Texas Instruments | DP3T Switch w/Imped Detect Micro-USB Switch Supports USB, UART, Audio, Chrgr Det (Rev. A) | Datasheet | Texas Instruments DP3T Switch w/Imped Detect Micro-USB Switch Supports USB, UART, Audio, Chrgr Det (Rev. A) Datasheet

Texas Instruments DP3T Switch w/Imped Detect Micro-USB Switch Supports USB, UART, Audio, Chrgr Det (Rev. A) Datasheet
TSU5611
SCDS326A – AUGUST 2011 – REVISED NOVEMBER 2011
www.ti.com
DP3T SWITCH WITH IMPEDANCE DETECTION MICRO-USB SWITCH
TO SUPPORT USB, UART, AUDIO, AND CHARGER DETECTION
Check for Samples: TSU5611
FEATURES
APPLICATIONS
•
•
•
•
•
•
1
Compatible Accessories
– USB Data Cable
– UART Cable
– Charger (Dedicated Charger or Host/Hub
Charger)
– Stereo Headset With Mic
Integrated LDOs for VREF and Mic Bias
USB and UART Path Supports USB 2.0 High
Speed
Audio Path Provides Negative Rail Support
and Click/Pop Reduction
Supports Factory Test Mode
1.8-V Compatible I2C Interface
ESD Performance Tested Per JESD 22
– 1500-V Human-Body Model (A114-B,
Class II)
– 1000-V Charged-Device Model (C101)
•
•
•
•
•
•
Cell Phones & Smart Phones
Tablet PCs
Digital Cameras & Camcorders
GPS Navigation Systems
Micro USB Interface with USB/UART
YZP PACKAGE
TOP VIEW
A
B
C
D
E
4
3
2
1
DESCRIPTION
The TSU5611 is designed to interface the cellular phone UART, USB, and audio chips with external peripherals
via a micro-USB connector. The switch features impedance detection for identification of various accessories that
are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port,
the switch uses a detection mechanism to identify the accessory (see the State Machine for details). It will then
switch to the appropriate channel—data, audio, or UART.
The TSU5611 has an I2C interface for communication with the cellular phone baseband or applications
processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is
generated when the device is unplugged.
ORDERING INFORMATION (1)
TA
–40°C to 85°C
(1)
(2)
PACKAGE (2)
WSCP–YZP (0.5-mm pitch)
Tape and Reel
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TSU5611YZPR
A7
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TSU5611
SCDS326A – AUGUST 2011 – REVISED NOVEMBER 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SUMMARY OF TYPICAL CHARACTERISTICS
USB PATH
UART PATH
AUDIO PATH
MIC PATH
1
1
1
1
ON-state resistance (rON)
5Ω
5Ω
3Ω
8.8 Ω
ON-state resistance match (ΔrON)
1Ω
1Ω
1.1 Ω
N/A
0.24 Ω
0.24 Ω
0.1 Ω
0.5 Ω
1 ms
1 ms
1 ms
1 ms
Number of switches
ON-state resistance flatness (rON(flat))
Turn-on/turn-off time (tON/tOFF)
Bandwidth (BW)
830 MHz
830 MHz
788 MHz
573 MHz
OFF isolation (OISO)
–22 dB
–22 dB
–75 dB
–100 dB
Crosstalk (XTALK)
–40 dB
–40 dB
–50 dB
–50 dB
Total harmonic distortion (THD)
Leakage current (INO(OFF)/INC(OFF))
Package options
N/A
N/A
0.05%
0.0017%
100 nA
100 nA
100 nA
100 nA
YZP package, 0.5-mm pitch
APPLICATION BLOCK DIAGRAM
2
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TSU5611
To request a full data sheet, please send an email to:
signal-switches@list.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
20-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
TSU5611YZPR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
DSBGA
YZP
20
3000
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
SNAGCU
Level-1-260C-UNLIM
(4/5)
-40 to 85
A7
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Jun-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TSU5611YZPR
Package Package Pins
Type Drawing
SPQ
DSBGA
3000
YZP
20
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
180.0
8.4
Pack Materials-Page 1
1.99
B0
(mm)
K0
(mm)
P1
(mm)
2.49
0.56
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Jun-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TSU5611YZPR
DSBGA
YZP
20
3000
182.0
182.0
20.0
Pack Materials-Page 2
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