Texas Instruments | Handset Architecture with Integrated Framestore/SourceDriver IC | Application notes | Texas Instruments Handset Architecture with Integrated Framestore/SourceDriver IC Application notes

Texas Instruments Handset Architecture with Integrated Framestore/SourceDriver IC Application notes
Handset Architecture with Integrated Framestore/SourceDriver IC
Literature Number: SNLA190
42.2 / J. A. Small
42.2: Handset Architecture with Integrated Framestore/Source Driver IC
Jeffrey A. Small and Christopher A. Ludden
National Semiconductor, Pittsford, NY, USA
Abstract
The application of TFT displays for handset applications requires
new display system architectures in order to achieve desired
power targets and to enable handset features such as integrated
cameras. There are significant benefits to embedding a framestore
into the source driver chip of a handset display system. This
paper explores these benefits with respect to typical handset
usage models, power consumption, memory architecture,
camera/video functions, and other advanced techniques for
display power optimization. In particular, both the system power
consumption and the source driver interface bandwidth
requirement will be greatly reduced. These and other benefits are
discussed, and the architecture of a TFT handset display system
incorporating such an embedded framestore is described.
1.
common electrode driver (VCOM) and the DC-DC conversion
circuitry are integrated into the second chip.
Introduction
Due to the high refresh rates required by the display module
within a handset, the power and data bandwidth requirements of
the interface between the baseband processor and the TFT-LCD
display module are relatively high. These will be significantly
reduced if a framestore is embedded into the display module.
If this embedded framestore is integrated into the source driver IC
of the display module, there will be yet additional benefits that
will minimize system power and cost: further reduction in power
dissipation, opportunities to optimize the memory architecture,
and improved integration of other imaging and video functions
within the system. The architecture of a two-chip TFT-LCD
chipset that includes such an integrated framestore will be
presented.
Figure 1: Three-Chip System
A detailed method for analyzing the power consumption of the
display system has been developed, and will be used to
demonstrate the system power reduction that is achieved by the
two-chip architecture.
2.
Background
Among other things, an imaging-enabled mobile phone handset
contains a baseband processor and/or a graphics controller that
generates image data, a video or still camera that generates
additional image data, and a TFT-LCD system to display the
image data. A typical display system contains 176x220 ~
176x240 RGB pixels and can display 18-bit color (6-bits each for
red, green, and blue channels). Figure 1 shows a 176x240 display
system that does not integrate the framestore with the source
drivers. This system uses three ICs and has the disadvantage of
requiring data transfer between the controller IC and the source
driver IC at the high-bandwidth display refresh rate.
Figure 2 shows an improved architecture that contains just two
ICs. The timing controller, source drivers and the framestore are
integrated into one of these chips, while the gate drivers, a
Figure 2: Two-Chip System
ISSN/0003-0966X/03/3402-1241-$1.00+.00 © 2003 SID
SID 03 DIGEST • 1241
42.2 / J. A. Small
2.1
Chipset
The chipset shown in Figure 2 has been developed for 18-bit color
176x240 TFT-LCD display systems. This chipset may be used
for lower resolutions such as 176x220. One chip contains the DCDC converters required to produce all of the system’s required DC
voltages directly from a single-cell Li-ion battery. It also contains
all of the gate drivers and associated logic, and a driver for the
LCD panel’s common electrode. The second chip contains a
timing controller, 528 source drivers (6-bits each, for 18-bit
color), a programmable gamma reference voltage generator, and a
176x240x18-bit framestore. This chip directly interfaces to the
host system via an 8/16 bit parallel interface or via an SPI
interface. It also contains a video interface for either 18-bit RGB
or 8/16 bit YCC 4:2:2 data. 1 The second chip was implemented
on a 0.35um CMOS process, with a die size of 1.98mm x
24.96mm.
3.
Advantages of Integrated Framestore
3.1
Interface Power Reduction
To avoid flickering in the display, display refresh rates of 60-100
frames/sec. are required. If the display module does not include a
framestore, significant interface power and processing bandwidth
will be required from the baseband or application processor, even
when the display data is static or slowly changing. This is so
because the baseband or application processor must continuously
generate and send data to the display module at the frame refresh
rate. A typical 60Hz display (176x220x18-bit) requires a data rate
of 2.32 Mword/s over an 18-bit interface. Assuming that half of
the data lines are toggling (on average), an interface voltage level
of 2.5V, and an interface capacitance of 20pf, the average power
(CV2F/2) required by the interface is:
20 pf × ( 2.5V) 2 × ( 2.32 MHz ÷ 2) × 18 × 50 % = 1.31mW (1)
This power consumption may not be obvious to the display
module designer because it is provided by the baseband or
application processor rather than by the display module.
If a framestore is included in the display module as in Figure 1,
the baseband processor no longer must transfer data at the display
refresh rate. In standby mode (i.e. no active phone conversation),
the image data is static or slowly changing, so that the average
data rate over the baseband processor interface approaches zero.
Thus, during standby mode the power consumption of this
interface also approaches zero. Since standby mode can represent
>95% of the handset operation, battery life will be significantly
improved in handset applications.
Even if video data is being displayed, the power consumption of
the baseband processor interface is still significantly reduced
because the video frame rate is much less than the display refresh
rate. For example, QCIF video (176×144×18-bit×15fps) has a bitrate of 6.9Mbit/s. This requires an average interface power of:
20pf × (2.5V) 2 × 6.9Mb/s ÷ 2 × 50% = 0.22mW (2)
This is a savings in power consumption of 1.09mW. Even if the
logic voltage levels are reduced to 1.8V, this power savings is
0.57mW, which is still significant.
1242 • SID 00 DIGEST
Furthermore, if the Display Controller, framestore and source
drivers are integrated into one IC as in Figure 2, the power
consumption of the interface between the source drivers and the
framestore will be reduced because this interface is internal to the
IC. This is in addition to the reduced power consumption of the
baseband processor interface.
3.2
Memory Architecture Requirements
The required memory cycle time of an embedded framestore is
modest, because the framestore can be easily designed to read an
entire line of data in one operation. A 176x220 display operating
at a 60Hz frame rate requires 220x60 = 13,200 line reads/sec. To
burst-write a QCIF frame (176x144) into the framestore within
15msec, 176x144/0.015 = 1,689,600 pixel writes/sec are required.
Assuming that negligible bandwidth is required to update the
graphics portion of each frame, a typical framestore thus requires
a peak bandwidth of:
0.0132M + 1.6896M = 1.703M operations/sec. (3)
This is easily achieved with any of the CMOS processes that are
used for the fabrication of the source driver circuits. This modest
speed requirement allows “simultaneous” loading of both graphics
and video data into the framestore through small internal FIFOs.
The die size and cost of such a framestore can be competitive with
those of an external framestore if the source driver is implemented
with a fine-line geometry CMOS process that includes a dual gate
oxide (DGO) option. A DGO process provides small geometries
for the fabrication of the framestore, while also providing the
higher voltage transistors that are required by the source drivers.
Alternatively, a non-DGO process could be used by employing
National Semiconductor’s voltage doubling techniques for the
source drive circuitry.
3.3
Video Architecture Optimization
When a framestore is integrated with the source drivers, video
may pass directly into the framestore because the framestore
decouples the video rate from the display refresh rate. Most
CMOS imager camera modules used in handsets can provide
cropped and/or sub-sampled streaming video, in either RGB or
YCC 4:2:2 formats. Such camera modules may be directly
connected to the input of the framestore. Thus, live video data
never needs to be sent through the handset processor in order to
display it. This greatly reduces the interface requirements
between the camera module and the handset processor.
As video data is sent to the framestore, a small amount of logic
easily converts YCC data back into 24-bit RGB data. Both spatial
and temporal dithering may be easily included as part of this logic
in order to convert this 24-bit RGB data into the bit-depth
supported by the source drivers and the LCD panel.
3.4
Additional Techniques for Power
Reduction
When active, the backlight is by far the largest consumer of power
in a display system. A typical backlight contains 4 white LEDS,
each with a forward voltage of 3.3V and a forward current of
10mA. Assuming an LED driver efficiency of 80%, the backlight
consumes 165mW when operating at full brightness. By
42.2 / J. A. Small
integrating the framestore with the source drivers, it becomes
practical to continuously collect statistics directly from the
framestore as the display is refreshed. These statistics may then
be used to automatically control the backlight power, via a PWM
output from the source driver chip.2
To simplify the source driver circuitry, TFT-LCD panels are
3
usually driven using a “line-inversion” scheme , wherein the
common electrode of the TFT-LCD panel is driven with a square
wave at half the line rate. Most of the AC power dissipation in a
TFT-LCD panel is due to the line-inversion rate charging and
discharging of the source to gate line capacitances and of the
source to common electrode capacitances.
When a framestore is integrated with the source drivers, it
becomes easy to modify the inversion scheme, display bit-depth,
and display refresh rate according to the required performance for
different operating modes. For example, when a handset is in
standby mode, it may only be necessary to use partial display at a
reduced bit-depth (which reduces the source driver power), and to
use frame-inversion rather than line-inversion. The AC power
dissipation of a TFT-LCD panel may be easily reduced by a factor
of twenty or more (to as little as 0.12mW) under such conditions.
This is a very substantial savings because a handset is typically in
standby mode over 95% of the time.
4.
Power Estimation
A detailed spreadsheet has been developed for use in accurately
estimating the system power consumption of this chipset. First,
the gross power consumption is calculated as the sum of several
components:
•
The AC power (CV2F/2) dissipated by the charging and
discharging of the various LCD panel capacitances.
This power is a function of the panel capacitances, the
VCOM modulation amplitude, the LCD voltage range, the
source driver supply voltage, the line inversion rate, the
gate voltage amplitude, and the line refresh rate.
•
The power dissipated by the toggling of logic nodes
within the column driver IC.
•
The power consumption of the analog circuitry (clock
generation, bias generation, and gamma DAC buffers)
in the column driver IC.
•
The power consumption of the framestore memory in
the column driver IC.
•
The power consumption of the gate driver IC.
The total power consumption from the battery is then calculated
by dividing the gross power consumption by the efficiency of the
DC-DC charge-pump converters. This efficiency is a function of
the battery voltage and the required DC voltages.
Using this chipset, for a typical 176x220 LCD panel the
calculated total power consumption from the system battery is
under 5mW when displaying an all-white image in 18-bit mode.
This includes the efficiency losses incurred during DC-DC
conversion. By decreasing the bit-depth to 12 bits, this power will
be reduced to under 4mW.
5.
Conclusions
Significant advantages are obtained by integrating a framestore
into the column driver chip of a small-format AMLCD display
system:
The bit-depth of the displayed data may be reduced without
changing the stored image data, in order to reduce power
consumption. The use of an integrated framestore also enables
the use of other inversion schemes, which can drastically reduce
the AC power dissipated by the LCD panel.
The integration of the framestore with the source drivers also
facilitates the implementation of an automatic backlight intensity
control that is based on the statistics of the displayed image.
6.
References
[1] ITU Recommendation ITU-R BT.601
[2] Insun Hwang, SID 01 Digest, pp. 492-493 (2001)
[3] Christopher Ludden, “How to Design Module
Electronics for Advanced TFT-LCDs,” SID Seminar,
June 1994.
SID 03 DIGEST • 1243
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and Automotive www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
Wireless Connectivity
www.ti.com/wirelessconnectivity
TI E2E Community Home Page
www.ti.com/video
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising