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Texas Instruments Generic ESD Evaluation Module User guides
User's Guide
SLVUBG5 – June 2018
Generic ESD Evaluation Module User's Guide
This User's Guide describes the characteristics, operation, and use of the Generic ESDEVM evaluation
module (EVM). This EVM includes footprints for almost all of TI's ESD portfolio to be able to test either the
signal integrity or DC characteristics. Since this board is for generic evaluation of the ESD parts, it does
not come with any devices soldered down. Devices can be sampled by going to ti.com/esd, clicking on the
product folder of the device and ordering samples.
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Contents
Introduction ...................................................................................................................
Definitions .....................................................................................................................
S-Parameter Analysis .......................................................................................................
Lower Speed Device Testing ...............................................................................................
Board Layout ................................................................................................................
Schematics and Bill of Materials ...........................................................................................
1
2
3
3
4
8
List of Figures
1
Ideal Contact Discharge Waveform of the Output Current of the ESD Simulator at 4 kV ......................... 3
2
System Level ESD Test Setup ............................................................................................. 4
3
3D Board Image
4
5
6
.............................................................................................................
ESDEVM Top Layer .........................................................................................................
ESDEVM Bottom Layer .....................................................................................................
ESDEVM Schematic ........................................................................................................
5
6
7
8
List of Tables
.................................................................................................
1
IEC61000-4-2 Test Levels
2
Waveform Parameters in Contact Discharge Mode ..................................................................... 2
2
3
Bill of Materials ............................................................................................................... 8
Trademarks
1
Introduction
Texas Instrument's ESDEVM evaluation module allows the evaluation of most of TI's ESD portfolio. The
board comes with all traditional ESD footprints in order to be able to test any number of devices. Devices
that need to be tested can be soldered onto their respect footprint and then tested. For the typical high
speed ESD devices, an impedance controlled layout is implemented to be able to take the S-parameter
and de-embed the board trace. For the non-high speed ESD diodes, footprints with traces going to test
points are provided to easily run DC tests such as breakdown voltage, holding voltage, leakage, etc. The
board layout also makes it easy to connect any of the device's pins to either power (VCC) or ground by
shorting the signal pin to which every the signal is. This board allows the testing of all of these typical ESD
diode footprints:
• DPY (0402)
• DPL (0201)
• DQA
• DBV
• DCK
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1
Definitions
•
•
•
•
•
•
www.ti.com
DPK
DRY
DRB
DQD
RVZ
DPW
More information about TI's packages
2
Definitions
Contact Discharge — a method of testing in which the electrode of the ESD simulator is held in contact
with the device-under-test (DUT).
Air Discharge — a method of testing in which the charged electrode of the ESD simulator approaches
the DUT, and a spark to the DUT actuates the discharge.
ESD simulator — a device that generates IEC61000-4-2 compliance ESD waveforms shown in Figure 1
with adjustable ranges shown in Table 1 and Table 2.
IEC61000-4-2 has 4 classes of protection levels. Classes 1 – 4 are shown in Table 1. Stress tests
should be incrementally tested to level 4 as shown in Table 2 until the point of failure. If the DUT
does not fail at 8 kV, testing can continue in 2 kV increments until failure.
Table 1. IEC61000-4-2 Test Levels
Contact Discharge
Air Discharge
Class
Test Voltage [± kV]
Class
Test Voltage [± kV]
1
2
1
2
2
4
2
4
3
6
3
8
4
8
4
15
Table 2. Waveform Parameters in Contact Discharge Mode
2
Stress Level Step
Simulator Voltage
[kV]
Ipeak ±15% [A]
Rise Time ±25%
[nS]
Current at 30ns
±30% [A]
Current at 60ns
±30% [A]
1
2
7.5
0.8
4
2
2
4
15
0.8
8
4
3
6
22.5
0.8
12
6
4
8
30
0.8
16
8
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S-Parameter Analysis
www.ti.com
Ip
15
10 % Ip
Current (A)
90 % Ip
10
I30
5
I60
10 % Ip
10
20
30
40
50
60
70
80
90
100
tr
Time (ns)
Figure 1. Ideal Contact Discharge Waveform of the Output Current of the ESD Simulator at 4 kV
3
S-Parameter Analysis
The top half of the ESDEVM allows signal analysis of ESD diodes. SMA connectors J9 and J10, allow the
S-parameter to be taken by vector network analyzer for the DPY (0402), DPL (0201) packages. Also, J16
and J17 can be used to calibrate out the board parasitics to get a more accurate frequency response for
the device connected. In order to get results for a particular device only one footprint should be populated
at a time. Also for the 4 channel DQA package SMA connectors are provided.
3.1
DQA 4-Port Analysis
ESDEVM is configured with SMA connectors (J1-J4) to allow 4-port analysis with a vector network
analyzer. Connect Port 1 to J1 Prot 2 to J2, Port 3 to J3, and Port 4 to J4. This confiuration allows for the
following terminology in 4 port analysis:
• S11: Return Loss
• S31: Insertion Loss
• S21: Near End Cross Talk
• S41: Far End Cross Talk
4
Lower Speed Device Testing
The lower portion of the board contains footprints for ESD devices that typically are not placed on high
speed signal lines. Therefore the best way to test these devices is to access their pins directly to do DC
characteristics on them or to strike the individual pins to see what the device can survive. Each pin of
each device goes out to the middle of a three test point row. In the row of test points, the outside most
hole is connected to the ground plane of the board. The inside most test point is connected to the VCC
plane of the board. This provides ease to be able to connect any setup of an ESD diode to its correct
functionality. Most ESD diodes will have one or two pins that are ground for the device which with this
layout can easily be shorted to ground by shorting the two test points together. In the same vain the ESD
diodes with VCC pins can be connected to the correct pin as well.
If it is desired to do ESD testing on the ESD diodes, make sure that the power pins are connected
correctly and use the method below to strike the device. After striking if there is a significant change in the
leakage, it is safe to assume the device is broken.
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Lower Speed Device Testing
4.1
www.ti.com
ESD Tests
TI's ESD portfolio of devices provide robust protection during an ESD event. In order to see the passing
level of the device the set up below should be used. It is important to note that due to the parasitics of the
EVM, the IEC waveform is slightly different than during validation of the device potentially lending to
different results.
4.1.1
Test Method and Set-Up
An example test setup is shown in Figure 2. Details of the testing table and ground planes can be found in
the IEC 61000-4-2 test procedure. Contact and air-gap discharge are tested using the same simulator with
the same discharge waveform. While the simulator is in direct contact with the test point during contact, it
is not during air-gap.
ESD Simulator
DUT or System
Typical Position for
Direct Discharge
Power and Ground Connection
Horizontal Coupling
Plane (HCP)
Insulation
470 K
To the Wall
Ground
470 K
Ground Reference Plane
Non-conducting Table
Figure 2. System Level ESD Test Setup
4.1.2
Evaluation of Test Results
After ESD testing, perform IV curve testing to see if device has broken or not.
5
Board Layout
This section provides the ESDEVM board layout. ESD224EVM is a 4-layer board of 370HR at 0.062”
thickness. Layers 2 and 3 are simple ground planes and not shown here.
4
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Board Layout
www.ti.com
Figure 3. 3D Board Image
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5
Board Layout
www.ti.com
Figure 4. ESDEVM Top Layer
6
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Board Layout
www.ti.com
Figure 5. ESDEVM Bottom Layer
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7
Schematics and Bill of Materials
www.ti.com
6
Schematics and Bill of Materials
6.1
Schematics
Figure 6. ESDEVM Schematic
Table 3. Bill of Materials
Count
Reference Designator
Description
Part Number
Manufacturer
8
J1, J2, J3, J4, J9, J10,
J16, J17
Connector, End launch
SMA 50 ohm, TH
142-0761-881
Cinch Connectivity
1
J11
Standard Banana Jack,
Insulated, Red
6091
Keystone
1
J18
Standard Banana Jack,
Insulated, Black
6092
Keystone
0
D1
1-Channel ESD Protection DPY0002A
Diode for USB Type-C
and Thunderbolt 3,
DPY0002A (X1SON-2)
Texas Instruments
0
D2
1-Channel ESD Protection DPL0002A
Diode for USB Type-C
and Thunderbolt 3,
DPL0002A (X2SON-2)
Texas Instruments
0
D3
Diode, TVS, Bi, 33 V,
SMA
SMA
0
D4
Diode, Zener, 5.1 V, 300
mW, SOD-523
SOD-523
0
D5
Diode, TVS, Uni, 36 V,
58.1 Vc, SOD-123FL
SOD-123FL
8
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Schematics and Bill of Materials
www.ti.com
Table 3. Bill of Materials (continued)
0
J5, J8
Header, 100mil, 7x1, TH
800-10-007-10-001000
Mill-Max
0
J6, J7
Header, 100mil, 7x2, Tin,
TH
PEC07DAAN
Sullins Connector
Solutions
0
J12, J15, J31, J34
Header, 100mil, 4x1, Tin,
TH
PEC04SAAN
Sullins Connector
Solutions
0
J13, J14, J32, J33
Header, 100mil, 4x2, Tin,
TH
PEC04DAAN
Sullins Connector
Solutions
0
J19, J22, J26, J29, J35,
J37, J38, J41, J42, J45
Header, 100mil, 3x1, Tin,
TH
PEC03SAAN
Sullins Connector
Solutions
0
J20, J21, J27, J28, J30,
J36, J39, J40, J43, J44
Header, 100mil, 3x2, Tin,
TH
PEC03DAAN
Sullins Connector
Solutions
0
J23, J24, J25
Header, 2.54 mm, 2x1,
Gold, TH
GBC02SAAN
Sullins Connector
Solutions
0
R1
RES, 0, 5%, 0.03 W,
01005
01005
0
TP1, TP2, TP3, TP4, TP5, Test Point, Compact,
TP6, TP7
Black, TH
0
U1
4-Channel ESD Protection DQA
Diode for USB Type-C
and HDMI 2.0, DQA0010A
(USON-10)
Texas Instruments
0
U2
6-Channel Ultra-LowCapacitance IEC ESD
Protection Diodes,
RVZ0014A (USON-14)
RVZ
Texas Instruments
0
U3
ESD Array For Portable
Space-Saving
Applications, 8 Channels,
-40 to +85 degC, 8-pin
WSON (DQD), Green
(RoHS & no Sb/Br)
DQD
Texas Instruments
0
U4
ESD-Protection Array for
High-Speed Data
Interfaces, 4 Channels,
-40 to +85 degC, 6-pin
SON (DRY), Green
(RoHS & no Sb/Br)
DRY
Texas Instruments
0
U5
Low-Capacitance + / - 15kV ESD Protection Array
for High-Speed Data
Interfaces, 4 Channels,
-40 to +85 degC, 6-pin
SOT-23 (DBV), Green
(RoHS & no Sb/Br)
DBV
Texas Instruments
0
U6
Low-Capacitance + / - 15kV ESD Protection Array
for High-Speed Data
Interfaces, 4 Channels,
-40 to +85 degC, 6-pin
SOT70 (DCK), Green
(RoHS & no Sb/Br)
DCK
Texas Instruments
0
U7
40-V, 450-mA, Low IQ,
DRB
Low-Dropout Voltage
Regulator with Power
Good, DRB0008B (VSON8)
Texas Instruments
0
U8
Low-Capacitance + / - 15kV ESD Protection Array
for High-Speed Data
Interfaces, 4 Channels,
-40 to +85 degC, 6-pin
USON (DPK), Green
(RoHS & no Sb/Br)
Texas Instruments
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5006
DPK
Keystone
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9
Schematics and Bill of Materials
www.ti.com
Table 3. Bill of Materials (continued)
0
U9
Low-Capacitance Array
DRL
with + / - 15 kV ESD
Protection, 4 Channels,
-40 to +85 degC, 5-pin
SOT (DRL), Green (RoHS
& no Sb/Br)
Texas Instruments
0
U10
4-Channel ESD Protection DPW
With +/-15kV Contact
ESD, DPW0004A
(X2SON-4)
Texas Instruments
10
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STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
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RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
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regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
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