Texas Instruments | SN74LVC2G07 Dual Buffer and Driver With Open-Drain Outputs (Rev. L) | Datasheet | Texas Instruments SN74LVC2G07 Dual Buffer and Driver With Open-Drain Outputs (Rev. L) Datasheet

Texas Instruments SN74LVC2G07 Dual Buffer and Driver With Open-Drain Outputs (Rev. L) Datasheet
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SN74LVC2G07
SCES308L – AUGUST 2001 – REVISED MAY 2015
SN74LVC2G07 Dual Buffer and Driver With Open-Drain Outputs
1 Features
3 Description
•
•
•
•
This dual buffer and driver is designed for 1.65-V to
5.5-V VCC operation. The output of the
SN74LVC2G07 device is open drain and can be
connected to other open-drain outputs to implement
active-low wired-OR or active-high wired-AND
functions. The maximum sink current is 32 mA.
1
•
•
•
•
•
•
•
•
•
Dual Open-Drain Buffer Configuration
-24-mA Output Drive at 3.3 V
Support Translation-Up and Down
Available in the Texas Instruments
NanoFree™ Package
Supports 5-V VCC Operation
Inputs and Open-Drain Outputs Accept Voltages
Up to 5.5 V
Max tpd of 3.7 ns at 3.3 V
Low Power Consumption, 10-μA Max ICC
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
2 Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Blu-ray Players and Home Theaters
DVD Recorders and Players
Desktops or Notebook PCs
Digital Video Cameras (DVC)
Embedded PCs
GPS: Personal Navigation Devices
Mobile Phones
Network Projector Front Ends
Portable Media Players
Solid State Drive (SSD): Enterprise
High-Definition (HDTV)
Tablet: Enterprise
Audio Dock: Portable
DLP Front Projection System
NanoFree package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
Device Information(1)
PART NUMBER
SN74LVC2G07
PACKAGE
BODY SIZE (NOM)
SOT-23 (6)
2.90 mm × 1.60 mm
SC70 (6)
2.00 mm × 1.25 mm
DRY SON (6)
1.45 mm × 1.00 mm
DSF SON (6)
1.00 mm × 1.00 mm
DSBGA (6)
1.41 mm × 0.91 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Functional Block Diagram
1A
2A
1
6
3
4
1Y
2Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVC2G07
SCES308L – AUGUST 2001 – REVISED MAY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
4
4
4
5
5
5
5
5
6
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics from –40°C to 85°C .........
Switching Characteristics from –40°C to 125°C .......
Operating Characteristics..........................................
Typical Characteristics ..............................................
7
Parameter Measurement Information .................. 7
8
Detailed Description .............................................. 8
7.1 (Open-Drain) ............................................................. 7
8.1
8.2
8.3
8.4
9
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
8
8
8
8
Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Application ................................................... 9
10 Power Supply Recommendations ..................... 10
11 Layout................................................................... 10
11.1 Layout Guidelines ................................................. 10
11.2 Layout Examples................................................... 10
12 Device and Documentation Support ................. 11
12.1
12.2
12.3
12.4
12.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
11
11
11
11
11
13 Mechanical, Packaging, and Orderable
Information ........................................................... 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision K (November 2013) to Revision L
•
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Changes from Revision J (August 2012) to Revision K
Page
•
Updated document to new TI data sheet format. ................................................................................................................... 1
•
Updated operating temperature range. .................................................................................................................................. 4
2
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5 Pin Configuration and Functions
DBV Package
6-Pin SOT-23
Top View
1A
GND
2A
1
2
3
YZP Package
6-Pin DSBGA
Bottom View
6
1Y
5
VCC
4
2A
3
4
2Y
GND
2
5
VCC
1 6
1A
1Y
2Y
DRY Package
6-Pin SON
Top View
DCK Package
6-Pin SC70
Top View
1A
1
6
1Y
GND
2
5
VCC
2A
3
4
2Y
1A
1
6
1Y
GND
2
5
VCC
2A
3
4
2Y
DSF Package
6-Pin SON
Top View
1A
1
6
1Y
GND
2
5
VCC
2A
3
4
2Y
Pin Functions
PIN
NAME
NO
I/O
DESCRIPTION
1A
1
I
Input 1
GND
2
—
Ground
2A
3
I
Input 2
2Y
4
O
Open-drain output 2
VCC
5
—
Power pin
1Y
6
O
Open-drain output 1
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
MIN
MAX
UNIT
Supply voltage
–0.5
6.5
V
(2)
VI
Input voltage
–0.5
6.5
V
VO
Voltage applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
VO
Voltage applied to any output in the high or low state (2) (3)
–0.5
6.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
(3)
Storage Temperature
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the Recommended Operating Conditions table.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
+2000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
+1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions (1)
VCC
Supply voltage
Operating
Data retention only
High-level input voltage
MAX
1.65
5.5
1.5
VCC = 1.65 V to 1.95 V
VIH
MIN
VCC = 2.3 V to 2.7 V
1.7
VCC = 3 V to 3.6 V
V
2
0.7 × VCC
VCC = 1.65 V to 1.95 V
Low-level input voltage
V
0.65 × VCC
VCC = 4.5 V to 5.5 V
VIL
UNIT
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VCC = 4.5 V to 5.5 V
V
0.3 × VCC
VI
Input voltage
0
5.5
V
VO
Output voltage
0
5.5
V
VCC = 1.65 V
4
VCC = 2.3 V
IOL
Low-level output current
Δt/Δv
Input transition rise or fall rate
VCC = 3 V
4
mA
24
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
VCC = 3.3 V ± 0.3 V
10
VCC = 5 V ± 0.5 V
(1)
8
16
ns/V
5
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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Recommended Operating Conditions(1) (continued)
TA
MIN
MAX
UNIT
–40
125
°C
Operating free-air temperature
6.4 Thermal Information
SN74LVC2G07
THERMAL METRIC (1)
RθJA
(1)
Junction-to-ambient thermal resistance
SOT-23
SC70
DRY (SON)
DSBGA
DSF (SON)
6 PINS
6 PINS
6 PINS
6 PINS
6 PINS
165
259
234
123
300
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOL = 100 μA
VOL
TYP (1)
–40°C to 125°C
MAX
MIN
TYP (1)
MAX
1.65 V to 5.5 V
0.1
0.1
1.65 V
0.45
0.45
IOL = 8 mA
2.3 V
0.3
0.3
0.4
0.4
0.55
0.55
0.55
0.55
IOL = 16 mA
3V
IOL = 32 mA
A inputs
MIN
IOL = 4 mA
IOL = 24 mA
II
–40°C to 85°C
VCC
4.5 V
VI = 5.5 V or GND
Ioff
VI or VO = 5.5 V
ICC
VI = 5.5 V or GND,
ΔICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
CI
VI = VCC or GND
(1)
All typical values are at VCC = 3.3 V, TA = 25°C.
IO = 0
UNIT
V
0 to 5.5 V
±5
±5
μA
0
±10
±10
μA
1.65 V to 5.5 V
10
10
μA
3 V to 5.5 V
500
500
μA
3.3 V
3.5
3.5
pF
6.6 Switching Characteristics from –40°C to 85°C
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
–40°C to 85°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
1.5
8.6
1
4.4
1
3.7
1
2.9
ns
6.7 Switching Characteristics from –40°C to 125°C
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
–40°C to 125°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
1.5
8.6
1
4.9
1
4.2
1
3.4
ns
6.8 Operating Characteristics
TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
3
3
4
4
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UNIT
pF
5
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6.9 Typical Characteristics
2.5
TPD
TPD - ns
2
1.5
1
0.5
0
-100
-50
0
50
Temperature - °C
100
150
D001
Figure 1. TPD Across Temperature at 3.3V Vcc
6
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7 Parameter Measurement Information
7.1 (Open-Drain)
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tPZL (see Notes E and F)
tPLZ (see Notes E and G)
tPHZ/tPZH
VLOAD
VLOAD
VLOAD
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tW
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VOH
Output
VM
VOL
tPHL
VM
VM
0V
tPLZ
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VM
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH – V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators have the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. Because this device has open-drain outputs, tPLZ and tPZL are the same as tPD.
F. tPZL is measured at VM.
G. tPLZ is measured at VOL + V∆.
H. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
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8 Detailed Description
8.1 Overview
The SN74LVC2G07 device contains two open drain buffer with a maximum sink current of 32 mA. This device is
fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing
damaging current backflow through the device when it is powered down.
8.2 Functional Block Diagram
1A
2A
1
6
3
4
1Y
2Y
8.3 Feature Description
The open-drain configuration means that the device cannot provide its own output drive current; instead, it relies
on pullup resistors to provide the "high" bus state. It can only drive the bus low. In the "Hi-Z" state, the
SN74LVC2G07 acts as an open circuit and allows the external pullup to pull the bus high. Therefore, the pullup
voltage determines the output level and therefore the SN74LVC2g07 can be used for up or down-translation. The
device can sink 24 mA at 3 V while retaining an output voltage (VOL) of 0.55 V or lower.
8.4 Device Functional Modes
Table 1 shows the device functional modes of the SN74LVC2G07 device.
Table 1. Function Table
INPUT
A
8
OUTPUT
Y
L
L
H
H
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SN74LVC2G07 is a high-drive CMOS device that can be used to implement a high output drive buffer, such
as an LED application. It can sink 32 mA of current at 4.5 V making it ideal for high-drive and wired-OR/AND
functions. The inputs are 5.5 V tolerant allowing it to translate up and down to VCC.
9.2 Typical Application
VCC
0.1 F
1A
1Y
2A
2Y
From
MCU
GND
Figure 3. Typical Application
9.2.1 Design Requirements
1. Recommended Input Conditions
– Rise time and fall time specs. See (Δt/ΔV) in the Recommended Operating Conditions table.
– Specified high and low levels. See (VIH and VIL) in the Recommended Operating Conditions table.
– Inputs are overvoltage tolerant allowing them to go as high as (VI max) in the Recommended Operating
Conditions table at any valid VCC.
2. Recommend Output Conditions
– Load currents should not exceed (IO max) per output and should not exceed (Continuous current through
VCC or GND) total current for the part. These limits are located in the Absolute Maximum Ratings table.
– Outputs should not be pulled above 5.5 V.
9.2.2 Detailed Design Procedure
This device uses CMOS technology and has balanced output drive. Take care to avoid bus contention because it
can drive currents that would exceed maximum limits. The high drive will also create fast edges into light loads
so routing and load conditions should be considered to prevent ringing.
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Typical Application (continued)
9.2.3 Application Curve
6
TPD
5
TPD - ns
4
3
2
1
0
0
1
2
3
Vcc - V
4
5
6
D002
Figure 4. TPD Across VCC at 25°C
10 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions table.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply a 0.1-μF capacitor is recommended and if there are multiple VCC pins then a 0.01-μF or 0.022-μF
capacitor is recommended for each power pin. It is ok to parallel multiple bypass caps to reject different
frequencies of noise. 0.1-μF and 1-μF capacitors are commonly used in parallel. The bypass capacitor should be
installed as close to the power pin as possible for best results.
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices inputs should not ever float. In many cases, functions or parts of functions
of digital logic devices are unused; for example, when only two inputs of a triple-input AND gate are used or only
3 of the 4 buffer gates are used. Such input pins should not be left unconnected because the undefined voltages
at the outside connections result in undefined operational states. Specified below are the rules that must be
observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low
bias to prevent them from floating. The logic level that should be applied to any particular unused input depends
on the function of the device. Generally they will be tied to GND or VCC whichever make more sense or is more
convenient.
11.2 Layout Examples
VCC
Input
Unused Input
Output
Output
Unused Input
Input
Figure 5. Layout Examples for SN74LVC2G07
10
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
Implications of Slow or Floating CMOS Inputs, SCBA004.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
NanoFree, E2E are trademarks of Texas Instruments.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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4-Apr-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74LVC2G07DBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(C075, C07F, C07K,
C07R)
SN74LVC2G07DBVRG4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(C07F, C07R)
SN74LVC2G07DCKR
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(CV5, CVF, CVJ, CV
K, CVR)
SN74LVC2G07DCKRE4
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CV5
SN74LVC2G07DCKRG4
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CV5
SN74LVC2G07DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(CV5, CVF, CVJ, CV
K, CVR)
SN74LVC2G07DCKTG4
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CV5
SN74LVC2G07DRYR
ACTIVE
SON
DRY
6
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CV
SN74LVC2G07DSFR
ACTIVE
SON
DSF
6
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
CV
SN74LVC2G07YZPR
ACTIVE
DSBGA
YZP
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 125
(CV7, CVN)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
4-Apr-2019
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC2G07 :
• Enhanced Product: SN74LVC2G07-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
SN74LVC2G07DBVR
SOT-23
DBV
6
3000
178.0
9.2
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.3
3.23
1.55
4.0
8.0
Q3
SN74LVC2G07DBVR
SOT-23
DBV
6
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
SN74LVC2G07DBVRG4
SOT-23
DBV
6
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
SN74LVC2G07DCKR
SC70
DCK
6
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
SN74LVC2G07DCKR
SC70
DCK
6
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
SN74LVC2G07DCKR
SC70
DCK
6
3000
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
SN74LVC2G07DCKRG4
SC70
DCK
6
3000
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
SN74LVC2G07DCKT
SC70
DCK
6
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
SN74LVC2G07DCKT
SC70
DCK
6
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
SN74LVC2G07DCKT
SC70
DCK
6
250
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
SN74LVC2G07DCKTG4
SC70
DCK
6
250
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
SN74LVC2G07DRYR
SON
DRY
6
5000
180.0
9.5
1.15
1.6
0.75
4.0
8.0
Q1
SN74LVC2G07DSFR
SON
DSF
6
5000
180.0
9.5
1.16
1.16
0.5
4.0
8.0
Q2
SN74LVC2G07YZPR
DSBGA
YZP
6
3000
178.0
9.2
1.02
1.52
0.63
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVC2G07DBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
SN74LVC2G07DBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
SN74LVC2G07DBVRG4
SOT-23
DBV
6
3000
180.0
180.0
18.0
SN74LVC2G07DCKR
SC70
DCK
6
3000
180.0
180.0
18.0
SN74LVC2G07DCKR
SC70
DCK
6
3000
180.0
180.0
18.0
SN74LVC2G07DCKR
SC70
DCK
6
3000
180.0
180.0
18.0
SN74LVC2G07DCKRG4
SC70
DCK
6
3000
180.0
180.0
18.0
SN74LVC2G07DCKT
SC70
DCK
6
250
180.0
180.0
18.0
SN74LVC2G07DCKT
SC70
DCK
6
250
180.0
180.0
18.0
SN74LVC2G07DCKT
SC70
DCK
6
250
180.0
180.0
18.0
SN74LVC2G07DCKTG4
SC70
DCK
6
250
180.0
180.0
18.0
SN74LVC2G07DRYR
SON
DRY
6
5000
184.0
184.0
19.0
SN74LVC2G07DSFR
SON
DSF
6
5000
184.0
184.0
19.0
SN74LVC2G07YZPR
DSBGA
YZP
6
3000
220.0
220.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
6
2X 0.95
1.9
1.45 MAX
3.05
2.75
5
2
4
0.50
6X
0.25
0.2
C A B
3
(1.1)
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X (0.95)
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214840/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X(0.95)
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DSF0006A
X2SON - 0.4 mm max height
SCALE 10.000
PLASTIC SMALL OUTLINE - NO LEAD
1.05
0.95
B
A
PIN 1 INDEX AREA
1.05
0.95
0.4 MAX
C
SEATING PLANE
0.05 C
(0.11) TYP
SYMM
0.05
0.00
3
4
SYMM
2X
0.7
4X
0.35
6
1
6X
(0.1)
PIN 1 ID
6X
0.45
0.35
0.22
0.12
0.07
0.05
C B A
C
4220597/A 06/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration MO-287, variation X2AAF.
www.ti.com
EXAMPLE BOARD LAYOUT
DSF0006A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.6)
(R0.05) TYP
1
6X (0.17)
6
SYMM
4X (0.35)
4
3
SYMM
(0.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:40X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220597/A 06/2017
NOTES: (continued)
4. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DSF0006A
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.6)
(R0.05) TYP
1
6
6X (0.17)
SYMM
4X (0.35)
4
3
SYMM
(0.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:40X
4220597/A 06/2017
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
YZP0006
DSBGA - 0.5 mm max height
SCALE 9.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.19
0.15
BALL TYP
0.05 C
0.5 TYP
C
SYMM
1
TYP
B
0.5
TYP
D: Max = 1.418 mm, Min =1.357 mm
E: Max = 0.918 mm, Min =0.857 mm
A
6X
0.015
0.25
0.21
C A
B
1
2
SYMM
4219524/A 06/2014
NanoFree Is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
TM
3. NanoFree package configuration.
www.ti.com
EXAMPLE BOARD LAYOUT
YZP0006
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
6X ( 0.225)
1
2
A
(0.5) TYP
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
( 0.225)
METAL
0.05 MAX
METAL
UNDER
MASK
0.05 MIN
( 0.225)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4219524/A 06/2014
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).
www.ti.com
EXAMPLE STENCIL DESIGN
YZP0006
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
6X ( 0.25)
(R0.05) TYP
2
1
A
(0.5)
TYP
SYMM
B
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4219524/A 06/2014
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
GENERIC PACKAGE VIEW
DRY 6
USON - 0.6 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4207181/G
PACKAGE OUTLINE
DRY0006A
USON - 0.6 mm max height
SCALE 8.500
PLASTIC SMALL OUTLINE - NO LEAD
1.05
0.95
B
A
PIN 1 INDEX AREA
1.5
1.4
C
0.6 MAX
SEATING PLANE
0.05
0.00
0.08 C
3X 0.6
SYMM
(0.127) TYP
(0.05) TYP
3
4
4X
0.5
SYMM
2X
1
1
6
6X
0.4
0.3
PIN 1 ID
(OPTIONAL)
5X
0.25
0.15
0.1
0.05
0.35
0.25
C A B
C
4222894/A 01/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
DRY0006A
USON - 0.6 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
(0.35)
5X (0.3)
6
1
6X (0.2)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(0.6)
LAND PATTERN EXAMPLE
1:1 RATIO WITH PKG SOLDER PADS
EXPOSED METAL SHOWN
SCALE:40X
0.05 MAX
ALL AROUND
EXPOSED
METAL
0.05 MIN
ALL AROUND
EXPOSED
METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222894/A 01/2018
NOTES: (continued)
3. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DRY0006A
USON - 0.6 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
(0.35)
5X (0.3)
1
6
6X (0.2)
SYMM
4X (0.5)
4
3
(R0.05) TYP
(0.6)
SOLDER PASTE EXAMPLE
BASED ON 0.075 - 0.1 mm THICK STENCIL
SCALE:40X
4222894/A 01/2018
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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