Texas Instruments | SN54HC132-DIE Quadruple Positive-NAND Gates with Schmitt-Trigger Inputs | Datasheet | Texas Instruments SN54HC132-DIE Quadruple Positive-NAND Gates with Schmitt-Trigger Inputs Datasheet

Texas Instruments SN54HC132-DIE Quadruple Positive-NAND Gates with Schmitt-Trigger Inputs Datasheet
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SN54HC132-DIE
SCLS750 – APRIL 2014
SN54HC132-DIE Quadruple Positive-NAND Gates with Schmitt-Trigger Inputs
1 Features
3 Description
•
•
•
•
•
The circuit functions as a NAND gate, but because of
the Schmitt action, it has different input threshold
levels for positive- and negative-going signals. The
SN54HC132-DIE performs the Boolean function
Y = A • B or Y = A + B in positive logic.
1
Wide Operating Voltage Range
Low Power Consumption
Low Input Current
Operation From Very Slow Input Transitions
High Noise Immunity
2 Applications
•
•
•
•
•
•
•
•
•
•
(1)
(2)
Cell Phones
PDAs
Portable Instrumentation
Audio and Video Signal Routing
Low-Voltage Data-Acquisition Systems
Communication Circuits
Modems
Hard Drives
Computer Peripherals
Wireless Terminals and Peripherals
This circuit is temperature compensated and can be
triggered from the slowest of input ramps and still
give clean jitter-free output signals.
Ordering Information (1)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
SN54HC132
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
SN54HC132TDG1
154
SN54HC132TDG2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN54HC132-DIE
SCLS750 – APRIL 2014
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4 Bare Die Information
2
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
TiW/ALCU2%
1210 nm
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
SN54HC132-DIE
www.ti.com
SCLS750 – APRIL 2014
Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
1A
1
179.1
568.8
279.9
669.6
1B
2
179.1
262.8
279.9
363.6
1Y
3
534.6
171.9
635.4
272.7
2A
4
821.25
175.5
922.05
276.3
2B
5
1127.25
175.5
1228.05
276.3
2Y
6
1280.7
388.8
1381.5
489.6
GND
7
1282.95
741.6
1383.75
842.4
3Y
8
1280.7
994.5
1381.5
1095.3
3A
9
1170.45
1191.6
1271.25
1292.4
3B
10
948.15
1191.6
1048.95
1292.4
4Y
11
598.95
1195.2
699.75
1296
4A
12
172.8
1191.6
273.6
1292.4
4B
13
179.1
1042.2
279.9
1143
VCC
14
179.1
762.3
279.9
863.1
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
3
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN54HC132TDG1
ACTIVE
0
100
TBD
Call TI
N / A for Pkg Type
25 Only
SN54HC132TDG2
ACTIVE
0
10
TBD
Call TI
N / A for Pkg Type
25 Only
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
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