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Texas Instruments TMDS171 RGZ EVM (Rev. A) User guides
User's Guide
SLLU217A – April 2015 – Revised April 2016
TMDS171 RGZ EVM
This document describes how to use and configure the TMDS171 RGZ EVM and provides
recommendations for system hardware implementation. These recommendations are only guidelines and
it is the designer’s responsibility to consider all system characteristics and requirements. Engineers should
refer to the TMDS171 datasheet (SLLSEN7) for technical details such as device operation, terminal
description, and so forth.
1
2
3
4
5
6
7
8
Contents
Overview ...................................................................................................................... 2
1.1
What is the TMDS171? ............................................................................................ 2
1.2
What is the TMDS171 EVM?...................................................................................... 2
1.3
What is Included in the TMDS171 EVM? ........................................................................ 2
1.4
What Does This EVM Look Like? ................................................................................ 3
Hardware Description ....................................................................................................... 4
2.1
Video Connectors for TMDS171 Ports ........................................................................... 4
2.2
Local I2C Access .................................................................................................... 4
2.3
Enable/Reset ........................................................................................................ 5
2.4
Power ................................................................................................................. 5
2.5
Jumper Configuration .............................................................................................. 6
2.6
Component Population Configuration ............................................................................ 7
2.7
USB Interface via TUSB3410 ..................................................................................... 8
Quick Start Guide .......................................................................................................... 11
References .................................................................................................................. 11
EVM Bill of Materials ....................................................................................................... 12
EVM Schematics ........................................................................................................... 14
EVM Layout ................................................................................................................. 21
Total Phase Aardvark I2C Host Adapter Scripts ....................................................................... 24
List of Figures
1
TMDS171 RGZ EVM ........................................................................................................ 3
2
TMDS171 RGZ EVM REVB ................................................................................................ 3
3
TMDS171 RGZ EVM Block Diagram...................................................................................... 4
4
Eye Scan Opening Tab ..................................................................................................... 8
5
Register Status/Control Tab ................................................................................................ 9
6
TMDS171 Device with TMDS Clock Ratio set to 1/10
10
7
TMDS171 Device with TMDS Clock Ratio set to 1/40
11
8
9
10
11
12
13
14
15
................................................................
................................................................
HDMI Input Connector .....................................................................................................
TMDS171 RGZ Schematic (48-Pin QFN) ...............................................................................
HDMI TX Connector .......................................................................................................
TMDS171 Select Options ................................................................................................
RESET Circuit ..............................................................................................................
Power Schematics (1.1-V and 3.3-V Regulators) ......................................................................
TUSB3410 Schematic .....................................................................................................
Layer 1 (Top) ...............................................................................................................
14
15
16
17
18
19
20
21
HDMI is a registered trademark of HDMI Licensing, LLC.
Total Phase, Aardvark I2C/SPI are trademarks of Total Phase, Inc..
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Overview
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16
Layer 2 (GND) .............................................................................................................. 21
17
Layer 3 (Power)
22
18
Layer 4 (Power)
22
19
20
............................................................................................................
............................................................................................................
Layer 5 (GND) ..............................................................................................................
Layer 6 (Bottom)............................................................................................................
23
23
List of Tables
1
Aardvark I2C (J5) Pin-out ................................................................................................... 4
2
TMDS171 Target I2C Address
3
SW1 DIP Switch Setting .................................................................................................... 6
4
EVM Bill of Materials ....................................................................................................... 12
1
Overview
1.1
What is the TMDS171?
.............................................................................................
5
The TMDS171 is a digital video interface (DVI) or high-definition multimedia interface (HDMI®) retimer.
The TMDS171 supports four TMDS channels, audio return channel (SPDIF_IN/ARC_OUT), and digital
display control (DDC) interfaces. The TMDS171 supports signaling rates up to 6Gbps to allow for the
highest resolutions of 4k/2k/60p 24-bits per pixel and up to WUXGA 16-bit color depth or 1080p with
higher refresh rates. The TMDS171 can be configured to support the HDMI standard. The TMDS171 will
automatically configure itself as a re-driver at low data rate (< 1.0Gbps) or as a re-timer above this data
rate by default, or it can be set to re-driver-only or re-timer-only modes.
1.2
What is the TMDS171 EVM?
The TMDS171 EVM is a printed-circuit board (PCB) created to help customers evaluate the TMDS171
device for video applications with HDMI interfaces. This EVM can also be used as a hardware reference
design for implementation of the TMDS171 in the RGZ package. PCB design and layout files can be
provided upon request to provide PCB design illustrations of the routing and placement rules with a
TMDS171 or DP159 RGZ component.
Note that the EVM design supports the TMDS171, DP159, and DP159 thru HDMI applications, so it
contains many components that would not be needed by a typical TMDS171 application. A separate
reference design specific to TMDS171 and DP159 are available for customers.
1.3
What is Included in the TMDS171 EVM?
The major components of the EVM are as below:
• TMDS171RGZ
• Standard HDMI source connector (receptacle)
• Standard HDMI sink connector (receptacle)
• DC power regulators
• I2C programming interface for external I2C host connection
• USB interface (utility available)
2
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Overview
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1.4
What Does This EVM Look Like?
Figure 1. TMDS171 RGZ EVM
Figure 2. TMDS171 RGZ EVM REVB
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Hardware Description
2
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Hardware Description
Figure 3 illustrates the EVM block diagram.
USB2
Connector
5-V Dongle
5-V to 3.3-V LDO
Aardvark
Connector
TUSB3410
SCL_CTL
3.3-V to 1.1-V LDO
IN0P/N
TMDS_D2P/N
IN1P/N
TMDS_D1P/N
TMDS171
(48-Pin QFN)
IN2P/N
TMDS_D0P/N
IN3P/N
TMDS_CLKP/N
AUXP/N
DDC_SCL/SDA
HDMI Connector
HDMI Connector Bottom
SDA_CTL
DDC - Snoop Only for TMDS171
Copyright © 2016, Texas Instruments Incorporated
Figure 3. TMDS171 RGZ EVM Block Diagram
2.1
Video Connectors for TMDS171 Ports
The EVM has two HDMI connections for video. P1 and P2 are standard HDMI connectors (Molex 471510001). There is a third video connection on the board for DisplayPort (J2), this function is not supported
on the TMDS171RGZ EVM.
2.2
Local I2C Access
The J5 input connector provides access to the local I2C signal of the TMDS171. Note that I2C signal levels
should be at 3.3 V when the I2C interface is accessed through the connector.
A standalone external I2C host can be connected via J5 for debug and control purposes. An example of an
external I2C Host controller is the Total Phase™ Aardvark I2C/SPI™ Host Adapter (Total Phase Part#:
TP240141). Sample scripts for this I2C host controller are provided by request.
Table 1. Aardvark I2C (J5) Pin-out
J5 Pin #
4
Description
J5 Pin #
Description
1
SCL_CTL
2
GND
3
SDA_CTL
4
NC
5
NC
6
NC
7
NC
8
NC
9
NC
10
GND
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Hardware Description
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2
Table 2. TMDS171 Target I C Address
TMDS171 I2C (1) Target Address
Bit 7 (MSB)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
A6
A5
A4
A3
A2
A1
A0
1
0
1
1
1
1
0
Bit 0 (W/R)
0/1
7 Bit Address = 5Eh
(1)
2.3
2
The target I C address for TMDS171 can be modified by the EVM jumper settings.
Enable/Reset
There are three device enable or reset options to use with the EVM.
1. Supervisor circuitry option
This is the default configuration on the TMDS171 EVM. The enable (EN) signal is held low until the
power good (PG) from the 3.3-V voltage regulator reaches a stable high voltage level and then is
released high.
2. RC timing option
C26 external capacitor and internal resistor are used to control the EN ramp time after the device is
powered on. C26 is DNI (Do Not Install option), by default. C26 must be installed and R77 must be
uninstalled to enable this option.
3. External control option
A push button (SW1) is provided for manual control of the TMDS171 EN/OE input.
2.4
Power
A DC Power Jack (J9) to accept a 5-V wall power adapter is provided on the EVM. The DC Power Jack
(CUI Inc. PJ-202AH) has an inner diameter of 2.1 mm and an outer diameter of 5.5 mm. The tip of the 5-V
power supply must be positive. A 5-V power supply of at least 1.0 A that meets the above requirements
can be used to power the TMDS171 RGZ EVM. Power is provided to the EVM when SW2 is set to
position 1.
CAUTION
Do not plug in any power source higher than the configured voltage (5 V).
Alternately, it is possible to power the EVM by connecting a USB Micro cable to a host and setting SW2 to
position 3. Using the EVM in this manner may exceed USB compliance requirements for power
consumption.
Note that to prevent any back-driving of 5 V in the system, most TMDS171 EVMs have been modified to
receive 5 V from the HDMI source connection to drive the Board_5V. This has been done by removing U6
and installing R104 on the EVMs.
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Jumper Configuration
Jumpers are provided to operate the device and EVM in different configurations.
Table 3. SW1 DIP Switch Setting
DIP SW
No
J1
Signal Name
Description
Default Config
HPD_SRC
JP 1–2 for DP159 thru HDMI
JP 2–3
JP 2–3 for TMDS171
Allows for 3.3 V to 5 V transition of HPD_SRC signal
NC for DP159
J3
I2_EN_PIN
JP 1–2 for I2C ENABLE
JP 2–3
JP 2–3 for PIN STRAP
Enables device configuration from I2C or pin straps
NC – N/A
J4
SCL
JP 1–2 for USB IF to I2C
JP 1–2
JP 2–3 for EXT IF to I2C
USB I2C Interface
NC – N/A
J6
SDA
JP 1–2 for USB IF to I2C
JP 1–2
JP 2–3 for EXT IF to I2C
USB I2C Interface
NC – N/A
J7
HDMI_SEL_TEST_A1
JP 1–2 for:
JP 2–3
● I2C Addr bit A1 = 1, when I2C_EN = H
● Test mode, when I2C_EN = L
JP 2–3 for:
● I2C Addr bit A1 = 0, when I2C_EN = H
● Normal mode, when I2C_EN = L
NC for weak internal pulldown (Normal mode)
J8
VSADJ
JP 1–2 for 7 k
JP 1–2
JP 2–3 for adjustable resistance
The default value is 4.64 kΩ early EVMs (prior to revision
B)
NC – N/A
J10
SLEW_CTL
JP 1–2 for fastest data rate
NC
JP 2–3 for 20 ps slow
NC for 40 ps slow
J11
SIG_EN
JP 1–2 for Signal Detect Enabled
NC
JP 2–3 for Signal Detect Disabled
NC for internal pulldown (Signal Detect Disabled)
J12
EQ_SEL_A0
JP 1–2 for:
NC
● I2C Addr bit A0 = 1, when I2C_EN = H
● Fixed EQ at 14 dB at 3G, when I2C_EN = L
JP 2–3 for:
● I2C Addr bit A0 = 0, when I2C_EN = H
● Fixed EQ at 7.5 dB at 3G, when I2C_EN = L
NC for Adaptive EQ
J14
TX_TERM_CTL
JP 1–2 for no transmit term
NC
JP 2–3 for transmit term in 150–300 ohm
NC for auto select of term
J15
PRE_SEL
JP 1–2 for –5 dB
NC
JP 2–3 for –2.5 dB
NC for 0 dB
J16
CEC CTL
JP 1–2 for DP159 thru HDMI
JP 2–3
JP 2–3 for TMDS171
Shorts HDMI_CEC_SRC to HDMI_CEC_SINK
NC for DP159
J17
SWAP_POL
JP 1–2 for RX Polarity Swap (Retimer Mode Only)
NC
JP 2–3 for RX Lane Swap
NC for normal
6
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2.6
Component Population Configuration
To allow the TMDS171 EVM to support both the TMDS171 RGZ device and the DP159 RGZ device, there
are many components that must be removed, placed, or modified, depending on the board configuration.
Here is a summary of the component configuration for the TMDS171. In addition, the unused source
receptacle can be depopulated.
Function
DIFFERENTIAL PAIR - IN
DIFFERENTIAL PAIR - HDMI IN
SDA / SCL - HDMI
DIFFERENTIAL PAIR - DP IN
SDA / SCL / HPD - DP
ARC / SPDIF to DP
ARC / SPDIF to HDMI
ARC / SPDIF SHORT
PULL UP DIFFERENTIAL PAIR HDMI OUT (not
on revision B)
DIFFERENTIAL PAIR - HDMI OUT (not on
revision B)
PULL UP DIFFERENTIAL PAIR HDMI IN
2.6.1
Reference Designator
C11, C12, C13, C14, C15, C16, C24, C25
R14, R15, R18, R19, R20, R21, R22, R23
R24, R25
R112, R109, R111, R108, R110, R107, R106,
R105
R33, R31, R32
C2, C3
C4, C5, C6, C7, R34
R113, R114
R37, R38, R39, R40, R41, R42, R43, R44
TMDS171
populated with 0 Ω
populated with 0 Ω
populated with 0 Ω
not populated
R47, R48, R49, R50, R51, R52, R53, R54
populated with 0 Ω
R1, R2, R3, R4, R6, R7, R8, R9
not populated
not populated
not populated
populated with 1 µF / 0 Ω
not populated
not populated
HPD Snoop Option – not available prior to Revision B EVM
To accommodate systems that do not properly resend DDC commands after HPD goes low, TI has
implemented an HPD snoop mode on the TMDS171RGZ revision B EVM. This mode allows the HPD line
to be routed around the TMDS171, but remain connected to the TMDS171 on the sink side to allow the
TMDS171 to snoop its state. This snoop mode is disabled by default on the TMDS171RGZ revision B
EVMs.
• Pop R131, no pop R129, R130 for HPD on
• No pop R131, pop R129, R130 for HPD snoop only
2.6.2
DDC Snoop Option – not available prior to Revision B EVM
To accommodate systems that do not properly support clock stretching on the DDC lines, TI implemented
a snoop mode on the TMDS171RGZ revision B EVM. This mode allows the DDC lines to be routed
around the TMDS171, but remain connected to the TMDS171 on the sink side to allow the TMDS171 to
snoop the DDC traffic. This snoop mode is enabled by default on the TMDS171RGZ revision B EVMs.
• Pop R16, R17, R24, R25. No pop R123, R124, R125, R126 - TMDS171, DDC on
• No pop R16, R17, R24, R25. Pop R123, R124, R125, R126 - TMDS171, DDC snoop only
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2.7
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USB Interface via TUSB3410
•
•
•
•
•
Install the Eye Scan software from TI
J6 must be set to SDA – SDA_USB
J4 must be set to SCL – SCL_USB
Attached the USB micro cable to J13 and to the host computer
Start the Eye Scan software
Figure 4 illustrates the Eye Scan opening tab.
Figure 4. Eye Scan Opening Tab
8
TMDS171 RGZ EVM
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Confirm that the SN65DP149/159/TMDS171/171 interface is present and selected. If it is not, check the
USB connection and confirm that the driver is loaded in Device Manager.
Figure 5. Register Status/Control Tab
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Hardware Description
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Select the Register Status/Control tab and click Refresh.
Figure 6. TMDS171 Device with TMDS Clock Ratio set to 1/10
10
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Quick Start Guide
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If using a generator or source that does not support DDC clock stretching per the I2C specification, when
running at HDMI speeds it may be necessary to force the TMDS Clock Ratio Bit. Select the HDMI Control
tab and check the DDC clock training block function, change the TMDS Clock Ratio: to 1/40.
Figure 7. TMDS171 Device with TMDS Clock Ratio set to 1/40
3
Quick Start Guide
1.
2.
3.
4.
5.
4
Apply 5-V power to the EVM, turn on SW2. LED D2 should light up.
If using external I2C adapter instead of pin straps, please configure the TMDS171 at this step.
Plug in an HDMI source using a standard HDMI cable into P1 (Standard HDMI connector).
Plug in an HDMI video sink device into P2 (Standard HDMI connector) using a standard HDMI cable.
Video output on HDMI sink should be observed
References
1.
2.
3.
4.
TMDS171 Product Preview
Aardvark I2C/SPI Host Adapter User Manual
High-Definition Multimedia Interface Specification Version 1.4b.
High-Definition Multimedia Interface Specification Version 2.0
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EVM Bill of Materials
5
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EVM Bill of Materials
Table 4. EVM Bill of Materials
QTY
12
Reference
Part
PCB Footprint
Manufacturer
Part Number
6
C1, C4, C5, C6, C7, C52
1 µF
603
Taiyo Yuden
LMK107B7105KA-T
12
C9, C10, C17, C18, C19, C21,
C23, C29, C40, C46, C59, C60
0.1 µF
402
Yageo
CC0402KRX5R6BB104
5
C8, C20, C35, C36, C57
10 µF
805
TDK
C2012X5R1A106K125AB
1
C31
10 µF
805
TDK
C2012X5R1C106K085AC
8
C11, C12, C13, C14, C15, C16,
C24, C25
0 Ω resistors
201
TDK
C0603X5R0J104M
5
C22, C37, C41, C42, C47
0.01 µF
402
1
C26 - DNI
DNI_200 nF
402
1
C27
18 pF
402
AVX
04025A180JAT2A
1
C28
220 pF
402
1
C30
220 µF
7343
Kemet
T495X337K010ATE060
1
C34
3.3 nF
402
1
C32
22 µF
805
2
C39, C58
2.2 µF
805
27
R31, R32, R33, R35, R87, R92,
R93, R105, R106, R107, R108,
R109, R110, R111, R112, R113,
R114, R120, C2, C3, C38, R129,
R130, R24, R25, R16, R17
DNI
402 / 201
2
C45, C49
22 pF
402
2
C50, C51
33 pF
402
1
D1
Zener 6V
SOT23
Diodes Inc.
MMBZ5233B-FDICT-ND
1
D2
LED Green 0805
805
Lite On
LTST-C171GKT
1
JP1
JUMPER
HDR_THVT_1x2_100
13
J1, J3, J4, J6, J7, J8, J10, J11,
J12, J14, J15, J16, J17
HDR3X1 M 0.1
HDR_THVT_1x3_100
3M
961103-6404-AR
1
J2
Display_Port_Connector_Sink_0
DISPLAYPORT
Molex
47272-0001
1
J5
Header 5x2 0.1" thru-hole
con_thvt_shrd_2x5_100_m
3M
N2510-6002-RB
1
J9
2.1mm x 5.5mm
PJ-202AH
CUI Inc.
PJ-202AH (PJ-002AH)
1
J13
USB Micro B
USB Micro B
FCI
10103592-0001LF
17
LP1, LP2, LP3, LP4, LP5, LP6,
LP7, LP8, LP9, LP10, LP11,
LP12, LP13, LP14, LP15, LP16,
LP17
LP
TESTLOOP
KOBIKONN
151-103-RC
1
L1
2.2 µH
1008
TDK
VLS252010ET-2R2M
1
L2
1 µH
1008
TDK
NLCV25T-1R0M-EFR
1
P1
HDMI_IN
CON_HDMI_RT_19_0p50mm
Molex
471510001
1
P2
HDMI_OUT
CON_HDMI_RT_19_0p50mm
Molex
471510001
2
Q1, Q2
FDV301N_NFET_8V
SOT23
Fairchild Semiconductor
FD301N
8
R1, R2, R3, R4, R6, R7, R8, R9 DNI
DNI
201
1
R5
100
402
6
R10, R11, R99, R100, R101,
R121
1K
402
3
R12, R27, R81
100K
402
1
R13
10
402
13
R14, R15, R18, R19, R20, R21,
R22, R23, R34, R123, R124,
R125, R126
0
201
4
R28, R29, R58, R59
2K
402
8
R77, R80, R83, R84, R89, R104,
R122, R131
0
402
1
R30
1M
402
1
R127
500K
402
1
R36
75
402
1
R56
27K
402
16
R57, R60, R61, R62, R63, R64,
R65, R66, R67, R68, R69, R70,
R71, R72, R73, R74
65K
402
TMDS171 RGZ EVM
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EVM Bill of Materials
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Table 4. EVM Bill of Materials (continued)
QTY
Reference
Part
PCB Footprint
1
R75
7K
402
Manufacturer
Part Number
1
R76
PTV09 10K POT
THRUHOLE
3
R78, R98, R102
10K
402
BOURNS
PTV09A-4015F-B103
2
R79, R88
4.7K
402
1
R82
500
402
1
R85
750K
402
1
R86
240K
402
1
R90
1.87K
402
1
R91
4.42K
402
1
R94
1.5K
402
2
R95, R96
33
201
1
R103
15K
402
3
R45, R46, R115
47K
402
1
SW1
PB_SWITCH
1
SW2
3POS_SPDT
SW_MOM_2NO
OMRON
B3SN-3012P
THRUHOLE_3POS
NKK Switches
1
U1
MS13ANW03
TMDS171RGZ
48_RGZ
TI
1
1
U9
SN74AUP1G04
DCK
TI
SN74AUP1G04DCKR
U2 - DNI
SN74CBT1G125 - DNI
DCK
TI
SN74CBT1G125DCKR
1
U3
TPS3808G30DBVT
6DBV
TI
TPS3808G30DBVT
1
U4
TPS62150A
RGT16
TI
TPS62150ARGTT
1
U6 - DNI
TPS61240 - DNI
6DRV
TI
TPS61240DRVT
1
U5
TPS74201RGWT
RGW20
TI
TPS74201RGWT
1
U7
TUSB3410
LQFP32
TI
TUSB3410VF
1
U8
24LC256
8SOIC
ON Semiconductor
CAT24C256W
1
Y1
12 MHz Crystal
ECX-32
ECS Inc.
ECS-120-20-33-TR
1
U16
TPD2E001
drl_5pin
TI
TPD2E001
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EVM Schematics
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EVM Schematics
Figure 8 through Figure 14 illustrate the EVM schematics.
BOARD_3P3V
BOARD_5V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
R7
50
0201
5%
R8
50
0201
5%
R4
50
0201
5%
Pop 50 ohm pullups on IN_Dxx lines for DP159 thru HDMI
No pop 50 ohm pullups on IN_Dxx lines for DP159
No pop 50 ohm pullups on IN_Dxx lines for TMDS171
BOARD_5V
R9
50
0201
5%
J1
0
R15
0
0
R18
R19
0
0
R20
R21
0
0
R22
R23
0
HDMI_CEC_SRC
ARC_OUT
HDMI_SCL_SRC_IN
HDMI_SDA_SRC_IN
IN_D2P
PAGE2,3
IN_D2N
IN_D1P
PAGE2,3
PAGE2,3
IN_D1N
IN_D0P
PAGE2,3
PAGE2,3
IN_D0N
IN_CLKP
PAGE2,3
PAGE2,3
IN_CLKN
PAGE2,3
R16
47K
0402
5%
R104
2
1
2
FDV301N_NFET_8V
FDV301N_NFET_8V
LP16
LP17
0
0
SCL_SRC
SDA_SRC
PAGE2,3
PAGE2,3
R126
0
R124 R123
0
0
R125
0
Pop R16, R17, R24, R25. No pop R123, R124, R125, R126 - TMDS171, DDC on
No pop R16, R17, R24, R25. Pop R123, R124, R125, R126 - TMDS171, DDC snoop only
Pop 2K resistors on R16, R17, pop R24, R25, no pop R123, R124, R125, R126 for DP159 thru HDMI
No pop R16, R17, R126, R125, R24, R25 for DP159
PAGE2,3
PAGE2,3
Pop 0 ohm series on IN_Dxx lines, DP_Sxx_SRC lines for DP159
No pop 0 ohm series on IN_Dxx lines, DP_Sxx_SRC lines for DP159 thru HDMI, TMDS171
BOARD_3P3V
J2
C1
R30
1M
0402
5%
1 uF
21
22
23
24
GND7
GND8
GND9
GND10
ML_3n
GND1
ML_3p
ML_2n
GND2
ML_2p
ML_1n
GND3
ML_1p
ML_0n
GND4
ML_0p
CAD (GND)
DP_CEC (GND)
AUX_p (SCL)
GND6
AUX_n (SDA)
HPD
DP_PWR_RTN
DP_PWR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Display_Port_Connector_Sink_0 - DNI
DISPLAYPORT IN
1
3
D1
Zener 6V
HDMI_SCL_SRC
HDMI_SDA_SRC
DPRX_GND
R12
100K
0402
Q1
3
Q2
PAGE3
0
Pop 0 ohm series on IN_Dxx lines for DP159 thru HDMI, TMDS171
No pop 0 ohm series on IN_Dxx lines for DP159
Pop R104 if U6 is no pop - TMDS171
No pop R104 if U6 is pop - DP159
DisplayPort++
HPD_SRC
R11
1K
0402
R13
10
0402
HPD_SRC
HPD_SRC_HDMI_RX_CONN
HPD_SRC_CONN
HDR3X1 M .1
HPD_SRC
R17
47K
0402 PAGE4 HPD_SRC_CONN
5%
LP15
R24
R25
HDMI_IN_5V
HPD_SRC_HDMI_RX_CONN
HDMI_IN
HDMI_IN
0402
1
2
3
R14
R5
100
0402
JP 1-2 for DP159 thru HDMI
JP 2-3 for TMDS171
R10
NC for DP159
1K
2
P1
22
23
Case3
Case4
Case1
Case2
20
21
R6
50
0201
5%
R3
50
0201
5%
3
HDMI RX
R2
50
0201
5%
1
R1
50
0201
5%
C_DPRX_LN3N
C_DPRX_LN3P
C_DPRX_LN2N
R109
C_DPRX_LN2P
C_DPRX_LN1N
C_DPRX_LN1P
R108
R107
C_DPRX_LN0N
C_DPRX_LN0P
DP_CAD
CEC_SRC
DP_SCL_SRC
R105
R112
0
0
R111
0
IN_CLKN
PAGE2,3
IN_CLKP
IN_D0N
PAGE2,3
PAGE2,3
IN_D0P
IN_D1N
IN_D1P
PAGE2,3
PAGE2,3
PAGE2,3
IN_D2N
PAGE2,3
IN_D2P
PAGE2,3
J16
0
R110
0
0
R106
0
R27
100K
0402
5%
R28
2K
0402
5%
R29
2K
0402
5%
1
2
3
CEC_SRC
HDMI_CEC_SRC
HDMI_CEC_SNK
HDMI_CEC_SNK
PAGE4
HDR3X1 M .1
0
CEC_SRC
DP_SDA_SRC
R33
0
JP 1-2 for DP159 thru HDMI
JP 2-3 for TMDS171
NC for DP159
CEC CTL
PAGE4
R31
0
R32
0
HPD_SRC
LP1
C2
0.1uF
SCL_SRC
PAGE2,3
SDA_SRC
PAGE2,3
LP2
C3
0.1uF
No pop for TMDS171
PAGE3
AUX_SRCN/ARC_OUT
AUX_SRCN
R114
DNI
LP3
0402
C4
C5
1 uF
1 uF
C6
ARC_OUT
AUX_SRCP/SPDIF_IN
AUX_SRCP
R127
500K
0402
C7
1 uF
R34
LP4
R113
DNI
0402
0
SPDIF_IN
1 uF
ARC_OUT
PAGE3
PAGE4
SPDIF_IN
R35
DNI
0402
5%
R36
75
0402
5%
No pop for DP159
Copyright © 2016, Texas Instruments Incorporated
Figure 8. HDMI Input Connector
14
TMDS171 RGZ EVM
SLLU217A – April 2015 – Revised April 2016
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EVM Schematics
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VDD_1P1V
PAGE6
VCC_3P3V
SLEW_CTL
OE
PAGE2
AUX_SRCN/ARC_OUT
PAGE2
AUX_SRCP/SPDIF_IN
PAGE2
SCL_SRC
PAGE2
SDA_SRC
PAGE5
SDA_SNK PAGE4
HDMI_SDA_SRC
PAGE2,3
SCL_SNK PAGE4
HDMI_SCL_SRC
PAGE2,3
VCC_3P3V
0.1uF
12
C25
13
37
38
0.1uF
VDD4
39
SDA_SNK
SCL_SNK
40
41
SLEW_CTL
42
OE
GND4
43
44
VCC2
45
46
47
SCL_SRC
48
OUT_CLKP
VCC1
0.1uF
IN_CLKP
IN_CLKN
C10
0.1uF
OUT_CLKN
36
TX_TERM_CTL
35
34
33
32
31
PAGE5
OUT_D2P
PAGE4
OUT_D2N
PAGE4
HPD_SNK
PAGE4
OUT_D1P
PAGE4
OUT_D1N
PAGE4
OUT_D0P
PAGE4
OUT_D0N
PAGE4
VDD_1P1V
30
29
28
27
HDMI_SEL#_TEST_A1
26
25
OUT_CLKP
PAGE4
OUT_CLKN
PAGE4
C17
C18
C19
0.1uF
0.1uF
0.1uF
PAGE5
SDA_CTL
PAGE5
SIG_EN
PAGE4
CEC_EN
PAGE5
PRE_SEL
PAGE5
EQ_SEL_A0
C22
C23
0.1uF
0.01uF
0.1uF
BOARD_5V
R130
1K
0402
5%
PAGE2
SCL_CTL
C21
PAGE5
TMDS171RGZ
48 PIN RGZ, HSIO
PAGE5
C20
10uF
VDD3
11
C24
HDMI_SEL#/A1
VDD2
IN_CLKN
OUT_D0N
I2C_EN/PIN
C9
24
IN_CLKP
PAGE2
OUT_D0P
IN_D0N
VSADJ
PAGE2
10
IN_D0P
23
I2C_EN_PIN
9
0.1uF
22
PAGE5
0.1uF
C16
GND3
EQ_SEL/A0
IN_D0N
OUT_D1N
GND1
PRE_SEL
IN_D0P
PAGE2
IN_D1N
21
8
C15
PAGE2
OUT_D1P
GND2
7
IN_D1P
20
0.1uF
HPD_SNK
CEC_EN/NC
6
C14
OUT_D2N
HPD_SRC
19
0.1uF
OUT_D2P
18
5
C13
IN_D2N
TX_TERM_CTL
SIG_EN
IN_D1N
4
AUX_SRCN/ARC_OUT
PAGE2
0.1uF
0
SDA_CTL
IN_D1P
R131
IN_D2P
17
PAGE2
3
C12
AUX_SRCP/SPDIF_IN
HPD_SRC
SWAP/POL
SCL_CTL
IN_D2N
PAGE2
2
0.1uF
16
PAGE2
1
C11
15
IN_D2P
VDD1
SWAP/POL
PAGE2
14
PAGE5
SDA_SRC
PAD
Pop caps on IN_Dxx lines for DP159
Pop 0 ohm on IN_Dxx lines for TMDS171
VDD5
U1
49
C8
10uF
HPD_SRC_CONN
R129
0
HPD_SNK
PAGE4
Pop R131, no pop R129, R130 for HPD on
No pop R131, pop R129, R130 for HPD snoop only
VSADJ
PAGE5
Copyright © 2016, Texas Instruments Incorporated
Figure 9. TMDS171 RGZ Schematic (48-Pin QFN)
SLLU217A – April 2015 – Revised April 2016
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TMDS171 RGZ EVM
Copyright © 2015–2016, Texas Instruments Incorporated
15
EVM Schematics
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HDMI TX
20
21
Case1
Case2
Case3
Case4
22
23
P2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
PAGE3
OUT_D2N
OUT_D1P
PAGE3
PAGE3
OUT_D1N
OUT_D0P
PAGE3
PAGE3
OUT_D0N PAGE3
OUT_CLKP PAGE3
OUT_CLKN PAGE3
HDMI_CEC_SNK PAGE2
SPDIF_IN PAGE2
LP14
LP10
LP11
LP12
R45
47K
0402
5%
HDMI_OUT
HDMI OUT
1
2
3
NC
A
GND
VCC
Y
5
4
CEC_SRC
R46
47K
0402
5%
SCL_SNK
SDA_SNK
PAGE3
PAGE3
HPD_SNK
PAGE3
BOARD_5V
R56
27K
0402
5%
U2
SN74AUP1G04
PAGE2
BOARD_5V
Pop 2K resistors on R45, R46 for TMDS171, DDC on
Pop 47K resistors on R45, R46 for TMDS171, DDC snoop only
Pop 2K resistors on R45, R46 for DP159
U9
CEC_EN
BOARD_5V
LP13
BOARD_3P3V
PAGE3
OUT_D2P
1
2
3
OE
A
GND
VCC
B
5
4
HDMI_CEC_SNK
SN74CBT1G125 - DNI
Pop U2 DP159 thru HDMI, DP159
No pop U2 for TMDS171
Copyright © 2016, Texas Instruments Incorporated
Figure 10. HDMI TX Connector
16
TMDS171 RGZ EVM
SLLU217A – April 2015 – Revised April 2016
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EVM Schematics
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VCC_3P3V
VCC_3P3V
R57
65K
0402
5%
J3
1
2
3
HI
I2C_EN_PIN
LO
I2C_EN_HI
Three place switches - hi, lo, no connect
Sampled at POR
I2C_EN_PIN
I2C_EN_LO
PAGE3
R60
65K
0402
5%
HDR3X1 M .1
R58
2K
0402
5%
R59
2K
0402
5%
VCC_3P3V
J4
PAGE3
1
2
3
SCL_USB
SCL
SCL_AAR
SCL_CTL
SCL_CTL_USB
PAGE8
J5
HDR3X1 M .1
J6
VCC_3P3V
PAGE3
1
2
3
SDA_USB
SDA
SDA_AAR
SDA_CTL
SDA_CTL_USB
PAGE8
1
2
3
HI
PRE_SEL
LO
R63
65K
0402
5%
PRE_SEL_HI
1
2
3
HI
SWAP/POL
LO
SWAP_POL_HI
SWAP/POL
SWAP_POL_LO
HDR3X1 M .1
PAGE3
R62
65K
0402
5%
AARDVARK
CONNECTOR
PRE_SEL
PRE_SEL_LO
2
4
6
8
10
Header 5x2 0.1" thru-hole
AARDVARK I2C
HDR3X1 M .1
J15
1
3
5
7
9
R61
65K
0402
5%
J17
VCC_3P3V
PAGE3
VCC_3P3V
HDR3X1 M .1
R64
65K
0402
5%
J10
1
2
3
HI
SLEW_CTL
LO
VCC_3P3V
SLEW_CTL_HI
J12
1
2
3
EQ_SEL_HI
EQ_SEL_A0
EQ_SEL_LO
SLEW_CTL
PAGE3
HI
HDMI_SEL#/TEST/A1
LO
R67
65K
0402
5%
R68
65K
0402
5%
J11
HI
SIG_EN
LO
J8
DEFAULT
VSADJ
POT
1
2
3
1
2
3
SIG_EN_HI
PAGE3
R69
65K
0402
5%
VCC_3P3V
R71
65K
0402
5%
J14
SIG_EN
SIG_EN_LO
HDR3X1 M .1
VSADJ
HDMI_SEL#_TEST_A1
PAGE3
R70
65K
0402
5%
R75
7K
0402
1%
1
2
3
HDR3X1 M .1
VCC_3P3V
HDR3X1 M .1
R66
65K
0402
5%
J7
SLEW_CTL_LO
HDR3X1 M .1
HI
EQ_SEL_A0
LO
R65
65K
0402
5%
PAGE3
HI
TX_TERM_CTL
LO
R73
65K
0402
5%
1
2
3
R72
65K
0402
TX_TERM_CTL_HI 5%
TX_TERM_CTL
TX_TERM_CTL_LO
HDR3X1 M .1
PAGE3
R74
65K
0402
5%
PAGE3
R76 - DNI
HDR3X1 M .1
R115
47K - DNI
0402
5%
PTV09 10K POT
Copyright © 2016, Texas Instruments Incorporated
Figure 11. TMDS171 Select Options
SLLU217A – April 2015 – Revised April 2016
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Copyright © 2015–2016, Texas Instruments Incorporated
17
EVM Schematics
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RESET CIRCUIT
VCC_3P3V
R77
0
OE
PAGE3
C26
DNI_200nF
BOARD_3P3V
SW1
PB_SWITCH
1
2
R79
4.7K
0402
5%
4
3
N.O.
VCC_3P3V
U3
PB_MANUAL_RESET
BOARD RESET
1
2
3
RESET#
GND
MR#
VDD
SENSE
CT
6
5
4
TPS3808
C27
18pF
PAGE7
REG_PG
Pop C26 and depop
R77 if not using the
Reset SW.
R78
10K
0402
5%
R80
TPS3808_CT
C28
C29
220pF
0.1uF
0
Copyright © 2016, Texas Instruments Incorporated
Figure 12. RESET Circuit
18
TMDS171 RGZ EVM
SLLU217A – April 2015 – Revised April 2016
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EVM Schematics
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WALL - OFF - USB 5V
SW2
3POS - SPDT
3.3V BUCK REGULATOR - 4V to 17V input
BOARD_3P3V
1
2
3
USB_5V
VCC_3P3V
LP5
J9
BOARD_IN
2
3
1
L1
U4
+
C30
330uF
C31
10uF
9
EN
PVIN2
PVIN1
AVIN
PG
FB
SS/TR
17
C34
3.3 nF
SW1
SW2
SW3
PGND2
PGND1
AGND
2.1mm x 5.5mm
PAD
S
T
13
12
11
10
VOS
16
15
6
14
PWRIN_SW
FSW
DEF
1
2
3
3.3V
R84
0
2.2 uH
4
R85
750K
0402
1%
R81
100K
0402
5
7
REG_PG
8
PAGE6
C32
22uF
FB_3PT3V
TPS62150A
R83
0
0402
R120
DNI
R86
240K
0402
1%
0402
BOARD_3P3V
BOARD_5V
5.0V BOOST
U6
6
L2
5
BOARD_3P3V
1 uH - DNI
BOARD_1P1V
BOARD_3P3V
U5
C35
10uF
5
6
7
8
R88
4.7K
0402
5%
EN1P2
10
11
IN1
IN2
IN3
IN4
PG
OUT1
OUT2
OUT3
OUT4
BIAS
EN
FB
0.01uF
SS1P2
15
NC1
NC2
NC3
NC4
NC5
NC6
GND
PAD
C37
SS
DNI
2
3
4
13
14
17
12
21
TPS74201RGWT
C38
9
REG_PG
GND
L
VOUT
EN
FB
1
2
3
R82
500
0402
5%
PAD
1.1V LDO REGULATOR
4
VIN
7
R87
DNI
0402
5%
TPS61240 - DNI
VDD_1P1V
LP6
1
20
19
18
C58
2.2uF - DNI
C57
10uF
D2
LED Green 0805
5V PWR
1.1V
R89
16
FB_1PT2V
R90
1.87K
0402
1%
0
LP7
C36
10uF
R91
4.42K
0402
1%
LP8
LP9
GND
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 13. Power Schematics (1.1-V and 3.3-V Regulators)
SLLU217A – April 2015 – Revised April 2016
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19
EVM Schematics
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USB_5V
BOARD_3P3V
+1V8
BOARD_3P3V
R92
DNI
R93
DNI
U16
J13
9
IO2
BOARD_3P3V
6
1
2
3
4
5
7
S3 S1
VBUS
DM
S5 DP
ID
GND
S4 S2
22pF
C49
R94
1.5K
5
R95
R96
7
6
33
33
22pF
C45
33pF
PUR
DM0
DP0
X2
26
4
3
X1
27
BOARD_3P3V
33pF
R122
A0
Vcc
A1
WP
A2 SCL
Vss SDA
C46
0.1uF
R98
10K
0402
5%
C47
0.01uF
X2
2
1
2
3
4
24
23
+1V8
1
USB Micro B
C59
0.1uF
U8
TEST1
TEST0
C50
Y1
C42
0.01uF
8
7
6
5
R99
1K
0402
5%
R121
1K
0402
5%
11
10
0
32
31
1
PAGE5
SCL_CTL_USB
PAGE5
SDA_CTL_USB
30
29
R101
1K
1
2
BOARD_3P3V
9
R103
15K
0402
5%
X1/CLKI
12 MHz
R100
1K
0402
5%
2 JP1
24LC256
C51
DTR
RTS
SOUT/IR_SOUT
SIN/IR_SIN
RI/CP
DCD
DSR
CTS
21
20
19
17
16
15
14
13
SCL
SDA
BOARD_3P3V
P3_0
CLKOUT
22
P3_1
P3_3
P3_4
WAKEUP
12
R102
10K
0402
5%
VREGEN
SUSP
RESET
TUSB3410
GND1
GND2
GND3
10
4
TPD2E001
C41
0.01uF
8
18
28
8
NC
GND
IO1
2
3
C60
0.1uF
VCC
5
1
C40
0.1uF
VDD1V8
VCC1
VCC2
U7
4
3
25
C39
2.2uF
RSTIn
C52
1 uF
Copyright © 2016, Texas Instruments Incorporated
Figure 14. TUSB3410 Schematic
20
TMDS171 RGZ EVM
SLLU217A – April 2015 – Revised April 2016
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EVM Layout
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7
EVM Layout
Figure 15 through Figure 20 illustrate the PCB layout images for the EVM.
Figure 15. Layer 1 (Top)
Figure 16. Layer 2 (GND)
SLLU217A – April 2015 – Revised April 2016
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TMDS171 RGZ EVM
Copyright © 2015–2016, Texas Instruments Incorporated
21
EVM Layout
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Figure 17. Layer 3 (Power)
Figure 18. Layer 4 (Power)
22
TMDS171 RGZ EVM
SLLU217A – April 2015 – Revised April 2016
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Copyright © 2015–2016, Texas Instruments Incorporated
EVM Layout
www.ti.com
Figure 19. Layer 5 (GND)
Figure 20. Layer 6 (Bottom)
SLLU217A – April 2015 – Revised April 2016
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TMDS171 RGZ EVM
Copyright © 2015–2016, Texas Instruments Incorporated
23
Total Phase Aardvark I2C Host Adapter Scripts
8
www.ti.com
Total Phase Aardvark I2C Host Adapter Scripts
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (April, 2015) to A Revision ......................................................................................................... Page
•
•
24
Changed signal rate to 6Gbps and resolutions support to 4k/2k/60p in the What is the TMDS171? section. ................ 2
Changed and added text, added TMDS171 Device with TMDS Clock Ratio set to 1/40 image and changed all other GUI
images in the USB Interface via TUSB3410 section.................................................................................. 8
Revision History
SLLU217A – April 2015 – Revised April 2016
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Copyright © 2015–2016, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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