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Texas Instruments TDP158RSBEVM (Rev. A) User guides
User's Guide
SLLU257A – February 2017 – Revised February 2018
TDP158 RSB Evaluation Module
This document describes how to use and configure the TDP158RSBEVM and provides recommendations
for system hardware implementation. These recommendations are only guidelines and it is the designer’s
responsibility to consider all system characteristics and requirements. Refer to the TDP158 data sheet
(SLLSEX2) for technical details such as device operation, terminal description, and so forth.
1
2
3
4
5
6
7
Contents
Overview ...................................................................................................................... 2
1.1
What is the TDP158? .............................................................................................. 2
1.2
What is the TDP158 EVM? ........................................................................................ 2
Hardware Description ....................................................................................................... 3
2.1
Video Connectors for TDP158 Ports ............................................................................. 3
2.2
Local I2C Access .................................................................................................... 3
2.3
Enable and Reset ................................................................................................... 4
2.4
Power ................................................................................................................. 4
2.5
Jumper Configuration .............................................................................................. 5
2.6
Component Population Configuration ............................................................................ 5
2.7
USB Interface via TUSB3410 .................................................................................... 6
Quick Start Guide ............................................................................................................ 6
Schematic and Bill of Materials ............................................................................................ 7
4.1
Schematic ............................................................................................................ 7
4.2
Bill of Materials .................................................................................................... 11
Board Layout ................................................................................................................ 13
Total Phase Aardvark I2C Host Adapter Scripts ........................................................................ 16
References .................................................................................................................. 16
List of Figures
1
TDP158RSBEVM ............................................................................................................ 2
2
TDP158RSBEVM Block Diagram
12
......................................................................................... 3
TDP158RSBEVM Schematics (1 of 4) - Input Connectors ............................................................ 7
TDP158RSBEVM Schematics (2 of 4) - TDP158RSB Implementation .............................................. 8
TDP158RSBEVM Schematics (3 of 4) - Regulators ................................................................... 9
TDP158RSBEVM Schematics (4 of 4) - TUSB3410 Implementation .............................................. 10
Layer 1 (Top) ............................................................................................................... 13
Layer 2 (GND) .............................................................................................................. 13
Layer 3 (PWR) .............................................................................................................. 14
Layer 4 (PWR) .............................................................................................................. 14
Layer 5 (GND) .............................................................................................................. 15
Layer 6 (Bottom)............................................................................................................ 15
1
Aardvark I C (J18) Pin-Out ................................................................................................. 4
2
TDP158 Target I2C Address ................................................................................................ 4
3
SW1 DIP Switch Setting .................................................................................................... 5
4
Component Configuration
3
4
5
6
7
8
9
10
11
List of Tables
2
..................................................................................................
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TDP158 RSB Evaluation Module
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1
Overview
5
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Bill of Materials
.............................................................................................................
11
Trademarks
Aardvark is a trademark of Total Phase, Inc..
All other trademarks are the property of their respective owners.
1
Overview
1.1
What is the TDP158?
The TDP158 is a DisplayPort to Transition Minimized Differential Signal (TMDS) redriver supporting Digital
Video Interface (DVI) 1.0 and High Definition Multimedia Interface (HDMI) 1.4b and 2.0 output signals.
The TDP158 supports the Dual Mode Standard version 1.1 type 1 and type 2 through the DDC link. The
TDP158 supports a data rate of up to 6Gbps per data lane to support UltraHD (4K×2K/60Hz) 8-bits per
color high-resolution video and HDTV with 16-bit color depth at 1080p (1920×1080/60Hz).
1.2
What is the TDP158 EVM?
The TDP158 EVM is a PCB created to help customers evaluate the TDP158 device for video applications.
This EVM can also be used as a hardware reference design for implementation of the TDP158 in the RSB
package. PCB design and layout files can be provided upon request to provide PCB design illustrations of
the routing and placement rules. Figure 1 is a picture of the EVM.
Copyright © 2017, Texas Instruments Incorporated
Figure 1. TDP158RSBEVM
2
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Hardware Description
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1.2.1
What is Included in the TDP158RSBEVM?
The major components of the EVM are as follows:
• TDP158RSB
• Standard DP source connector (receptacle)
• Standard HDMI sink connector (receptacle)
• DC power regulators
• I2C programming interface for external I2C host connection
• USB interface (utility available)
2
Hardware Description
Figure 2 illustrates the EVM block diagram.
USB2
Connector
5-V
Dongle
5-V to 3.3-V
LDO
Aardvark
Connector
3.3-V to 1.1-V
LDO
TUSB3410
SCL_CTL
IN0P/N
TMDS_D2P/N
IN1P/N
TMDS_D1P/N
IN2P/N
TDP158
(40-Pin RSB)
TMDS_D0P/N
I3P/N
TMDS_CLKP/N
DDC_SCL/SDA
DDC_SCL/SDA
HDMI Connector
DP Connector Top
SDA_CTL
Copyright © 2017, Texas Instruments Incorporated
Figure 2. TDP158RSBEVM Block Diagram
2.1
Video Connectors for TDP158 Ports
The EVM has a DP connection for the source and an HDMI connection for the sink. J2 is a standard DP
connector (Molex 47272-0001). J4 is a standard HDMI connector (Molex 4715-10001). There is a third
video connection on the board for an HDMI source (J1), this function is not supported on the TDP158RSB
EVM.
2.2
Local I2C Access
Access to the local I2C signals on the TDP158 is provided via input connector J18. Note that the I2C signal
levels should be at 3.3 V when the I2C interface is accessed through the connector.
A standalone external I2C host can be connected via J18 for debug and control purposes. An example of
an external I2C Host controller is the Total Phase Aardvark™ I2C/SPI Host Adapter (Total Phase Part#:
TP240141). Sample scripts for this I2C Host controller are provided by request.
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2
Table 1. Aardvark I C (J18) Pin-Out
J18 Pin #
Description
J18 Pin #
Description
1
SCL_CTL
2
GND
3
SDA_CTL
4
NC
5
NC
6
NC
7
NC
8
NC
9
NC
10
GND
Table 2. TDP158 Target I2C Address
TDP158 I2C Target Address
Bit 7 (MSB)
A6
Bit 6
A5
Bit 5
A4
1
0
1
Bit 4
A3
Bit 3
A2
Bit 2
A1
Bit 1
A0
Bit 0 (W/R)
1
1
1
0
0/1
7 Bit Address = 5Eh
NOTE: The target I2C address for the TDP158 can be modified with the EVM jumper settings.
2.3
Enable and Reset
There are three device enable and reset options to use with the EVM.
A. Supervisor circuitry option
This is the default configuration on the TDP158 EVM. The enable (EN) signal is held low until the
power good (PG) from the 3.3-V voltage regulator reaches a stable high-voltage level then is released
high.
B. RC timing option
The C35 external capacitor and internal resistor are used to control the EN ramp time after the device
is powered on. The C35 is a DNI (Do Not Install option) by default. The C35 needs to be installed and
R70 needs to be uninstalled to enable this option.
C. External control option
A push button (SW1) is provided for manual control of the EN and OE input of the TDP158.
2.4
Power
A DC power jack (J13) to accept a 5-V wall power adapter is provided on the EVM. The DC power jack
(CUI Inc. PJ-202AH) has an inner diameter of 2.1 mm and an outer diameter of 5.5 mm. The tip of the 5-V
power supply must be positive. A 5-V power supply of at least 1.5 A that meets the stated requirements
can be used to power the TDP158RSBEVM. Power is provided to the EVM when SW1 is set to
position 1.
CAUTION
Do not plug in any power source higher than the configured voltage (5 V).
Alternately, it is possible to power the EVM by connecting a USB micro cable to a host and setting SW1 to
position 3. Note that this usage may exceed USB compliance requirements for power consumption.
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2.5
Jumper Configuration
Jumpers are provided to operate the device and EVM in different configurations, see Table 3.
Table 3. SW1 DIP Switch Setting
2.6
DIP SW No
Signal Name
J3
HPD_SNK
Description
Default Config
JP 2–3 for external HPD
JP 2–1 for board_5V
JP 2–3
J5
PRE
JP 1–2 for 3 db
JP 2–3 for 0 db
When I2C_EN is low
JP 2–3
J6
SWAP
JP 1–2 for SWAP
JP 2–3 for Normal
When I2C_EN is low
JP 2–3
J7
I2C_EN
JP 1–2 for I2C_EN = High; Puts Device into I2C Control Mode
JP 2–3 for I2C_EN = Low; Puts Device into Pin Strap Mode
JP 2–3
Puts Device into Pin Strap Mode
J8
TERM
JP 1–2 for 75–150 Ω
JP 2–3 for 150–300 Ω
NC; no termination
NC
Note: When TMDS_CLOCK_RATIO_STATUS
bit = 1, the TDP158 automatically sets source
termination at 75 Ω to 150 Ω.
J9
VSADJ
JP 1–2 for 5.5 kΩ
JP 2–3 for adjustable resistance (6 kΩ)
NC – N/A
JP 2–3
The default value is 6 kΩ on early EVMs (prior to
revision B)
J10
EQ1_SEL_A0
JP 1–2 for:
• tabI2C Addr bit A0 = 1, when I2C_EN = H
• tabFixed EQ at 14 dB @ 3G, when I2C_EN = L
JP 2–3 for:
• tabI2C Addr bit A0 = 0, when I2C_EN = H
• tabFixed EQ at 7.5 dB @ 3G, when I2C_EN = L
NC for Adaptive EQ
NC
J11
EQ2_SEL_A1
JP 1–2 for:
• tabI2C Addr bit A0 = 1, when I2C_EN = H
• tabFixed EQ at 14 dB @ 3G, when I2C_EN = L
JP 2–3 for:
• tabI2C Addr bit A0 = 0, when I2C_EN = H
• tabFixed EQ at 7.5 dB @ 3G, when I2C_EN = L
NC for Adaptive EQ
NC
J12
SLEW
JP 1–2 for fast
JP 2–3 for slowest
NC for mid range
NC
Component Population Configuration
To allow the TDP158 EVM to support both HDMI or DP input, there are many components that need to be
removed, placed, or modified depending on the board configuration. Table 4 provides a summary of the
component configuration for the TDP158 RSB. In addition, the unused source receptacle can be
depopulated.
Table 4. Component Configuration
Function
Reference Designator
TDP158
Differential Pair - IN
C16, C17, C18, C19, C20, C21, C22, C23
populated with 0.1 µF
Differential Pair - HDMI IN
R9, R10, R11, R14, R15, R16, R17, R18
not populated (0 Ω)
SDA or SCL - HDMI
R12, R13
not populated (2 kΩ)
Differential Pair - DP IN
R26, R27, R31, R32, R33, R34, R35, R37
populated with 0 Ω
SDA, SCL, or HPD - DP
R29, R30
populated with 2 kΩ
Pullup Differential Pair HDMI IN
R1, R2, R3, R4, R5, R6, R7, R8
populated with 49.9 Ω
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2.6.1
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DDC Snoop Option
To accommodate systems that do not properly resend DDC commands after HPD goes low, TI has
implemented an DDC snoop mode on the TDP158RSB EVM. This mode allows the HPD line to be routed
around the TDP158, but remain connected to the TDP158 on the sink side to allow the TDP158 to snoop
its state. This snoop mode is disabled, by default, on the TDP158RSB EVMs.
• Pop R22, R23, no pop R19, R20, R12, R13 for HDMI, DDC snoop
• Pop R24, R25, no pop R38, R39, R29, R30 for DP, DDC snoop
• Pop R19, R20, R12, R13, no pop R22, R23 for HDMI, DDC on
• Pop R38, R39, R29, R30, no pop R24, R25 for DP, DDC on
2.6.2
HPD Snoop Option
Not available for the TDP158RSB EVM.
2.7
USB Interface via TUSB3410
Use the following settings for USB interface via TUSB3410:
• J19 must be set to SDA – SDA_USB
• J17 must be set to SCL – SCL_USB
• Attached USB micro cable to J16 and to the host computer
• Start the Eye Scan Tool software. Refer to the EyesScan Tool User's Guide (SLUUBK2) for details.
3
Quick Start Guide
Use the following steps for quick-start procedures:
1. Apply 5-V power to the EVM, turn on SW1. LED D1 should light up.
2. If using external I2C adapter instead of pin straps, configure the TDP158 at this step.
3. Plug in a DP source using a standard DP cable into J2 (Standard DP connector).
4. Plug in an HDMI video sink device into J4 (Standard HDMI connector) using a standard HDMI cable.
5. Video output on HDMI sink should be observed.
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Schematic and Bill of Materials
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4
Schematic and Bill of Materials
This section contains the schematics and bill of materials for the EVM.
4.1
Schematic
Figure 3 through Figure 6 illustrates the EVM schematics.
BOARD_3P3V
R1
49.9
HDMI RX
R2
49.9
R6
49.9
R4
49.9
R7
49.9
R8
49.9
BOARD_5V
J1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
R10
R14
R9
0 - DNI
IN_D2P
PAGE2,3
0 - DNI
R11
0 - DNI
IN_D2N
IN_D1P
PAGE2,3
PAGE2,3
0 - DNI
IN_D1N
IN_D0P
PAGE2,3
PAGE2,3
IN_D0N
IN_CLKP
PAGE2,3
PAGE2,3
0 - DNI
R15
R16
0 - DNI
R17
R18
0 - DNI
0 - DNI
HDMI_IN_5V
R21
HPD_SRC
R12
2K - DNI
R13
2K - DNI
LP1
IN_CLKN
PAGE2,3
CEC
PAGE2,3
SPDIF
PAGE3
HDMI_SCL_SR_IN
HDMI_SDA_SRC_IN
R19
R20
LP2
0 - DNI
0 - DNI
SCL_SRC
SDA_SRC
PAGE2,3
PAGE2,3
0 Ohm - DNI
BOARD_5V
PAGE2,3
HPD_SRC is a 3.3V signal
HDMI specification requires
a 5.0V signal
20
21
Case1
Case2
Case3
Case4
22
23
R5
49.9
R3
49.9
R22
0 - DNI
R23
0 - DNI
Pop R22, R23, no pop R19, R20, R12, R13 for HDMI, DDC SNOOP
Pop R19, R20, R12, R13, no pop R22, R23 for HDMI, DDC ON
HDMI_SCL_SRC
HDMI_SDA_SRC
BOARD_3P3V
PAGE3
PAGE3
BOARD_3P3V
Displ ayPort++
J2
DPRX_GND
C1
R36
1M
1 uF
21
22
23
24
GND7
GND8
GND9
GND10
ML_3n
GND1
ML_3p
ML_2n
GND2
ML_2p
ML_1n
GND3
ML_1p
ML_0n
GND4
ML_0p
CAD (GND)
DP_CEC (GND)
AUX_p (SCL)
GND6
AUX_n (SDA)
HPD
DP_PWR_RTN
DP_PWR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
C_DPRX_LN3N
C_DPRX_LN3P
C_DPRX_LN2N
C_DPRX_LN2P
C_DPRX_LN1N
C_DPRX_LN1P
R26
R27
0
R31
R32
0
R33
0
0
R35
0
R34
C_DPRX_LN0N
C_DPRX_LN0P
DP_CAD
DP_SCL_SRC
0
R37
0
0
IN_CLKN
IN_CLKP
IN_D0N
PAGE2,3
PAGE2,3
IN_D0P
IN_D1N
IN_D1P
PAGE2,3
PAGE2,3
PAGE2,3
IN_D2N
PAGE2,3
IN_D2P
PAGE2,3
CEC
R24
0 - DNI
PAGE2,3
PAGE2,3
DP_SDA_SRC
HPD_SRC
R25
0 - DNI
R28
100K
R29
2K
R38
0
R39
0
R30
2K
Pop R38, R39, R29, R30 no pop R24, R25 for DP, DDC ON
Pop R24, R25 no pop R38, R39, R29, R30 for DP, DDC snoop NOTE: DDC snoop enables 5V DDC operation
SCL_SRC
PAGE2,3
SDA_SRC
PAGE2,3
PAGE2,3
Copyright © 2017, Texas Instruments Incorporated
Display_Port_Connector_Sink
Figure 3. TDP158RSBEVM Schematics (1 of 4) - Input Connectors
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Schematic and Bill of Materials
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VCC_3P3V
VDD_1P1V
C2
10uF
C3
C4
C5
C6
C7
C8
C9
C10
0.01uF
0.01uF
0.01uF
10 pF
4.7 pF
0.01uF
0.01uF
10 pF
C11
10uF
C12
C13
C14
C15
0.01uF
0.01uF
10 pF
4.7 pF
BOARD_5V
LP3
VDD_1P1V
VCC_3P3V
R40
2K
R41
2K
R42
1K
PAGE2
IN_D2P
PAGE2
IN_D2N
PAGE2
IN_D1P
PAGE2
IN_D1N
PAGE2
IN_D0P
PAGE2
IN_D0N
PAGE2
0.1uF
0.1uF
4
C18
0.1uF
5
C19
0.1uF
6
C20
0.1uF
7
C21
0.1uF
9
C22
0.1uF
10
C23
IN_CLKN
PAGE2
2
C17
IN_CLKP
PAGE2
1
C16
0.1uF
41
HDMI TX
IN_D2P
OUT_D2P
IN_D2N
OUT_D2N
TDP158
IN_D1P
3
2
1
PAD
15
35
GND2
GND1
11
37
VCC1
VCC2
20
31
12
VDD1
VDD2
40
VDD3
NC
U1
VDD4
19
J3
30
OUT_D1N
IN_D0P
OUT_D0P
IN_D0N
OUT_D0N
27
3
25
7
8
9
24
IN_CLKP
22
OUT_CLKP
IN_CLKN
HPD_SRC
4
5
6
26
OUT_CLKN
HPD_SRC
1
2
3
29
OUT_D1P
IN_D1N
J4
HPD_SNK
21
10
11
12
28
19
33
16
32
15
D2P
GND1
D2N
GND5
GND6
GND7
GND8
20
21
22
23
SDA_CTL and SCL_CTL are configuration
inputs when I2C_EN is low. J5 and J6 will set
the values of these pins and J17 and J19
should not be populated.
VCC_3P3V
D1P
GND2
D1N
R43
0 Ohm
J5
D0P
GND3
D0N
1
2
3
HI
PRE
LO
SDA_CTL/PRE
R44
0 Ohm
CLKP
GND4
CLKN
HPD
VCC_3P3V
SDA_SNK
SCL_SRC
SCL_SNK
R48
0 Ohm
PAGE5
R49
PAGE5
0 Ohm
OE
J6
CEC
UTILITY
DDC/CEC GND
5V
HI
SWAP
LO
1
2
3
SCL_CTL/SWAP
R47
0 Ohm
LP5
SCL_CTL/SWAP
HDMI_SDA_SRC
PAGE2
SDA_CTL/PRE
HDMI_SCL_SRC
PAGE2
1
2
3
OE
PAGE4
R51
5.49K
VCC_3P3V
HI
EQ1_A0
LO
R45
0 Ohm
SCL
TDP158RSB
R50
0 Ohm
VCC_3P3V
R52
0 Ohm
J10
SDA
VCC_3P3V
J8
HI
TERM
LO
13
14
17
18
CEC
SPDIF
BOARD_5V
36
VSADJ
18
SLEW
34
EQ2/A1
23
13
8
1
2
3
EQ1/A0
J7
HI
I2C_EN
LO
PAGE2
PAGE2
LP4
17
R46
0 Ohm
TERM
I2C_EN
VCC_3P3V
16
SCL_SRC
SDA_SRC
SDA_CTL/PRE
38
14
PAGE2
SDA_SRC
SCL_CTL/SWAP
PAGE2
39
1
2
3
HI
EQ2_A1
LO
R57
0 Ohm
R53
0 Ohm
J11
1
2
3
R54
0 Ohm
J12
HI
SLEW
LO
R58
0 Ohm
J9
VCC_3P3V
1
2
3
R59
0 Ohm
1
2
3
R55
PTV09 10K POT
DEFAULT
VSADJ
POT
HDR3X1 M .1
R56
47K
Copyright © 2017, Texas Instruments Incorporated
Figure 4. TDP158RSBEVM Schematics (2 of 4) - TDP158RSB Implementation
8
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WALL - OFF - USB 5V
SW1
3POS - SPDT
3.3V BUCK REGULATOR - 4V to 17V input
BOARD_3P3V
1
2
3
USB_5V
VCC_3P3V
LP6
J13
BOARD_IN
2
3
1
L1
U2
2.1mm x 5.5mm
+
C24
220uF
C25
10uF
9
EN
PVIN2
PVIN1
AVIN
SS/TR
R60
100K
7
REG_PG
PAGE4
C26
22uF
FB_3PT3V
8
DEF
2
R61
750K
5
FSW
3.3V
J14
1
2.2 uH
4
PG
FB
17
C27
3.3 nF
1
2
3
SW1
SW2
SW3
PGND2
PGND1
AGND
S
T
13
12
11
10
VOS
PAD
14
TPS62150A
16
15
6
PWRIN_SW
R62
0 Ohm
R63
240K
BOARD_3P3V
BOARD_3P3V
1.1V LDO REGULATOR
BOARD_1P1V
BOARD_3P3V
R64
10K - DNI
U3
R65
4.7K
10
EN1P2
11
IN1
IN2
IN3
IN4
PG
OUT1
OUT2
OUT3
OUT4
BIAS
EN
FB
1
20
19
18
SS
6
L2
R66
1.87K
16
1 uH
LP8
4
C29
10uF
FB_1PT2V
VIN
GND
L
VOUT
EN
FB
1
2
3
R67
499
TPS61240
7
15
2
5
NC1
NC2
NC3
NC4
NC5
NC6
GND
PAD
SS1P2
U4
1.1V
J15
1
C30
0.01uF
LP7
REG_PG
9
PAD
C28
10uF
5
6
7
8
BOARD_5V
5.0V BOOST
VDD_1P1V
C33
TPS74201RGWT
2
3
4
13
14
17
12
21
C34
R68
4.99K
C31
2.2uF
C32
10uF
10 pF
D1
LED Green 0805
5V PWR
1nF - DNI
VCC_3P3V
BOARD_3P3V
RESET
R69
10K
R70
0 Ohm
OE
PAGE3
C35
VCC_3P3V
220nF - DNI
R71
4.7K
SW2
PB_SWITCH
1
2
U5
PB_MANUAL_RESET
4
3
N.O.
18pF
PAGE4
REG_PG
RESET#
GND
MR#
VDD
SENSE
CT
TPS3808
C36
RESET
1
2
3
R72
6
5
4
TPS3808_CT
LP9
C37
C38
220pF
0.1uF
LP10
GND
GND
0 Ohm
Copyright © 2017, Texas Instruments Incorporated
Figure 5. TDP158RSBEVM Schematics (3 of 4) - Regulators
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Schematic and Bill of Materials
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TUSB3410
USB_5V
+1V8
BOARD_3P3V
C46
0.1uF
BOARD_3P3V
J16
11
10
9
R73
22pF
C45
6
1
2
3
4
5
7
R74
R75
1.5K
5
7
6
33
33
33pF
22pF
C48
DM0
DP0
X2
26
24
23
X2
2
4
3
X1
27
BOARD_3P3V
33pF
R77
1K
C50
0.1uF
U7
R78
1K
32
8
7
6
5
31
CAT24C256WI-GT3
PAGE5
SCL_CTL_USB
PAGE5
SDA_CTL_USB
R80
1K
X1/CLKI
CRYSTAL
C49
11
10
A0
Vcc
A1
WP
A2 SCL
Vss SDA
C44
0.01uF
1
USB Micro B
1
2
3
4
TEST1
TEST0
C47
Y1
C43
0.1uF
R76
10K
PUR
+1V8
30
29
R81
1K
1
2
BOARD_3P3V
9
R82
15K
DTR
RTS
SOUT/IR_SOUT
SIN/IR_SIN
RI/CP
DCD
DSR
CTS
21
20
19
17
16
15
14
13
SCL
SDA
BOARD_3P3V
P3_0
CLKOUT
22
P3_1
R79
10K
0402
5%
P3_3
P3_4
WAKEUP
12
VREGEN
SUSP
GND1
GND2
GND3
S3 S1
VBUS
S6 DM
DP
S5 ID
GND
S4 S2
C40
0.01uF
RESET
TUSB3410
8
18
28
8
C39
0.01uF
VDD1V8
VCC1
VCC2
C42
2.2uF
4
U6
C41
0.1uF
3
25
BOARD_3P3V
RSTIn
VCC_3P3V
R83
2K
PAGE3
SCL_CTL/SWAP
C51
1 uF
AARDVARK
CONNECTOR
R84
2K
J17
1
2
3
SCL_USB
SCL
SCL_AAR
SCL_CTL_USB
PAGE5
J18
J19
PAGE3
SDA_CTL/PRE
SDA_USB
SDA
SDA_AAR
1
2
3
SDA_CTL_USB
PAGE5
1
3
5
7
9
2
4
6
8
10
CONN PCB 5x2-S
Copyright © 2017, Texas Instruments Incorporated
Figure 6. TDP158RSBEVM Schematics (4 of 4) - TUSB3410 Implementation
10
TDP158 RSB Evaluation Module
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Schematic and Bill of Materials
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4.2
Bill of Materials
Table 5 lists the EVM BOM.
Table 5. Bill of Materials
Item
Qty
Reference
Part
PCB Footprint
Manufacturer
Part Number
Pkg
Description
1
2
C1,C51
1 uF
603
Taiyo Yuden
LMK107B7105KA-T
603
CAP CER 1UF 10V 10% X7R 0603
2
5
C38,C41,C43,C46,C50
0.1uF
402
Yageo
CC0402KRX5R6BB104
402
CAP CER 0.1UF 10V 10% X5R 0402
3
6
C2,C11,C25,C28,C29,C3
2
10uF
805
TDK
C2012X5R1C106K085AC
805
CAP CER 10UF 16V 10% X5R 0805
4
8
C16,C17,C18,C19,C20,C
21,C22,C23
0.1uF
201
TDK
C0603X5R0J104M
201
CAP CER .10UF 6.3V X5R 0201
5
11
C3,C4,C5,C8,C9,C12,C1
3,C30,C39,C40,C44
0.01uF
402
Murata
GRM155R71H103KA88D
402
CAP CER 1000PF 50V 10% X7R 0402
6
4
C6,C10,C14,C33
10 Pf
402
Murata
GRM1555C1H100JA01D
402
CAP CER 10PF 50V 10% X7R 0402
7
1
C36
18pF
402
AVX
04025A180JAT2A
402
CAP CERM 18PF 5% 50V NP0 0402
8
1
C37
220pF
402
Taiyo Yuden
UMK105B7221KV-F
402
CAP CER 220PF 50V 10% X7R 0402
9
1
C24
220uF
7343
Kemet
T491D227K016AT
7343
CAP TANT 220UF 16V 10% 2917
10
1
C27
3.3 nF
402
Samsung
CL05B332KB5NNNC
402
CAP CER 3300PF 50V 10% X7R 0402
11
1
C26
22uF
805
Murata
GRM21BR60J226ME39L
805
CAP CER 22UF 6.3V 20% X5R 0805
12
2
C31,C42
2.2uF
805
Taiyo Yuden
EMK212BJ225KG-T
805
CAP CER 2.2UF 16V 10% X5R 0805
13
0
C34,C35,R9,R10,R11,R1
4,R15,R16,R17,R18,
R19,R20,R22,R23,R24,R
25, R12,R13,R21,R64
DNI
402 / 201
14
2
C45,C48
22pF
402
Murata
GRM1555C1H220JA01D
402
CAP CER 22PF 50V 5% NP0 0402
15
2
C47,C49
33pF
402
Murata
GRM1555C1H330JA01D
402
CAP CER 33PF 50V 5% NP0 0402
16
2
C7,C15
4.7pF
402
Murata
GRM1555C1H4R7CA01D
402
CAP CER 4.7PF 50V 5% NP0 0402
17
1
D1
LED Green 0805
805
Lite On
LTST-C171GKT
805
LED GREEN CLEAR THIN 0805 SMD
18
2
J14,J15
HDR2X1 M .1
HDR_THVT_1x2_100
3M
961102-6404-AR
HDR2X1
CONN HEADER VERT SGL 2POS GOLD
19
11
J3,J5,J6,J7,J8,J9,J10,J1
1,J12,J17,J19
HDR3X1 M .1
HDR_THVT_1x3_100
3M
961103-6404-AR
HDR3X1
CONN HEADER VERT SGL 3POS GOLD
20
1
J2
Display_Port_Connect
or_Sink_0
DISPLAYPORT
Molex
47272-0001
DISPLAYPORT
CONN RCPT 20POS UDI R/A SMD
21
1
J18
Header 5x2 0.1" thruhole
con_thvt_shrd_2x5_100_m
3M
N2510-6002-RB
con_thvt_shrd_2x5_100_
m
CONN HEADER 10 POS STRGHT GOLD
22
1
J13
2.1mm x 5.5mm
PJ-202AH
CUI Inc.
PJ-202AH (PJ-002AH)
2.1mm x 5.5mm
CONN PWR JACK 2.1X5.5MM HIGH CUR
23
1
J16
USB Micro B
USB Micro B
FCI
10103592-0001LF
USB MICRO
CONN RCPT REV MICRO USB B R/A
24
10
LP1,LP2,LP3,LP4,LP5,L
P6,LP7,LP8,LP9,LP10
LP
TESTLOOP
Keystone Electronics
5006
THRU
TEST POINT PC COMPACT .063"D BLK
25
1
L1
2.2 uH
1008
TDK
VLS252010ET-2R2M
1008
INDUCTOR POWER 2.2UH 1.3A SMD
26
1
L2
1 uH
1008
TDK
NLCV25T-1R0M-EFR
1008
INDUCTOR POWER 1.0UH 1008
27
2
J1,J4
HDMI
CON_HDMI_RT_19_0p50mm
Molex
471510001
CON_HDMI_RT_19_0p5
0mm
CONN RCPT 19POS HDMI RT ANG SMD
28
8
R1,R2,R3,R4,R5,R6,R7,
R8
49.9
201
Panasonic
ERJ-1GEF49R9C
201
RES SMD 49.9 OHM 1% 1/20W 0201
29
5
R42,R77,R78,R80,R81
1K
402
Yageo
RC0402JR-071KL
402
RES SMD 1K OHM 5% 1/16W 0402
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Table 5. Bill of Materials (continued)
Item
Qty
Reference
Part
PCB Footprint
Manufacturer
Part Number
Pkg
Description
30
2
R28,R60
100K
402
Yageo
RC0402JR-07100KL
402
RES SMD 100K OHM 5% 1/16W 0402
31
10
R26,R27,R31,R32,R33,R
34,R35,R37,R38,R39
0
201
Panasonic
ERJ-1GN0R00C
201
RES SMD 0.0 OHM JUMPER 1/20W
32
6
R29,R30,R40,R41,R83,R
84
2K
402
Yageo
RC0402JR-072KL
402
RES SMD 2K OHM 5% 1/16W 0402
33
17
R43,R44,R45,R46,R47,R
48,R49,R50,R52,R53,R5
4,R57,R58,R59,R62,R70,
R72
0 Ohm
402
Panasonic
ERJ-2GE0R00X
402
RES SMD 0.0 OHM JUMPER 1/10W
34
1
R36
1M
402
Yageo
RC0402JR-071ML
402
RES SMD 1M OHM 5% 1/16W 0402
35
1
R51
5.49K
402
Panasonic
ERJ-2RKF5491X
402
RES SMD 5.49K OHM 1% 1/10W 0402
36
1
R55
PTV09 10K POT
THRUHOLE
Bourns
PTV09A-4015F-B103
THRUHOLE
POT 10K OHM 9MM SQ .05W CARB
37
3
R69,R76,R79
10K
402
Yageo
RC0402JR-0710KL
402
RES SMD 10K OHM 5% 1/16W 0402
38
2
R65,R71
4.7K
402
Yageo
RC0402JR-074K7L
402
RES SMD 4.7K OHM 5% 1/16W 0402
39
1
R67
499
402
Vishay Dale
CRCW0402499RDHEDP
402
RES SMD 499 OHM 0.5% 1/16W 0402
40
1
R61
750K
402
Vishay Dale
CRCW0402750KJNED
402
RES SMD 750K OHM 5% 1/16W 0402
41
1
R63
240K
402
Vishay Dale
CRCW0402240KJNED
402
RES SMD 240K OHM 5% 1/16W 0402
42
1
R66
1.87K
402
Stackpole
RMCF0402FT1K87
402
RES SMD 1.87K OHM 1% 1/16W 0402
43
1
R68
4.99K
402
Yageo
RC0402FR-074K99L
402
RES SMD 4.99K OHM 1% 1/16W 0402
44
1
R73
1.5K
402
Yageo
RC0402JR-071K5L
402
RES SMD 1.5K OHM 5% 1/16W 0402
45
2
R74,R75
33
201
Yageo
RC0201JR-0733RL
201
RES SMD 33 OHM 5% 1/20W 0201
46
1
R82
15K
402
Yageo
RC0402JR-0715KL
402
RES SMD 15K OHM 5% 1/16W 0402
47
1
R56
47K
402
Rohm
MCR01MRTJ473
402
RES SMD 47K OHM 5% 1/16W 0402
48
1
SW2
PB_SWITCH
SW_MOM_2NO
OMRON
B3SN-3012P
SW_MOM_2NO
SWITCH TACTILE SPST-NO 0.05A 24V
49
1
SW1
3POS_SPDT
THRUHOLE_3POS
NKK Switches
MS13ANW03
THRUHOLE_3POS
SW SLIDE SPDT 6A SILVER STR 125V
50
1
U1
TDP158RSB
40_RSB
TI
TDP158RSB
40_RSB
6 Gbps AC Coupled to TMDS™/HDMI™ Redriver
51
1
U5
TPS3808G30DBVT
6DBV
TI
TPS3808G30DBVT
6DBV
IC VOLT SUPERVISOR 3.0V SOT23-6
52
1
U2
TPS62150A
RGT16
TI
TPS62150ARGTT
RGT16
IC REG BUCK SYNC ADJ 1A 16QFN
53
1
U4
TPS61240
6DRV
TI
TPS61240DRVT
6DRV
IC REG BOOST SYNC 5V 0.45A 6SON
54
1
U3
TPS74201RGWT
RGW20
TI
TPS74201RGWT
RGW20
IC REG LDO ADJ 1.5A 20VQFN
55
1
U6
TUSB3410
LQFP32
TI
TUSB3410VF
LQFP-32
IC CONV SERIAL-TO-USB 32-LQFP
56
1
U7
CAT24C256WI-GT3
8SOIC
ON Semiconductor
CAT24C256WI-GT3
8SOIC
IC EEPROM 256KBIT 400KHZ 8SOIC
57
1
Y1
12 MHz Crystal
ECX-32
ECS Inc.
ECS-120-20-33-TR
4-SMD
CRYSTAL 12MHZ 20PF SMD
58
4
EVM Assembly
0.75" Standoff
4-40 - F/F
Keystone Electronics
2029
OD 0.187"
ROUND STANDOFF 4-40 ALUM 3/4"
59
4
EVM Assembly
0.25"- Stainless Steel
Screws
4-40 Phillips Panhead
Building Fasteners
PMSSS 440 0025 PH
OD 0.187"
MACHINE SCREW PAN PHILLIPS 4-40
60
9
Shunts
SHUNT
3M
969102-0000-DA
SHUNT
SHUNT JUMPER .1" BLACK GOLD
61
1
PCB
ANY
INT043
12
Shunt
TDP158RSBEVM
TDP158 RSB Evaluation Module
Printed Circuit Board
SLLU257A – February 2017 – Revised February 2018
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Board Layout
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5
Board Layout
Figure 7 through Figure 12 display the EVM board layouts.
Figure 7. Layer 1 (Top)
Figure 8. Layer 2 (GND)
SLLU257A – February 2017 – Revised February 2018
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TDP158 RSB Evaluation Module
13
Board Layout
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Figure 9. Layer 3 (PWR)
Figure 10. Layer 4 (PWR)
14
TDP158 RSB Evaluation Module
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Board Layout
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Figure 11. Layer 5 (GND)
Figure 12. Layer 6 (Bottom)
SLLU257A – February 2017 – Revised February 2018
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TDP158 RSB Evaluation Module
15
Total Phase Aardvark I2C Host Adapter Scripts
6
www.ti.com
Total Phase Aardvark I2C Host Adapter Scripts
Request the latest scripts from your TI representative.
7
References
1.
2.
3.
4.
TDP158 6-Gbps AC-Coupled to TMDS™/HDMI™ Redriver
Aardvark™ Adapter User Manual
High-Definition Multimedia Interface Specification Version 1.4b.
High-Definition Multimedia Interface Specification Version 2.0.
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (February 2017) to A Revision .................................................................................................. Page
•
•
•
•
•
•
16
Changed the EVM Figure 1 .............................................................................................................. 2
Corrected Reference Designators column in Table 4 ................................................................................ 5
Corrected TPD158 coulmn resistor values in Table 4 ................................................................................ 5
Changed the Section 2.6.1 ............................................................................................................... 6
Changed the Section 2.6.2 ............................................................................................................... 6
Changed From: TDP158 product preview To: the production datasheet in Section 7 ......................................... 16
Revision History
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Copyright © 2017–2018, Texas Instruments Incorporated
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
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You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
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RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
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regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
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third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
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