Texas Instruments | SN74LVC1G74 Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset (Rev. E) | Datasheet | Texas Instruments SN74LVC1G74 Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset (Rev. E) Datasheet

Texas Instruments SN74LVC1G74 Single Positive-Edge-Triggered D-Type Flip-Flop with Clear and Preset (Rev. E) Datasheet
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SN74LVC1G74
SCES794E – OCTOBER 2009 – REVISED JANUARY 2015
SN74LVC1G74 Single Positive-Edge-Triggered D-Type Flip-Flop
with Clear and Preset
1 Features
3 Description
•
This single positive-edge-triggered D-type flip-flop is
designed for 1.65-V to 5.5-V VCC operation.
1
•
•
•
•
•
•
•
•
•
•
•
Available in the Texas Instruments
NanoFree™ Package
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Supports Down Translation to VCC
Max tpd of 5.9 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model
– 200-V Machine Model
– 1000-V Charged-Device Model
NanoFree™ package technology is a major
breakthrough in IC packaging concepts, using the die
as the package.
A low level at the preset (PRE) or clear (CLR) input
sets or resets the outputs, regardless of the levels of
the other inputs. When PRE and CLR are inactive
(high), data at the data (D) input meeting the setup
time requirements is transferred to the outputs on the
positive-going edge of the clock pulse. Clock
triggering occurs at a voltage level and is not related
directly to the rise time of the clock pulse. Following
the hold-time interval, data at the D input can be
changed without affecting the levels at the outputs.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
Device Information(1)
PART NUMBER
2 Applications
•
•
•
•
•
•
SN74LVC1G74
Servers
LED Displays
Network switch
Telecom Infrastructure
Motor Drivers
I/O Expanders
PACKAGE
BODY SIZE
SM8 (8)
2.95 mm × 2.80 mm
US8 (8)
2.30 mm × 2.00 mm
X2SON (8)
1.40 mm × 1.00 mm
UQFN (8)
1.50 mm × 1.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Schematic
PRE
D
Q
CLK
Q
CLR
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVC1G74
SCES794E – OCTOBER 2009 – REVISED JANUARY 2015
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
4
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
4
4
5
5
6
6
6
7
7
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions ......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Switching Characteristics ..........................................
Operating Characteristics..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 8
9
Detailed Description .............................................. 9
9.1
9.2
9.3
9.4
Overview ...................................................................
Functional Block Diagram .........................................
Feature Description...................................................
Device Functional Modes..........................................
9
9
9
9
10 Application and Implementation........................ 10
10.1 Application Information ........................................ 10
10.2 Typical Power Button Circuit ................................ 10
11 Power Supply Recommendations ..................... 11
12 Layout................................................................... 12
12.1 Layout Guidelines ................................................. 12
12.2 Layout Example .................................................... 12
13 Device and Documentation Support ................. 12
13.1 Trademarks ........................................................... 12
13.2 Electrostatic Discharge Caution ............................ 12
13.3 Glossary ................................................................ 12
14 Mechanical, Packaging, and Orderable
Information ........................................................... 12
5 Revision History
Changes from Revision D (January 2013) to Revision E
Page
•
Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table,
Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
•
Updated Features. .................................................................................................................................................................. 1
Changes from Original (October 2009) to Revision A
Page
•
Changed Ioff description in Features....................................................................................................................................... 1
•
Changed Timing Requirements table. .................................................................................................................................... 6
•
Changed Switching Requirements table. ............................................................................................................................... 6
2
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6 Pin Configuration and Functions
DCT PACKAGE
(TOP VIEW)
DCU PACKAGE
(TOP VIEW)
CLK
1
8
VCC
D
2
7
PRE
Q
3
6
CLR
GND
4
5
Q
CLK
D
Q
GND
1
8
2
7
3
6
4
5
VCC
PRE
CLR
Q
See mechanical drawings for dimensions.
DQE PACKAGE
(TOP VIEW)
CLK
D
Q
GND
VCC
PRE
CLR
Q
1 8
2 7
3 6
4 5
RSE PACKAGE
(TOP VIEW)
VCC
PRE
CLR
Q
1
8
7
2
3
6
4
5
CLK
D
Q
GND
See mechanical drawings for dimensions
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
CLK
1
I
Clock input
CLR
6
I
Clear input - Pull low to set Q output low
D
2
I
Input
GND
4
—
Ground
Q
5
O
Output
Q
3
O
Inverted output
PRE
7
I
Preset input - Pull low to set Q output high
VCC
8
—
Supply
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
MIN
MAX
Supply voltage range
–0.5
6.5
UNIT
V
(2)
VI
Input voltage range
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high or low state (2) (3)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
(3)
Storage temperature range
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The value of VCC is provided in the Recommended Operating Conditions table.
7.2 ESD Ratings
PARAMETER
V(ESD)
(1)
(2)
4
Electrostatic discharge
DEFINITION
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins (2)
1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
VCC
Operating
Supply voltage
Data retention only
1.65
5.5
VCC = 3 V to 3.6 V
V
2
0.7 × VCC
VCC = 1.65 V to 1.95 V
Low-level input voltage
V
1.7
VCC = 4.5 V to 5.5 V
VIL
UNIT
0.65 × VCC
VCC = 2.3 V to 2.7 V
High-level input voltage
MAX
1.5
VCC = 1.65 V to 1.95 V
VIH
MIN
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VCC = 4.5 V to 5.5 V
V
0.3 × VCC
VI
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
VCC = 1.65 V
–4
VCC = 2.3 V
–8
–16
VCC = 3 V
VCC = 4.5 V
–32
VCC = 1.65 V
4
VCC = 2.3 V
IOL
Low-level output current
Δt/Δv
8
16
VCC = 3 V
Input transition rise or fall rate
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
VCC = 3.3 V ± 0.3 V
10
DQE Package
–40
85
–40
125
°C
DCT Package
DCU Package
(1)
ns/V
5
RSE Package
Operating free-air temperature
mA
24
VCC = 4.5 V
VCC = 5 V ± 0.5 V
TA
mA
–24
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
7.4 Thermal Information
SN74LVC1G74
THERMAL METRIC
RθJA
(1)
(1)
Junction-to-ambient thermal resistance
DCT
DCU
RSE
DQE
8 PINS
8 PINS
8 PINS
8 PINS
220
227
243
261
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 µA
VOH
1.65 V to 5.5 V
1.65 V
1.2
IOH = –8 mA
2.3 V
1.9
4.5 V
IOL = 100 µA
1.65 V to 5.5 V
0.1
IOL = 4 mA
1.65 V
0.45
IOL = 8 mA
2.3 V
0.3
IOL = 32 mA
II
0.4
VI = 5.5 V or GND
VI or VO = 5.5 V
ICC
VI = 5.5 V or GND,
IO = 0
ΔICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
V
0.55
4.5 V
Ioff
(1)
3.8
3V
IOL = 24 mA
Data or
control inputs
2.3
IOH = –32 mA
IOL = 16 mA
UNIT
V
2.4
3V
IOH = –24 mA
MAX
VCC – 0.1
IOH = –4 mA
IOH = –16 mA
VOL
MIN TYP (1)
VCC
0.55
0 to 5.5 V
±5
µA
0
±10
µA
1.65 V to 5.5 V
10
µA
3 V to 5.5 V
500
µA
3.3 V
5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
7.6 Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
–40°C to 85°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
MIN
fclock
MAX
VCC = 2.5 V
MIN
80
tw
tsu
MAX
–40°C to 125°C
VCC = 3.3 V
MIN
175
MAX
VCC = 5 V
MIN
175
MAX
VCC = 3.3 V
MIN
200
MAX
VCC = 5 V
MIN
175
200 MHz
CLK
6.2
2.7
2.7
2
2.7
2
PRE or CLR low
6.2
2.7
2.7
2
2.7
2
Data
2.9
1.7
1.3
1.1
1.3
1.1
PRE or CLR inactive
1.9
1.4
1.2
1
1.2
1.2
0
0.3
1.2
0.5
1.2
0.5
th
UNIT
MAX
ns
ns
ns
7.7 Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
–40°C to 85°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
MIN
fmax
80
CLK
tpd
PRE or CLR
low
6
MAX
VCC = 2.5 V
MIN
MAX
175
–40°C to 125°C
VCC = 3.3 V
MIN
MAX
175
VCC = 5 V
MIN
MAX
200
VCC = 3.3 V
MIN
MAX
175
VCC = 5 V
MIN
200
MHz
Q
4.8
13.4
2.2
7.1
2.2
5.9
1.4
4.1
2.2
7.9
1.4
6.1
Q
6
14.4
3
7.7
2.6
6.2
1.6
4.4
2.6
8.2
1.6
6.4
4.4
12.9
2.3
7
1.7
5.9
1.6
4.1
1.7
7.9
1.6
6.1
Q or Q
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UNIT
MAX
ns
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7.8 Operating Characteristics
TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
35
35
37
40
UNIT
pF
7.9 Typical Characteristics
10
14
12
VCC = 3 V,
TA = 25°C
tpd – Propagation Delay Time – ns
tpd – Propagation Delay Time – ns
VCC = 3 V,
TA = 25°C
One Output Switching
10
8
6
4
One Output Switching
8
6
4
2
2
0
50
100
150
200
250
300
CL – Load Capacitance – pF
Figure 1. Propagation Delay (Low to High Transition)
vs Load Capacitance
0
50
100
150
200
250
300
CL – Load Capacitance – pF
Figure 2. Propagation Delay (High to Low Transition)
vs Load Capacitance
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8 Parameter Measurement Information
VLOAD
S1
RL
From Output
Under Test
Open
TEST
GND
CL
(see Note A)
S1
Open
VLOAD
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
RL
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
£2 ns
£2 ns
£2.5 ns
£2.5 ns
VM
VLOAD
CL
RL
VD
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kW
500 W
500 W
500 W
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tW
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPLH
VOH
Output
VM
VOL
tPHL
VM
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
tPZL
tPHL
VM
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + VD
VOL
tPHZ
VM
VOH – VD
VOH
»0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 W.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuit and Voltage Waveforms
8
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9 Detailed Description
9.1 Overview
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
9.2 Functional Block Diagram
PRE
CLK
7
1
C
C
C
5
Q
TG
C
C
C
C
D
2
TG
TG
TG
3
C
CLR
Q
C
C
6
9.3 Feature Description
•
•
•
Allow down voltage translation
– 5 V to 3.3 V
– 5.0 V to 1.8 V
– 3.3 V to 1.8 V
Inputs accept voltage levels up to 5.5 V
Ioff Feature
– Can prevent backflow current that can damage device when powered down
9.4 Device Functional Modes
Table 1. Function Table
INPUTS
(1)
OUTPUTS
PRE
CLR
CLK
D
Q
Q
L
H
X
X
H
L
H
L
X
X
L
H
L
L
X
X
H (1)
H (1)
H
H
↑
H
H
L
H
H
↑
L
L
H
H
H
L
X
Q0
Q0
This configuration is nonstable; that is, it does not persist when PRE or CLR returns to its inactive (high) level.
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the
other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs
at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval,
data at the D input can be changed without affecting the levels at the outputs.
The resistor and capacitor at the CLR pin are optional. If they are not used, the CLR pin should be connected
directly to VCC to be inactive.
10.2 Typical Power Button Circuit
3V
3V
3V
NC
A
GND
VCC
Y
SN74LVC1G17
CLK
D
Q
GND
VCC
PRE
CLR
Q
MCU
SN74LVC1G74
Figure 4. Device Power Button Circuit
10.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus
contention because it can drive currents that would exceed maximum limits. Outputs can be combined to
produce higher drive but the high drive will also create faster edges into light loads so routing and load conditions
should be considered to prevent ringing.
10.2.2 Detailed Design Procedure
1. Recommended Input Conditions:
– For rise time and fall time specifications, see (Δt/ΔV) in Recommended Operating Conditions table.
– For specified high and low levels, see (VIH and VIL) in Recommended Operating Conditions table.
– Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC.
2. Recommend Output Conditions:
– Load currents should not exceed 50 mA per output and 100 mA total for the part.
– Series resistors on the output may be used if the user desires to slow the output edge signal or limit the
10
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Typical Power Button Circuit (continued)
output current.
10.2.3 Application Curves
60
40
100
TA = 25°C, VCC = 3 V,
VIH = 3 V, VIL = 0 V,
All Outputs Switching
80
TA = 25°C, VCC = 3 V,
VIH = 3 V, VIL = 0 V,
All Outputs Switching
20
I OL – mA
I OH – mA
60
0
–20
–40
40
20
–60
0
–80
–100
–1
–0.5 0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
–20
–0.2
0.0
VOH – V
Figure 5. Output Current Drive
vs HIGH-level Output Voltage
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
VOL – V
Figure 6. Output Current Drive
vs LOW-level Output Voltage
11 Power Supply Recommendations
The power supply can be any voltage between the minimum and maximum supply voltage rating located in the
Recommended Operating Conditions table. Each VCC terminal should have a good bypass capacitor to prevent
power disturbance. For devices with a single supply, a 0.1-μF capacitor is recommended and if there are multiple
VCC terminals then .01-μF or .022-μF capacitors are recommended for each power terminal. It is acceptable to
parallel multiple bypass caps to reject different frequencies of noise. The 0.1-μF and 1-μF capacitors are
commonly used in parallel. The bypass capacitor should be installed as close to the power terminal as possible
for best results.
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12 Layout
12.1 Layout Guidelines
When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of
digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used,
or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the
undefined voltages at the outside connections result in undefined operational states.
Specified in Figure 7 are rules that must be observed under all circumstances. All unused inputs of digital logic
devices must be connected to a high or low bias to prevent them from floating. The logic level that should be
applied to any particular unused input depends on the function of the device. Generally they will be tied to GND
or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a
transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part when
asserted. This will not disable the input section of the I/Os so they also cannot float when disabled.
12.2 Layout Example
Vcc
Input
Unused Input
Output
Unused Input
Output
Input
Figure 7. Layout Diagram
13 Device and Documentation Support
13.1 Trademarks
NanoFree is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.
12
Submit Documentation Feedback
Copyright © 2009–2015, Texas Instruments Incorporated
Product Folder Links: SN74LVC1G74
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jul-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74LVC1G74DCTR
ACTIVE
SM8
DCT
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
N74
Z
SN74LVC1G74DCUR
ACTIVE
VSSOP
DCU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(N74Q, N74R)
SN74LVC1G74DCURG4
ACTIVE
VSSOP
DCU
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
N74R
SN74LVC1G74DCUT
ACTIVE
VSSOP
DCU
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(N74Q, N74R)
SN74LVC1G74DQER
ACTIVE
X2SON
DQE
8
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
DP
SN74LVC1G74RSE2
ACTIVE
UQFN
RSE
8
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
DP
SN74LVC1G74RSER
ACTIVE
UQFN
RSE
8
5000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
DP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Jul-2019
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Sep-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LVC1G74DCTR
SM8
DCT
8
3000
180.0
13.0
3.35
4.5
1.55
4.0
12.0
Q3
SN74LVC1G74DCUR
VSSOP
DCU
8
3000
180.0
8.4
2.25
3.35
1.05
4.0
8.0
Q3
SN74LVC1G74DCUR
VSSOP
DCU
8
3000
178.0
9.5
2.25
3.35
1.05
4.0
8.0
Q3
SN74LVC1G74DCURG4
VSSOP
DCU
8
3000
180.0
8.4
2.25
3.35
1.05
4.0
8.0
Q3
SN74LVC1G74DCUT
VSSOP
DCU
8
250
180.0
8.4
2.25
3.35
1.05
4.0
8.0
Q3
SN74LVC1G74DCUT
VSSOP
DCU
8
250
178.0
9.5
2.25
3.35
1.05
4.0
8.0
Q3
SN74LVC1G74DQER
X2SON
DQE
8
5000
180.0
9.5
1.15
1.6
0.5
4.0
8.0
Q1
SN74LVC1G74RSE2
UQFN
RSE
8
5000
180.0
9.5
1.7
1.7
0.75
4.0
8.0
Q3
SN74LVC1G74RSER
UQFN
RSE
8
5000
180.0
9.5
1.7
1.7
0.75
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Sep-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVC1G74DCTR
SM8
DCT
8
3000
182.0
182.0
20.0
SN74LVC1G74DCUR
VSSOP
DCU
8
3000
202.0
201.0
28.0
SN74LVC1G74DCUR
VSSOP
DCU
8
3000
202.0
201.0
28.0
SN74LVC1G74DCURG4
VSSOP
DCU
8
3000
202.0
201.0
28.0
SN74LVC1G74DCUT
VSSOP
DCU
8
250
202.0
201.0
28.0
SN74LVC1G74DCUT
VSSOP
DCU
8
250
202.0
201.0
28.0
SN74LVC1G74DQER
X2SON
DQE
8
5000
184.0
184.0
19.0
SN74LVC1G74RSE2
UQFN
RSE
8
5000
184.0
184.0
19.0
SN74LVC1G74RSER
UQFN
RSE
8
5000
184.0
184.0
19.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
DCT (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,30
0,15
0,65
8
0,13 M
5
0,15 NOM
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
2,90
2,70
4,25
3,75
Gage Plane
PIN 1
INDEX AREA
1
0,25
4
0° – 8°
3,15
2,75
0,60
0,20
1,30 MAX
Seating Plane
0,10
0,10
0,00
NOTES: A.
B.
C.
D.
4188781/C 09/02
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion
Falls within JEDEC MO-187 variation DA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OUTLINE
RSE0008A
UQFN - 0.6 mm max height
SCALE 7.000
PLASTIC QUAD FLATPACK - NO LEAD
1.55
1.45
B
A
PIN 1 INDEX AREA
1.55
1.45
C
0.6
0.5
SEATING PLANE
0.05
0.00
0.05 C
2X
0.1
0.05
0.35
0.25
6X
C A B
C
0.4
0.3
2X
4
3
(0.12)
TYP
0.45
0.35
5
SYMM
2X
1
2X
7
1
4X 0.5
8
SYMM
PIN 1 ID
(45 X 0.1)
4X
0.25
0.15
0.1
0.05
C A B
C
0.3
0.2
0.1
0.05
C A B
C
4220323/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RSE0008A
UQFN - 0.6 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
(R0.05) TYP
2X (0.6)
8
6X (0.55)
7
1
4X (0.25)
SYMM
(1.3)
2X
(0.2)
4X (0.5)
5
3
4
2X (0.3)
(1.35)
LAND PATTERN EXAMPLE
SCALE:30X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
METAL
UNDER
SOLDER MASK
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4220323/B 03/2018
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RSE0008A
UQFN - 0.6 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
(R0.05) TYP
8
2X (0.6)
6X (0.55)
7
1
4X (0.25)
SYMM
(1.3)
4X (0.5)
2X (0.2)
5
3
4
2X
(0.3)
(1.35)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICKNESS
SCALE: 30X
4220323/B 03/2018
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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