Texas Instruments | Rad-Tolerant Space Grade Die, Quadruple 2-Input Positive-AND Gate, SN54HC273-DIE | Datasheet | Texas Instruments Rad-Tolerant Space Grade Die, Quadruple 2-Input Positive-AND Gate, SN54HC273-DIE Datasheet

Texas Instruments Rad-Tolerant Space Grade Die, Quadruple 2-Input Positive-AND Gate, SN54HC273-DIE Datasheet
SN54HC273-DIE
www.ti.com
SCLS735 – JUNE 2013
RAD-TOLERANT SPACE GRADE DIE, QUADRUPLE 2-INPUT POSITIVE-AND GATES
Check for Samples: SN54HC273-DIE
FEATURES
1
•
•
•
•
•
•
•
•
Wide Operating Voltage Range
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption
Typical tpd = 12 ns
Low Input Current
Contain Eight Flip-Flops With Single-Rail Outputs
Direct Clear Input
Applications Include:
– Buffer/Storage Registers
– Shift Registers
– Pattern Generators
DESCRIPTION
Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the
positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not
related directly to the transition time of the positive-going pulse. When CLK is at either the high or low level, the
D input has no effect at the output.
Table 1. FUNCTION TABLE
(each flip-flop)
INPUTS
OUPUT
Q
CLR
CLK
D
L
X
X
L
H
↑
H
H
H
↑
L
L
H
L
X
Q0
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
SN54HC273V
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
SN54HC273VTDG1
100
SN54HC273VTDG2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments space production baseline and is in compliance with the Texas Instruments Quality Control
System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature
only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual
Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are
tested unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54HC273-DIE
SCLS735 – JUNE 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
2
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
TiW/AlCu2%
1210 nm
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: SN54HC273-DIE
SN54HC273-DIE
www.ti.com
SCLS735 – JUNE 2013
Table 2. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
CLR
1
124.05
606.65
214.05
696.65
1Q
2
124.05
216.95
214.05
306.95
1D
3
369.75
119.75
459.75
209.75
2D
4
562.35
132.35
652.35
222.35
2Q
5
706.35
109.85
796.35
199.85
3Q
6
1210.35
132.35
1300.35
222.35
3D
7
1375.05
132.35
1465.05
222.35
4D
8
1591.95
132.35
1681.95
222.35
4Q
9
1897.05
162.95
1987.05
252.95
GND
10
1901.55
567.95
1991.55
657.95
CLK
11
1901.55
786.65
1991.55
876.65
5Q
12
1897.05
1135.85
1987.05
1225.85
5D
13
1599.15
1264.55
1689.15
1354.55
6D
14
1351.65
1267.25
1441.65
1357.25
6Q
15
1178.85
1268.15
1268.85
1358.15
7Q
16
637.05
1268.15
727.05
1358.15
7D
17
473.25
1267.25
563.25
1357.25
8D
18
310.35
1267.25
400.35
1357.25
8Q
19
124.05
1154.75
214.05
1244.75
VCC
20
124.05
769.55
214.05
859.55
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: SN54HC273-DIE
3
PACKAGE OPTION ADDENDUM
www.ti.com
8-Sep-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN54HC273VTDG1
ACTIVE
0
100
TBD
Call TI
N / A for Pkg Type
25 to 25
SN54HC273VTDG2
ACTIVE
0
10
TBD
Call TI
N / A for Pkg Type
25 to 25
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
8-Sep-2017
OTHER QUALIFIED VERSIONS OF SN54HC273-DIE :
• Space: SN54HC273-SP
NOTE: Qualified Version Definitions:
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 2
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