Texas Instruments | A Inter Chip-USB VOLTAGE LEVEL TRANSLATOR (Rev. A) | Datasheet | Texas Instruments A Inter Chip-USB VOLTAGE LEVEL TRANSLATOR (Rev. A) Datasheet

Texas Instruments A Inter Chip-USB VOLTAGE LEVEL TRANSLATOR (Rev. A) Datasheet
TXS0202
SCES711A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
A Inter Chip-USB Voltage Level Translator
Check for Samples: TXS0202
FEATURES
1
•
•
•
1
No Direction Control Signal Required
VCCA, VCCB Supply Voltage: 1.65 V to 3.6 V
Meets All Requirements of the IC-USB
Standard
Small Packages: WCSP
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Ioff Supports Partial-Power-Down Mode
Operation
ESD Performance
– A port (Host-Side)
– 2000-V Human-Body Model
– 100-V Machine Model
– 500-V Charged-Device Model
– B port (Peripheral-Side)
– >4kV HBM
•
•
•
•
2
A
B
C
D
Table 1. YZP TERMINAL ASSIGNMENTS
(Top Through View)
1
2
A
D+(B)
D–(B)
B
GND
VCCB
C
VCCA
OE
D
D+(A)
D–(A)
DESCRIPTION
The TXS0202 is a 2-bit voltage level translator optimized for use in Interchip USB (IC-USB) applications. VCCA
and VCCB can each operate over the full range of 1.65 V to 3.6 V. The device has been designed to maintain
cross-over skew to be less than 1 ns. The device has integrated pull-ups and pull-down resistors to aid in the
protocol communication between a host and a peripheral. The translator is a buffered auto-direction sensing type
translator. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down. To ensure the
high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor;
the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION (1)
TA
–40°C to 85°C
(1)
(2)
(3)
PACKAGE
WSCP – YZP
(2)
Tape and reel
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TXS0202YZPR
_ _ _ 7PS _ (3)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TXS0202
SCES711A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
TYPICAL APPLICATION BLOCK DIAGRAM
1.8 V
3V
D+
Application
Processor
D–
VCCA
VCCB
D+(A)
D+(B)
D–(A)
D–(B)
OE
D+
D–
MM SIM Card
GND
TXS0202
PIN FUNCTIONS
PIN
DESCRIPTION
WSCP (YFP)
BALL NO.
NAME
A1
D+(B)
USB data signal connected to peripheral
A2
D–(B)
USB data signal connected to peripheral
B1
GND
Ground
B2
VCCB
B-side supply voltage (1.65 V to 3.6 V)
C1
VCCA
A-side supply voltage (1.65 V to 3.6 V)
C2
OE
D1
D+(A)
USB data signal connected to host
D2
D–(A)
USB data signal connected to host
Output enable input control
FUNCTIONAL TABLE
2
CONTROL INPUT
OUTPUT CIRCUIT
OE
B PORT
L
Hi-Z
H
Enabled
OPERATION
Isolation
Bi-directional communications between host and peripheral
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TXS0202
TXS0202
SCES711A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
–0.5
4.6
V
VCCA
VCCB
Supply voltage rang
VI
Input voltage range
A port, B port, control inputs
–0.5
VCCx + 0.5
V
VO
Voltage range applied to any output
in the high-impedance or power-off state
A port, B port
–0.5
VCCx + 0.5
V
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
ICC
IGND
Continuous current through VCCA, VCCB, or GND
±100
mA
Tstg
Storage temperature range
150
°C
(1)
–65
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
TXS0202
THERMAL METRIC (1)
YZP
UNITS
8 PINS
θJA
(1)
Junction-to-ambient thermal resistance
°C/W
102
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
VCCA, VCCB
Supply voltage
A port I/Os
VIH
High-level input voltage
Low-level input voltage
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
MAX
3.6
VCCA – 0.2
VCCA
VCCB – 0.2
VCCB
VCCA × 0.65
3.6
A port I/Os
0
0.15
B port I/Os
0
0.15
OE
0
VCCA × 0.35
B port I/Os
OE
VIL
MIN
1.65
–40
Product Folder Link(s): TXS0202
V
V
V
10
ns/V
85
°C
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Copyright © 2011, Texas Instruments Incorporated
UNIT
3
TXS0202
SCES711A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
D+
150K
150K
150K
150K
Peripheral
D-
Host
D+
150K
150K
150K
150K
150K
150K
150K
Host
3K
600K
D-
Peripheral
150K
150K
600K
L
Host
150K
150K
600K
600K
D150K
150K
High-Z
3K
Peripheral
150K
150K
150K
2. Attach Mode
1. Power Up
D+
3K
150K
D+
150K
3K/600K
Host
600K
3K/600K
D-
Peripheral
High-Z
3. Acknowledge Mode
150K
4. Ready Mode
Figure 1. Block Diagram Showing Different Modes in the TXS0202
4
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TXS0202
TXS0202
SCES711A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
PARAMETER
VOH(D–) (D– A or B port)
VOL(D–) (D– A or B port)
TEST CONDITIONS
VOL(D+) (D– A or B port)
VCCBx
TA = –40°C to 85°C
MIN MAX
1.65 V
VCCO × 0.67
2.3 V
2.3 V
VCCO × 0.67
3.3 V
3.3 V
VCCO × 0.67
IOL = 220 μA, VIx ≤ 0.15 V
1.65 V
1.65 V
0.45
IOL = 180 μA, VIx ≤ 0.15 V
2.3 V
2.3 V
0.55
3.3 V
3.3 V
1.65 V
IOH = –20 μA,
VIx ≥ VCCx – 0.2 V
VCCO × 0.67
2.3 V
2.3 V
VCCO × 0.67
3.3 V
3.3 V
VCCO × 0.67
IOL = 220 μA, VIx ≤ 0.15 V
1.65 V
1.65 V
0.45
IOL = 300 μA, VIx ≤ 0.15 V
2.3 V
2.3 V
0.55
IOL = 620 μA, VIx ≤ 0.15 V
3.3 V
3.3 V
0.7
D–/D+ A or B port, OE =
OPEN
1.65 V to 3.6 V
1.65 V to 3.6 V
IBOFF, D+, D– B port
1.65 V to 3.6 V
0V
0V
1.65 V to 3.6 V
1.65 V to 3.6 V
1.65 V to 3.6 V
VI = VO = Open,
OE = High
V
±2
±2
±2
±2
12
3.6 V
0V
2.3
12
0V
3.6 V
0.026
–1
1.65 V to 3.6 V
2.7
24
3.6 V
0V
0.031
–12
0V
3.6 V
2.7
24
Ci
OE
3.6 V
3.6 V
2.5
3.5
7
7.5
9.5
10
3.6 V
3.6 V
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TXS0202
μA
±2
2.2
1.65 V to 3.6 V
B port
V
±2
VI = VO = Open,
OE = High
Cio
V
0.7
ICCB
A port
UNIT
V
1.65 V
IAOFF, D+, D– A port
ICCA
TYP
1.65 V
OE
II
TA = 25°C
IOH = –20 μA,
VIx ≥ VCCx – 0.2 V
IOL = 220 μA, VIx ≤ 0.15 V
VOH(D+) (D+ A or B port)
VCCA
μA
μA
pF
pF
5
TXS0202
SCES711A – JUNE 2011 – REVISED JUNE 2011
www.ti.com
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
FROM
(INPUT)
TO
(OUTPUT)
VCCB = 1.8 V ± 0.15 V
VCCB = 3.3 V ± 0.3 V
TYP
TYP
A
B
5
5
B
A
5
5
A port rise times
2
2
ns
tfA
A port fall times
2
2
ns
trB
B port rise times
2
2
ns
tfB
B port fall times
2
2
ns
Channel-to-channel
0.5
0.5
ns
15
15
Mbps
PARAMETER
tpd
trA
tsk(o)
Max data rate
UNIT
ns
PARAMETER MEASUREMENT INFORMATION
VCCI
VCCI
VCCO
Input
VCCI/2
VCCI/2
0V
DUT
IN
t PLH
t PHL
OUT
18 pF
Output
VCCO/2
0.9
VCCO
0.1
VCCO
tr
DATA RATE, SKEW, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT
VOH
VCCO/2
VOL
tf
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A. CL includes probe and jig capacitance.
B. The outputs are measured one at a time, with one transition per measurement.
C. tPLH and tPHL are the same as tpd.
6
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Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s): TXS0202
PACKAGE OPTION ADDENDUM
www.ti.com
20-May-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
TXS0202YZPR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
DSBGA
YZP
8
3000
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
SNAGCU
Level-1-260C-UNLIM
(4/5)
-40 to 85
7P
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Jun-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TXS0202YZPR
Package Package Pins
Type Drawing
SPQ
DSBGA
3000
YZP
8
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
180.0
8.4
Pack Materials-Page 1
1.02
B0
(mm)
K0
(mm)
P1
(mm)
2.02
0.63
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Jun-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXS0202YZPR
DSBGA
YZP
8
3000
182.0
182.0
20.0
Pack Materials-Page 2
PACKAGE OUTLINE
YZP0008
DSBGA - 0.5 mm max height
SCALE 8.000
DIE SIZE BALL GRID ARRAY
B
A
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.19
0.15
0.05 C
BALL TYP
0.5 TYP
D
C
SYMM
1.5
TYP
0.5
TYP
8X
0.015
D: Max = 1.918 mm, Min =1.858 mm
B
0.25
0.21
C A B
E: Max = 0.918 mm, Min =0.858 mm
A
1
2
SYMM
4223082/A 07/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YZP0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.23)
2
1
A
(0.5) TYP
B
SYMM
C
D
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
SOLDER MASK
OPENING
0.05 MAX
( 0.23)
SOLDER MASK
OPENING
0.05 MIN
( 0.23)
METAL
METAL UNDER
SOLDER MASK
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4223082/A 07/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YZP0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.25)
(R0.05) TYP
1
2
A
(0.5)
TYP
B
SYMM
C
METAL
TYP
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4223082/A 07/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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