Texas Instruments | SN74AVC4T234 4-Bit Dual-Supply Bus Transceiver With Config Voltage Translation (Rev. A) | Datasheet | Texas Instruments SN74AVC4T234 4-Bit Dual-Supply Bus Transceiver With Config Voltage Translation (Rev. A) Datasheet

Texas Instruments SN74AVC4T234 4-Bit Dual-Supply Bus Transceiver With Config Voltage Translation (Rev. A) Datasheet
SN74AVC4T234
SCES810A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
4-BIT DUAL-SUPPLY NON-INVERTING BUS TRANSLATOR
Check for Samples: SN74AVC4T234
FEATURES
1
•
•
•
•
•
•
•
•
•
•
•
•
•
Wide Operating VCC Range of 0.9 V to 3.6 V
3.6-V I/O Tolerant to Support Mixed-Mode
Signal Operation
Max tpd of 3.7 ns at 3.3 V
Balanced propagation delays: tPLH = tPHL
Low Static-Power Consumption, 5-μA Max ICC
Input-Disable Feature Allows Floating Input
Conditions
±3-mA Output Drive at 1.8 V
26Ω series resistor on A-side outputs
Ioff Supports Partial Power-Down-Mode
Operation
Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at Input
Maximum Data Rates
– 380 Mbps (1.8-V to 3.3-V Translation)
– 200 Mbps (<1.8-V to 3.3-V Translation)
– 200 Mbps (Translate to 2.5 V or 1.8 V)
– 150 Mbps (Translate to 1.5 V)
– 100 Mbps (Translate to 1.2 V)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 500-V Charged-Device Model (C101)
ZSU PACKAGE
(TOP VIEW)
7
6
5
4
3
2
1
A
B
C
DESCRIPTION
This 4-bit noninverting bus transceiver uses two separate configurable power-supply rails to enable
asynchronous communication between B-port inputs and A-port outputs. The A port is designed to track VCCA
while the B port is designed to track VCCB. Both VCCA and VCCB are configurable from 0.9 V to 3.6 V.
The SN74AVC4T234 solution offers the industry's low-power needs in battery-powered portable applications by
ensuring both a very low static and dynamic power consumption across the entire VCC range of 0.9 V to 3.6 V,
resulting in an increased battery life. This product also maintains excellent signal integrity.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
The VCC isolation feature ensures that if either VCC input is at GND, then A-side ports are in the high-impedance
state.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
SN74AVC4T234
SCES810A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
MicroStarCSP -ZSU
–40°C to 85°C
(1)
(2)
(3)
ORDERABLE PART NUMBER
Tape and reel
TOP-SIDE MARKING
ZTD _ _ (3)
SN74AVC4T234ZSUR
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
ZSU: The actual top-side marking has two additional characters that designate the year and month date code.
LOGIC DIAGRAM (POSITIVE LOGIC)
VCCB
VCCA
B1
A1
B2
A2
B3
A3
B4
A4
TERMINAL FUNCTIONS
TERMINAL
2
NAME
ZSU
Package
TYPE
DESCRIPTION
B1
C7
I
Data input port
B2
C5
I
Data input port
B3
C3
I
Data input port
B4
C1
I
Data input port
A1
A7
O
Data output port
A2
A5
O
Data output port
A3
A3
O
Data output port
Data output port
A4
A1
O
VCCA
B6
PWR
A-side output port power supply voltage (0.9 V to 3.6 V)
VCCB
B4
PWR
B-side input port power supply voltage (0.9 V to 3.6 V)
GND
B2
PWR
Ground
Copyright © 2011, Texas Instruments Incorporated
SN74AVC4T234
SCES810A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
–0.5
4.6
Output ports (A port)
–0.5
4.6
Input ports (B port)
–0.5
4.6
A port
–0.5
4.6
V
A port
–0.5
VCCA + 0.5
V
VCCA
Supply voltage range
VCCB
VI
Input voltage range (2)
VO
Voltage range applied to any output in the high-impedance or
power-off state (2)
(2) (3)
UNIT
V
V
VO
Voltage range applied to any output in the high or low state
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
Continuous current through VCCA, VCCB, or GND
±50
mA
θJA
Package thermal impedance
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
(4)
180.4
–65
150
ºC/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Copyright © 2011, Texas Instruments Incorporated
3
SN74AVC4T234
SCES810A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
RECOMMENDED OPERATING CONDITIONS (1)
(2) (3)
MIN
MAX
VCCA
Supply voltage
VCCI
VCCO
0.9
3.6
V
VCCB
Supply voltage
0.9
3.6
V
VCCI × 0.8
3.6
0.9 V to 1.1 V
High-level
input voltage
VIH
Low-level
input voltage
VIL
VI
Input voltage
VO
Output voltage
IOH
Data inputs (4)
Data inputs
Low-level output current
Δt/Δv
VCCI × 0.8
3.6
VCCI × 0.65
3.6
2.3 V to 2.7 V
VCCI × 0.65
3.6
3 V to 3.6 V
Input transition rise or fall rate
VCCI × 0.65
3.6
0
VCCI × 0.2
1.1 V to 1.4 V
0
VCCI × 0.2
1.1 V to 1.95 V
0
VCCI × 0.35
2.3 V to 2.7 V
0
VCCI × 0.35
3 V to 3.6 V
0
VCCI × 0.35
0
3.6
V
0
VCCO
V
0.9 V to 1.1 V
-0.1
1.1 V to 1.3 V
–1
1.4 V to 1.6 V
–2
1.65 V to 1.95 V
–3
2.3 V to 2.7 V
–6
3 V to 3.6 V
–12
0.9 V to 1.1 V
0.1
1.1 V to 1.3 V
1
1.4 V to 1.6 V
2
1.65 V to 1.95 V
3
2.3 V to 2.7 V
6
3 V to 3.6 V
12
3 V to 3.6 V
10
2.3 V to 2.7 V
20
1.65 V to 1.95 V
50
1.4 V to 1.6 V
100
1.1 V to 1.3 V
TA
(1)
(2)
(3)
(4)
4
Operating free-air temperature
V
0.9 V to 1.1 V
Active state
High-level output current
IOL
(4)
1.1 V to 1.4 V
1.4 V to 1.95 V
UNIT
V
mA
mA
ns/V
100
–40
85
°C
VCCI is the VCCB input port.
VCCO is the VCCA output port.
All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
For VCCI values not specified in the data sheet, VIH min = VCCI × 0.7 V, VIL max = VCCI × 0.3 V
Copyright © 2011, Texas Instruments Incorporated
SN74AVC4T234
SCES810A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (1)
(2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
VCCA
VCCB
MIN
TYP
MIN
0.9 V
VCCA – 0.1
1.1 V
0.88
IOH = –2 mA
1.4 V
VI = VIH
1.65 V
MAX
1.05
0.9 V to 3.6 V
IOH = –6 mA
2.3V
1.75
IOH = –12 mA
3V
2.3
IOL = 100 μA
0.9 V
0.1
IOL = 1 mA
1.1 V
0.2
IOL = 2 mA
1.4 V
VI = VIL
1.65 V
0.2
0.9 V to 3.6 V
0.25
IOL = 6 mA
2.3V
0.3
IOL = 12 mA
3V
0.55
A or B port VI or VO = 0 to 3.6 V
VCCB or GND, IO = 0
0V
0 V to 3.6 V
±0.1
±1
±5
0 V to 3.6 V
0V
±0.1
±1
±5
0 V to 3.6 V
8
0 V to 3.6 V
0V
8
0.8 V to 3.6 V 0.8 V to 3.6 V
0 V to 3.6 V
0 V to 3.6 V
0V
V
μA
8
0V
0V
UNIT
V
1.2
0.8 V to 3.6 V 0.8 V to 3.6 V
μA
8
ICCB
VCCB or GND, IO = 0
ICCA + ICCB
VCCB or GND, IO = 0
Ci
VCCB
VCCB = 3.3 V or GND
3.3 V
3.3 V
22
Cio
A or B port VCCA = 3.3 V or GND
3.3 V
3.3 V
5
(1)
(2)
MAX
IOH = –1 mA
IOL = 3 mA
ICCA
–40°C to 85°C
TA = 25°C
IOH = –100 μA
IOH = –3 mA
VOL
Ioff
TEST CONDITIONS
8
μA
8
0.8 V to 3.6 V 0.8 V to 3.6 V
16
μA
pF
7
pF
VCCO is the VCCA output port.
VCCI is the VCCB input port.
Copyright © 2011, Texas Instruments Incorporated
5
SN74AVC4T234
SCES810A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCB = 1.1 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
B
A
tPLH
tPHL
VCCA = 1.1 V
VCCA = 1.4 V
VCCA = 1.65
V
VCCA = 2.3 V
VCCA = 3 V
TYP
TYP
TYP
TYP
TYP
5.5
4.6
4.2
3.7
3.9
4.7
3.9
3.4
3
3.1
UNIT
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCB = 1.4 V (see Figure 1)
PARAMETER
tPLH
tPHL
6
FROM
(INPUT)
TO
(OUTPUT)
B
A
VCCA = 1.1 V
VCCA = 1.4 V
VCCA = 1.65 V
VCCA = 2.3 V
VCCA = 3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
4.7
2.0
5
1.5
3.8
1.2
3.8
1.0
3.8
4.2
2.0
5
1.5
3.9
1.2
3
1.0
3.0
UNIT
ns
Copyright © 2011, Texas Instruments Incorporated
SN74AVC4T234
SCES810A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCB = 1.65 V (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
B
A
tPLH
tPHL
VCCA = 1.1 V
VCCA = 1.4 V
VCCA = 1.65 V
VCCA = 2.3 V
VCCA = 3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
4.3
2.0
4.2
1.5
4.1
1.2
3.8
1.0
3.7
2.6
2.0
4.2
1.5
4.1
1.2
3.8
1.0
3.7
UNIT
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCB = 2.3 V (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
B
A
tPLH
tPHL
VCCA = 1.1 V
VCCA = 1.4 V
VCCA = 1.65 V
VCCA = 2.3 V
VCCA = 3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
2.7
2.0
3.5
1.5
3.1
1.2
2.8
0.2
4.1
2.4
2.0
3.7
1.5
3.7
1.2
2.8
0.2
3.5
UNIT
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCB = 3 V (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
B
A
tPLH
tPHL
VCCA = 1.1 V
VCCA = 1.4 V
VCCA = 1.65 V
VCCA = 2.3 V
VCCA = 3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
3.9
2.0
3.8
1.5
3.6
0.5
3.6
0.2
3.6
3.9
2.0
3.7
1.5
3.1
0.5
3.5
0.2
3.0
UNIT
ns
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
CpdA
(1)
(1)
B to A
Outputs
enabled
TEST
CONDITIONS
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
VCCA =
VCCB = 1.1 V
VCCA =
VCCB = 1.4 V
VCCA =
VCCB = 1.65 V
VCCA =
VCCB = 2.3 V
VCCA =
VCCB = 3 V
TYP
TYP
TYP
TYP
TYP
18.5
18.5
18.5
18.5
18.5
UNIT
pF
Power dissipation capacitance per transceiver
Copyright © 2011, Texas Instruments Incorporated
7
SN74AVC4T234
SCES810A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
2 × VCCO
From Output
Under Test
CL
(see Note A)
S1
RL
TEST
S1
t pd
Open
Open
GND
RL
LOAD CIRCUIT
VCCO
CL
RL
VTP
1.2 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
30 pF
30 pF
30 pF
30 pF
30 pF
0.5 kW
0.5 kW
0.5 kW
0.5 kW
0.5 kW
0.1 V
0.1 V
0.15 V
0.15 V
0.3 V
VCCI
Input
VCCI/2
VCCI/2
0V
t PLH
Output
t PHL
VCCO/2
VOH
VCCO/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A.
B.
C.
D.
E.
F.
CL includes probe and jig capacitance.
All input pulses are supplied by generators having the following characteristics: PRR £ 10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
The outputs are measured one at a time, with one transition per measurement.
tPLH and tPHL are the same as tpd.
VCCI is VCCB.
VCCO is VCCA.
Figure 1. Load and Circuit and Voltage Waveforms
8
Copyright © 2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
SN74AVC4T234ZSUR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
uCSP
ZSU
11
2500
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
SN98.5/AG1/CU0.5
Level-2-260C-1 YEAR
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
ZTD
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74AVC4T234ZSUR
Package Package Pins
Type Drawing
uCSP
ZSU
11
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
8.4
Pack Materials-Page 1
1.6
B0
(mm)
K0
(mm)
P1
(mm)
2.2
0.55
4.0
W
Pin1
(mm) Quadrant
8.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AVC4T234ZSUR
uCSP
ZSU
11
2500
338.1
338.1
20.6
Pack Materials-Page 2
PACKAGE OUTLINE
ZSU0011A
MicroStar CSP
TM
- 0.45 mm max height
SCALE 8.000
MICRO CHIP SCALE PACKAGE
A
2.1
1.9
B
BALL A1
CORNER
1.5
1.3
C
0.45 MAX
SEATING PLANE
0.05
0.00
0.08 C
BUMP TYP
1.5 TYP
0.5 TYP
C
0.866
TYP
SYMM
B
0.433
TYP
0.5 TYP
A
1
11X
0.1
0.05
0.3
0.2
2
3
5
4
6
7
SYMM
C A B
C
4220297/B 07/2016
MicroStar CSP is a trademark of Texas Istruments
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
ZSU0011A
MicroStar CSP
TM
- 0.45 mm max height
MICRO CHIP SCALE PACKAGE
(0.5) TYP
11X ( 0.25)
1
4
2 3
5
6
7
A
(0.866)
TYP
(0.433)
TYP
SYMM
B
C
(0.5) TYP
SYMM
LAND PATTERN EXAMPLE
SCALE:25X
( 0.25)
METAL
0.05 MAX
METAL UNDER
SOLDER MASK
0.05 MIN
( 0.25)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4220297/B 07/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
ZSU0011A
MicroStar CSP
TM
- 0.45 mm max height
MICRO CHIP SCALE PACKAGE
(0.5)
TYP
11X ( 0.25)
(R0.05) TYP
1
2
3
4
5
6
7
A
(0.866)
TYP
SYMM
B
(0.433)
TYP
C
METAL
TYP
SYMM
(0.5) TYP
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4220297/B 07/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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