Texas Instruments | SNx4HC04 Hex Inverters (Rev. G) | Datasheet | Texas Instruments SNx4HC04 Hex Inverters (Rev. G) Datasheet

Texas Instruments SNx4HC04 Hex Inverters (Rev. G) Datasheet
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SN54HC04, SN74HC04
SCLS078G – DECEMBER 1982 – REVISED SEPTEMBER 2015
SNx4HC04 Hex Inverters
1 Features
3 Description
•
•
•
•
•
•
The SNx4HC04 devices contain six independent
inverters. They perform the Boolean function Y = A in
positive logic.
1
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive up to 10 LSTTL Loads
Low Power Consumption, 20-µA Maximum ICC
Typical tpd = 8 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 µA Maximum
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LCCC (20)
8.89 mm × 8.89 mm
CDIP (14)
19.56 mm × 6.67 mm
2 Applications
CFP (14)
9.21 mm × 5.97 mm
•
•
•
•
SOIC (14)
8.65 mm × 3.91 mm
PDIP (14)
19.30 mm × 6.35 mm
SOP (14)
10.3 mm × 5.3 mm
TSSOP (14)
5.00 mm × 4.40 mm
SN54HC04
Cameras
E-Meters
Ethernet Switches
Infotainment
SN74HC04
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Logic Diagram (Positive Logic)
A
Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HC04, SN74HC04
SCLS078G – DECEMBER 1982 – REVISED SEPTEMBER 2015
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
5
5
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Operating Characteristics..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 7
Detailed Description .............................................. 8
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8
8.3 Feature Description................................................... 8
8.4 Device Functional Modes.......................................... 8
9
Application and Implementation .......................... 9
9.1 Application Information.............................................. 9
9.2 Typical Application ................................................... 9
10 Power Supply Recommendations ..................... 11
11 Layout................................................................... 11
11.1 Layout Guidelines ................................................. 11
11.2 Layout Example .................................................... 11
12 Device and Documentation Support ................. 12
12.1
12.2
12.3
12.4
12.5
Related Links ........................................................
Community Resource............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
12
12
12
12
12
13 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (August 2013) to Revision G
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
ESD warning added................................................................................................................................................................ 4
Changes from Revision E (October 2010) to Revision F
•
2
Page
Removed Ordering Information table. .................................................................................................................................... 3
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SCLS078G – DECEMBER 1982 – REVISED SEPTEMBER 2015
5 Pin Configuration and Functions
J, W, D, DB, N, NS, or PW Packages
14-Pin SOIC, CDIP, CFP, PDIP, TSSOP, SOP
Top View
4
11
5
10
9
8
20 19
18
5
17
1
6A
2
6
16
7
15
14
8
6Y
NC
5A
NC
5Y
9 10 11 12 13
3Y
6
7
3
4
4A
12
2A
NC
2Y
NC
3A
VCC
3
6A
6Y
5A
5Y
4A
4Y
4Y
VCC
13
1Y
14
2
1A
NC
1
GND
NC
1A
1Y
2A
2Y
3A
3Y
GND
FK Package
Top View
NC – No internal connection
Pin Functions
PIN
SOIC,
CDIP,
CFP,
SSOP,
PDIP,
TSSOP
LCCC
1A
1
2
I
Input 1A
1Y
2
3
O
Output 1Y
2A
3
4
I
Input 2A
2Y
4
6
O
Output 2Y
3A
5
8
I
Input 3A
3Y
6
9
O
Output 3Y
GND
7
10
—
Ground Pin
4Y
8
12
O
Output 4Y
4A
9
13
I
Input 4A
5Y
10
14
O
Output 5Y
5A
11
16
I
Input 6A
6Y
12
18
O
Output 6Y
6A
13
19
I
Input 6A
VCC
14
20
—
Power Pin
NC
—
1,5,7,11,15,17
—
No Connection
NAME
I/O
DESCRIPTION
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Supply voltage
(2)
MIN
MAX
UNIT
–0.5
7
V
IIK
Input clamp current
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current (2)
VO < 0
±20
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
Storage temperature
–60
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Machine Model
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
SN54HC04
VCC
Supply voltage
VCC = 2 V
VIH
High-level input voltage
VCC = 4.5 V
VCC = 6 V
SN74HC04
MIN
NOM
MAX
2
5
6
MIN
NOM
MAX
2
5
6
1.5
1.5
3.15
3.15
4.2
4.2
VCC = 2 V
VCC = 4.5 V
UNIT
V
V
0.5
0.5
1.35
1.35
VIL
Low-level input voltage
VI
Input voltage
0
VCC
0
VCC
V
VO
Output voltage
0
VCC
0
VCC
V
VCC = 6 V
1.8
VCC = 2 V
Δt/Δv Input transition rise or fall rate
TA
(1)
4
Operating free-air temperature
1.8
1000
1000
VCC = 4.5 V
500
500
VCC = 6 V
400
400
–55
125
V
–40
85
ns
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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SCLS078G – DECEMBER 1982 – REVISED SEPTEMBER 2015
6.4 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = –20 µA
VOH
VI = VIH or VIL
IOH = –4 mA
IOH = –5.2 mA
IOL = 20 µA
VOL
VI = VIH or VIL
IOL = 4 mA
IOL = 5.2 mA
II
VI = VCC or 0
ICC
VI = VCC or 0,
IO = 0
TA = 25°C
MIN
TYP
SN54HC04
MAX
MAX
MIN
2V
1.9
1.998
1.9
1.9
4.5 V
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
UNIT
MAX
V
5.34
2V
0.002
0.1
0.1
0.1
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
2
40
20
µA
10
10
10
pF
6V
Ci
MIN
SN74HC04
6V
3
V
6.5 Switching Characteristics
over operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 3)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
tpd
A
Y
tt
Y
TA = 25°C
MIN
SN54HC04
MIN
SN74HC04
TYP
MAX
MAX
MIN
2V
45
95
125
120
4.5 V
9
19
29
24
6V
8
16
25
20
2V
38
75
110
95
4.5 V
8
15
22
19
6V
6
13
19
16
UNIT
MAX
ns
ns
6.6 Operating Characteristics
TA = 25°C
Cpd
PARAMETER
TEST CONDITIONS
Power dissipation capacitance per inverter
No load
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TYP
20
UNIT
pF
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6.7 Typical Characteristics
40
16
14
30
12
TPD
TPD
10
8
20
6
10
4
TPLH
2
TPLH
TPHL
0
±40
10
60
Temperature (ƒC)
TPHL
0
1
110
2
VCC at 25 (ƒC)
C001
Figure 1. TPD vs Temperature
6
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3
4
5
C002
Figure 2. TPD vs VCC
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SCLS078G – DECEMBER 1982 – REVISED SEPTEMBER 2015
7 Parameter Measurement Information
From Output
Under Test
Test
Point
Input
0V
CL= 50 pF
(see Note A)
50%
10%
90%
In-Phase
Output
90%
tPHL
tPLH
LOAD CIRCUIT
Input
VCC
50%
50%
tr
0V
90%
90%
VOH
50%
10%
tr
VCC
50%
10%
50%
10%
tPHL
Out-of-Phase
Output
90%
VOL
tf
tPLH
50%
10%
tf
50%
10%
90%
tf
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VOLTAGE WAVEFORMS
INPUT RISE AND FALL TIMES
A.
C L includes probe and test-fixture capacitance.
B.
Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having
the following characteristics: PRR ≤ MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C.
The outputs are measured one at a time with one input transition per measurement.
D.
tPLH and tPHL are the same as tpd.
Figure 3. Load Circuit and Voltage Waveforms
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8 Detailed Description
8.1 Overview
The SNX4HC04 device contains six inverter gates. Each inverter gate performs the function of Y = A.
8.2 Functional Block Diagram
A
Y
Figure 4. Logic Diagram (Positive Logic)
8.3 Feature Description
The SNx4HC series of devices offer a wide operating voltage range from 2 V to 6 V. The outputs can drive up to
10 LSTTL loads. The SNx4HC04 offers low power consumption of 20 μA maximum ICC and typical propagation
delays of tpd = 8 ns. At 5 V, the outputs have ±4 mA of output drive capability. Inputs have low input current
leakage of 1 μA maximum.
8.4 Device Functional Modes
Table 1. Function Table
(Each Inverter)
8
INPUT
A
OUTPUT
Y
H
L
L
H
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SCLS078G – DECEMBER 1982 – REVISED SEPTEMBER 2015
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SNX4HC04 is a low-drive CMOS device that can be used for a multitude of inverting buffer type functions.
The device can produce 4 mA of drive current at 5 V, making it Ideal for driving multiple outputs and good for
low-noise applications.
9.2 Typical Application
5-V accessory
3.3-V or 5-V regulated
0.1 µF
Figure 5. Typical Application Schematic
9.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Take care to avoid bus contention because it
can drive currents that would exceed maximum limits. The high drive also creates fast edges into light loads, so
routing and load conditions should be considered to prevent ringing.
9.2.2 Detailed Design Procedure
1. Recommended Input Conditions
– For rise time and fall time specifications, see Δt/ΔV in Recommended Operating Conditions.
– For specified High and low levels, see VIH and VIL in Recommended Operating Conditions.
– Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC.
2. Recommend Output Conditions
– Load currents should not exceed 25 mA per output and 50 mA total for the part.
– Outputs should not be pulled above VCC.
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Typical Application (continued)
9.2.3 Application Curve
Figure 6. Typical Technology Output Drive Curve
10
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SCLS078G – DECEMBER 1982 – REVISED SEPTEMBER 2015
10 Power Supply Recommendations
The power supply can be any voltage between the MIN and MAX supply voltage rating located in Recommended
Operating Conditions.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, TI recommends a 0.1-μF bypass capacitor. If there are multiple VCC pins, TI recommends a 0.01-μF or
0.022-μF bypass capacitors for each power pin. It is acceptable to parallel multiple bypass capacitors to reject
different frequencies of noise. A 0.1 μF and 1 μF bypass capacitors are commonly used in parallel. For best
results, install the bypass capacitor as close to the power pin as possible for best.
11 Layout
11.1 Layout Guidelines
When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of
digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used,
or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the
undefined voltages at the outside connections result in undefined operational states.
Specified in Figure 7 are rules that must be observed under all circumstances. All unused inputs of digital logic
devices must be connected to a high or low bias to prevent them from floating. The logic level that should be
applied to any particular unused input depends on the function of the device. Generally they will be tied to GND
or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a
transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part when
asserted. This will not disable the input section of the I/Os so they also cannot float when disabled.
11.2 Layout Example
Vcc
Input
Unused Input
Output
Unused Input
Output
Input
Figure 7. Layout Diagram
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12 Device and Documentation Support
12.1 Related Links
The following table lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN54HC04
Click here
Click here
Click here
Click here
Click here
SN74HC04
Click here
Click here
Click here
Click here
Click here
12.2 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12
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PACKAGE OPTION ADDENDUM
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24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-8409801VCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8409801VC
A
SNV54HC04J
5962-8409801VDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8409801VD
A
SNV54HC04W
84098012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
84098012A
SNJ54HC
04FK
8409801CA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409801CA
SNJ54HC04J
8409801DA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409801DA
SNJ54HC04W
JM38510/65701B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
65701B2A
JM38510/65701BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65701BCA
M38510/65701B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
65701B2A
M38510/65701BCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
65701BCA
SN54HC04J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54HC04J
SN74HC04D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DBR
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DBRE4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DBRG4
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
HC04
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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24-Aug-2018
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74HC04DRE4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DRG3
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DRG4
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04DT
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04N
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
N / A for Pkg Type
-40 to 85
SN74HC04N
SN74HC04NE4
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC04N
SN74HC04NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04NSRG4
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWRG4
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SN74HC04PWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC04
SNJ54HC04FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
84098012A
SNJ54HC
04FK
SNJ54HC04J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409801CA
SNJ54HC04J
SNJ54HC04W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
8409801DA
SNJ54HC04W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC04, SN54HC04-SP, SN74HC04 :
• Catalog: SN74HC04, SN54HC04
• Automotive: SN74HC04-Q1, SN74HC04-Q1
• Military: SN54HC04
• Space: SN54HC04-SP
NOTE: Qualified Version Definitions:
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Oct-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74HC04DR
SOIC
D
14
2500
330.0
16.8
6.5
9.5
2.1
8.0
16.0
Q1
SN74HC04DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04DRG3
SOIC
D
14
2500
330.0
16.8
6.5
9.5
2.1
8.0
16.0
Q1
SN74HC04DRG4
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04DRG4
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04DT
SOIC
D
14
250
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC04NSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74HC04PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC04PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC04PWRG4
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC04PWT
TSSOP
PW
14
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Oct-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74HC04DR
SOIC
D
14
2500
364.0
364.0
27.0
SN74HC04DR
SOIC
D
14
2500
367.0
367.0
38.0
SN74HC04DR
SOIC
D
14
2500
333.2
345.9
28.6
SN74HC04DRG3
SOIC
D
14
2500
364.0
364.0
27.0
SN74HC04DRG4
SOIC
D
14
2500
333.2
345.9
28.6
SN74HC04DRG4
SOIC
D
14
2500
367.0
367.0
38.0
SN74HC04DT
SOIC
D
14
250
210.0
185.0
35.0
SN74HC04NSR
SO
NS
14
2000
367.0
367.0
38.0
SN74HC04PWR
TSSOP
PW
14
2000
364.0
364.0
27.0
SN74HC04PWR
TSSOP
PW
14
2000
367.0
367.0
35.0
SN74HC04PWRG4
TSSOP
PW
14
2000
367.0
367.0
35.0
SN74HC04PWT
TSSOP
PW
14
250
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
J0014A
CDIP - 5.08 mm max height
SCALE 0.900
CERAMIC DUAL IN LINE PACKAGE
PIN 1 ID
(OPTIONAL)
A
4X .005 MIN
[0.13]
.015-.060 TYP
[0.38-1.52]
1
14
12X .100
[2.54]
14X .014-.026
[0.36-0.66]
14X .045-.065
[1.15-1.65]
.010 [0.25] C A B
.754-.785
[19.15-19.94]
8
7
B
.245-.283
[6.22-7.19]
.2 MAX TYP
[5.08]
C
.13 MIN TYP
[3.3]
SEATING PLANE
.308-.314
[7.83-7.97]
AT GAGE PLANE
.015 GAGE PLANE
[0.38]
0 -15
TYP
14X .008-.014
[0.2-0.36]
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
www.ti.com
EXAMPLE BOARD LAYOUT
J0014A
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
(.300 ) TYP
[7.62]
SEE DETAIL A
SEE DETAIL B
1
14
12X (.100 )
[2.54]
SYMM
14X ( .039)
[1]
8
7
SYMM
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
.002 MAX
[0.05]
ALL AROUND
(.063)
[1.6]
METAL
( .063)
[1.6]
SOLDER MASK
OPENING
METAL
(R.002 ) TYP
[0.05]
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
DETAIL A
DETAIL B
SCALE: 15X
13X, SCALE: 15X
4214771/A 05/2017
www.ti.com
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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