
chip with an event on the inputs.
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Switching Characteristics
VCC = +5.0V ± 10%, TA = −40°C to +85°C (1) (2) (3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
tPHLD
Differential Propagation Delay High to Low
1.0
3.40
6.0
ns
tPLHD
Differential Propagation Delay Low to High
1.0
3.48
6.0
ns
tSKD
Differential Skew |tPHLD − tPLHD|
0
0.08
1.2
ns
tSK1
Channel-to-Channel Skew (4)
0
0.6
1.5
ns
(5)
CL = 5 pF, VID = 200 mV,
See Figure 2 and Figure 3
tSK2
Chip to Chip Skew
5.0
ns
tTLH
Rise Time
0.5
2.5
ns
tTHL
Fall Time
0.5
2.5
ns
tPHZ
Disable Time High to Z
10
20
ns
tPLZ
Disable Time Low to Z
10
20
ns
tPZH
Enable Time Z to High
4
15
ns
tPZL
Enable Time Z to Low
4
15
ns
(1)
(2)
(3)
(4)
(5)
RL = 2 kΩ, CL = 10 pF,
See Figure 4 and Figure 5
All typicals are given for: VCC = +5.0V, TA = +25°C.
Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr and tf (0%–100%) ≤ 1 ns for RIN and tr and tf ≤ 6 ns
for EN or EN*.
CL includes probe and jig capacitance.
Channel-to-Channel Skew is defined as the difference between the propagation delay of one channel and that of the others on the same
chip with an event on the inputs.
Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
Parameter Measurement Information
Figure 2. Receiver Propagation Delay and Transition Time Test Circuit
Figure 3. Receiver Propagation Delay and Transition Time Waveforms
4
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Parameter Measurement Information (continued)
CL includes load and test jig capacitance.
S1 = VCC for tPZL and tPLZ measurements.
S1 = GND for tPZH and tPHZ measurements.
Figure 4. Receiver TRI-STATE Delay Test Circuit
Figure 5. Receiver TRI-STATE Delay Waveforms
Typical Application
Figure 6. Point-to-Point Application
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APPLICATIONS INFORMATION
LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as
is shown in Figure 6. This configuration provides a clean signaling environment for the quick edge rates of the
drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair
cable, a parallel pair cable, or simply PCB traces. Typically the characteristic impedance of the media is in the
range of 100Ω. A termination resistor of 100Ω should be selected to match the media, and is located as close to
the receiver input pins as possible. The termination resistor converts the current sourced by the driver into a
voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver configuration,
but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as well as
ground shifting, noise margin limits, and total termination loading must be taken into account.
TheDS90C032B differential line receiver is capable of detecting signals as low as 100 mV, over a ±1V commonmode range centered around +1.2V. This is related to the driver offset voltage which is typically +1.2V. The
driven signal is centered around this voltage and may shift ±1V around this center point. The ±1V shifting may be
the result of a ground potential difference between the driver's ground reference and the receiver's ground
reference, the common-mode effects of coupled noise, or a combination of the two. Both receiver input pins
should honor their specified operating input voltage range of 0V to +2.4V (measured from each pin to ground),
exceeding these limits may turn on the ESD protection circuitry which will clamp the bus voltages.
RECEIVER FAILSAFE
The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS
logic levels. Due to the high gain and tight threshold of the receiver, care should be taken to prevent noise from
appearing as a valid signal.
The receiver's internal failsafe circuitry is designed to source/sink a small amount of current, providing failsafe
protection (a stable known state of HIGH output voltage) for floating and terminated (100Ω) receiver inputs in low
noise environment (differential noise < 10mV).
1. Open Input Pins.
TheDS90C032B is a quad receiver device, and if an application requires only 1, 2, or 3 receivers, the unused
channel(s) inputs should be left OPEN. Do not tie unused receiver inputs to ground or any other voltages.
The input is biased by internal high value pull up and pull down resistors to set the output to a HIGH state.
This internal circuitry will ensure a HIGH, stable output state for open inputs.
2. Terminated Input. TheDS90C032B requires external failsafe biasing for terminated input failsafe.
Terminated input failsafe is the case of a receiver that has a 100Ω termination across its inputs and the
driver is in the following situations. Unplugged from the bus, or the driver output is in TRI-STATE or in poweroff condition. The use of external biasing resistors provide a small bias to set the differential input voltage
while the line is un-driven, and therefore the receiver output will be in HIGH state. If the driver is removed
from the bus but the cable is still present and floating, the unplugged cable can become a floating antenna
that can pick up noise. The LVDS receiver is designed to detect very small amplitude and width signals and
recover them to standard logic levels. Thus, if the cable picks up more than 10mV of differential noise, the
receiver may respond. To insure that any noise is seen as common-mode and not differential, a balanced
interconnect and twisted pair cables is recommended, as they help to ensure that noise is coupled common
to both lines and rejected by the receivers.
3. Operation in environment with greater than 10mV differential noise.
TI recommends external failsafe biasing on its LVDS receivers for a number of system level and signal
quality reasons. First, only an application that requires failsafe biasing needs to employ it. Second, the
amount of failsafe biasing is now an application design parameter and can be custom tailored for the specific
application. In applications in low noise environments, they may choose to use a very small bias if any. For
applications with less balanced interconnects and/or in high noise environments they may choose to boost
failsafe further. TI's "LVDS Owner’s Manual provides detailed calculations for selecting the proper failsafe
biasing resistors. Third, the common-mode voltage is biased by the resistors during the un-driven state. This
is selected to be close to the nominal driver offset voltage (VOS). Thus when switching between driven and
un-driven states, the common-mode modulation on the bus is held to a minimum.
6
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For additional Failsafe Biasing information, please refer to Application Note AN-1194 for more detail.
The footprint of theDS90C032B is the same as the industry standard 26LS32 Quad Differential (RS-422)
Receiver.
For additional LVDS application information, please refer to TI's LVDS Owner's Manual available through TI's
website http://www.ti.com/lvds
Pin Descriptions
Pin No.
Name
2, 6, 10, 14
RIN+
Non-inverting receiver input pin
Description
1, 7, 9, 15
RIN−
Inverting receiver input pin
3, 5, 11, 13
ROUT
Receiver output pin
4
EN
Active high enable pin, OR-ed with EN*
12
EN*
Active low enable pin, OR-ed with EN
16
VCC
Power supply pin, +5V ± 10%
8
GND
Ground pin
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Typical Performance Characteristics
8
Output High Voltage vs Power Supply Voltage
Output High Voltage vs Ambient Temperature
Figure 7.
Figure 8.
Output Low Voltage vs Power Supply Voltage
Output Low Voltage vs Ambient Temperature
Figure 9.
Figure 10.
Output Short Circuit Current vs Power Supply Voltage
Output Short Circuit Current vs Ambient Temperature
Figure 11.
Figure 12.
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Typical Performance Characteristics (continued)
Differential Propagation Delay vs Power Supply Voltage
Differential Propagation Delay vs Ambient Temperature
Figure 13.
Figure 14.
Differential Skew vs Power Supply Voltage
Differential Skew vs Ambient Temperature
Figure 15.
Figure 16.
Transition Time vs Power Supply Voltage
Transition Time vs Ambient Temperature
Figure 17.
Figure 18.
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
10
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS90C032BTM
NRND
SOIC
D
16
48
TBD
Call TI
Call TI
-40 to 85
DS90C032BTM
DS90C032BTM/NOPB
ACTIVE
SOIC
D
16
48
Green (RoHS
& no Sb/Br)
CU SN | Call TI
Level-1-260C-UNLIM
-40 to 85
DS90C032BTM
DS90C032BTMX
NRND
SOIC
D
16
2500
TBD
Call TI
Call TI
-40 to 85
DS90C032BTM
DS90C032BTMX/NOPB
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU SN | Call TI
Level-1-260C-UNLIM
-40 to 85
DS90C032BTM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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16-Aug-2014
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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29-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS90C032BTMX
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
DS90C032BTMX/NOPB
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.3
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90C032BTMX
SOIC
D
16
2500
367.0
367.0
35.0
DS90C032BTMX/NOPB
SOIC
D
16
2500
367.0
367.0
35.0
Pack Materials-Page 2
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