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Texas Instruments TUSB546 USB Type-C™ Enabler EVM User guides
User's Guide
SLLU251 – August 2016
TUSB546 USB Type-C™ Enabler EVM
The TUSB546 USB Type-C™ Alternate Mode re-driving switch supports data rates up to 10 Gbps for a
downstream facing port (host). This guide describes how to bring up the EVM and includes schematics
that can be used as a reference design for the alternate mode implementations of the host system with
the TUSB546 device.
1
2
3
4
Contents
TUSB546EVM-SRC ......................................................................................................... 2
TUSB546EVM Configuration ............................................................................................... 2
2.1
TUSB546 EVM Default EQ Configuration ....................................................................... 2
2.2
TUSB546 EQ Control .............................................................................................. 3
2.3
Power ................................................................................................................. 4
TUSB546EVM Schematics ................................................................................................. 5
Bill of Materials ............................................................................................................. 10
List of Figures
1
TUSB546 EVM ............................................................................................................... 2
2
Test Board Setup ............................................................................................................ 2
3
TUSB546EVM Block Diagram ............................................................................................. 5
4
TUSB546EVM Schematics (1 of 4)
6
5
TUSB546EVM Schematics (2 of 4)
7
7
.......................................................................................
.......................................................................................
TUSB546EVM Schematics (3 of 4) .......................................................................................
TUSB546EVM Schematics (4 of 4) .......................................................................................
1
TUSB546 Configuration Pins............................................................................................... 2
2
Configuration Pin-Level Definitions ........................................................................................ 3
3
USB 3.1 EQ Settings ........................................................................................................ 3
4
DisplayPort EQ Settings .................................................................................................... 4
5
TUSB546 EVM Bill of Materials .......................................................................................... 10
6
8
9
List of Tables
USB Type-C is a trademark of USB Implementers Forum, Inc..
All other trademarks are the property of their respective owners.
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1
TUSB546EVM-SRC
1
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TUSB546EVM-SRC
Figure 1 illustrates the EVM board.
Figure 1. TUSB546 EVM
The TUSB546EVM-SRC can be used with a legacy DP Source or USB Host system to evaluate the USB
Type-C implementation. Figure 2 is a typical test setup.
Figure 2. Test Board Setup
The EVM comes with a legacy Type B USB receptacle to connect to USB host systems and a DisplayPort
receptacle to connect to DisplayPort-capable source. The TUSB546 EVM uses the Texas Instruments
TPS65982 (http://www.ti.com/product/TPS65982) controller for power delivery and CC pin control.
2
TUSB546EVM Configuration
This section provides the configuration options available in the TUSB546EVM.
2.1
TUSB546 EVM Default EQ Configuration
The headers in Table 1 are provided for TUSB546 EQ configuration by default, configuration settings may
need to be optimized depending on the amount of loss of each channel in the system.
Table 1. TUSB546 Configuration Pins
2
Reference Designator
JMP Control
Configuration
JMP1
Downstream EQ0
No Connect
JMP2
Downstream EQ1
SHUNT on pin 2–4 (20-kΩ pulldown)
JMP3
Upstream SSEQ0
SHUNT on pin 2–1 (1-kΩ pullup)
JMP4
Upstream SSEQ1
SHUNT on pin 2–4 (20-kΩ pulldown)
JMP5
DP EQ0
SHUNT on pin 2–4 (20-kΩ pulldown)
JMP6
DP EQ1
SHUNT on pin 2–4 (20-kΩ pulldown)
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TUSB546EVM Configuration
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2.2
TUSB546 EQ Control
Each of the TUSB546 receiver lanes has individual controls for receiver equalization. Table 2, Table 3,
and Table 4 detail the gain values for each available combination for downstream, upstream, and all
DisplayPort configurations.
Table 2. Configuration Pin-Level Definitions
Level
Settings
0
Option 1: Tie 1 kΩ 5% to GND
Option 2: Tie directly to GND
R
Tie 20 kΩ, 5% to GND
F
Float (leave pin open)
1
Option 1: Tie 1 kΩ 5% to VCC
Option 2: Tie directly to VCC
Table 3. USB 3.1 EQ Settings
USB3.1 Downstream Facing Ports
USB3.1 Upstream Facing Port
EQ1 Pin
Level
EQ0 Pin
Level
EQ Gain @ 5 GHz (dB)
SSEQ1 Pin
Level
SSEQ0 Pin
Level
EQ Gain @ 5 GHz (dB)
0
0
0
0
0
0
0
R
1
0
R
1
0
F
2
0
F
2
0
1
3
0
1
3
R
0
4
R
0
4
R
R
5
R
R
5
R
F
6
R
F
6
R
1
7
R
1
7
F
0
8
F
0
8
F
R
9
F
R
9
F
F
10
F
F
10
F
1
11
F
1
11
1
0
12
1
0
12
1
R
13
1
R
13
1
F
14
1
F
14
1
1
15
1
1
15
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TUSB546EVM Configuration
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Table 4. DisplayPort EQ Settings
All DisplayPort Lanes
2.3
DPEQ1 Pin Level
DPEQ0 Pin Level
EQ Gain @ 5 GHz (dB)
0
0
0
0
R
1
0
F
2
0
1
3
R
0
4
R
R
5
R
F
6
R
1
7
F
0
8
F
R
9
F
F
10
F
1
11
1
0
12
1
R
13
1
F
14
1
1
15
Power
The EVM is designed to operate off of the VBUS from a USB host connected via USB Type B J4. No
external power is to be applied via J14 unless standalone operation is desired.
If testing the DisplayPort only, or if bypassing VBUS power, the EVM must be powered via J14 (5-V, 1-A
input).
4
TUSB546 USB Type-C™ Enabler EVM
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TUSB546EVM Schematics
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3
TUSB546EVM Schematics
Figure 3 displays the block diagram of the EVM.
Type_C VBUS
3P3V 5 V
AUX
TPS65982
Standard DP Sink
Connector
AUX
SBU
3P3V
C_SSTX1
DP0
C_SSRX1
DP1
C_SSTX2
DP2
C_SSRX2
TUSB546
(Socket Option)
DP3
USB-C(TM) Connector
SBU
SSTX
USB Type-B
Receptacle
SSRX
VBUS_5V
5V
5V_IN
3.3 V
5 V to 3.3 V
3.3 V
Copyright © 2016, Texas Instruments Incorporated
Figure 3. TUSB546EVM Block Diagram
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TUSB546EVM Schematics
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Figure 4 through Figure 7 show the EVM schematics.
TUSB546 - INT017A USB-C(TM) Enabler Board
Config Switch
LDO_1V8D
1046_3P3V
R154
10K
R153
R151
NC,4.7K NC,10K
SILKSCREEN:
R152
NC,4.7K
R103
NC,10K
R17
4.7K
R18
NC,10K
R19
4.7K
1046_EN/CTL1
AMSEL/CTL0
POL/FLIP
TUSB546
SW1
SilkScreen:
C32
C33
SSRXP_UP pg3
SSRXM_UP pg3
0.1uF
0201
0.1uF
0201
1046SSEQ1
CAD_SNK
1046_EN
AMSEL
POL
GND
LP5
SSTXP_UP pg3
SSTXM_UP pg3
1
2
3
4
1
2
3
4
8
7
6
5
CAD_SNK_L
8
7
6
5
4-POS 50-MIL SMT
SilkScreen:
1046_3P3V
1046DPEQ1
SilkScreen:
BRD_3P3V
R74
0
1046_3P3V
LP3
LP4
1046_3P3V
18
APU_DP_TX3N
19
2
TX1P
DP3P
HPDIN/DCI_CLK
DP3N
RX1N
VCC
RX1P
TUSB1046
BOARD_3P3V
1
VCC
4
5
6
3
SSEQ1
DPEQ1
SSRXN
SSRXP
7
TX1N
FLIP_SCL
Input from
TPS65982
VCC
8
SSTXP
SSTXN
EQ1
DP2N
I2C_EN
20
40
CRX2P
39
CRX2N
38
1046_EQ0
37
CTX2P_C
C28
36
CTX2N_C
C29
35
1046_EQ1
34
CTX1N_C
C30
33
CTX1P_C
C31
32
CRX1N
30
CRX1P
pg4 1046_EN
pg2,3,4 HPD_OUT
0.1uF
0201
0.1uF
0201
CTX2P
0.1uF
0201
0.1uF
0201
DNI, 20
0
CTX1N
DNI, 20
0
CTX2P pg3
CTX2N
DCI_CLK
CTL0
AMSEL
CTL1
EN
Mux Operation
X
LOW
LOW
POWER DOWN
LOW
LOW
HIGH
4-lane Orientation 1
HIGH
LOW
HIGH
4-lane Orientation 2
LOW
HIGH
HIGH
2-lane Orientation 1
SILKSCREEN
2
1
HPD_OUT pg2,3,4
CRX1N pg3
DCI_DAT
CAD_SNK
1046_EQ* Config
DCI_CLK
NC, HEADER 2
J17
AUX Snoop EN in GPIO mode
DCI_DAT in I2C mode
2
1
BOARD_3P3V
POL
R104
R113
0
NC, 0
R156
R155
0
NC, 0
I2C_SDA1046
I2C_SDA_Ext
BOARD_3P3V
SILKSCREEN
R114
1K +/- 5%
DCI_DAT
I2C_SCL1046 pg4
I2C_SCL_Ext pg4
I2C_SDA1046 pg4
I2C_SDA_Ext pg4
CSBU1_1046 pg3
R117
1K +/- 5%
JMP1
NC, HEADER 2
1046_EN
CSBU2_1046
FLIP
POL
20KPD
J16
CTX1P pg3 HPD_OUT in GPIO Mode
DCI_CLK in I2C Mode
I2C_SCL1046
I2C_SCL_Ext
CSBU1_1046
pg3 1046_DP_AUXP
pg3 1046_DP_AUXN
1KPU
I2CEN
1KPD
CTX1N pg3
CTX1P
0
DNI, 0
R134
1K +/- 5%
SILKSCREEN
CTX2N pg3
Pad Sharing
1046_3P3V
HPD_OUT in I2C Mode
1046 DP ENABLE in GPIO Mode
4
4 Pin-T Berg Jumper
R133
20K +/- 5%
CRX1P pg3
R150
R164
pg4 AMSEL
1
21046_I2C_EN
3
CRX2N pg3
R149
R165
31
29
CAD_SNK/DCI_DAT/EN
CRX2P pg3
pg3,4 POL
R163
R162
I2C_EN Header Config
220 @ 100MHZ
10uF
VCC
APU_DP_TX3P
DP2P
28
17
TX2N
SBU1
16
1046_I2C_EN
TX2P
DPEQ0_A1
SBU2
15
APU_DP_TX2N
DP1N
27
APU_DP_TX2P
C26
C27
0.1uF 0.1uF
JMP7
EQ0
AUXN
14
RX2P
RX2N
DP1P
26
13
1046DPEQ0
C35
0.1uF
R132
1K +/- 5%
SSEQ0_A0
25
pg3 APU_DP_TX3N
APU_DP_TX1N
R102
0
41
GND
DP0N
AUXP
pg3 APU_DP_TX3P
1046_3P3V
12
CTL1/HPDIN
pg3 APU_DP_TX2N
11
APU_DP_TX1P
24
pg3 APU_DP_TX2P
1046SSEQ0
DP0P
CTL0_SDA
pg3 APU_DP_TX1N
10
23
pg3 APU_DP_TX1P
9
APU_DP_TX0N
22
pg3 APU_DP_TX0N
APU_DP_TX0P
21
pg3 APU_DP_TX0P
R72
0
C34
C36
0.1uF
U1
R73
0
BOARD_3P3V
FB4
JMP2
1
21046_EQ0
3
4
4
R116
1K +/- 5%
4 Pin-T Berg Jumper
R115
20K +/- 5%
1
21046_EQ1
3
R119
1K +/- 5%
4 Pin-T Berg Jumper
R118
20K +/- 5%
SILKSCREEN
SILKSCREEN
1KPU
EQ0
1KPD
1KPU
EQ1
1KPD
20KPD
20KPD
CSBU2_1046 pg3
1046_SSEQ* Config
BOARD_3P3V
HIGH
HIGH
2-lane Orientation 2
LOW
HIGH
LOW
USB3.1 only Orientation 1
HIGH
HIGH
LOW
USB3.1 only Orientation 2
R123
1K +/- 5%
JMP3
JMP4
1
21046SSEQ0
3
4
HIGH
BOARD_3P3V
R120
1K +/- 5%
4 Pin-T Berg Jumper
R121
20K +/- 5%
4 Pin-T Berg Jumper
R125
20K +/- 5%
SILKSCREEN
DCI
CTL1/HPDIN
DP ENABLE in GPIO mode
HPD in I2C mode
DP Enable in GPIO mode,
Unused in I2C mode
29
CAD_SNK/DCI_DAT
AUX Snoop EN in GPIO mode
DCI_DAT in I2C mode
AUX Snoop EN in GPIO mode
EN in I2C mode
32
DCI_CLK
HPD in GPIO mode
DCI_CLK in I2C mode
HPD
1KPU
SSEQ1
1KPD
20KPD
non-DCI
23
R124
1K +/- 5%
SILKSCREEN
1KPU
SSEQ0
1KPD
20KPD
1
21046SSEQ1
3
4
R122
1K +/- 5%
1046_DPEQ* Config
BOARD_3P3V
BOARD_3P3V
R126
1K +/- 5%
R129
1K +/- 5%
JMP5
4
JMP6
1
21046DPEQ0
3
4 Pin-T Berg Jumper
R127
20K +/- 5%
4
R128
1K +/- 5%
4 Pin-T Berg Jumper
R131
20K +/- 5%
SILKSCREEN
20KPD
1KPU
DPEQ0
1KPD
1
21046DPEQ1
3
R130
1K +/- 5%
SILKSCREEN
20KPD
1KPU
DPEQ1
1KPD
Copyright © 2016, Texas Instruments Incorporated
Figure 4. TUSB546EVM Schematics (1 of 4)
6
TUSB546 USB Type-C™ Enabler EVM
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SILKSCREEN
TP1
GND
BOARD_3P3V
TP6
1
TEST POINT
R1
NC, 10K
TEST POINT
J1
HPD
GND
1
2
Test Purpose
Headers and
Options
BOARD_3P3V
C_CC2
1
R2
NC, 1M
TP2
HPD
GND
TP7
1
C_CC2
TUSB546 - INT017A USB-C(TM) Enabler Board
C_CC1
R3
NC, 0
C_CC2
R6
NC, 0
POL
POL pg2,4
C_CC1
C_CC1
1
R4
NC, 10K
TEST POINT
TEST POINT
R5
NC, 1M
TP3
GND
1
TEST POINT
place near J2 Type-C connector
USB and DP Connectors
TypeC_VBUS
TypeC Connector and Source
Pin Mapping
VBUS1
VBUS2
VBUS3
VBUS4
A1
B12
GND
ML2P
ML1P
SSTXP1
SSTXP2
A2
B11
SSRXP1
SSRXP2
ML3P
ML0P
ML2N
ML1N
SSTXN1
SSTXN2
A3
B10
SSRXN1
SSRXN2
ML3N
ML0N
A4
B9
VBUS
AUXP
AUXN
CC1
CC2
SBU1
SBU2
DN1
DP1
VBUS
DP2
DN2
CC1
A5
B8
DP1
A6
B7
DN2
SSTXP1
SSTXN1
DN1
A7
B6
DP2
SSRXP2
SSRXN2
SBU2
AUXN
AUXP
SBU1
A8
B5
CC2
VBUS
A9
B4
VBUS
A10
B3
SSTXN2
SSTXN1
ML1N
ML2N
A11
B2
B1
SSTXP2
SSTXP1
GND
ML1P
ML2P
A12
ML0N
ML3N
SSRXN2
SSRXN1
ML0P
ML3P
SSRXP2
SSRXP1
GND
10
9
8
7
6
5
4
3
2
1
Shield10 SSTXP2
Shield9 SSTXN2
Shield8
Shield7 SSRXP1
Shield6 SSRXN1
Shield5
Shield4
GND0
Shield3
GND1
Shield2
GND2
Shield1
GND3
A4
A9
B4
B9
C1
10uF
A5
B5
Share Pads:
R9 and R10
C_CC1 pg4
C_CC2 pg4
A8
B8
CSBU1
CSBU2
A7
A6
C_T_DM
C_T_DP
R16
R11
0
0
B6
B7
C_B_DP
C_B_DM
R12
R15
0
0
A2
A3
VBUS_TYPEB
R7
NC, 0
R8
R9
0
0
C_USB_TN pg4
C_USB_TP pg4
R10
NC, 0
C_USB_BP pg4
C_USB_BN pg4
Share Pads:
R11 and R12
CSBU1_65982 pg4
CSBU1_1046 pg2
CSBU2_1046 pg2
SILKSCREEN:
1
2
3
4
5
6
7
8
9
10
11
pg4 DM_UP
pg4 DP_UP
pg2 SSTXM_UP
pg2 SSTXP_UP
CTX2P pg2
CTX2N pg2
B11
B10
5V_COM
1
PMEG3050EP, 115
5V_IN
D2
LED Green 0805
J4
CRX2P pg2
CRX2N pg2
B2
B3
D1
2
CSBU2_65982 pg4
CTX1P pg2
CTX1N pg2
A11
A10
5V_COM
TP5
TEST POINT
1
GND
USB Host
Connection
J2
pg2 SSRXM_UP
pg2 SSRXP_UP
SSTXM_UP
SSTXP_UP
SSRXM_UP
SSRXP_UP
CRX1P pg2
CRX1N pg2
A1
A12
B1
B12
VBUS
DM
DP
GND
SSTXN
SSTXP
GND
SSRXN
SSRXP
SHIELD0
SHIELD1
C2
10uF
R25
330
0402
5%
USB3_TYPEB_CONNECTOR
TypeC_Receptacle_DualSMT_TOP
ESD
Components
U2
CTX1N
CTX1P
CRX1N
CRX1P
1
2
3
4
5
U3
D1+ NC10
D1NC9
GND GND
D2+
NC7
D2NC6
10
9
8
7
6
CTX1N
CTX1P
C_CC1
C_CC2
CRX1N
CRX1P
CSBU1
CSBU2
1
2
3
4
5
TPD4E05U06
CRX2N
CRX2P
1
2
3
4
5
10
9
8
7
6
C_CC1
C_CC2
10
9
8
7
6
C_USB_BN
C_USB_BP
APU_DP_AUXP
APU_DP_AUXN
CSBU1
CSBU2
R105
R106
0
0
R107
R108
NC, 0
NC, 0
1046_DP_AUXP pg2
1046_DP_AUXN pg2
AUXP_65982 pg4
AUXN_65982 pg4
TPD4E05U06
U5
CTX2N
CTX2P
D1+ NC10
D1NC9
GND GND
D2+
NC7
D2NC6
U4
D1+ NC10
D1NC9
GND GND
D2+
NC7
D2NC6
10
9
8
7
6
CTX2N
CTX2P
C_USB_BN
C_USB_BP
CRX2N
CRX2P
C_USB_TN
C_USB_TP
1
2
3
4
5
TPD4E05U06
D1+ NC10
D1NC9
GND GND
D2+
NC7
D2NC6
C_USB_TN
C_USB_TP
TPD4E05U06
BOARD_3P3V
R20
NC, 100k
BOARD_3P3V
APU_CFG1P
DisplayPort Source Connection
R21
NC, 100k
J3
pg2 APU_DP_TX3N
pg2 APU_DP_TX3P
pg2 APU_DP_TX1N
pg2 APU_DP_TX1P
BOARD_3P3V
R76
NC, 1M
APU_DP_TX3N
APU_DP_TX3P
APU_DP_TX1N
APU_DP_TX1P
ML_LANE3(n)
ML_LANE3(p)
GND4
ML_LANE1(n)
ML_LANE1(p)
GND3
CONFIG1
AUX_CH(p)
AUX_CH(n)
RTN_DP_PWR
21
22
23
24
GND
ML_LANE2(n)
ML_LANE2(p)
GND1
ML_LANE0(n)
ML_LANE0(p)
CONFIG2
GND2
HPD
DP_PWR
2
4
6
8
10
12
14
16
18
20
APU_DP_TX2N
APU_DP_TX2P
R78
NC, 1M
APU_DP_AUXN
R75
NC, 1M
DP SINK-SIDE CONNECTOR
Shld
Shld
Shld
Shld
APU_CFG1P
APU_DP_AUXP
APU_DP_AUXN
1
3
5
7
9
11
13
15
17
19
APU_DP_AUXP
R77
NC, 1M
APU_DP_TX2N pg2
APU_DP_TX2P pg2
APU_DP_TX0N
APU_DP_TX0P
APU_CFG2M
HPD_OUT
R23
0
R22
DNI, 0 HPD
DP_PWR
APU_DP_TX0N pg2
APU_DP_TX0P pg2
HPD_OUT pg2,4
HPD pg4
NOTE: ALL DIFF PAIRS ARE
ROUTED 85 TO 90 OHMS
DIFFERENTIAL AND 50 OHMS
COMMON MODE. ALL OTHER
TRACES ARE 50 OHM.
R24
NC, 5M
TP4
1
NC, TEST POINT
SILKSCREEN:
DP_PWR
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Figure 5. TUSB546EVM Schematics (2 of 4)
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TUSB546EVM Schematics
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TUSB546 - INT017A USB-C(TM) Enabler Board
NOTE: ALL DIFF PAIRS ARE
ROUTED 85 TO 90 OHMS
DIFFERENTIAL AND 50 OHMS
COMMON MODE. ALL OTHER
TRACES ARE 50 OHM.
BOARD_20V
J14
TPS65982
PD
Controller
NOTE: OPEN by default
2
1
BOARD_12V
J18
R27
0
R32
NC, 0
R28
0
Q2
9
817309_D
7
6
5
1
2
3
4
0.01, 1%, 0.25W
C3
10uF
Q1
17309_S
R26
R81
R33
NC, 0
CSD17309Q3
1
2
3
4
GPIO2
GPIO0
GPIO1
CSD17309Q3
R29
R30
R31
0
0
0
POL pg2,3
AMSEL pg2
1046_EN pg2
2
1
HV_GATE1
NC, 0R
9
8
7
6
5
R157
GND
C13
10uF
LP1
H10
982_3V3 VOUT_3V3 220 @ 100MHZ
LDO_3V3
C17
10uF
LDO_1V8D
B1
H1
LP2
H2
G1
A2
K1
E1
LDO_1V8A
LDO_BMC
C19
1uF
C18
1uF
R14
R13
pg3 DP_UP
pg3 DM_UP
C20
1uF
R37
R38
pg2,3 HPD_OUT
0
NC, 0
L5
K5
0
0
GPIO4_HPD
GPIO5_HPD
C10
E10
J1
J2
pg3 AUXP_65982
pg3 AUXN_65982
I2C_SCL1046
I2C_SDA1046
R158
R159
NC, 0
NC, 0
DBG_CTL1
R160
0
DBG_CTL2
R161
0
LDO_3V3
R53
10K
R54
3.3K
R56
10K
R57
3.3K
L2
K2
DEBUG3
DEBUG4
L3
K3
LSX_P2R
LSX_R2P
K4
L4
DBG_CTL1_R
DBG_CTL2_R
LDO_3V3
R55
3.3K
DEBUG1
DEBUG2
R58
3.3K
E4
D5
SPI_CLK
SPI_MOSI
SPI_MISO
SPI_SSZ
A3
B4
A4
B3
SWD_DAT
SWD_CLK
F4
G4
UART_TX
UART_RX
E2
F2
I2C_ADDR
F1
I2C_SDA1
I2C_SCL1
I2C_IRQ1Z
D1
D2
C1
I2C_SDA2
I2C_SCL2
I2C_IRQ2Z
A5
B5
B6
A9
HV_GATE2
B9
HV_GATE1
A10
SENSEN
SENSEP
PP_5V0_1
PP_5V0_2
PP_5V0_3
PP_5V0_4
TypeC_VBUS
FB3
VBUS4
VBUS3
VBUS2
VBUS1
RPD_G1
C_CC1
C_CC2
RPD_G2
PP_CABLE
VDDIO
VIN_3V3
C_USB_TP
C_USB_TN
VOUT_3V3
LDO_3V3
LDO_1V8D
LDO_1V8A
LDO_BMC
C_USB_BP
C_USB_BN
C_SBU1
C_SBU2
USB_RP_P
USB_RP_N
R_OSC
GPIO4
GPIO5
GPIO0
GPIO1
GPIO2
GPIO3
GPIO6
GPIO7
GPIO8
AUX_P
AUX_N
DEBUG1
DEBUG2
RESETZ
MRESET
DEBUG3
DEBUG4
BUSPOWERZ
65982_VBUS
K11
J11
J10
H11
C14
1uF
K9
L9
L10
K10
R34
0
R35
21 @ 100MHZ
B340A-13-F C9
D3
0.01uF
982_CC1 R109
982_CC2 R110
0
0
C15
220pF
C_USB_TP pg3
C_USB_TN pg3
K7
L7
C16
220pF
SILKSCREEN:
PD CTRL
C_USB_BP pg3
C_USB_BN pg3
K8
L8
G2
R36
GPIO1
DEBUG3
DEBUG4
I2CADDR
DBGCTL1
DBGCTL2
BUSPWRz
15K
B2
C2
D10
G11
G10
D7
H6
GPIO0
GPIO1
GPIO2
GPIO3
GPIO6
GPIO7
GPIO8
F11
E11
PD_RESETZ
PD_MRESET
F10
PD_BUSPWRZ
1
2
3
4
5
6
7
8
GPIO1
DEBUG3
DEBUG4
I2C_ADDR
DBG_CTL1
DBG_CTL2
PD_BUSPWRZ
UART_TX
UART_RX
R63
J17_14
R135
R143
NC, 0
GPIO7
0
C_CC2 pg3,4
J17_12
R136
R144
NC, 0
GPIO3
0
C_CC1 pg3,4
D6
R65
100K
pg2 I2C_SCL_Ext
GPIO1
I2C_SCL_Ext
R139
R141
0
NC, 0
J17_11
SPI_CLK
I2C_SDA_Ext
R140
R142
0
NC, 0
J17_13
LPad_5V
J12
I2C_SCL2
I2C_SCL1
2
4
6
8
10
AUXP_65982
AUXN_65982
Pad Sharing
LSX_P2R
LSX_R2P
SILKSCREEN:
SPI
BOARD_20V
R85
R83
NC, 0
NC, 0
I2C_SDA2 R86
I2C_SDA1 R84
NC, 0
NC, 0
R80
R79
1
R82
NC, 0 3
UART_RX
5
UART_TX
7
R93
09
J17_11
11
J17_13
13
I2C_IRQ2Z
15
J17_17
17
19
2
1
PMEG3050EP, 115
BOARD_12V
I2C_SDA2
I2C_SDA1
R67
R69
SPI_MISO
SPI_CLK
SPI_SSZ
0
0
1
3
5
7
9
2
4
6
8
10
DEBUG1
DEBUG3
R89
R90
0
NC, 0
GPIO8
GPIO6
R96
R97
0
NC, 0
DEBUG2
DEBUG4
R92
R91
0
NC, 0
TP8
TEST POINT
2
4
6
8
10
12
14
16
18
20
SPI_MISO
SPI_MOSI
J17_10
J17_12
J17_14
J17_16
J17_18 R137
0
J17_20 R138
0
J17_16 R145
R146
DBG_CTL1
0
NC, 0POL
NC, HEADER 2
J17_10 R147
R148
GPIO2
0
NC, 0HPD
LPad_5V
TP9
1
J5
TEST POINT
1
2
HPD pg3
LPad_3P3V
BOARD_3P3V
NC, HEADER 2
J6
1046_EN
AMSEL
1
2
J15_1
J15_3
NC, 0
NC, 0
DEBUG1_3
GPIO6_8
DEBUG2_4
J11
2
I2C_IRQ1Z
4
SPI_SSZ
6
8 J15.8
R94
0 PD_RESETZ
10 J15.10
R95
0 I2C_SCL1
SPI_MOSI
12
SPI_MISO
14
GPIO4_HPD
GPIO5_HPD
16
SPI_SSZ
18
R98
NC, 0
PD_MRESET
SWD_DAT
20
R99
0
SWD_CLK
NC, HDR10x2 M .1 Receptacle
SWD_DAT
DBG_CTL2
GPIO0
1
3
5
7
9
11
13
15
17
19
pg2 I2C_SCL1046
I2C_SCL1046
R100
R111
NC, 0
0
I2C_SCL2
I2C_SCL1
I2C_SDA1046
R101
R112
NC, 0
0
I2C_SDA2
I2C_SDA1
1
Header 5x2 0.1" Shroud RA thru-hole
PMEG3050EP, 115
5V_COM
3.3K
SPI_MOSI
D5
2
SPI_WP# R62
SILKSCREEN: PD Test Headers
NC, 0
NC, 0
R87
R88
J8
D4
C21
0.01uF
3
NC, HEADER 2
SPI
Programming
Header
0
0
/WP
8
4
NC, HDR10x2 M .1 Receptacle
SW4
SWITCH SPST-NO
R68
R70
VCC
GND
1
2
5V_COM
SILKSCREEN: PD Test Headers
Header 5x2 0.1" RA thru-hole
I2C_SCL2
I2C_SCL1
/CS
DO
DI
CLK
/HOLD
1
J7
SYS_DC_OUT
1
2
5
6
7
L11
I2C_SDA1
2
3.3K
SPI_SSZ
SPI_MISO
SPI_MOSI
SPI_CLK
SPI_HOLD#
TypeC_VBUS
NC
65982_3P3V
3
3.3K
3.3K
NC, 3.3K
J15
I2C_SDA2
I2C_SCL2
I2C_IRQ2Z
pg2 I2C_SDA_Ext
SWD_DAT
SWD_CLK
R45
1K
R52
NC, TBD
I2C_SDA1
I2C_SCL1
I2C_IRQ1Z
Keil
Debugger
Header
1
R44
1K
W25Q80
BOARD_3P3V
4
R43
1K
DBG_CTL1_H
DBG_CTL2_H
PD_BUSPWRZ_3V3
PD_BUSPWRZ_1V8
I2C_ADDR
SW3
B3SN-3012
SILKSCREEN: MRST
R42
1K
U7
R59
R60
R61
SWD_DAT
SWD_CLK
PD_SYS_RST
PD_MRESET
R41
1K
LDO_3V3
C22
0.01uF
1
3
5
7
9
R40
1K
GPIO1_H
DEBUG3_H
DEBUG4_H
SPI_CLK
SPI_MOSI
SPI_MISO
SPI_SSZ
SILKSCREEN: PDRST
R66
1K
16
15
14
13
12
11
10
9
R46 R47 R48 R49 R50 R51
100K 100K 100K 100K100K 100K
LPad_5V LPad_3P3V
Place near the edge
R39
1K
SW2
8-POS 50-MIL SMT
SILKSCREEN:
CSBU1_65982 pg3
CSBU2_65982 pg3
R64
1K
3
LDO_3V3
LDO_1V8D
K6
L6
PD_SYS_RST
2
C12
0.01uF
DBG_CTL1
DBG_CTL2
TPS65982
4
C11
0.01uF
LSX_P2R
LSX_R2P
BOARD_3P3V
1
C10
0.01uF
C_CC1 pg3,4
C_CC2 pg3,4
0
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
B11
A11
C11
D11
65982_3P3V
FB2
HRESET
BOARD_3P3V
C8
0.1uF
PP_HV1
PP_HV2
PP_HV3
PP_HV4
A1
B8
D8
E5
E6
E7
E8
G5
G6
G7
G8
H4
H5
H8
F5
F6
F7
F8
L1
A6
A7
A8
B7
65982_5V
FB1
21 @ 100MHZ
C7
22uF
H7
U6
SS
5V_COM
C4
0.22uF
C6
0.1uF
B10
HV_GATE2
C5
10uF
NC, 0R
pg2 I2C_SDA1046
D6
2
1
Pad Sharing
DNI, PMEG3050EP, 115
Copyright © 2016, Texas Instruments Incorporated
Figure 6. TUSB546EVM Schematics (3 of 4)
8
TUSB546 USB Type-C™ Enabler EVM
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TUSB546EVM Schematics
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TUSB546 - INT017A USB-C(TM) Enabler Board
Power
BOARD_3P3V
NOTE: POPULATE JUMPER BY DEFAULT
J9
PMEG3050EP, 115
D7
5V_COM
2
SILKSCREEN:
U3_PG
R71
2
1
1
5V_COM
5V_IN
178K
J10
8
5V DC Input
3
C24
2
10uF
1
3
DC_POWER_JACK
C23
6
L1
SW
VOS
7
U3_SW
10uF
1uH
EN
MODE
GND
9
2
VIN
PG
U8
1
PwPd
5V_IN
FB
5
4
C25
22uF
TPS62082DSGT
SYS_DC_OUT
SILKSCREEN:
20V DC_OUT
J13
2
1
3
SHIELD4
SHIELD3
SHIELD2
SHIELD1
POWER1
SENSE
POWER2
GND2
GND1
9
8
7
6
5
4
JPD1135-509-7F
Copyright © 2016, Texas Instruments Incorporated
Figure 7. TUSB546EVM Schematics (4 of 4)
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Bill of Materials
4
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Bill of Materials
Table 5 lists the TUSB546EVM bill of materials (BOM).
Table 5. TUSB546 EVM Bill of Materials
Item
Qty
Reference
Part
Manufacturer
Manufacturer Part Number
PCB Footprint
1
9
C1,C2,C3,C5,C13,C17,C23,C24
,C34
10uF
Murata
GRM188R61C106MA73D
603
2
1
C4
0.22uF
Murata
GRM152R61A224KE19D
402
3
12
C6,C8,C26,C27,C28,C29,C30,C
31,C32,C33,C35,C36
0.1uF
Murata
GRM155R61A104KA01D
402
4
2
C7,C25
22uF
Murata
GRM188R60J226MEA0D
603
5
6
C9,C10,C11,C12,C21,C22
0.01uF
Murata
GRM155R71C103KA01D
402
6
4
C14,C18,C19,C20
1uF
Murata
GRM155R60J105ME19D
402
7
2
C15,C16
220pF
Murata
GRM1555C1H221JA01D
402
8
5
D1,D4,D5,D6,D7
SCHOTTKY
NXP
PMEG3050EP,115
SOD-128
9
1
D2
LED Green 0805
Lumex
SML-LX0805GC-TR
805
10
1
D3
B340A-13-F
Diodes Inc
B340A-13-F
11
2
FB1,FB3
21 @ 100MHZ
Taiyo Yuden
FBMJ2125HM210NT
12
2
FB2,FB4
220 @ 100MHZ
MuRata
BLM18EG221SN1D
13
7
JMP1,JMP2,JMP3,JMP4,JMP5,
JMP6,JMP7
4 Pin-T Berg Jumper
14
4
J1,J9,J14,J18
CON02
68001-402HLF
HDR_THVT_1X2_100_M
15
1
J2
TypeC_Receptacle_DualSMT_T Foxconn
OP
UT12113-11601-7H
USB_TYPEC_UT1211
16
1
J3
DP SINK-SIDE CONNECTOR
Molex Inc
472720001
con_DP_SD-47272-001
17
1
J4
USB3_TYPEB_CONNECTOR
Amphenol Commercial Products
GSB4211311WEU
usb3_typeb_ak4aa009
18
5
J5,J6,J15,J16,J17
NC, HEADER 2
Omron Electronics Inc-EMC Div
XG8T-0231
berg1x2
19
1
J7
Header 5x2 0.1" RA thru-hole
FCI
68021-210HLF
HDR_THRT_68020
20
1
J8
Header 5x2 0.1" Shroud RA
thru-hole
3M
20210-5002HB
HDR_THRT_2X5_100
21
1
J10
DC_PWR_JACK
CUI Inc.
PJ-202AH
pj-202ah
22
2
J11,J12
NC, HDR10x2 M .1 Receptacle
Sullins
PPPC102LFBN-RC
HDR_THVT_2x10_100_F
23
1
J13
JPD1135-509-7F
Foxconn
JPD1135-509-7F
Jack_THRT_JPD1135
24
2
LP1,LP5
LP
Keystone Electronics
5011
THM Test Point
25
3
LP2,LP3,LP4,
Keystone Electronics
5010
THM Test Point
26
1
L1
1uH
Taiyo Yuden
NR3015T1R0N
IND_NR3015
27
2
Q1,Q2
MOS_P_4D_3S
Texas Instruments
CSD17309Q3
Q3_SON-8
10
berg2x3tee
FCI
TUSB546 USB Type-C™ Enabler EVM
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Bill of Materials
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Table 5. TUSB546 EVM Bill of Materials (continued)
Item
Qty
Reference
Part
Manufacturer
Manufacturer Part Number
PCB Footprint
28
2
R1,R4
NC, 10K
Panasonic Electronic Components
ERJ-2GEJ103X
402
29
6
R2,R5,R75,R76,R77,R78
NC, 1M
Panasonic Electronic Components
ERJ-2GEJ105X
402
30
34
R3,R6,R7,R10,R32,R33,R38,R7 NC, 0
9,R80,R82,R83,R84,R85,R86,R
87,R88,R90,R91,R97,R98,R100,
R101,R107,R108,R113,R135,R1
36,R141,R142,R146,R148,R155
,R158,R159
Panasonic Electronic Components
ERJ-2GE0R00X
402
31
53
R8,R9,R11,R12,R13,R14,R15,R 0
16,R23,R27,R28,R29,R30,R31,
R34,R35,R37,R67,R68,R69,R70
,R72,R73,R74,R89,R92,R93,R9
4,R95,R96,R99,R102,R104,R10
5,R106,R109,R110,R111,R112,
R137,R138,R139,R140,R143,R1
44,R145,R147,R156,R160,R161
,R163,R164,R165
Panasonic Electronic Components
ERJ-2GE0R00X
402
32
2
R17,R19
4.7K
Panasonic Electronic Components
ERJ-2GEJ472X
402
33
3
R18,R103,R151
NC,10K
Panasonic Electronic Components
ERJ-2GEJ103X
402
34
2
R20,R21
NC, 100k
Panasonic Electronic Components
ERJ-2GEJ104X
402
35
2
R22,R162
DNI, 0
Panasonic Electronic Components
ERJ-1GN0R00C
201
36
1
R24
NC, 1M
Panasonic Electronic Components
ERJ-1GEF1004C
201
37
1
R25
330
Panasonic Electronic Components
ERJ-2GEJ331X
402
38
1
R26
0.01, 1%, 0.25W
Panasonic Electronic Components
ERJ-6BWFR010V
805
39
1
R36
15K
Panasonic Electronic Components
ERJ-2RKF1502X
402
40
9
R39,R40,R41,R42,R43,R44,R45 1K
,R64,R66
Panasonic Electronic Components
ERJ-2GEJ102X
402
41
7
R46,R47,R48,R49,R50,R51,R65 100K
Panasonic Electronic Components
ERJ-2GEJ104X
402
42
1
R52
NC, 100
Panasonic Electronic Components
ERJ-2GEJ101X
402
43
3
R53,R56,R154
10K
Panasonic Electronic Components
ERJ-2GEJ103X
402
44
8
R54,R55,R57,R58,R59,R60,R62 3.3K
,R63
Panasonic Electronic Components
ERJ-2GEJ332X
402
45
1
R61
NC, 3.3K
Panasonic Electronic Components
ERJ-2GEJ332X
402
46
1
R71
178K
Panasonic Electronic Components
ERJ-3EKF1783V
603
47
2
R81,R157
NC, 0R
Vishay Dale
RCL12250000Z0EG
2512
48
14
R114,R116,R117,R119,R120,R1 1K +/- 5%
22,R123,R124,R126,R128,R129
,R130,R132,R134
Panasonic Electronic Components
ERJ-2GEJ102X
402
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Bill of Materials
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Table 5. TUSB546 EVM Bill of Materials (continued)
Item
Qty
Manufacturer
Manufacturer Part Number
PCB Footprint
49
7
R115,R118,R121,R125,R127,R1 20K +/- 5%
31,R133
Panasonic Electronic Components
ERJ-2GEJ203X
402
50
2
R149,R150
DNI, 20
Panasonic Electronic Components
ERJ-2GEJ200X
402
51
2
R152,R153
NC,4.7K
Panasonic Electronic Components
ERJ-2GEJ472X
402
52
1
SW1
4-POS 50-MIL SMT
CampersandK(ITT-CANNON)
TDA04H0SB1R
sw_smvt_dip_4pos_8
53
1
SW2
8-POS 50-MIL SMT
CampersandK(ITT-CANNON)
TDA08H0SB1R
SW_SMVT_SPST_TDA08
54
1
SW3
Pushbutton Switch
Omron Electronics Inc-EMC Div
B3SN-3012P
switch_b3sn
55
1
SW4
SWITCH SPST-NO
CampersandK Components
KMT221G HF LFS
kmt2_switch
56
8
TP1,TP2,TP3,TP5,TP6,TP7,TP8 TEST POINT
,TP9
Samtec
HTSW-101-07-G-S
berg1x1
57
1
TP4
NC, TEST POINT
Keystone Electronics
1035
berg1x1
58
1
U1
TUSB546
Texas Instruments
TUSB546
59
4
U2,U3,U4,U5
TPD4E05U06
Texas Instruments
TPD4E05U06
DQA
60
1
U6
TPS65982
Texas Instruments
TPS65982
ZQZ_BGA_96
61
1
U7
W25Q80
WINBOND
W25Q80DVSNIG
SOIC_8_197x157_50
62
1
U8
TPS62082DSGT
Texas Instruments
TPS62082DSGT
dsg
12
Reference
Part
TUSB546 USB Type-C™ Enabler EVM
SLLU251 – August 2016
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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