Texas Instruments | TPD1S414EVM (Rev. A) | User Guides | Texas Instruments TPD1S414EVM (Rev. A) User guides

Texas Instruments TPD1S414EVM (Rev. A) User guides
User's Guide
SLVU916A – May 2015 – Revised June 2015
TPD1S414EVM
This user's guide describes the characteristics, operation, and use of the TPD1S414EVM evaluation
module (EVM). This EVM includes 4 TPD1S414’s in various configurations for testing. Three TPD1S414’s
are configured for IEC61000-4-5 compliance testing; one TPD1S414 is configured for throughput on USB
2.0 Type A connectors for throughput analysis. This user's guide includes setup instructions, schematic
diagrams, a bill of materials, and printed-circuit board layout drawings for the EVM.
1
Introduction
Texas Instrument’s TPD1S414 evaluation module helps designers evaluate the operation and
performance of the TPD1S414 device. The TPD1S414 is a single-chip solution for USB connector’s VBUS
line protection. The bi-directional nFET switch ensures safe current flow in both charging and host mode
while protecting the internal system circuits from any over-voltage conditions at the VBUS_CON pin. On the
VBUS_CON pin, this device can handle over-voltage protection up to 30 V. After the EN pin toggles low, the
TPD1S414 waits 15 ms before turning ON the nFET through a soft start delay. ACK pin indicates the FET
is completely turned ON.
SLVU916A – May 2015 – Revised June 2015
Submit Documentation Feedback
TPD1S414EVM
Copyright © 2015, Texas Instruments Incorporated
1
Board Setup
www.ti.com
Table 1. EVM Configuration
2
Reference Designator
TI Part Number
U1A-U1C
TPD1S414
Configuration
Surge
U1D and U3
TPD1S414 and TPD3E001
Surge and ESD
Board Setup
This section describes the intended use of the TPD1S414EVM. A generalized outline of the procedure
given in IEC-61000-4-5 is described here. IEC-61000-4-5 should be referred to for a more specific testing
outline.
2.1
U1A – U1C
Three separate and identical test setups for TPD1S414 (U1A – U1C) are pinned out to allow evaluating
device performance during normal operating conditions as well as during surge events. VBUS_CON is J1A –
J1C and VBUS_SYS is J3A – J3C. Surge can be injected onto VBUS_CON using J2A – J2C. A Schottky Barrier
Diode (D2A – D2C) protects equipment attached to J1x from any surge (up to 90 V DC) injected on J2x.
Another Schottky Barrier Diode (D3A – D3C) prevents VBUS_CON from back driving voltage into the surge
tester, which can cause the surge tester problems with outputting an IEC61000-4-5 compliant signal.
Figure 1. TPD1S414 Board Configuration for U1A – U1C
Test points (TP1A – TP1C and TP2A – TP2C) provide Kelvin connections for monitoring the voltage drop
across U1A – U1C during surge events as well as for measuring RDYN while current is flowing through
TPD1S414. A 3-pin header (JP1A – JP1C) allows shunting the EN pin (JP1A – JP1C) on or off. A 2-pin
header (JP2A – JP2C) allows monitoring ACK by observing an LED (D1A – D1C) with a shunt installed, or
by measuring the voltage by clipping to the TPD1S414 side of JP2x. All testing requires +5V applied to
VCC (PS1) and ground to GND (PS2).
2
TPD1S414EVM
SLVU916A – May 2015 – Revised June 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Board Setup
www.ti.com
2.2
U1D
Figure 2. TPD1S414 Board Configuration for U1D
A pass through USB2.0 port is included for system level testing. The female USB connector (J1) is the
“Connector” side of TPD1S414 and a male USB connector (J2) is the “System” side. ESD protection has
been added to the Hi-Speed data lines and ID pin in the form of TPD3E001DRL to complete the port
protection example scheme.
Surge can be injected onto VBUS_CON using J2D. A Schottky Barrier Diode (D2D) protects equipment
attached to J1 from any surge (up to 90 V DC) injected on J2D. Another Schottky Barrier Diode (D3D)
prevents VBUS_CON from back driving voltage into the surge tester, which can cause the surge tester
problems with outputting an IEC61000-4-5 compliant signal.
A 3-pin header (JP1D) allows shunting the EN pin (JP1D) on or off. A 2-pin header (JP2D) allows
monitoring ACK by observing an LED (D1D) with a shunt installed, or by measuring the voltage by clipping
to the TPD1S414 side of JP2D. All testing requires +5V applied to VCC (PS1) and ground to GND (PS2).
SLVU916A – May 2015 – Revised June 2015
Submit Documentation Feedback
TPD1S414EVM
Copyright © 2015, Texas Instruments Incorporated
3
Bill of Materials
3
www.ti.com
Bill of Materials
Table 2. Bill of Materials
Value
Description
Package Reference
Part Number
Manufacturer
C1A, C1B,
C1C, C1D
Designator
4
1uF
CAP, CERM, 1uF, 25V, +/-10%, X7R, 1206
1206
12063C105KA
T2A
AVX
C2A, C2B,
C2C, C2D
4
2.2uF
CAP, CERM, 2.2uF, 100V, +/-10%, X7R, 1210
1210
GRM32ER72A
225KA35L
MuRata
D1A, D1B,
D1C, D1D
4
Red
LED, Green, SMD
1.6 x 0.8 x 0.8 mm
LTSTC190GKT
Lite-On
D2A, D2B,
D2C, D2D,
D3A, D3B,
D3C, D3D
8
90V
Diode, Schottky, 90 V, 2 A, SMB
SMB
B290-13-F
Diodes Inc.
H1, H2, H3, H4
4
Machine Screw, Round, #4-40 x 1/4, Nylon,
Philips pan head
Screw
NY PMS 440
0025 PH
B & F Fastener Supply
H5, H6, H7, H8
4
Standoff, Hex, 0.5"L #4-40 Nylon
Standoff
1902C
Keystone
J1
1
Connector, Receptacle, USB TYPE A, 4POS SMD USB TYPE A CONNECTOR
RECEPTACLE 4 POS SMD
896-43-004-00- Mill-Max
000000
J1A, J1B, J1C,
J2A, J2B, J2C,
J2D, J3A, J3B,
J3C, PS1, PS2
12
Standard Banana Jack, Un-insulated, 5.5 mm
Keystone_575-4
575-4
Keystone
J2
1
Connector, USB Type A, 4POS R/A, SMD
USB Type A right angle
48037-1000
Molex
JP1A, JP1B,
JP1C, JP1D
4
PEC03SAAN
Header, Male 3-pin, 100 mil spacing,
0.100 inch x 3
PEC03SAAN
Sullins
JP2A, JP2B,
JP2C, JP2D
4
PEC02SAAN
Header, Male 2-pin, 100 mil spacing,
0.100 inch x 2
PEC02SAAN
Sullins
R1A, R1B,
R1C, R2
4
4.3k
RES, 4.3 kΩ, 5%, 0.125W, 0805
0805
CRCW08054K
30JNEA
Vishay-Dale
TP1A, TP1B,
TP1C, TP2A,
TP2B, TP2C
6
Red
Test Point, Miniature, Red, TH
Red Miniature Test point
5000
Keystone
U1A, U1B,
U1C, U1D
4
USB CHARGER OVP SWITCH WITH ESD FOR
VBUS_CON PIN, YFF0012ALAR
YFF0012ALAR
TPD1S414YFF
Texas Instruments
U2A, U2B,
U2C, U2D
4
SN74LVC1G12 IC, Single Bus Buffer Gate With 3-States Outputs,
5DCK
OE Active Low
DCK
SN74LVC1G12 Texas Instruments
5DCK
U3
1
TPD3E001DRL IC, LOW-CAPACITANCE 3-CHANNEL ±15-kV
R
ESD-PROTECTION ARRAY FOR HIGH-SPEED
DATA INTERFACES
SOP-5 (DRL)
TPD3E001DRL Texas Instruments
R
4
Quantity
TPD1S414EVM
SLVU916A – May 2015 – Revised June 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Schematics
www.ti.com
4
Schematics
Figure 3. TPD1S414EVM Schematic
5
Board Layout
This section provides the TPD1S414EVM board layout. TPD1S414EVM is a 4-layer board of FR-4 at
0.062" thickness.
SLVU916A – May 2015 – Revised June 2015
Submit Documentation Feedback
TPD1S414EVM
Copyright © 2015, Texas Instruments Incorporated
5
Board Layout
www.ti.com
Figure 4. Top Layer Copper
6
Figure 5. Bottom Layer Copper
TPD1S414EVM
SLVU916A – May 2015 – Revised June 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
Board Layout
www.ti.com
Figure 6. Layer 2 Copper
Figure 7. Layer 3 Copper
SLVU916A – May 2015 – Revised June 2015
Submit Documentation Feedback
TPD1S414EVM
Copyright © 2015, Texas Instruments Incorporated
7
Revision History
www.ti.com
Revision History
Changes from Original (May 2015) to A Revision ........................................................................................................... Page
•
•
8
Updated section order. ................................................................................................................... 1
Added Schematics section. .............................................................................................................. 5
Revision History
SLVU916A – May 2015 – Revised June 2015
Submit Documentation Feedback
Copyright © 2015, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertising