Texas Instruments | SN74LVCR16245A 16-Bit Bus Transceiver with 3-State Outputs (Rev. B) | Datasheet | Texas Instruments SN74LVCR16245A 16-Bit Bus Transceiver with 3-State Outputs (Rev. B) Datasheet

Texas Instruments SN74LVCR16245A 16-Bit Bus Transceiver with 3-State Outputs (Rev. B) Datasheet
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SN74LVCR16245A
SCES427B – FEBRUARY 2003 – REVISED JUNE 2014
SN74LVCR16245A 16-Bit Bus Transceiver with 3-State Outputs
1 Features
2 Applications
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Member of the Texas Instruments
Widebus™ Family
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 4.8 ns at 3.3 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With 3.3-V VCC)
All Inputs and Outputs Have Equivalent 26-Ω
Series Resistors, So No External Resistors Are
Required
Ioff Supports Live Insertion, Partial-Power-Down
Mode, and Back-Drive Protection
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
Servers
PCs and Notebooks
Network Switches
Telecom Infrastructures
3 Description
This 16-bit (dual-octal) noninverting bus transceiver is
designed for 1.65-V to 3.6-V VCC operation.
The SN74LVCR16245A device is designed for
asynchronous communication between data buses.
All inputs and outputs have equivalent 26-Ω resistors
that will slow the edges of the output and reduce
switching noise caused by long capacitive etch runs
or cables.
This device can be used as two 8-bit transceivers or
one 16-bit transceiver. Active bus-hold circuitry holds
unused or undriven data inputs at a valid logic state.
Device Information(1)
PART NUMBER
PACKAGE
SN74LVCR16245A
BODY SIZE (NOM)
TSSOP (48)
12.50 mm × 6.1 mm
TVSOP (48)
9.70 mm × 4.40 mm
SSOP (48)
15.88 mm × 7.49 mm
BGA MICROSTAR
7.00 mm × 4.50 mm
JUNIOR (56)
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
24
36
13
1B1
To Seven Other Channels
2OE
2B1
To Seven Other Channels
Pin numbers shown are for the DGG, DGV, and DL packages.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN74LVCR16245A
SCES427B – FEBRUARY 2003 – REVISED JUNE 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
9
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
5
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
5
5
6
6
7
7
7
8
Absolute Maximum Ratings ......................................
Handling Ratings.......................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Switching Characteristics ..........................................
Operating Characteristics..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 9
Detailed Description ............................................ 10
9.1
9.2
9.3
9.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
10
10
10
10
10 Application and Implementation........................ 11
10.1 Application Information.......................................... 11
10.2 Typical Application ............................................... 11
11 Power Supply Recommendations ..................... 12
12 Layout................................................................... 12
12.1 Layout Guidelines ................................................. 12
12.2 Layout Example .................................................... 12
13 Device and Documentation Support ................. 13
13.1 Trademarks ........................................................... 13
13.2 Electrostatic Discharge Caution ............................ 13
13.3 Glossary ................................................................ 13
14 Mechanical, Packaging, and Orderable
Information ........................................................... 13
5 Revision History
Changes from Revision A (November 2004) to Revision B
Page
•
Updated document to new TI data sheet standards. ............................................................................................................. 1
•
Deleted Ordering Information table. ....................................................................................................................................... 1
•
Updated Ioff Feature bullet. ..................................................................................................................................................... 1
•
Added Applications. ............................................................................................................................................................... 1
•
Added Handling Ratings table. ............................................................................................................................................... 5
•
Changed MAX ambient temperature to 125°C. ..................................................................................................................... 6
•
Added Thermal Information table. .......................................................................................................................................... 6
•
Added Typical Characteristics. ............................................................................................................................................... 8
2
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6 Pin Configuration and Functions
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1DIR
1B1
1B2
GND
1B3
1B4
VCC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCC
2B5
2B6
GND
2B7
2B8
2DIR
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
1A1
1A2
GND
1A3
1A4
VCC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCC
2A5
2A6
GND
2A7
2A8
2OE
Pin Functions
PIN
I/O
DESCRIPTION
1DIR
I
Direction pin 1
1B1
I/O
1B1 input or output
3
1B2
I/O
1B2 input or output
4
GND
—
Ground pin
5
1B3
I/O
1B3 input or output
6
1B4
I/O
1B4 input or output
7
VCC
—
Power pin
8
1B5
I/O
1B5 input or output
9
1B6
I/O
1B6 input or output
10
GND
—
Ground pin
11
1B7
I/O
1B7 input or output
12
1B8
I/O
1B8 input or output
13
2B1
I/O
2B1 input or output
14
2B2
I/O
2B2 input or output
15
GND
—
Ground pin
16
2B3
I/O
2B3 input or output
17
2B4
I/O
2B4 input or output
18
VCC
—
Power pin
19
2B5
I/O
2B5 input or output
20
2B6
I/O
2B6 input or output
21
GND
—
Ground pin
NO.
NAME
1
2
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Pin Functions (continued)
PIN
I/O
DESCRIPTION
2B7
I/O
2B7 input or output
2B8
I/O
2B8 input or output
24
2DIR
I
Direction pin 2
25
2OE
I
Output Enable 2
26
2A8
I/O
2A8 input or output
27
2A7
I/O
2A7 input or output
28
GND
—
Ground pin
29
2A6
I/O
2A6 input or output
30
2A5
I/O
2A5 input or output
31
VCC
—
Power pin
32
2A4
I/O
2A4 input or output
33
2A3
I/O
2A3 input or output
34
GND
—
Ground pin
35
2A2
I/O
2A2 input or output
36
2A1
I/O
2A1 input or output
37
1A8
I/O
1A8 input or output
38
1A7
I/O
1A7 input or output
39
GND
—
Ground pin
40
1A6
I/O
1A6 input or output
41
1A5
I/O
1A5 input or output
42
VCC
—
Power pin
43
1A4
I/O
1A4 input or output
44
1A3
I/O
1A3 input or output
45
GND
—
Ground pin
46
1A2
I/O
1A2 input or output
47
1A1
I/O
1A1 input or output
48
1OE
I
NO.
NAME
22
23
Output Enable 1
GQL OR ZQL PACKAGE
(TOP VIEW)
1
2
3
4
5
1
2
3
4
5
6
A
A
1DIR
NC
NC
NC
NC
1OE
B
B
1B2
1B1
GND
GND
1A1
1A2
C
1B4
1B3
1A4
1B6
1B5
VCC
GND
1A3
D
VCC
GND
1A5
1A6
E
1B8
1B7
1A7
1A8
F
2B1
2B2
2A2
2A1
G
2B3
2B4
GND
GND
2A4
2A3
H
2B5
2B6
2A5
J
2B7
2B8
VCC
GND
2A6
H
VCC
GND
2A8
2A7
J
K
2DIR
NC
NC
NC
NC
2OE
C
D
E
F
G
K
4
Pin Assignments
6
NC − No internal connection
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
VCC
MIN
MAX
Supply voltage range
–0.5
6.5
UNIT
V
(2)
VI
Input voltage range
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high or low state (2) (3)
–0.5
VCC + 0.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through each VCC or GND
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the Recommended Operating Conditions table.
7.2 Handling Ratings
Tstg
V(ESD)
(1)
(2)
MIN
MAX
UNIT
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins (1)
0
2000
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins (2)
0
1500
Storage temperature range
Electrostatic discharge
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
Operating
VCC
Supply voltage
VIH
High-level input voltage
Data retention only
MIN
MAX
1.65
3.6
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
VCC = 1.65 V to 1.95 V
Low-level input voltage
VI
Input voltage
V
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
VO
Output voltage
IOH
High-level output current
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
5.5
High or low state
0
VCC
3-state
0
5.5
VCC = 1.65 V
–2
VCC = 2.3 V
–4
VCC = 2.7 V
–8
V
V
mA
–12
VCC = 1.65 V
2
VCC = 2.3 V
4
VCC = 2.7 V
8
VCC = 3 V
(1)
V
0.8
0
VCC = 3 V
IOL
V
1.5
VCC = 1.65 V to 1.95 V
VIL
UNIT
mA
12
–40
10
ns/V
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
7.4 Thermal Information
THERMAL METRIC (1)
DGG
DGV
DL
48 PINS
48 PINS
48 PINS
RθJA
Junction-to-ambient thermal resistance
64.3
78.4
68.4
RθJC(top)
Junction-to-case (top) thermal resistance
17.6
30.7
34.7
RθJB
Junction-to-board thermal resistance
31.5
41.8
41.0
ψJT
Junction-to-top characterization parameter
1.1
3.8
12.3
ψJB
Junction-to-board characterization parameter
31.2
41.3
40.4
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
n/a
(1)
6
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = –100 µA
1.65 V to 3.6 V
IOH = –2 mA
II
Control inputs
MAX
1.2
1.7
2.7 V
2.2
IOH = –6 mA
3V
2.4
IOH = –8 mA
2.7 V
2
IOH = –12 mA
3V
2
IOL = 100 µA
1.65 V to 3.6 V
0.2
1.65 V
0.45
2.3 V
0.7
V
IOL = 4 mA
2.7 V
0.4
IOL = 6 mA
3V
0.55
IOL = 8 mA
2.7 V
0.6
IOL = 12 mA
3V
0.8
VI = 0 to 5.5 V
UNIT
VCC – 0.2
2.3 V
IOL = 2 mA
VOL
TYP (1)
1.65 V
IOH = –4 mA
VOH
MIN
V
3.6 V
±5
µA
Ioff
VI or VO = 5.5 V
0
±10
µA
IOZ (2)
VO = 0 to 5.5 V
3.6 V
±5
µA
VI = VCC or GND,
ICC
20
3.6 V ≤ VI ≤ 5.5 V (3)
IO = 0
One input at VCC – 0.6 V,
Other inputs at VCC or GND
∆ICC
3.6 V
20
2.7 V to 3.6 V
500
µA
µA
Ci
Control inputs
VI = VCC or GND
3.3 V
3
pF
Cio
A or B ports
VO = VCC or GND
3.3 V
12
pF
(1)
(2)
(3)
All typical values are at VCC = 3.3 V, TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This applies in the disabled state only.
7.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted) (See Figure 3)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
ten
tdis
PARAMETER
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B or A
1
7.8
1
5.8
1.5
5.7
1.5
4.8
ns
OE
A or B
1.5
10
1
8
1.5
7.9
1.5
6.3
ns
OE
A or B
1.5
11.9
1
8.4
1.5
8.3
2.2
7.4
ns
7.7 Operating Characteristics
TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
per transceiver
Outputs enabled
Outputs disabled
TEST
CONDITIONS
VCC = 1.8 V
VCC = 2.7 V
VCC = 3.3 V
TYP
TYP
TYP
f = 10 MHz
35
38
43
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UNIT
pF
7
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7.8 Typical Characteristics
4.5
8
4
7
TPD in ns
3.5
6
TPD (ns)
TPD (ns)
3
2.5
2
5
4
3
1.5
2
1
1
0.5
TPD in ns
0
-100
0
-50
0
50
Temperature (qC)
100
150
0
D001
Figure 1. TPD vs Temperature
8
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1
2
VCC (V)
3
4
D002
Figure 2. TPD vs VCC
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8 Parameter Measurement Information
From Output
Under Test
VLOAD
Open
S1
RL
GND
CL
(see Note A)
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUT
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
VCC
VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
th
VI
VM
Input
VM
VI
VM
Data Input
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VI
VM
Input
VM
0V
tPHL
tPLH
VOH
VM
Output
VM
VOL
tPLH
tPHL
VOH
Output
VM
VM
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VI
Output
Control
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VM
VM
0V
tPLZ
tPZL
VLOAD/2
VM
VOL + V∆
VOL
tPHZ
tPZH
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. t PZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuit and Voltage Waveforms
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9 Detailed Description
9.1 Overview
The SN74LVCR16245A device is designed for asynchronous communication between data buses. The logic
levels of the direction-control (DIR) input and the output-enable (OE) input activate either the B-port outputs or
the A-port outputs or place both output ports into the high-impedance mode. The device transmits data from the
A bus to the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port
outputs are activated. The input circuitry on both A and B ports always is active and must have a logic HIGH or
LOW level applied to prevent excess ICC and ICCZ.
All inputs and outputs have equivalent 26-Ω resistors that will slow the edges of the output and reduce switching
noise caused by long capacitive etch runs or cables.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor. The minimum value of the resistor is determined by the current-sinking capability of the driver. Inputs
can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a
mixed 3.3-V/5-V system environment.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
9.2 Functional Block Diagram
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
24
2OE
36
13
1B1
To Seven Other Channels
2B1
To Seven Other Channels
Pin numbers shown are for the DGG, DGV, and DL packages.
Figure 4. Logic Diagram (Positive Logic)
9.3 Feature Description
•
•
•
Wide operating voltage range
– Operates from 1.65 V to 3.6 V
Allows down voltage translation
– Inputs accept voltages to 5.5 V
Ioff feature
– Allows voltages on the inputs and outputs when VCC is 0 V
9.4 Device Functional Modes
Table 1. Function Table
(Each 8-Bit Section)
INPUTS
10
OPERATION
OE
DIR
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
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10 Application and Implementation
10.1 Application Information
The SN74LVCR16245A device is a 16-bit bidirectional transceiver. This device can be used as two 8-bit
transceivers or one 16-bit transceiver. It allows data transmission from the A bus to the B bus or from the B bus
to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can
be used to disable the device so that the buses are effectively isolated. The device has 5.5V tolerant inputs at
any valid VCC which allows it to be used in multi-power systems and can be used for down translation.
10.2 Typical Application
Regulated 3.6 V
OE
VCC
DIR
A1
B1
uC
System Logic
uC or
System Logic
A8
B8
LEDs
GND
Figure 5. Typical Application Diagram
10.2.1 Design Requirements
This device uses CMOS technology and has balanced output drive. Care should be taken to avoid bus
contention because it can drive currents that would exceed maximum limits. The high drive will also create fast
edges into light loads; therefore, routing and load conditions should be considered to prevent ringing.
10.2.2 Detailed Design Procedure
1. Recommended Input Conditions
– Rise time and fall time specs: See (Δt/ΔV) in Recommended Operating Conditions
– Specified high and low levels: See (VIH and VIL) in Recommended Operating Conditions
– Inputs are overvoltage tolerant allowing them to go as high as 5.5 V at any valid VCC
2. Recommend Output Conditions
– Load currents should not exceed 25 mA per output and 50 mA total for the part
– Outputs should not be pulled above VCC
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Copyright © 2003–2014, Texas Instruments Incorporated
Product Folder Links: SN74LVCR16245A
11
SN74LVCR16245A
SCES427B – FEBRUARY 2003 – REVISED JUNE 2014
www.ti.com
Typical Application (continued)
10.2.3 Application Curves
300
ICC 1.8 V
ICC 2.5 V
ICC 3.3 V
250
ICC - mA
200
150
100
50
0
0
10
20
30
40
Frequency - MHz
50
60
D004
Figure 6. ICC vs Frequency
11 Power Supply Recommendations
The power supply can be any voltage between the MIN and MAX supply voltage rating located in the
Recommended Operating Conditions table.
Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single
supply, 0.1 μf is recommended; if there are multiple VCC pins, then 0.01 μf or 0.022 μf is recommended for each
power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 μf and a
1 μf are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as
possible for best results.
12 Layout
12.1 Layout Guidelines
When using multiple-bit logic devices, inputs should never float.
In many cases, functions or parts of functions of digital logic devices are unused, for example, when only two
inputs of a triple-input AND gate are used or only 3 of the 4 buffer gates are used. Such input pins should not be
left unconnected because the undefined voltages at the outside connections result in undefined operational
states. Figure 7 specifies the rules that must be observed under all circumstances. All unused inputs of digital
logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should
be applied to any particular unused input depends on the function of the device. Generally they will be tied to
GND or VCC, whichever makes more sense or is more convenient. It is generally acceptable to float outputs,
unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the output section of the
part when asserted. This will not disable the input section of the I/Os, so they cannot float when disabled.
12.2 Layout Example
Vcc
Unused Input
Input
Output
Unused Input
Output
Input
Figure 7. Layout Diagram
12
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Copyright © 2003–2014, Texas Instruments Incorporated
Product Folder Links: SN74LVCR16245A
SN74LVCR16245A
www.ti.com
SCES427B – FEBRUARY 2003 – REVISED JUNE 2014
13 Device and Documentation Support
13.1 Trademarks
Widebus is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2003–2014, Texas Instruments Incorporated
Product Folder Links: SN74LVCR16245A
13
PACKAGE OPTION ADDENDUM
www.ti.com
27-Dec-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
74LVCR16245ADGGRG4
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVCR16245A
SN74LVCR16245ADGGR
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVCR16245A
SN74LVCR16245ADGVR
ACTIVE
TVSOP
DGV
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LDR245A
SN74LVCR16245ADLR
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LVCR16245A
SN74LVCR16245AZQLR
NRND
BGA
MICROSTAR
JUNIOR
ZQL
56
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
LDR245A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
27-Dec-2019
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.6
13.0
1.8
12.0
24.0
Q1
SN74LVCR16245ADGGR TSSOP
DGG
48
2000
330.0
24.4
SN74LVCR16245ADGVR TVSOP
DGV
48
2000
330.0
16.4
7.1
10.2
1.6
12.0
16.0
Q1
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
ZQL
56
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
SN74LVCR16245ADLR
SSOP
SN74LVCR16245AZQLR BGA MI
CROSTA
R JUNI
OR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVCR16245ADGGR
TSSOP
DGG
48
2000
367.0
367.0
45.0
SN74LVCR16245ADGVR
TVSOP
DGV
48
2000
367.0
367.0
38.0
SN74LVCR16245ADLR
SSOP
DL
48
1000
367.0
367.0
55.0
ZQL
56
1000
350.0
350.0
43.0
SN74LVCR16245AZQLR BGA MICROSTAR
JUNIOR
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OUTLINE
ZQL0056A
JRBGA - 1 mm max height
SCALE 2.100
PLASTIC BALL GRID ARRAY
4.6
4.4
B
A
BALL A1 CORNER
7.1
6.9
1 MAX
C
SEATING PLANE
0.35
TYP
0.15
BALL TYP
0.1 C
3.25 TYP
(0.625) TYP
SYMM
K
(0.575) TYP
J
H
G
5.85
TYP
SYMM
F
E
D
C
56X
NOTE 3
B
A
0.65 TYP
BALL A1 CORNER
1
2
3
4
5
0.45
0.35
0.15
0.08
C B A
C
6
0.65 TYP
4219711/B 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. No metal in this area, indicates orientation.
www.ti.com
EXAMPLE BOARD LAYOUT
ZQL0056A
JRBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
(0.65) TYP
56X ( 0.33)
2
1
3
4
5
6
A
(0.65) TYP
B
C
D
E
SYMM
F
G
H
J
K
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
0.05 MAX
METAL UNDER
SOLDER MASK
0.05 MIN
EXPOSED METAL
( 0.33)
METAL
( 0.33)
SOLDER MASK
OPENING
EXPOSED METAL
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4219711/B 01/2017
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99).
www.ti.com
EXAMPLE STENCIL DESIGN
ZQL0056A
JRBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
56X ( 0.33)
(0.65) TYP
1
2
3
4
5
6
A
(0.65) TYP
B
C
D
E
SYMM
F
G
H
J
K
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4219711/B 01/2017
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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