Texas Instruments | SN54AHC32, SN74AHC32 (Rev. I) | Datasheet | Texas Instruments SN54AHC32, SN74AHC32 (Rev. I) Datasheet

Texas Instruments SN54AHC32, SN74AHC32 (Rev. I) Datasheet
SN54AHC32
SN74AHC32
www.ti.com
SCLS247I – OCTOBER 1995 – REVISED JUNE 2013
QUADRUPLE 2-INPUT POSITIVE-OR GATES
Check for Samples: SN54AHC32, SN74AHC32
FEATURES
1
Operating Range 2-V to 5.5-V VCC
Latch-Up Performance Exceeds 250 mA Per
JESD 17
13
3
12
4
11
5
10
6
9
7
8
1B
1Y
2A
2B
2Y
14
1B
1A
NC
VCC
4B
VCC
1
SN54AHC32 . . . FK PACKAGE
(TOP VIEW)
1Y
NC
2A
NC
2B
13 4B
2
3
12 4A
4
4Y
10 3B
9 3A
11
5
6
7
8
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3B
2Y
GND
NC
3Y
3A
2
VCC
4B
4A
4Y
3B
3A
3Y
3Y
14
1A
1
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74AHC32 . . . RGY PACKAGE
(TOP VIEW)
SN54AHC32 . . . J OR W PACKAGE
SN74AHC32 . . . D, DB, DGV, N, NS,
OR PW PACKAGE
(TOP VIEW)
1A
1B
1Y
2A
2B
2Y
GND
•
GND
•
•
NC − No internal connection
DESCRIPTION
The ’AHC32 devices are quadruple 2-input positive-OR gates. These devices perform the Boolean function Y =
A • B or Y = A + B in positive logic.
FUNCTION TABLE
(EACH GATE)
INPUTS
OUTPUT
A
B
Y
H
X
H
X
H
H
L
L
L
LOGIC DIAGRAM (POSITIVE LOGIC)
A
B
Y
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2013, Texas Instruments Incorporated
SN54AHC32
SN74AHC32
SCLS247I – OCTOBER 1995 – REVISED JUNE 2013
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
VALUE
UNIT
Supply voltage range, VCC
–0.5 to 7
V
Input voltage range, VI (2)
–0.5 to 7
V
Output voltage range, VO (2)
–0.5 to VCC + 0.5
V
Input clamp current, IIK (VI < 0)
–20
mA
Output clamp current, IOK (VO < 0 or VO > VCC)
±20
mA
Continuous output current, IO (VO = 0 to VCC)
±25
mA
Continuous current through VCC or GND
±50
mA
D package
Package thermal impedance, θJA
(3)
86
DB package (3)
96
DGV package (3)
127
N package (3)
80
NS package (3)
76
PW package (3)
113
RGY package (4)
47
Storage temperature range, Tstg
(1)
(2)
(3)
(4)
°C/W
–65 to 150
°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
The package thermal impedance is calculated in accordance with JESD 51-5
RECOMMENDED OPERATING CONDITIONS (1)
SN54AHC32
VCC
Supply voltage
VIH
High-level input voltage
SN74AHC32
MIN
MAX
2
5.5
MIN
MAX
2
5.5
VCC= 2 V
1.5
1.5
VCC= 3V
2.1
2.1
VCC= 5.5 V
3.85
UNIT
V
V
3.85
VCC= 2 V
0.5
0.5
VCC= 3 V
0.9
0.9
VIL
Low-level Input voltage
VI
Input voltage
0
5.5
0
5.5
V
VO
Output voltage
0
VCC
0
VCC
V
VCC= 5.5 V
1.65
VCC= 2 V
IOH
High-level output current
IOL
Low-level output current
Δt/Δv
Input Transition rise or fall rate
TA
Operating free-air temperature
(1)
2
1.65
–50
–50
VCC= 3.3 V ± 0.3 V
–4
–4
VCC= 5 V ± 0.5 V
–8
–8
VCC= 2 V
50
50
VCC= 3.3 V ± 0.3 V
4
4
VCC= 5 V ± 0.5 V
8
8
100
100
20
20
VCC= 3.3 V ± 0.3 V
VCC= 5 V ± 0.5 V
–55
125
V
–40
125
mA
mA
ns/V
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Submit Documentation Feedback
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: SN54AHC32 SN74AHC32
SN54AHC32
SN74AHC32
www.ti.com
SCLS247I – OCTOBER 1995 – REVISED JUNE 2013
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –50 µA
SN54AHC32
SN74AHC32
MAX
MIN
MAX
MIN
TA = –40°C TO
125°C
Recommended
MIN
TYP
2V
1.9
2
1.9
1.9
1.9
MAX
MIN
2.9
2.9
3
2.9
2.9
4.4
4.5
4.4
4.4
4.4
IOH = –4 mA
3V
2.58
2.48
2.48
2.48
IOH = –8 mA
4.5 V
3.94
VOL
ICC
VI = VCC or
GND,
Ci
VI = VCC or GND
IO = 0
V
3.8
0.1
0.1
0.1
0.1
3V
0.1
0.1
0.1
0.1
4.5 V
0.1
0.1
0.1
0.1
3V
0.36
0.5
0.44
0.5
4.5 V
0.36
0.5
0.44
0.5
±0.1
(1)
±1
±1
µA
20
20
20
µA
0 V to 5.5
V
VI = 5.5 V or GND
3.8
MAX
2V
IOH = 4 mA
IOH = 8 mA
3.8
UNIT
SN74AHC32
3V
IOL = 50 µA
(1)
TA = –40°C TO
85°C
4.5 V
VOH
II
TA = 25°C
VCC
TA = –55°C TO
125°C
5.5 V
±1
2
5V
2
10
10
V
pF
On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPLH
tPHL
(1)
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A or B
Y
CL = 15 pF
A or B
Y
CL = 50 pF
TA = 25°C
TA = –40°C TO
125°C
TA = –55°C TO
125°C
TA = –40°C TO
85°C
SN54AHC32
SN74AHC32
SN74AHC32
MIN
MIN
MIN
MAX
MAX
Recommended
TYP
MAX
5.5 (1)
7.9 (1)
1 (1)
9.5 (1)
1
9.5
1
9.5
5.5 (1)
7.9 (1)
1 (1)
9.5 (1)
1
9.5
1
9.5
8
11.4
1
13
1
13
1
13
8
11.4
1
13
1
13
1
13
UNIT
MAX
ns
ns
On products compliant to MIL-PRF-38535, this parameter is not production tested.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
tPLH
tPHL
(1)
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
A or B
Y
CL = 15 pF
A or B
Y
CL = 50 pF
TA = 25°C
TA = –55°C TO
125°C
TA = –40°C TO
85°C
SN54AHC32
SN74AHC32
MIN
MIN
MAX
MAX
TA = –40°C TO
125°C
Recommended
UNIT
SN74AHC32
TYP
MAX
3.8 (1)
5.5 (1)
1 (1)
6.5 (1)
1
6.5
MIN
1
MAX
6.5
3.8 (1)
5.5 (1)
1 (1)
6.5 (1)
1
6.5
1
6.5
5.3
7.5
1
8.5
1
8.5
1
8.5
5.3
7.5
1
8.5
1
8.5
1
8.5
ns
ns
On products compliant to MIL-PRF-38535, this parameter is not production tested.
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: SN54AHC32 SN74AHC32
Submit Documentation Feedback
3
SN54AHC32
SN74AHC32
SCLS247I – OCTOBER 1995 – REVISED JUNE 2013
www.ti.com
NOISE CHARACTERISTICS
VCC = 5 V, CL = 50 pF, TA = 25°C (1)
SN74AHC32
PARAMETER
MIN
TYP
UNIT
MAX
VOL(P)
Quiet output, maximum dynamic VOL
0.3
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
–0.3
–0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
4.7
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
(1)
V
3.5
V
1.5
V
Characteristics are for surface-mount packages only.
OPERATING CHARACTERISTICS
VCC = 5 V, TA = 25°C
PARAMETER
Cpd
4
Power dissipation capacitance
Submit Documentation Feedback
TEST CONDITIONS
No load,
f = 1 MHz
TYP
14
UNIT
pF
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: SN54AHC32 SN74AHC32
SN54AHC32
SN74AHC32
www.ti.com
SCLS247I – OCTOBER 1995 – REVISED JUNE 2013
PARAMETER MEASUREMENT INFORMATION
VCC
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
50% VCC
50% VCC
Input
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
0V
tPLH
tPHL
VOH
In-Phase
Output
50% VCC
50% VCC
VOL
tPHL
Out-of-Phase
Output
Output
Waveform 1
S1 at VCC
(see Note B)
50% VCC
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
VCC
Output
Control
VOL + 0.3 V
VOL
tPHZ
Output
Waveform 2
S1 at GND
(see Note B)
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
A.
CL includes probe and jig capacitance.
B.
Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output
control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output
control.
C.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf
≤ 3 ns.
D.
The outputs are measured one at a time with one input transition per measurement.
E.
All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: SN54AHC32 SN74AHC32
Submit Documentation Feedback
5
SN54AHC32
SN74AHC32
SCLS247I – OCTOBER 1995 – REVISED JUNE 2013
www.ti.com
REVISION HISTORY
Changes from Revision H (July 2003) to Revision I
Page
•
Changed document format from Quicksilver to DocZone. .................................................................................................... 1
•
Extended operating temperature range to 125°C ................................................................................................................. 2
6
Submit Documentation Feedback
Copyright © 1995–2013, Texas Instruments Incorporated
Product Folder Links: SN54AHC32 SN74AHC32
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9682501Q2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629682501Q2A
SNJ54AHC
32FK
5962-9682501QCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9682501QC
A
SNJ54AHC32J
5962-9682501QDA
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9682501QD
A
SNJ54AHC32W
SN74AHC32D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHC32
SN74AHC32DBR
ACTIVE
SSOP
DB
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HA32
SN74AHC32DE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHC32
SN74AHC32DGVR
ACTIVE
TVSOP
DGV
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HA32
SN74AHC32DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHC32
SN74AHC32N
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 125
SN74AHC32N
SN74AHC32NSR
ACTIVE
SO
NS
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
AHC32
SN74AHC32PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HA32
SN74AHC32PWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HA32
SN74AHC32RGYR
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
HA32
SNJ54AHC32FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629682501Q2A
SNJ54AHC
32FK
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
24-Aug-2018
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SNJ54AHC32J
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9682501QC
A
SNJ54AHC32J
SNJ54AHC32W
ACTIVE
CFP
W
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9682501QD
A
SNJ54AHC32W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
OTHER QUALIFIED VERSIONS OF SN54AHC32, SN74AHC32 :
• Catalog: SN74AHC32
• Enhanced Product: SN74AHC32-EP, SN74AHC32-EP
• Military: SN54AHC32
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74AHC32DGVR
TVSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
DGV
14
2000
330.0
12.4
6.8
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
4.0
1.6
8.0
12.0
Q1
SN74AHC32DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74AHC32NSR
SO
NS
14
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74AHC32PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74AHC32RGYR
VQFN
RGY
14
3000
330.0
12.4
3.75
3.75
1.15
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AHC32DGVR
TVSOP
DGV
14
2000
367.0
367.0
35.0
SN74AHC32DR
SOIC
D
14
2500
367.0
367.0
38.0
SN74AHC32NSR
SO
NS
14
2000
367.0
367.0
38.0
SN74AHC32PWR
TSSOP
PW
14
2000
367.0
367.0
35.0
SN74AHC32RGYR
VQFN
RGY
14
3000
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OUTLINE
J0014A
CDIP - 5.08 mm max height
SCALE 0.900
CERAMIC DUAL IN LINE PACKAGE
PIN 1 ID
(OPTIONAL)
A
4X .005 MIN
[0.13]
.015-.060 TYP
[0.38-1.52]
1
14
12X .100
[2.54]
14X .014-.026
[0.36-0.66]
14X .045-.065
[1.15-1.65]
.010 [0.25] C A B
.754-.785
[19.15-19.94]
8
7
B
.245-.283
[6.22-7.19]
.2 MAX TYP
[5.08]
C
.13 MIN TYP
[3.3]
SEATING PLANE
.308-.314
[7.83-7.97]
AT GAGE PLANE
.015 GAGE PLANE
[0.38]
0 -15
TYP
14X .008-.014
[0.2-0.36]
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
www.ti.com
EXAMPLE BOARD LAYOUT
J0014A
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
(.300 ) TYP
[7.62]
SEE DETAIL A
SEE DETAIL B
1
14
12X (.100 )
[2.54]
SYMM
14X ( .039)
[1]
8
7
SYMM
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
.002 MAX
[0.05]
ALL AROUND
(.063)
[1.6]
METAL
( .063)
[1.6]
SOLDER MASK
OPENING
METAL
(R.002 ) TYP
[0.05]
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
DETAIL A
DETAIL B
SCALE: 15X
13X, SCALE: 15X
4214771/A 05/2017
www.ti.com
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising