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Texas Instruments Introduction to IBIS (I/O Buffer Info Specification) Modeling Application notes
Application Note 1111 An Introduction to IBIS (I/O Buffer Information
Specification) Modeling
Literature Number: SNLA046
National Semiconductor
Application Note 1111
Syed B. Huq
June 1998
INTRODUCTION
With time to market becoming shorter and shorter, system
designers are struggling to release a product from concept to
reality in a tightly budgeted time. The need to simulate before prototyping is very essential and the ability to simulate
and simulate accurately has heightened even more. But in
order to simulate a system level board, all components on
the board need to be modeled. Unfortunately many device
models are not readily available from vendors.
IBIS (I/O Buffer Information Specification) is a Behavioral
Modeling Specification that is gaining world wide popularity
as a standard format to generate device models. IBIS solves
many of the problems that prevented system designers from
obtaining semiconductor vendor’s SPICE models.
This application note discusses various aspects of IBIS including its history, advantages, compatibility, model generation flow, data requirements in modeling the input/output
structures and future trends.
show in Dallas, IBISv1.1 was released. The major changes
were the addition of more comments to the original specification.
IBISv2.0 was ratified in June 1994 at the DAC conference in
San Diego. IBISv2.0 is a considerable improvement over
IBISv1.1. Some of the added features are, Multiple rail support (ex. V+ and V− supply for RS-232), ECL, Terminator
models, Open drain, Open collector, Differential I/O, Controlled slew rate and Definitions of complex package parameters to name a few.
IBISv2.1 added more comments to clarify v2.0 and has been
ratified December 1994. Today IBIS is an approved standard
within EIA (Electronic Industry Alliance) and is also known
under ANSI/EIA-656.
IBISv3.0 has been ratified at DAC97. The committee is in the
process of finalizing the development of the v3.0 parser.
IBISv3.0 has various advanced features. Some of the added
features are Driver selection, Diode stored charge, Package
Model extension, Electrical board description, Multi-stage
Drivers, Series elements and more. IBISv3.1 improves upon
clarification issues with v3.0.
ABOUT IBIS...
I/O Buffer Information Specification is a fast and accurate
behavioral method of modeling input/output buffers based on
V/I curve data derived from measurement or full circuit simulation. It uses a standardized software parsable format in the
form of an ASCII file to store the Behavioral Information
needed to model device characteristics of integrated circuits.
IBIS can be used by almost any Simulators/EDA tools in the
industry. A wide range of Industry leaders support the IBIS
open forum. Below is a partial list of vendors supporting the
IBIS method of model generation.
AMP Incorporated www.amp.com (AMPredictor)
Applied Simulation Technology www.edac.org/Apsim
(Apsim)
Avanti (Meta I/O)
Cadence Design System www.cadence.com (DFSigNoise)
HPEESof www.hp.com
HyperLynx www.hyperlynx.com (LineSimPRO)
INCASES www.pad.incases.com (INSIDE, EXLIN)
IntuSoft www.intusoft.com (IS_SPICE)
Mentor Graphics www.mentorg.com (IS)
Quantic EMC Inc www.quantic-emc.com (Greenfield)
Veribest www.veribest.com
Viewlogic Systems www.viewlogic.com (XTK/TLC)
Zuken-Redac
ADVANTAGES OF IBIS
The IBIS model file protects proprietary information about
the modeled circuit as no process or circuit design information is disclosed. A SPICE model on the other hand can disclose substantial information that Semiconductor vendors
consider to be confidential such as circuit nodal connections
and process parameters. IBIS models are accurate, as
non-linear aspects of I/O structures as well as package parasitic and ESD structures are considered in the model parameters. Since IBIS is behavioral, the simulation time for an
IBIS model can run 25x faster than a structural model
(SPICE). IBIS does not have non-convergence issues like
SPICE and can practically run on any Industry wide platforms as most EDA vendors support the IBIS specification.
One of the most popular uses of IBIS is for Signal Integrity
Analysis on system boards. The models are very easy to
create as they can be made from bench measurements or
from simulation data.
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 1998 National Semiconductor Corporation
AN012626
www.national.com
AN-1111
HISTORY OF IBIS
The originator of IBIS was Intel. Presently the standard is being driven by the IBIS forum with over 35 members consisting of EDA vendors, Computer manufacturers, Semiconductor vendors and Universities.
IBISv1.0 was released in April 1993. IBISv1.0 is capable of
modeling standard TTL or CMOS type of I/O structure. In
June 1993 at the DAC (Design Automation Conference)
The EIG (Electronic Information Group) within EIA has been
actively working towards making IBIS part of the IEC (European standard). IBIS has been accepted as IEC-62014-1
(Sep’97) at the Tokyo International Standards meeting.
The software parser (known as the “Golden Parser” ) validates the IBIS model file. The Golden Parser checks the
syntax of the IBIS model file to confirm that the data format
meets the IBIS specification. The object code of the parser is
available for free from the forum. Simulator vendors may
also purchase the source code for a fee.
IBIS is backwards compatible. So all models created today
using the present version of the specification are guaranteed
to work with future versions of IBIS. The IBIS forum is continually defining new and improved ways of modeling complex and unique I/O structures.
An Introduction to IBIS (I/O Buffer Information Specification) Modeling
An Introduction to IBIS
(I/O Buffer Information
Specification) Modeling
Following is a behavioral block diagram of IBIS (Figure 1)
and the pieces needed to create an Input and an Output
model.
AN012626-1
FIGURE 1. Behavioral Diagram of IBIS
OUTPUT STRUCTURE MODEL
Information needed to model the output structure is shown in
Figure 3. Pullup defines VOH/IOH, Pulldown defines
the VOL/IOL and Ramp defines the dV/dT of the Rising and
Falling waveforms.
INPUT STRUCTURE MODEL
Information needed to model the Input Structure is shown in
Figure 2. C__pkg, R__pkg and L__pkg are the package parameters. Power__Clamp and GND__Clamp defines the
ESD structures on the Inputs. The V/I curve data defines
these clamp structures. C__comp is the input capacitance of
the input pin.
AN012626-2
FIGURE 2. Input/Enable Structure Model
AN012626-3
FIGURE 3. Output Structure Model
www.national.com
2
Measurements of package parameters can be made through
TDR (Time Domain Reflectometry) techniques if they are not
available from the semiconductor vendor. V/I data can be
collected using a curve tracer or programmable supply with
sinking and sourcing capabilities. Clamp curves can be generated by putting the device in TRI-STATE ® and sweeping
the I/O. For non TRI-STATE devices, the V/I curves are the
summation of the Clamp and Pullup/Pulldown.
The Pullup and Pulldown data are created from the V/I
curves. The remaining parameters are similar to the Input
structure except that they define the package parasitic of the
output pin as well as the output capacitance of the output
pin.
The Pullup and Power__Clamp data are “VCC relative”,
meaning that the voltage values are referenced to VCC and
not ground. So the voltages in the tables are derived from
the equation: Vtable = VCC − Voutput. VCC relative data is necessary for the simulator as the Pullup structure depends on
the voltage between the output and VCC and not the voltage
between the output and ground pin.
The required data is: R__pkg, L__pkg, C__pkg and
C__comp for all Inputs and Outputs and Enables.
Power__Clamp and GND__Clamp (ESD structures if
present) for I/O. Pullup, Pulldown and Ramp rates for Outputs.
An Interconnect engineer can create a slow and a fast model
using IBIS. The slow model is useful to determine flight time
and the fast model is useful to analyze overshoot, undershoot, crosstalk, etc. By combining min IOH/IOL with max
ramp time and max package parameters, a slow model is
generated. To create a fast model, the max IOH/IOL, min
ramp and minimum package information is used.
The Interconnect engineer then creates the IBIS ASCII file
following the format defined in the IBIS standard (Step 2).
This can be done on a UNIX or DOS text editor.
The ASCII model file is then checked by the “Golden Parser”
for possible syntax errors (Step 3). If passed, the model is
then imported into a simulator and validated for accuracy
(Step 4). Now the model is ready for use. Figure 4 shows this
flow in a graphical form.
MODEL GENERATION FLOW
The following steps are used in generating an IBIS model. All
necessary V/I and other parameters need to be either measured on the bench, obtained from simulation or provided by
the semiconductor vendor. (Step 1)
AN012626-4
FIGURE 4. IBIS Model Generation Flow
IBIS models are primarily used for SI (Signal Integrity) Analysis. These are typically crosstalk, ringing, overshoot, undershoot, mismatched impedance, reflections, line termination
analysis, topology scheme analysis, design rule generation
and multi-board simulation.
IBIS is best suited for SI analysis on system boards requiring
very little run time (25X faster than SPICE).
MODEL VALIDATION ON SIMULATOR
Model validation is the final and critical step to IBIS modeling. Visual inspection, s2iplt checks, parser test, simulation
of model under known loads, comparison of simulation data
to bench/SPICE, edge rate and signal swing level verification are also done during this phase. National’s Interface
Products Group validates the IBIS models on two different
IBIS complaint simulators.
3
www.national.com
An Introduction to IBIS (I/O Buffer Information Specification) Modeling
IBIS is also working with the JC-16B committee to define
SSTL and HSTL technology modeling using IBIS.
FUTURE TRENDS OF IBIS
Since its formation in 1993, IBIS has improved it’s specification by many folds. More complex modeling features and
possibly timing analysis may be added to future IBIS specifications. DIE (Die Information Exchange) forum which
specifies DIE information for MCM applications references
IBIS as the Signal Integrity Analysis specification. FMF (Free
Model Forum), OMF (Open Model Forum), CFI (CAD
Framework Initiative) are some of the other forums that references IBIS for behavioral modeling.
EIAJ III (I/O Interface model for Ics) is another organization
working on generating an I/O spec based on IBIS but with
added SPICE syntax’s.
IEC 93/67/NP(IBIS and EMC simulation) is a task force assigned to investigate the use of IBIS models for EMC simulation.
NATIONAL AND IBIS
National’s various product lines are generating IBIS models
today. Interface Applications actively participates in IBIS forum meetings and was very instrumental in adding the Differential I/O specification to IBISv2.1.
CONCLUSION
IBIS modeling is accurate, easy to create and compatible on
a wide rage of Simulation platforms. It solves the
“NO MODELS AVAILABLE” problem in the industry. IBIS has
created a common Industry format for modeling using Behavioral information and does not disclose any propietary
process parameters or circuit design details.
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AN-1111
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