Texas Instruments | Sys Design Consid for TFT-LCD Panels Using Sample & Hold Based Column Drivers | Application notes | Texas Instruments Sys Design Consid for TFT-LCD Panels Using Sample & Hold Based Column Drivers Application notes

Texas Instruments Sys Design Consid for TFT-LCD Panels Using Sample & Hold Based Column Drivers Application notes
System Design Considerations for TFT-LCD Panels Using Sample and Hold
Based Column Drivers
Literature Number: SNLA194
P-35 / C. Zajac
P-35: System Design Considerations for TFT-LCD Panels Using Sample and
Hold Based Column Drivers
C. Zajac, S. Poniatowski
National Semiconductor Corporation, Santa Clara, CA
Abstract
Control
Inputs
In this paper, we outline the unique system requirements of a flat
panel display that uses sample and hold based column drivers.
The basic operation and system considerations of the sample and
hold architecture are compared to the traditional R-DAC
architecture, specifically in terms of output performance and
accuracy.
1.
Introduction
Column drivers using a sample and hold based architecture have
advantages for both IC manufacturers as well as TFT-LCD panel
manufacturers when compared to the traditional resistor DAC (RDAC) based column drivers. For the IC manufacturer, the sample
and hold architecture allows for smaller die size due to the
elimination of many space consuming R-DAC cells. This allows
for lower cost, higher yield rates, and larger column driver
capacity at the wafer level.
For the TFT-LCD panel
manufacturer, the sample and hold architecture allows true 8-bit
panels to be built at similar cost and power consumption to the
dithered 8-bit panels. The smaller die size also allows for
advanced packaging technologies such as Chip-On-Glass without
expanding the bezel size of the overall panel.
RSDS TM
Bus
Gamma
Tap Points
Traditional R-DAC Architecture
The traditional R-DAC architecture uses one R-DAC per output to
convert the digital data into analog voltage levels. Digital data is
loaded and stored in data latches until the conversion takes place.
Because each output has an independent DAC, the data
conversion only needs to occur once per line, typically at the end
of the line.
Figure 1 shows the typical R-DAC architecture. RSDS™ data is
loaded into the column driver and is stored in the data latches
based on the control inputs.
The D to A Converters
simultaneously convert all outputs of data from their digital level
to their analog level based on the voltages applied across the
internal resistor string.
Shift Register
RSDS TM
Rx
Data Latches
and Level Shifters
Resistor
String
D to A Converters
Output Buffer Amplifiers
Column Driver
Outputs
Figure 1. Traditional R-DAC Column Driver Architecture
Figure 2 shows the location of the data latch and conversion in the
R-DAC architecture. Because there is a DAC dedicated to each
output, the data latching and conversion only needs to occur once
per line.
Data
Data Loading
Data
Latched/
Converted
Because the sample and hold architecture samples output voltages
throughout the line time and not just at the end of the line, there
are several system design considerations that need to be taken into
account when designing with sample and hold based column
drivers.
This paper will outline the important operation
characteristics of the traditional R-DAC and sample and hold
architectures and the different system requirements.
2.
Control
Logic
CLK1
Data
Driven on
Outputs
Figure 2. Data Conversion and Output Driving in an R-DAC
Architecture
3.
Sample and Hold Architecture
The sample and hold architecture uses shared DACs for the
outputs. Data is latched and converted many times throughout the
line. Each time data is latched and converted, the resulting output
voltage is sampled onto a capacitor until it is time for the outputs
to drive to the new level. For example, a sample and hold column
driver with 384 outputs and 12 shared DACs will need to convert
and sample voltages 32 times every line. This is shown in Figure
3.
ISSN/0003-0966X/03/3401-0333-$1.00+.00 © 2003 SID
SID 03 DIGEST • 333
P-35 / C. Zajac
Data
For a Sample and Hold architecture, it is critical that the
difference between the gamma voltage and the internal reference
voltage (which is developed from the analog supply) needs to be
consistent across the entire line time. Note that this does not
necessarily mean that both voltages need to be independently
stable across the line, but the delta between them must be stable.
Data Loading
CLK1
Data
Converted/
Sampled
Data
Data
Converted/ Converted/
Sampled
Sampled
Data
Converted/
Sampled
Data
Driven on
Outputs
Figure 3. Sample and Hold Data Conversion and Sampling
The sample and hold circuitry operates in two stages, the
sampling stage and the driving stage. As shown in Figure 4,
during the sampling stage switches S1 and S3 are closed, allowing
the DAC voltage to charge up the capacitor. The voltage
developed across the capacitor is equal to the gamma voltage
minus the internal reference voltage. The voltage is then held on
the capacitor until the outputs need to start driving. As shown in
Figure 5, during the driving phase, switch S2 is closed and the
output drives the sampled voltage.
S2
S3
4.1
Generating Gamma Voltages
Because the internal reference voltages are developed from the
analog supply, in order to maintain good correlation between the
gamma voltages and the references, the gamma voltages should be
developed from the analog supply. The analog supply will droop
(20-80mV typically) when the outputs begin to drive. If the
gamma references are developed from a separate reference that is
stable relative to the analog supply, then there will be a difference
between the gamma voltages and the internal reference.
A second important consideration is the driving of the gamma
voltages. In many systems it is common to use external
operational amplifiers to drive at least some of the gamma
voltages. This provides additional stability and precision to the
gamma voltages. In the Sample and Hold architecture, these op
amps can artificially stabilize the gamma references in relation to
the analog supply. The recommended method for generating the
gamma voltages is to use a simple resistor divider as shown in
Figure 6.
Analog
Supply
S1
DAC
Internal
Reference
GMA1
Figure 4. Sample and Hold Sampling
S2
GMA2
S3
S1
DAC
GMA16
Internal
Reference
Figure 5. Sample and Hold Driving
4.
System Considerations for Sample and
Hold Architectures
Because the R-DAC architecture only samples the output voltage
once per line, it is critical that the gamma input voltages be
accurate and stable at that point. For the rest of the line, the
stability and accuracy of the gamma voltages are not as critical.
334 • SID 03 DIGEST
Figure 6. Recommended Gamma Voltage Generation
The error in the sampled voltage can be estimated. The internal
reference is ¾ of the analog supply for the voltages in the upper
range and ¼ of the analog supply for voltages in the lower range.
If the analog supply droops X mV, then the internal references
will droop ¾ X and ¼ X mV. The gamma voltage will droop a
fraction of the overall droop based on its relationship to the analog
rail (i.e. if the target gamma voltage is 82% of the analog rail, the
droop on that voltage will be 82% X mV). The output voltage
P-35 / C. Zajac
error can be reduced to zero near the center of the gamma curve
(when the target gamma voltages are ¾ and ¼ of the analog rail)
and will be a worst case 25% of the droop at the ends of the
gamma curve. Having a higher output error at the ends of the
gamma curve is normally acceptable because adjacent gray levels
can be 100mV or more apart. At the center of the curve, where
the output error approaches zero, the gray levels are sometimes
separated by 30mV or less.
4.2
Gamma and Power Supply Decoupling
In addition to using the most efficient circuitry to generate the
gamma reference voltages, the overall decoupling scheme needs
to be considered. For the analog supply, large decoupling
capacitors (10-22µF) can be used at the output of the DC-DC
converter for energy storage. At the input to the column driver,
0.1-0.47µF capacitors are recommended.
On the gamma
reference voltages, only small decoupling capacitors (0.1µF or
less) should be used. These capacitor values will typically
provide good high frequency decoupling without stabilizing either
the analog supply or the gamma reference voltages independent of
the other.
The ideal scenario is to generate a perfect analog supply, but
experimental results have shown that the instantaneous current
draw of the column drivers when the outputs begin driving is so
large that it would take several hundred µF in order to completely
stabilize the supply. The best alternative is to provide some
energy storage on the analog supply, but to try and match the
decoupling of the gamma references and analog supply.
5.
Conclusions
The idea of column drivers that use a sample and hold architecture
is not new. The practical implementation has been somewhat
elusive. We have demonstrated that a sample and hold column
driver can have very good output performance if the differences
between the sample and hold and the traditional R-DAC are
understood and accounted for.
In our experience, the system changes needed to improve the
performance of a sample and hold column driver not only improve
the column driver performance, but they aslo tend to reduce the
total number of components in the system and can reduce the
overall system power. The success of the sample and hold
architecture will lead to more cost effective true 8-bit column
drivers and higher performance displays for all large scale
applications.
6.
Acknowledgements
We would like to thank Alex Erhart and Mark Kuhns for sharing
their insight into the design and performance of sample and hold
architectures. Thanks to Tomohiro Tashiro and his colleagues at
ADI for their cooperation with LCD module development.
SID 03 DIGEST • 335
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising