Texas Instruments | SN74LVC1G3208 (Rev. B) | Datasheet | Texas Instruments SN74LVC1G3208 (Rev. B) Datasheet

Texas Instruments SN74LVC1G3208 (Rev. B) Datasheet
SN74LVC1G3208
www.ti.com
SCES605B – SEPTEMBER 2004 – REVISED DECEMBER 2013
Single 3-Input Positive OR-AND Gate
Check for Samples: SN74LVC1G3208
FEATURES
DESCRIPTION
•
This device is designed for 1.65-V to 5.5-V VCC
operation.
1
2
•
•
•
•
•
•
•
•
•
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•
Available in the Texas Instruments NanoStar™
and NanoFree™ Packages
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Provides Down Translation to VCC
Max tpd of 5 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at the
Input (Vhys = 250 mV Typ @ 3.3 V)
Can Be Used in Three Combinations:
– OR-AND Gate
– OR Gate
– AND Gate
Ioff Supports Live Insertion, Partial-PowerDown Mode, and Back-Drive Protection
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
A
1
6
The SN74LVC1G3208 device is a single 3-input
positive OR-AND gate. It performs the Boolean
function Y = (A + B) ● C in positive logic.
By tying one input to GND or VCC, the
SN74LVC1G3208 device offers two more functions.
When C is tied to VCC, this device performs as a 2input OR gate (Y = A + B). When A is tied to GND,
the device works as a 2-input AND gate (Y = B ● C).
This device also works as a 2-input AND gate when
B is tied to GND (Y = A ● C).
NanoStar™ and NanoFree™ package technology is
a major breakthrough in IC packaging concepts,
using the die as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.
YEP OR YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
C
A
GND
GND
2
5
VCC
B
3
4
Y
B
1
2
3
6
5
4
C
VCC
B
3
4
Y
GND
2
5
VCC
A
1
6
C
Y
See mechanical drawings for dimensions.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2013, Texas Instruments Incorporated
SN74LVC1G3208
SCES605B – SEPTEMBER 2004 – REVISED DECEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Function Table (1)
INPUTS
B
C
OUTPUT
Y
H
X
H
H
X
H
H
H
X
X
L
L
L
L
H
L
A
(1)
X = Valid H or L
Logic Diagram (Positive Logic)
A
B
1
3
4
C
Y
6
Function Selection Table
LOGIC FUNCTION
FIGURE
2-Input AND Gate
Figure 1
2-Input OR Gate
Figure 2
Y = (A + B) ● C
Figure 3
Logic Configurations
VCC
B
VCC
A
Y
C
B
1
6
2
5
3
4
C
Y
C
Y
A
1
6
2
5
3
4
C
Y
Figure 1. 2-Input AND Gate
VCC
A
B
Y
A
B
1
6
2
5
3
4
Y
Figure 2. 2-Input OR Gate
2
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SCES605B – SEPTEMBER 2004 – REVISED DECEMBER 2013
VCC
A
B
A
Y
C
B
1
6
2
5
3
4
C
Y
Figure 3. Y = (A + B) ● C
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
–0.5
6.5
V
–0.5
VCC + 0.5
(2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off state
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCC or GND
θJA
Tstg
(1)
(2)
(3)
(4)
Package thermal impedance (4)
DBV package
165
DCK package
259
YEP or YZP package
123
Storage temperature range
–65
150
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
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SN74LVC1G3208
SCES605B – SEPTEMBER 2004 – REVISED DECEMBER 2013
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Recommended Operating Conditions (1)
VCC
Supply voltage
Operating
Data retention only
High-level input voltage
MAX
5.5
1.5
VCC = 1.65 V to 1.95 V
VIH
MIN
1.65
UNIT
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 3 V to 3.6 V
V
2
VCC = 4.5 V to 5.5 V
0.7 × VCC
VCC = 1.65 V to 1.95 V
0.35 × VCC
VCC = 2.3 V to 2.7 V
0.7
VCC = 3 V to 3.6 V
0.8
VIL
Low-level input voltage
VI
Input voltage
0
5.5
V
VO
Output voltage
0
VCC
V
VCC = 4.5 V to 5.5 V
0.3 × VCC
VCC = 1.65 V
–4
VCC = 2.3 V
IOH
High-level output current
V
–8
VCC = 3 V
–16
mA
–24
VCC = 4.5 V
IOL
Low-level output current
–32
VCC = 1.65 V
4
VCC = 2.3 V
8
VCC = 3 V
16
mA
24
Δt/Δv
Input transition rise or fall rate
VCC = 4.5 V
32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V
20
VCC = 3.3 V ± 0.3 V
10
VCC = 5 V ± 0.5 V
TA
(1)
4
Operating free-air temperature
ns/V
5
–40
125
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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SCES605B – SEPTEMBER 2004 – REVISED DECEMBER 2013
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
1.65 V to
5.5 V
IOH = –100 µA
VOH
1.2
1.9
1.9
2.4
2.4
2.3
2.3
3.8
3.8
3V
TYP (1)
MAX
UNIT
V
IOH = –32 mA
4.5 V
IOL = 100 µA
1.65 V to
5.5 V
0.1
0.1
IOL = 4 mA
1.65 V
0.45
0.45
IOL = 8 mA
2.3 V
0.3
0.3
0.4
0.4
0.55
0.55
0.55
0.6
0 to 5.5 V
±5
±5
µA
3V
4.5 V
VI = 5.5 V or GND
VI or VO = 5.5 V
VI = 5.5 V or GND, IO = 0
ΔICC
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = VCC or GND
(1)
VCC – 0.1
1.2
IOL = 32 mA
ICC
VCC – 0.1
2.3 V
IOL = 24 mA
Ioff
MIN
1.65 V
IOL = 16 mA
II
–40°C to 85°C
MAX
IOH = –8 mA
IOH = –24 mA
A, B, or C
inputs
TYP (1)
IOH = –4 mA
IOH = –16 mA
VOL
–40°C to 85°C
MIN
V
0
±10
±10
µA
1.65 V to
5.5 V
10
10
µA
3 V to 5.5 V
500
500
µA
3.3 V
3.5
3.5
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
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SCES605B – SEPTEMBER 2004 – REVISED DECEMBER 2013
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Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 4)
SN74LVC1G3208
–40°C to 85°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A, B, or C
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
3.7
14
2.5
7
1.7
5
1.3
3.4
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 5)
SN74LVC1G3208
–40°C to 85°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A, B, or C
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.5
17.5
1.8
7.6
1.8
5.9
1.3
4
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF or 50 pF (unless otherwise noted) (see Figure 5)
SN74LVC1G3208
–40°C to 125°C
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A, B, or C
Y
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
VCC = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.5
17.5
1.8
7.6
1.8
5.9
1.3
4.5
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST
CONDITIONS
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
TYP
TYP
TYP
TYP
f = 10 MHz
15
15
16
17
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UNIT
pF
Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: SN74LVC1G3208
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SCES605B – SEPTEMBER 2004 – REVISED DECEMBER 2013
Parameter Measurement Information
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
15 pF
15 pF
15 pF
15 pF
1 MΩ
1 MΩ
1 MΩ
1 MΩ
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VI
VM
Input
VM
0V
VOH
VM
Output
VM
VOL
VM
0V
VLOAD/2
VM
tPZH
VOH
Output
VM
tPLZ
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPHL
VM
tPZL
tPHL
tPLH
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + V∆
VOL
tPHZ
Output
Waveform 2
S1 at GND
(see Note B)
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 4. Load Circuit and Voltage Waveforms
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Parameter Measurement Information
VLOAD
S1
RL
From Output
Under Test
CL
(see Note A)
Open
GND
RL
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUTS
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
5 V ± 0.5 V
VI
tr/tf
VCC
VCC
3V
VCC
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
VCC/2
2 × VCC
2 × VCC
6V
2 × VCC
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
VI
Timing Input
VM
0V
tw
tsu
VI
Input
VM
VM
th
VI
Data Input
VM
VM
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VI
VM
Input
VM
0V
VOH
VM
Output
VM
VOL
VM
tPLZ
VLOAD/2
VM
tPZH
VOH
Output
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPLH
tPHL
VM
tPZL
tPHL
tPLH
VI
Output
Control
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VM
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 5. Load Circuit and Voltage Waveforms
8
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SCES605B – SEPTEMBER 2004 – REVISED DECEMBER 2013
REVISION HISTORY
Changes from Revision A (June 2005) to Revision B
Page
•
Updated document to new TI data sheet format. ................................................................................................................. 1
•
Updated Features. ................................................................................................................................................................ 1
•
Removed Ordering Information table. ................................................................................................................................... 1
•
Added ESD warning. ............................................................................................................................................................ 2
•
Updated operating temperature range. ................................................................................................................................. 4
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PACKAGE OPTION ADDENDUM
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25-Sep-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
74LVC1G3208DBVRE4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CDD5, CDDR)
74LVC1G3208DBVRG4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CDD5, CDDR)
74LVC1G3208DBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CDD5, CDDR)
SN74LVC1G3208DBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CDD5, CDDR)
SN74LVC1G3208DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(CDD5, CDDR)
SN74LVC1G3208DCKR
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(DD5, DDJ, DDK, DD
R)
SN74LVC1G3208DCKT
ACTIVE
SC70
DCK
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
(DD5, DDJ, DDR)
SN74LVC1G3208YZPR
ACTIVE
DSBGA
YZP
6
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
DDN
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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25-Sep-2019
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC1G3208 :
• Automotive: SN74LVC1G3208-Q1
• Enhanced Product: SN74LVC1G3208-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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25-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
SN74LVC1G3208DBVR
SOT-23
DBV
6
3000
178.0
9.2
SN74LVC1G3208DBVR
SOT-23
DBV
6
3000
180.0
SN74LVC1G3208DBVT
SOT-23
DBV
6
250
178.0
SN74LVC1G3208DBVT
SOT-23
DBV
6
250
SN74LVC1G3208DCKR
SC70
DCK
6
SN74LVC1G3208DCKR
SC70
DCK
SN74LVC1G3208DCKT
SC70
DCK
SN74LVC1G3208DCKT
SC70
SN74LVC1G3208YZPR
DSBGA
3.3
3.23
1.55
4.0
8.0
Q3
8.4
3.23
3.17
1.37
4.0
8.0
Q3
9.2
3.3
3.23
1.55
4.0
8.0
Q3
180.0
8.4
3.23
3.17
1.37
4.0
8.0
Q3
3000
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
6
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
6
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
DCK
6
250
178.0
9.2
2.4
2.4
1.22
4.0
8.0
Q3
YZP
6
3000
178.0
9.2
1.02
1.52
0.63
4.0
8.0
Q1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVC1G3208DBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
SN74LVC1G3208DBVR
SOT-23
DBV
6
3000
202.0
201.0
28.0
SN74LVC1G3208DBVT
SOT-23
DBV
6
250
180.0
180.0
18.0
SN74LVC1G3208DBVT
SOT-23
DBV
6
250
202.0
201.0
28.0
SN74LVC1G3208DCKR
SC70
DCK
6
3000
180.0
180.0
18.0
SN74LVC1G3208DCKR
SC70
DCK
6
3000
180.0
180.0
18.0
SN74LVC1G3208DCKT
SC70
DCK
6
250
180.0
180.0
18.0
SN74LVC1G3208DCKT
SC70
DCK
6
250
180.0
180.0
18.0
SN74LVC1G3208YZPR
DSBGA
YZP
6
3000
220.0
220.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
6
2X 0.95
1.9
1.45 MAX
3.05
2.75
5
2
4
0.50
6X
0.25
0.2
C A B
3
(1.1)
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X (0.95)
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214840/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X(0.95)
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
YZP0006
DSBGA - 0.5 mm max height
SCALE 9.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.19
0.15
BALL TYP
0.05 C
0.5 TYP
C
SYMM
1
TYP
B
0.5
TYP
D: Max = 1.418 mm, Min =1.358 mm
E: Max = 0.918 mm, Min =0.858 mm
A
6X
0.015
0.25
0.21
C A
B
1
2
SYMM
4219524/A 06/2014
NanoFree Is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
TM
3. NanoFree package configuration.
www.ti.com
EXAMPLE BOARD LAYOUT
YZP0006
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
6X ( 0.225)
1
2
A
(0.5) TYP
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
( 0.225)
METAL
0.05 MAX
METAL
UNDER
MASK
0.05 MIN
( 0.225)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4219524/A 06/2014
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).
www.ti.com
EXAMPLE STENCIL DESIGN
YZP0006
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
6X ( 0.25)
(R0.05) TYP
2
1
A
(0.5)
TYP
SYMM
B
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4219524/A 06/2014
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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