Texas Instruments | MAX3237E 3-V TO 5.5-V Multichannel RS-232 1-MBit/s Line Driver/Receiver (Rev. B) | Datasheet | Texas Instruments MAX3237E 3-V TO 5.5-V Multichannel RS-232 1-MBit/s Line Driver/Receiver (Rev. B) Datasheet

Texas Instruments MAX3237E 3-V TO 5.5-V Multichannel RS-232 1-MBit/s Line Driver/Receiver (Rev. B) Datasheet
MAX3237E
www.ti.com
SLLS709B – MAY 2006 – REVISED JANUARY 2010
3-V TO 5.5-V MULTICHANNEL RS-232
1-MBit/s LINE DRIVER/RECEIVER
Check for Samples: MAX3237E
FEATURES
1
•
•
•
•
•
•
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates From 250 kbits/s to 1 Mbit/s
Low Standby Current . . . 1 mA Typical
External Capacitors . . . 4 × 0.1 mF
Accepts 5-V Logic Input With 3.3-V Supply
Designed to Be Interchangeable With Maxim
MAX3237E
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
ESD Protection for RS-232 I/O Pins
– ±15 kV – Human-Body Model (HBM)
– ±8 kV – IEC61000-4-2, Contact Discharge
– ±15 kV – IEC61000-4-2, Air-Gap Discharge
APPLICATIONS
•
•
•
•
•
Battery-Powered, Hand-Held, and Portable
Equipment
PDAs and Palmtop PCs
Notebooks, Sub-Notebooks, and Laptops
Digital Cameras
Mobile Phones and Wireless Devices
QFN PACKAGE
(TOP VIEW)
C2 +
GND
C2−
V−
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
DOUT5
EN
SHDN
1
28
2
27
3
26
4
25
5
24
6
23
7
22
8
21
9
20
10
19
11
18
12
17
13
16
14
15
C1+
V+
VCC
C1−
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
DIN5
ROUT1B
MBAUD
V−
C2–
GND
C2+
C1+
V+
VCC
NC
DB, DW, OR PW PACKAGE
(TOP VIEW)
32 31 30 29 28 27 26 25
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
NC
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
C1–
DIN1
IN2
DIN3
ROUT1
ROUT2
DIN4
ROUT3
9 10 11 12 13 14 15 16
DOUT5
EN
SHDN
MBAUD
NC
ROUT1B
DIN5
NC
•
DESCRIPTION
The MAX3237E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. This device operates at data signaling rates of 250 kbit/s in normal operating mode
(MBAUD = GND) and 1Mbit/s when MBAUD = VCC. The driver output slew rate is a maximum of 30 V/ms.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2010, Texas Instruments Incorporated
MAX3237E
SLLS709B – MAY 2006 – REVISED JANUARY 2010
www.ti.com
The MAX3237E transmitters are disabled and the outputs are forced into high-impedance state when the device
is in shutdown mode (SHDN = GND) and the supply current falls to less than 1 mA. Also, during shutdown, the
onboard charge pump is disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also
can be placed in the high-impedance state by setting enable (EN) high. ROUT1B remains active all the time,
regardless of the EN and SHDN condition.
The MAX3237EC is characterized for operation from 0°C to 70°C. The MAX3237EI is characterized for operation
from –40°C to 85°C.
AVAILABLE OPTIONS (1)
PACKAGED DEVICES (2)
TA
MAX3237ECDBR
0°C to 70°C
MAX3237ECPWR
MAX3237ECRHBR (QFN package)
MAX3237ECDWR
MAX3237EIDBR
–40°C to 85°C
MAX3237EIPWR
MAX3237EIRHBR (QFN package)
MAX3237EIDWR
(1)
(2)
For the most current package and ordering information, see the
Package Option Addendum at the end of this document, or see the
TI web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at
www.ti.com/packaging.
Table 1. FUNCTION TABLE
INPUTS
(1)
2
OUTPUTS
SHDN
EN
DOUT
ROUT
ROUT1B
0
0
Z (1)
Active
Active
0
1
Z (1)
Z (1)
Active
1
0
Active
Active
Active
1
1
Active
Z (1)
Active
Z = high impedance (off)
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Product Folder Link(s): MAX3237E
MAX3237E
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SLLS709B – MAY 2006 – REVISED JANUARY 2010
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1
DIN2
DIN3
DIN4
DIN5
SHDN
MBAUD
ROUT1B
ROUT1
ROUT2
ROUT3
EN
24
5
23
6
22
7
19
10
17
12
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
14
15
16
21
8
20
9
18
11
RIN1
RIN2
RIN3
13
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Product Folder Link(s): MAX3237E
3
MAX3237E
SLLS709B – MAY 2006 – REVISED JANUARY 2010
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.3
6
V
V+
Positive-output supply voltage range (2)
–0.3
7
V
V–
Negative-output supply voltage range (2)
0.3
–7
V
13
V
V+ – V–
Supply voltage difference
VI
Input voltage range
VO
Output voltage range
(2)
Package thermal impedance
Tstg
Storage temperature range
(1)
(2)
(3)
–0.3
6
Receiver
–25
25
Driver
Receiver
Short-circuit duration
qJA
Driver (SHDN, MBAUD, EN)
DOUT to GND
–13.2
13.2
–0.3
VCC + 0.3
UNIT
V
V
Unlimited
(3)
–65
62
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
See Figure 5
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control high-level input voltage
DIN, SHDN, MBAUD, EN
VIL
Driver and control low-level input voltage
DIN, SHDN, MBAUD, EN
VI
Receiver input voltage
TA
Operating free-air temperature
(1)
VCC = 3.3 V
VCC = 5 V
MAX3237EC
MAX3237EI
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
2
5.5
2.4
5.5
UNIT
V
V
0
0.8
V
–25
25
V
0
70
–40
85
°C
Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
ELECTRICAL CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
II
Input leakage current
ICC
Supply current
(TA = 25°C)
TEST CONDITIONS
DIN, SHDN, MBAUD, EN
No load, SHDN = VCC
(1)
(2)
4
SHDN = GND
Shutdown supply current
SHDN = RIN = GND,
DIN = GND or VCC
MIN TYP (2)
MAX
9
18
mA
0.5
2
mA
1
10
mA
10
300
nA
UNIT
Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
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MAX3237E
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SLLS709B – MAY 2006 – REVISED JANUARY 2010
DRIVER SECTION ELECTRICAL CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
MIN TYP (2)
TEST CONDITIONS
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–5.4
IIH
High-level input current
VI = VCC
IIL
Low-level input current
VI at GND
IOS
Short-circuit output current (3)
VCC = 3.6 V or 3.3 V,
VO = 0 V
ro
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
(1)
(2)
(3)
MAX
V
V
±0.01
±1
±0.01
300
UNIT
mA
±1
mA
±60
mA
Ω
50k
Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
DRIVER SECTION SWITCHING CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
CL = 1000 pF,
MBAUD = GND
Maximum data rate
CL = 1000 pF,
VCC = 4.5 V to 5.5 V,
MBAUD = VCC
MAX
UNIT
250
RL = 3 kΩ, 1 DIN switching,
See Figure 1
1000
CL = 250 pF,
VCC = 3 V to 4.5 V,
MBAUD = VCC
kbit/s
1000
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
MBAUD = VCC or GND, See Figure 2
SR(tr)
Slew rate,
transition region
(see Figure 1)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ,
TA = 25°C
(1)
(2)
(3)
TYP (2)
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF,
100
ns
MBAUD = GND
6
30
MBAUD = VCC
24
150
MBAUD = GND
4
30
V/ms
Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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5
MAX3237E
SLLS709B – MAY 2006 – REVISED JANUARY 2010
www.ti.com
RECEIVER SECTION ELECTRICAL CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1 mA
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
VCC = 3.3 V
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
Ioz
Output leakage current
EN = VCC
ri
Input resistance
VI = ±3 V to ±25 V
1.5
2.4
2
2.4
VCC = 5 V
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.5
UNIT
V
0.4
VIT+
(1)
(2)
MIN
TEST CONDITIONS
V
V
V
0.5
V
±0.05
±10
mA
5
7
kΩ
3
Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
RECEIVER SECTION SWITCHING CHARACTERISTICS (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP (2)
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 3
150
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 3
150
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
2.6
ms
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ, See Figure 4
2.4
ms
tsk(p)
Pulse skew (3)
See Figure 3
50
ns
TYP
UNIT
(1)
(2)
(3)
ns
Test conditions are C1–C4 = 0.1 mF at VCC = 3 V to 5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD PROTECTION
PIN
TEST CONDITIONS
HBM
DOUT, RIN
6
±15
IEC61000-4-2, Contact Discharge
±8
IEC61000-4-2, Air-Gap Discharge
±15
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kV
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): MAX3237E
MAX3237E
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SLLS709B – MAY 2006 – REVISED JANUARY 2010
PARAMETER MEASUREMENT INFORMATION
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
tTHL
CL
(see Note A)
3V
SHDN = VCC
TEST CIRCUIT
0V
tTLH
3V
3V
Output
−3 V
−3 V
6V
SR(tr) +
t THL or tTLH
VOH
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPLH
tPHL
VOH
3V
SHDN = VCC
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
EN = GND
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
tPHL
50 Ω
3V
EN = GND
tPLH
CL
(see Note A)
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
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MAX3237E
SLLS709B – MAY 2006 – REVISED JANUARY 2010
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PARAMETER MEASUREMENT INFORMATION (continued)
3V
Input
VCC
3 V or 0 V
1.5 V
GND
S1
−3 V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
3 V or 0 V
1.5 V
VOH
Output
50%
Output
CL
(see Note A)
EN
Generator
(see Note B)
50 Ω
0.3 V
tPZL
(S1 at VCC)
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
NOTES: A.
B.
C.
D.
VOLTAGE WAVEFORMS
CL includes probe and jig capacitance.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
tPLZ and tPHZ are the same as tdis.
tPZL and tPZH are the same as ten.
Figure 4. Receiver Enable and Disable Times
8
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MAX3237E
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SLLS709B – MAY 2006 – REVISED JANUARY 2010
APPLICATION INFORMATION
CBYPASS = 0.1 µF
+
−
1
2
+
C2
V+
28
27
+
GND
C3†
−
−
3
4
−
+
C1+
C2+
C2−
VCC
V−
C1−
C4
DOUT1
DOUT2
DOUT3
RIN1
+
−
26
C1
25
5
24
6
23
7
22
8
21
DIN1
DIN2
DIN3
ROUT1
5 kΩ
RS-232 Port
RIN2
9
20
ROUT2
Logic I/Os
5 kΩ
DOUT4
RIN3
10
19
11
18
DIN4
ROUT3
5 kΩ
DOUT5
12
17
16
EN
SHDN
13
14
15
DIN5
ROUT1B
MBAUD
†
C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or
electrolytic capacitors are used, they should be connected as shown.
VCC vs CAPACITOR VALUES
VCC
3.3 V ± 0.15 V
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
C1
0.1 µF
0.22 µF
0.047 µF
0.22 µF
C2, C3, and C4
0.1 µF
0.22 µF
0.33 µF
1 µF
Figure 5. Typical Operating Circuit and Capacitor Values
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MAX3237ECDB
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3237EC
MAX3237ECDBG4
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3237EC
MAX3237ECDBR
ACTIVE
SSOP
DB
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3237EC
MAX3237ECDBRG4
ACTIVE
SSOP
DB
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3237EC
MAX3237ECDW
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3237EC
MAX3237ECDWG4
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3237EC
MAX3237ECDWR
ACTIVE
SOIC
DW
28
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MAX3237EC
MAX3237ECPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP237EC
MAX3237ECPWR
ACTIVE
TSSOP
PW
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP237EC
MAX3237ECPWRG4
ACTIVE
TSSOP
PW
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP237EC
MAX3237EIDB
ACTIVE
SSOP
DB
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3237EI
MAX3237EIDBR
ACTIVE
SSOP
DB
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3237EI
MAX3237EIDW
ACTIVE
SOIC
DW
28
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MAX3237EI
MAX3237EIPW
ACTIVE
TSSOP
PW
28
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP237EI
MAX3237EIPWR
ACTIVE
TSSOP
PW
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP237EI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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24-Aug-2018
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
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Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
MAX3237ECDBR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
MAX3237ECDWR
SOIC
DW
28
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
MAX3237ECPWR
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
MAX3237EIDBR
SSOP
DB
28
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
MAX3237EIPWR
TSSOP
PW
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX3237ECDBR
SSOP
DB
28
2000
367.0
367.0
38.0
MAX3237ECDWR
SOIC
DW
28
1000
350.0
350.0
66.0
MAX3237ECPWR
TSSOP
PW
28
2000
367.0
367.0
38.0
MAX3237EIDBR
SSOP
DB
28
2000
367.0
367.0
38.0
MAX3237EIPWR
TSSOP
PW
28
2000
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
DB0028A
SSOP - 2 mm max height
SCALE 1.500
SMALL OUTLINE PACKAGE
C
8.2
TYP
7.4
A
0.1 C
PIN 1 INDEX AREA
SEATING
PLANE
26X 0.65
28
1
2X
10.5
9.9
NOTE 3
8.45
14
15
28X
B
5.6
5.0
NOTE 4
SEE DETAIL A
(0.15) TYP
0.38
0.22
0.15
C A B
2 MAX
0.25
GAGE PLANE
0 -8
0.95
0.55
0.05 MIN
DETAIL A
A 15
TYPICAL
4214853/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
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EXAMPLE BOARD LAYOUT
DB0028A
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
SYMM
28X (1.85)
(R0.05) TYP
1
28X (0.45)
28
26X (0.65)
SYMM
15
14
(7)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4214853/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DB0028A
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
28X (1.85)
SYMM
(R0.05) TYP
1
28X (0.45)
28
26X (0.65)
SYMM
14
15
(7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4214853/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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