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Texas Instruments DS90UB924-Q1EVM User guides
DS90UB924-Q1EVM
User's Guide
Literature Number: SNLU208
April 2016
Contents
1
DS90UB924-Q1EVM User's Guide
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
1.15
.......................................................................................... 5
General Description ......................................................................................................... 5
Features ....................................................................................................................... 5
System Requirements ...................................................................................................... 6
Contents of the Demo Evaluation Kit ..................................................................................... 6
Applications Diagram ........................................................................................................ 6
Typical Configuration ........................................................................................................ 7
Quick Start Guide ............................................................................................................ 8
Default Jumper Settings .................................................................................................... 9
Default Switch Settings ..................................................................................................... 9
Demo Board Connections ................................................................................................. 10
ALP Software Setup ....................................................................................................... 12
1.11.1 System Requirements ........................................................................................... 12
1.11.2 Download Contents .............................................................................................. 12
1.11.3 Installation of the ALP Software ................................................................................ 12
1.11.4 Startup - Software Description.................................................................................. 13
1.11.5 Information Tab ................................................................................................... 16
1.11.6 Pattern Generator Tab........................................................................................... 17
1.11.7 Registers Tab ..................................................................................................... 18
1.11.8 Registers Tab - Address 0x00 selected ....................................................................... 19
1.11.9 Scripting Tab ...................................................................................................... 21
Troubleshooting ALP Software ........................................................................................... 22
1.12.1 ALP Loads the Incorrect Profile ................................................................................ 22
1.12.2 ALP does not detect the EVM .................................................................................. 24
Typical Connection and Test Equipment ................................................................................ 26
Equipment References .................................................................................................... 27
Cable References .......................................................................................................... 27
2
Bill of Materials .................................................................................................................. 28
A
EVM PCB Schematics ......................................................................................................... 30
A.1
A.2
A.3
A.4
B
31
32
33
34
Board Layout ..................................................................................................................... 35
B.1
2
Board Stackup ..............................................................................................................
DS90UB924-Q1 Deserializer .............................................................................................
USB-to-I2C Controller .....................................................................................................
Power ........................................................................................................................
Board Layers ................................................................................................................ 35
Contents
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List of Figures
1-1.
Applications Diagram ........................................................................................................ 6
1-2.
Typical Configuration ........................................................................................................ 7
1-3.
...................................................................................................... 8
............................................................................................................. 13
Initial ALP Screen .......................................................................................................... 14
Follow-up Screen ........................................................................................................... 15
ALP Information Tab ....................................................................................................... 16
ALP Pattern Generator Tab ............................................................................................... 17
ALP Registers Tab ......................................................................................................... 18
ALP Device ID Selected ................................................................................................... 19
ALP Scripting Tab .......................................................................................................... 21
USB2ANY Setup ........................................................................................................... 22
Remove Incorrect Profile .................................................................................................. 22
Add Correct Profile ......................................................................................................... 23
ALP No Devices Error ..................................................................................................... 24
Windows 7, ALP USB Driver ............................................................................................. 24
ALP in Demo Mode ........................................................................................................ 25
ALP Preferences Menu .................................................................................................... 25
Typical Test Setup for Video Application ................................................................................ 26
Typical Test Setup for Evaluation ........................................................................................ 26
Board Stackup .............................................................................................................. 31
Deserializer.................................................................................................................. 32
USB-to-I2C Controller ..................................................................................................... 33
Power ........................................................................................................................ 34
Top Silkscreen .............................................................................................................. 35
Top Solder Mask ........................................................................................................... 35
Top Copper ................................................................................................................. 35
Internal Layer 1: Ground .................................................................................................. 35
Internal Layer 2: Power .................................................................................................... 35
Bottom Copper.............................................................................................................. 35
Bottom Solder Mask ....................................................................................................... 37
Bottom Silkscreen .......................................................................................................... 37
Drill ........................................................................................................................... 37
1-4.
1-5.
1-6.
1-7.
1-8.
1-9.
1-10.
1-11.
1-12.
1-13.
1-14.
1-15.
1-16.
1-17.
1-18.
1-19.
1-20.
A-1.
A-2.
A-3.
A-4.
1
2
3
4
5
6
7
8
9
Interfacing to the EVM
Launching ALP
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List of Figures
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3
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List of Tables
Default Board Jumper Settings
1-2.
Default Board Switch Settings
1-3.
1-4.
1-5.
1-6.
1-7.
1-8.
1-9.
2-1.
4
............................................................................................ 9
............................................................................................. 9
Power Supply ............................................................................................................... 10
USB2ANY Connector ...................................................................................................... 10
I2C Interface Header ....................................................................................................... 10
MODE SELECTION INPUTS (S1) ....................................................................................... 10
IDx Settings (S2 and S3) ................................................................................................. 10
OUTPUT STATE SELECT (S4) .......................................................................................... 11
MODE_SEL Settings (S5) ................................................................................................ 11
Bill of Materials ............................................................................................................. 28
1-1.
List of Tables
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Chapter 1
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DS90UB924-Q1EVM User's Guide
1.1
General Description
The DS90UB924-Q1EVM (Evaluation Module) helps system designers evaluate the operation and
performance of the DS90UB924-Q1 FPD-Link III Deserializer. The device translates a high-speed
serialized FPD-Link III interface transported over a single Shielded Twisted Pair (STP) cable into four
FPD-Link (OpenLDI) compatible LVDS data output pairs and on LVDS clock. The DS90UB924-Q1 is in
conjunction with the DS90UB921-Q1, DS90UB925Q-Q1, DS90UB927Q-Q1, DS90UB929Q1,DS90UB949-Q1, and DS90UB947-Q1 Serializers.
The DS90UB924-Q1EVM board features a 20-position IDC connector for connecting to the FPD-Link
(OpenLDI) outputs and a HSD Automotive Connector for connecting an automotive-grade STP cable to
the FPD-Link III input. The included SMA connectors may also be configured as the FPD-Link III data
input, enabling evaluation of other connectors and cable configurations.
The DS90UB924-Q1 supports clocks in the range of 5 MHz to 96 MHz.
WARNING
The demo board is not intended for EMI testing. The demo board was
designed for easy accessibility to device pins with tap points for
monitoring or applying signals, additional pads for termination, and
multiple connector options.
1.2
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications AEC-Q100
– Device Temperature Grade 2: -40°C to +105°C Ambient Operating Temperature Range
– Device HBM ESD Classification Level ± 8 kV
– Device CDM ESD Classification Level C6
5 MHz to 96 MHz Pixel Clock Support
Bidirectional Control Channel Interface with I2C-Compatible Serial Control Bus
Low EMI FPD-Link (OpenLDI) Video Output
Supports High Definition (720p) Digital Video
RGB888 + VS, HS, DE and I2S Audio Supported
Up to 4 I2S Digital Audio Outputs for Surround Sound Applications
4 Bidirectional GPIO Channels With 2 Dedicated Pins
Single 3.3 V supply with 1.8 V or 3.3 V Compatible LVCMOS I/O Interface
AC-Coupled STP Interconnect Up to 10 Meters
DC-Balanced and Scrambled Data with Embedded Clock
Adaptive Cable Equalization
Internal Pattern Generation
Backward Compatible Modes
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System Requirements
1.3
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System Requirements
In order to demonstrate, the following is required:
1. FPD-Link III compatible serializer
(a) DS90UB921-Q1, DS90UB929-Q1, DS90UB949-Q1, and DS90UB947-Q1 up to 96MHz
(b) DS90UB925Q-Q1 and DS90UB927Q-Q1 up to 85MHz
2. Optional I2C controller
3. Power supply for 3.3 V or 5 V @ 1 A
1.4
Contents of the Demo Evaluation Kit
1. One EVM board with the DS90UB924-Q1
2. USB Cable
1.5
Applications Diagram
FPD-Link
(Open LDI)
VDD33
VDDIO
(3.3V) (1.8V or 3.3V)
HOST
Graphics
Processor
RGB Digital Display Interface
VDDIO
VDD33
(1.8V or 3.3V) (3.3V)
R[7:0]
G[7:0]
B[7:0]
HS
VS
DE
PCLK
TxOUT3+/-
FPD-Link III
1 Pair/AC Coupled
DOUT+
TxOUT2+/-
RIN+
RIN-
DOUT100Q STP Cable
PDB
I2S AUDIO
(STEREO)
3
SCL
SDA
IDx
DS90UB921-Q1
Serializer
DAP
OEN
OSS_SEL
MODE_SEL
PDB
INTB
MAPSEL
LFMODE
BISTEN
MODE_SEL
DS90UB924-Q1
Deserializer
TxOUT1+/TxOUT0+/-
LVDS Display
720p or
Graphic
Proccesor
TxCLKOUT+/INTB_IN
LOCK
PASS
6
I2S
MCLK
SCL
SDA
IDx
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Figure 1-1. Applications Diagram
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Typical Configuration
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1.6
Typical Configuration
I2C
Digital Video
Processor /
Graphics Controller
A/V Source
FPD-Link
DS90UB921-Q1
I2S
ADC
FPD-Link III
8 )RUZDUG &KDQQHO (A/V, I2C, GPIO)
Back Channel (I2C, GPIO) :
LCD Monitor, LCD TV, Digital TV
I2S
FPD-Link
LCD Drivers
DS90UB924-Q1
I2C
LCD Controller
-Timing
-Clock/Data
DAC
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Figure 1-2. Typical Configuration
Figure 1-1 and Figure 1-2 illustrate the use of the chipset in a display application.
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Quick Start Guide
1.7
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Quick Start Guide
1. The DS90UB924-Q1EVM is configured for the differential operation by using STP cable.
2. Connect J4 to compatible Serializer e.g. DS90UB921-Q1, DS90UB925Q-Q1, DS90UB927Q-Q1,
DS90UB929-Q1, DS90UB949-Q1, and DS90UB947-Q1.
3. Configure switches S2, S3 and S5 to set I2C address (IDx) and the device configuration select
(MODE_SEL).
• S2 and S3: IDx = 0x58 (default factory setting)
• S5: MODE_SEL = 1 (default factory setting)
4. Connect J8 to 3.3 V and J9 to GND.
(a) Optional power options available, J7, 5 V (see Table 1-3)
5. Connect J6 with miniUSB cable to PC USB port
For details of pin-names and pin-functions, please refer to the DS90UB924-Q1 datasheet.
Figure 1-3. Interfacing to the EVM
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Default Jumper Settings
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1.8
Default Jumper Settings
Ensure that the board has the default board jumper settings:
Table 1-1. Default Board Jumper Settings
1.9
JUMPER
JUMPER SETTINGS
JP7
Connect jumper to select +3.3 V for VDDIO = VDD33 or +1.8 V for VDDIO = 1.8 V
Default Switch Settings
Ensure that the board has the default board switch settings:
Table 1-2. Default Board Switch Settings
SWITCH
SWITCH SETTINGS
S1
1 to 3 OFF, 4 ON
S2
1 to 8 OFF
S3
1 ON, 2 to 8 OFF
S4
1 ON, 2 OFF, 3 ON
S5
1 ON, 2 to 3 OFF
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Demo Board Connections
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1.10 Demo Board Connections
Table 1-3. Power Supply
DESIGNATOR
SIGNAL
DESCRIPTION
5 V power supply, 5 V power connector that supplies power to the
entire board.
J7
5V
J8
3.3 V
3.3 V power supply, 3.3 V power connector that supplies power to the
entire board.
J9
GND
Ground
Table 1-4. USB2ANY Connector
DESIGNATOR
DESCRIPTION
J6
mini USB 5 pin, USB Connector for USB-to-I2C Controller. Connect
USB cable to host PC to use the ALP evaluation software with the
EVM board.
Table 1-5. I2C Interface Header
DESIGNATOR
SIGNAL
J5.1
VDDI2C
J5.2
SCL
J5.3
SDA
J5.4
GND
Table 1-6. MODE SELECTION INPUTS (S1)
DESIGNATOR
DESCRIPTION
S1.1
BISTEN
LOW: Normal operation.
HIGH: Enable the Built-In Self-tet (BIST) mode.
S1.2
MAPSEL
LOW: Assign LSBs to TxOUT3±.
HIGH: Assign MSBs to TxOUT3±.
S1.3
LFMODE
LOW: 5 MHz ≤ PCLK < 15 MHz.
HIGH: 15 MHz < PCLK ≤ 96 MHz
S1.4
PDB
LOW: The device enters low power mode and all register are reset.
HIGH: Normal Operation.
Table 1-7. IDx Settings (S2 and S3) (1)
(1)
10
DESIGNATOR
MODE #
7-Bit ADDRESS
S2.1
3
0x34
8-Bit ADDRESS
0x68
S2.2
4
0x35
0x6A
S2.3
5
0x36
0x6C
S2.4
6
0x37
0x6E
S2.5
7
0x38
0x70
S2.6
8
0x39
0x72
S2.7
9
0x3A
0x74
S2.8
10
0x3B
0x76
S3.1 (Default)
1
0x2C
0x58
S3.8
2
0x33
0x66
Only set one high.
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Demo Board Connections
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Table 1-8. OUTPUT STATE SELECT (S4)
DESIGNATOR
DESCRIPTION
S4.1
OEN
S4.2
BISTC / INTB_IN
S4.3
OSS_SEL
Table 1-9. MODE_SEL Settings (S5)
(1)
(1)
DESIGNATOR
MODE #
REPEAT
BKWD
I2S-B
LCBL
S5.1 (Default)
1
L
L
L
L
S5.2
7
H
L
L
H
S5.3
9
L
H
L
L
Only set one high.
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ALP Software Setup
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1.11 ALP Software Setup
1.11.1 System Requirements
Operating System:
USB:
USB2ANY Firmware Version:
Windows 7 64-bit
USB2ANY
2.6.5.0
1.11.2 Download Contents
TI Analog LaunchPAD can be downloaded from: http://www.ti.com/tool/alp.
Download and extract the zip file to a temporary location that can be deleted later.
Make sure J6 on the DS90UB924-Q1 EVM is connected to a PC USB port with USB cable and power is
applied to the DS90UB924-Q1 EVM.
The following installation instructions are for the Windows 7 64-bit Operating System.
1.11.3 Installation of the ALP Software
Execute the ALP Setup Wizard program called “ALP_setup_v_x_x_x.exe” that was extracted to a
temporary location on the local drive of your PC.
There are 7 steps to the installation once the setup wizard is started:
1. Select the "Next" button.
2. Select “I accept the agreement” and then select the “Next” button.
3. Select the location to install the ALP software and then select the “Next” button.
4. Select the location for the start menu shortcut and then select the “Next” button.
5. There will then be a screen that allows the creation of a desktop icon. After selecting the desired
choices select the “Next” button.
6. Select the “Install” button, and the software will then be installed to the selected location.
7. Uncheck “Launch Analog LaunchPAD” and select the “Finish” button. The ALP software will start if
“Launch Analog LaunchPAD” is checked, but it will not be useful until the USB driver is installed and
board is attached.
Connect J6 USB jack of the DS90UB924-Q1 EVM board to a PC/laptop USB port using a Type A
1
2
3
4
A to mini-B
1 2 3
4
MINI
USB cable. The “Found New Hardware Wizard” will open on the
PC/laptop.
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ALP Software Setup
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1.11.4 Startup - Software Description
Make sure all the software has been installed and the hardware is powered on and connected to the PC.
Execute “Analog LaunchPAD” shortcut from the start menu. The default start menu location is under All
Programs > Texas Instruments > Analog LaunchPAD vx.x.x > Analog LaunchPAD to start MainGUI.exe.
Figure 1-4. Launching ALP
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ALP Software Setup
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1.11.4.1 Initial ALP Screen
The application should come up in the state shown in Figure 1-5. If it does not, see Section 1.12,
“Troubleshooting ALP Software”.
Under the Devices tab click on “DS90UB924” to select the device and open up the device profile and its
associated tabs.
Figure 1-5. Initial ALP Screen
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ALP Software Setup
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After selecting the DS90UB924, the following screen should appear.
Figure 1-6. Follow-up Screen
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ALP Software Setup
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1.11.5 Information Tab
The Information tab is shown below. Please note the device revision could be different.
Figure 1-7. ALP Information Tab
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ALP Software Setup
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1.11.6 Pattern Generator Tab
The Pattern Generator tab is shown below.
Figure 1-8. ALP Pattern Generator Tab
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ALP Software Setup
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1.11.7 Registers Tab
The Registers tab is shown below.
Figure 1-9. ALP Registers Tab
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1.11.8 Registers Tab - Address 0x00 selected
Address 0x00 selected as shown below. Note that the “Value:” box,
value of that register.
, will now show the hex
Figure 1-10. ALP Device ID Selected
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ALP Software Setup
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By double clicking on the Address bar
or a single click on
. Address 0x00 expanded reveals contents by bits. Any register address
displayed can be expanded.
Any RW Type register,
, can be written into by writing the hex value into the “Value:” box,
or putting the pointer into the individual register bit(s) box by a left mouse click to put a check mark
(indicating a “1”) or un-checking to remove the check mark (indicating a “0”). Click the “Apply” button to
write to the register, and “refresh” to see the new value of the selected (highlighted) register.
The box toggles on every mouse click.
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ALP Software Setup
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1.11.9 Scripting Tab
The Scripting tab is shown below.
Figure 1-11. ALP Scripting Tab
The script window provides a full Python scripting environment which can be for running scripts and
interacting with the device in an interactive or automated fashion.
WARNING
Directly interacting with devices either through register
modifications or calling device support library functions can effect
the performance and/or functionality of the user interface and may
even crash the ALP Framework application.
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Troubleshooting ALP Software
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1.12 Troubleshooting ALP Software
1.12.1 ALP Loads the Incorrect Profile
If ALP opens with the incorrect profile loaded the correct profile can be loaded from the
USB2ANY/Aardvark Setup found under the tools menu.
Figure 1-12. USB2ANY Setup
Highlight the incorrect profile in the Defined ALP Devices list and press the remove button.
Figure 1-13. Remove Incorrect Profile
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Find the correct profile under the Select a Daughter Board list, highlight the profile and press Add.
Figure 1-14. Add Correct Profile
Select Ok and the correct profile should now be loaded.
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Troubleshooting ALP Software
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1.12.2 ALP does not detect the EVM
If the following window opens after starting the ALP software, double check the hardware setup.
Figure 1-15. ALP No Devices Error
It may also be that the USB driver is not installed. Check the device manager. There should be a “HIDcompliant device” under the “Human Interface Devices” as shown below.
Figure 1-16. Windows 7, ALP USB Driver
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Troubleshooting ALP Software
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The software should start with only “DS90UB924” in the “Devices” pull down menu. If there are more
devices then the software is most likely in demo mode. When the ALP is operating in demo mode there is
a “(Demo Mode)” indication in the lower left of the application status bar as shown below.
Figure 1-17. ALP in Demo Mode
Disable the demo mode by selecting the “Preferences” pull down menu and un-checking “Enable Demo
Mode”.
Figure 1-18. ALP Preferences Menu
After demo mode is disabled, the ALP software will poll the ALP hardware. The ALP software will update
and have only “DS90UB924” under the “Devices” pull down menu.
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Typical Connection and Test Equipment
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1.13 Typical Connection and Test Equipment
The following is a list of typical test equipment that may be used to generate signals for the Serializer
inputs:
1. Digital Video Source – for generation of specific display timing such as Digital Video Processor,
OpenLDI or Graphics Controller (GPU).
2. Any other signal generator / video source - This video generator may be used for video signal sources.
3. Any other signal / video generator that provides the correct input levels as specified in the datasheet.
The picture below shows a typical test set up using a Graphics Controller and display.
Figure 1-19. Typical Test Setup for Video Application
The picture below shows a typical test set up using a video generator and logic analyzer.
Figure 1-20. Typical Test Setup for Evaluation
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Equipment References
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1.14 Equipment References
NOTE: Please note that the following references are supplied only as a courtesy to our valued
customers. It is not intended to be an endorsement of any particular equipment or supplier.
Digital Video Pattern Generator:
Astrodesign
www.astro-americas.com
Logic Analyzer:
keysight Technologies
www.keysight.com
Corelis CAS-1000-I2C/E I2C Bus Analyzer and Exerciser Products:
www.corelis.com/products/I2C-Analyzer.htm
Aardvark I2C/SPI Host Adapter Part Number: TP240141
www.totalphase.com/products/aardvark_i2cspi
1.15 Cable References
TI recommends Shielded Twisted Pair (STP) 100ohm differential impedance and 24 AWG (or larger
diameter) cable for high-speed data applications.
Leoni Dacar 535-2 series cable:
www.leoni-automotive-cables.com
Rosenberger HSD connector:
www.rosenberger.de/en/Products/35_Automotive_HSD.php
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Chapter 2
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Bill of Materials
Table 2-1. Bill of Materials
28
Item
Qty
Reference
Description
Manufacturer
Part Number
1
2
CR1,CR2
SUPPRESSOR ESD 24VDC 0603 SMD
Littelfuse Inc
PGB1010603MR
2
16
C1,C5,C8,C9,C10,C12,
C13,C14,C16,C17,C22,
C26,C28,C33,C35,C37
CAP CER .1UF 50V 10% X7R 0603
Murata Electronics
North America
GRM188R71H104KA93D
3
4
C2,C3,C54,C56
CAP CER .1UF 16V X7R 0402
Murata
GCM155R71C104KA55D
4
2
C6,C7
CAP CERAMIC 4.7PF 25V C0G 0402
Panasonic
ECD-G0E4R7C
5
5
C11,C27,C29,C36,C38
CAP CER 10UF 16V X7R 10% 1206.
TDK
C3216X7R1C106K
6
1
C15
CAPACITOR TANT 1.0UF 16V 10% SMD
Kemet
T491A105K016AT
7
2
C18,C19
CAP CERAMIC 15PF 50V NP0 0603
Kemet
C0603C150J5GACTU
8
1
C21
CAP CER 22UF 6.3V 10% X7R 1206
Murata
GCM31CR70J226KE23L
9
2
C23,C32
CAPACITOR TANT 2.2UF 20V 10% SMD
KEMET
T491B225K020AT
10
2
C24,C31
CAP TANTALUM 22UF 25V 20% SMD
nichicon
F931E226MNC
11
12
C25,C40,C41,C42,C43,
C44,C45,C46,C51,C52,
C53,C55
CAP CER 4.7UF 16V X7R 0805
Murata
490-5332-1-ND
12
1
C30
CAP CERM 33000PF 5% 50V X7R 0603
AVX Corporation
06035C333JAT2A
SML-LX0402SOC-TR
13
2
D1,LED2
LED ORN/CLEAR 610NM 0402 SMD
Lumex Opto/ Components
Inc
14
2
D3,D4
DIODE SCHOTTKY 400MW 20V SOD123
Diodes Inc.
SD103CW-13-F
15
1
JP3
CONN HEADER 20POS .100 STR 15AU
FCI
67997-220HLF
16
3
JP5,JP6,JP11
CONN HEADER VERT .100 2POS 30AU
AMP/Tyco
87220-2
17
1
JP7
CONN HEADER VERT .100 3POS 15AU
AMP/Tyco
87224-3
Johnson Components
142-0701-851
18
4
J1,J2,J11,J12
End Launch Jack Receptacle - Tab
Contact
19
1
J3
CONN HEADER 20 POS STRGHT GOLD.
3M
N2520-6002RB
Rosenberger
D4S20B-40ML5-Y
Molex/Waldom Electronics
Corp
22-11-2042
UX60-MB-5ST
20
1
J4
Automotive HSD Connector - Right Angle
Plug
21
1
J5
CONN HEADER 4POS .100 VERT GOLD
22
1
J6
CONN RECEPT MINI USB2.0 5POS
Hirose
23
1
J7
CONN POWER JACK 2.1MM.
CPU Inc
PJ-002A
24
2
J8,J9
BANANA-female (non-insulated)
Johnson
108-0740-001
25
1
LED1
LED GREEN 0.2MM 13MCD 0402 SMD
Rohm
SML-P12PTT86
L1
CHOKE COIL COMMON MODE 280MA
SMD
Murata
DLW21SN900HQ2L
26
1
27
2
L2,L4
FERRITE CHIP 1000 OHM 0402
Murata
BLM15AX102SN1D
28
2
R9,R11
RES 0.0 OHM 1/20W 5% 0201 SMD
Panasonic
ERJ-1GE0R00C
29
2
R18,R52
RES 90.9K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF9092X
30
1
R19
RES 137K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1373X
31
1
R20
RES 150K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1503X
32
1
R21
RES 154K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1543X
33
1
R22
RES 174K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1743X
34
1
R23
RES 187K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1873X
35
1
R24
RES 200K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2003X
36
1
R25
RES 215K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2153X
37
1
R26
RES 226K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2263X
Bill of Materials
SNLU208 – April 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
www.ti.com
Table 2-1. Bill of Materials (continued)
Item
Qty
Reference
Description
Manufacturer
Part Number
38
2
R27,R43
RES 243K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2433X
39
1
R28
RES 240K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2403X
40
1
R29
RES 267K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2673X
41
1
R30
RES 270K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2703X
42
1
R31
RES 280K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2803X
43
1
R32
RES 294K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2943X
44
7
R37,R38,R97,R103,R1
04,R105,R106
RES 10.0K OHM 1/10W 1% 0603 SMD
Panasonic
ERJ-3EKF1002V
45
2
R44,R114
RES 210K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF2103X
46
1
R45
RES 191K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1913X
47
1
R46
RES 165K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1653X
48
1
R47
RES 158K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1583X
49
1
R48
RES 140K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1403X
50
1
R49
RES 127K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1273X
51
1
R50
RES 113K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF1133X
52
1
R51
RES 97.6K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF9762X
53
1
R53
RES 76.8K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF7682X
54
1
R54
RES 71.5K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF7152X
55
1
R55
RES 60.4K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF6042X
56
1
R56
RES 49.9K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF4992X
57
2
R57,R58
RES 40.2K OHM 1/10W 1% 0402 SMD
Panasonic
ERJ-2RKF4022X
58
2
R59,R60
RES 4.7K OHM 1/10W 5% 0603 SMD
Panasonic
ERJ-3GEYJ472V
59
8
R62,R63,R64,R65,R95,
R96,R120,R121
RES ZERO OHM 1/16W 5% 0402 SMD
Panasonic
ERJ-2GEJ0R00X
60
4
R66,R91,R99,R101
RES ZERO OHM 1/10W 5% 0603 SMD
Panasonic
ERJ-3GEY0R00V
61
2
R67,R119
RES 68 OHM 1/10W 5% 0402 SMD
Panasonic
ERJ-2GEJ680X
62
5
R68,R74,R82,R86,R10
2
RES 100K OHM 1/10W 5% 0402 SMD
Panasonic
ERJ-2GEJ104X
63
2
R69,R70
RES 22 OHM 1/16W 3300PPM 5% 0603
Panasonic
ERA-V33J220V
64
2
R75,R76
RES ZERO OHM 1/4W 5% 1206 SMD
Panasonic
ERJ-8GEY0R00V
65
1
R81
RES 2.49K OHM 1/10W 1% 0603 SMD
Vishay/Dale
CRCW06032K49FKEA
66
2
R83,R87
RES 5.62K OHM 1/10W 1% 0603 SMD.
Vishay
CRCW06035K62FKEA
67
1
R85
RES 9.31K OHM 1/10W 1% 0603 SMD
Vishay/Dale
CRCW06039K31FKEA
68
1
R109
RES 124K OHM 1/10W 1% 0603 SMD
Panasonic
ERJ-3EKF1243V
69
1
R119
RES 255K OHM 1/10W 1% 0603 SMD
Panasonic
ERJ-3EKF2553V
70
1
R115
RES 49.9K OHM 1/10W 1% 0603 SMD
Panasonic
ERJ-3EKF4992V
71
1
R116
RES 40.2K OHM 1/10W 1% 0603 SMD
Panasonic
ERJ-3EKF4022V
72
1
R118
RES 56 OHM 1/10W 5% 0402 SMD
Panasonic
ERJ-2GEJ560X
73
2
SW1,SW2
SWITCH TACT
APEM Components
ADTSM31NV
74
1
S1
SWITCH DIP EXTENDED SEALED 4POS
Grayhill
78B04ST
75
2
S2,S3
SWITCH TAPE SEAL 8 POS SMD
CTS Electrocomponents
219-8MST
76
1
S4
SWITCH DIP EXTENDED UNSEAL 3POS
Grayhill
78B03T
77
1
S5
SWITCH TAPE SEAL 3 POS SMD
CTS Electrocomponents
219-3MST
78
1
U1
FPD-Link III Deserializer LVDS
TI
DS90UB924-Q1
79
1
U2
IC AVR MCU 128K 64QFN
Atmel
AT90USB1287-16MU
80
2
U4,U5
IC REG LDO 500MA ADJ SOT223-4
TI
LP38693MP-ADJ/NOPB
81
1
U6
IC REG LDO 300MA 3.3V 8MSOP
TI
LP3982IMM-3.3/NOPB
82
1
Y1
CRYSTAL 8.000 MHZ 18PF SMD
Abracon Corporation
ABM3-8.000MHZ-D2Y-T
SNLU208 – April 2016
Submit Documentation Feedback
Bill of Materials
Copyright © 2016, Texas Instruments Incorporated
29
Appendix A
SNLU208 – April 2016
EVM PCB Schematics
30
Bill of Materials
SNLU208 – April 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Board Stackup
www.ti.com
A.1
Board Stackup
Figure A-1. Board Stackup
SNLU208 – April 2016
Submit Documentation Feedback
EVM PCB Schematics
Copyright © 2016, Texas Instruments Incorporated
31
DS90UB924-Q1 Deserializer
A.2
www.ti.com
DS90UB924-Q1 Deserializer
Figure A-2. Deserializer
32
EVM PCB Schematics
SNLU208 – April 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
USB-to-I2C Controller
www.ti.com
A.3
USB-to-I2C Controller
Figure A-3. USB-to-I2C Controller
SNLU208 – April 2016
Submit Documentation Feedback
EVM PCB Schematics
Copyright © 2016, Texas Instruments Incorporated
33
Power
A.4
www.ti.com
Power
Figure A-4. Power
34
EVM PCB Schematics
SNLU208 – April 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Appendix B
SNLU208 – April 2016
Board Layout
B.1
Board Layers
The following mechanical drawings (not to scale) illustrate the physical layout and stack-up of the 4-layer
evaluation board:
Figure 1. Top Silkscreen
SNLU208 – April 2016
Submit Documentation Feedback
Figure 2. Top Solder Mask
Board Layout
Copyright © 2016, Texas Instruments Incorporated
35
Board Layers
www.ti.com
Figure 3. Top Copper
36
Figure 4. Internal Layer 1: Ground
Board Layout
SNLU208 – April 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Board Layers
www.ti.com
Figure 5. Internal Layer 2: Power
SNLU208 – April 2016
Submit Documentation Feedback
Figure 6. Bottom Copper
Board Layout
Copyright © 2016, Texas Instruments Incorporated
37
Board Layers
www.ti.com
Figure 7. Bottom Solder Mask
38
Board Layout
Figure 8. Bottom Silkscreen
SNLU208 – April 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Board Layers
www.ti.com
Figure 9. Drill
SNLU208 – April 2016
Submit Documentation Feedback
Board Layout
Copyright © 2016, Texas Instruments Incorporated
39
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
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