Texas Instruments | SN74AUC14 Hex Schmitt-Trigger Inverter (Rev. A) | Datasheet | Texas Instruments SN74AUC14 Hex Schmitt-Trigger Inverter (Rev. A) Datasheet

Texas Instruments SN74AUC14 Hex Schmitt-Trigger Inverter (Rev. A) Datasheet
SN74AUC14
www.ti.com
SCES473A – AUGUST 2003 – REVISED MAY 2010
HEX SCHMITT-TRIGGER INVERTER
Check for Samples: SN74AUC14
FEATURES
1
•
VCC
1
14
2
13 6A
3
4
12 6Y
5
6
10 5Y
11 5A
9 4A
7
8
4Y
•
•
•
•
•
1Y
2A
2Y
3A
3Y
1A
•
RGY PACKAGE
(TOP VIEW)
Optimized for 1.8-V Operation and Is 3.6-V I/O
Tolerant to Support Mixed-Mode Signal
Operation
Ioff Supports Partial-Power-Down Mode
Operation
Sub-1-V Operable
Max tpd of 2 ns at 1.8 V
Low Power Consumption, 10-mA Max ICC
±8-mA Output Drive at 1.8 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
GND
•
DESCRIPTION/ORDERING INFORMATION
This hex Schmitt-trigger inverter is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to
1.95-V VCC operation.
The SN74AUC14 contains six independent inverters and performs the Boolean function Y = A. The device
functions as six independent inverters, but because of Schmitt action, it may have different input threshold levels
for positive-going (VT+) and negative-going (VT–) signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 85°C
(1)
(2)
QFN – RGY
ORDERABLE PART NUMBER
Tape and reel
SN74AUC14RGYR
TOP-SIDE MARKING
MS14
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
OUTPUT
Y
H
L
L
H
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2010, Texas Instruments Incorporated
SN74AUC14
SCES473A – AUGUST 2003 – REVISED MAY 2010
www.ti.com
LOGIC DIAGRAM, EACH INVERTER
(POSITIVE LOGIC)
A
Y
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
MIN
MAX
Supply voltage range
–0.5
3.6
UNIT
V
(2)
VI
Input voltage range
–0.5
3.6
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
3.6
V
VO
Output voltage range (2)
–0.5
VCC + 0.5
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±20
mA
±100
mA
Continuous current through VCC or GND
qJA
Package thermal impedance
Tstg
Storage temperature range
(1)
(2)
(3)
(3)
–65
V
47
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-5.
Recommended Operating Conditions (1)
VCC
Supply voltage
VI
Input voltage
VO
Output voltage
IOH
IOL
High-level output current
Low-level output current
MIN
MAX
0.8
2.7
V
0
3.6
V
0
VCC
V
VCC = 0.8 V
–0.7
VCC = 1.1 V
–3
VCC = 1.4 V
–5
VCC = 1.65 V
–8
VCC = 2.3 V
–9
VCC = 0.8 V
0.7
VCC = 1.1 V
3
VCC = 1.4 V
5
VCC = 1.65 V
8
VCC = 2.3 V
TA
(1)
2
Operating free-air temperature
UNIT
mA
mA
9
–40
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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Copyright © 2003–2010, Texas Instruments Incorporated
Product Folder Link(s): SN74AUC14
SN74AUC14
www.ti.com
SCES473A – AUGUST 2003 – REVISED MAY 2010
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VT+
TEST CONDITIONS
Positive-going input threshold voltage
VCC
MIN TYP (1)
0.8 V
0.5
1.1 V
0.51
0.86
1.4 V
0.65
1
1.65 V
0.79
1.16
2.3 V
1.11
0.8 V
VT–
Negative-going input threshold voltage
VOH
VOL
Hysteresis (VT+ – VT–)
High-level output voltage
Low-level output voltage
1.1 V
0.22
0.53
1.4 V
0.3
0.58
1.65 V
0.39
0.62
2.3 V
0.58
V
0.87
0.21
1.1 V
0.25
0.38
1.4 V
0.31
0.5
1.65 V
0.37
0.62
2.3 V
0.48
0.77
0.8 V to 2.7 V
IOH = –0.7 mA
0.8 V
IOH = –3 mA
1.1 V
0.8
IOH = –5 mA
1.4 V
1
IOH = –8 mA
1.65 V
1.2
IOH = –9 mA
2.3 V
1.8
IOL = 100 mA
0.8 V to 2.7 V
IOL = 0.7 mA
0.8 V
IOL = 3 mA
1.1 V
0.3
IOL = 5 mA
1.4 V
0.4
IOL = 8 mA
1.65 V
0.45
2.3 V
0.6
V
VCC – 0.1
0.55
V
0.2
0.25
V
VI = VCC or GND
0 to 2.7 V
±5
mA
Ioff
VI or VO = 2.7 V
0
±10
mA
ICC
VI = VCC or GND,
10
mA
Ci
VI = VCC or GND
(1)
A inputs
V
1.56
IOH = –100 mA
IOL = 9 mA
II
UNIT
0.3
0.8 V
ΔVT
MAX
IO = 0
0.8 V to 2.7 V
2.5 V
2.5
pF
All typical values are at TA = 25°C.
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Copyright © 2003–2010, Texas Instruments Incorporated
Product Folder Link(s): SN74AUC14
3
SN74AUC14
SCES473A – AUGUST 2003 – REVISED MAY 2010
www.ti.com
Switching Characteristics
over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1)
PARAMETER
VCC = 1.2 V
± 0.1 V
FROM
(INPUT)
TO
(OUTPUT)
VCC = 0.8 V
TYP
MIN
MAX
A
Y
8.8
1.2
5.7
tpd
VCC = 1.5 V
± 0.1 V
VCC = 1.8 V
± 0.15 V
MIN MAX
0.7
MIN
3.9
0.6
VCC = 2.5 V
± 0.2 V
TYP MAX
1.2
UNIT
MIN MAX
3
0.5
1.8
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A
Y
tpd
VCC = 1.8 V
± 0.15 V
VCC = 2.5 V
± 0.2 V
UNIT
MIN
TYP
MAX
MIN
MAX
0.7
1.7
3.5
0.7
2.7
ns
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
4
Power dissipation
capacitance
TEST
CONDITIONS
VCC = 0.8 V
VCC = 1.2 V
VCC = 1.5 V
VCC = 1.8 V
VCC = 2.5 V
TYP
TYP
TYP
TYP
TYP
f = 10 MHz
17
18
19
20
22
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UNIT
pF
Copyright © 2003–2010, Texas Instruments Incorporated
Product Folder Link(s): SN74AUC14
SN74AUC14
www.ti.com
SCES473A – AUGUST 2003 – REVISED MAY 2010
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
RL
LOAD CIRCUIT
VCC
CL
RL
V∆
0.8 V
1.2 V ± 0.1 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
15 pF
15 pF
15 pF
15 pF
15 pF
30 pF
30 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
2 kΩ
1 kΩ
500 Ω
0.1 V
0.1 V
0.1 V
0.15 V
0.15 V
0.15 V
0.15 V
VCC
Timing Input
VCC/2
0V
tw
tsu
th
VCC
VCC/2
Input
VCC/2
VCC
VCC/2
VCC/2
Data Input
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
VCC/2
Input
VCC/2
0V
tPHL
tPLH
VOH
VCC/2
Output
VCC/2
VOL
tPHL
VCC/2
VCC/2
tPZL
tPLZ
VCC
VCC/2
tPZH
VCC/2
VOL
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
VOH
Output
VCC
Output
Control
VOL
tPHZ
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + V∆
VCC/2
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, slew rate ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
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Copyright © 2003–2010, Texas Instruments Incorporated
Product Folder Link(s): SN74AUC14
5
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
SN74AUC14RGYR
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MS14
SN74AUC14RGYRG4
ACTIVE
VQFN
RGY
14
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
MS14
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74AUC14RGYR
Package Package Pins
Type Drawing
VQFN
RGY
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
330.0
12.4
Pack Materials-Page 1
3.75
B0
(mm)
K0
(mm)
P1
(mm)
3.75
1.15
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AUC14RGYR
VQFN
RGY
14
3000
367.0
367.0
35.0
Pack Materials-Page 2
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