Texas Instruments | TXS0206 MMC, SD Card, Memory Stick(TM) Voltage-Translation Transceiver (Rev. C) | Datasheet | Texas Instruments TXS0206 MMC, SD Card, Memory Stick(TM) Voltage-Translation Transceiver (Rev. C) Datasheet

Texas Instruments TXS0206 MMC, SD Card, Memory Stick(TM) Voltage-Translation Transceiver (Rev. C) Datasheet
TXS0206
www.ti.com
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
WITH ESD PROTECTION AND EMI FILTERING
Check for Samples: TXS0206
FEATURES
1
•
2
•
•
•
Level Translator
– VCCA and VCCB Range of 1.1 V to 3.6 V
– Fast Propagation Delay (4 ns Max When
Translating Between 1.8 V and 3 V)
Integrated EMI Filtering and ESD Protection
Circuitry
ESD Protection Exceeds JESD 22 (A Port)
– 2500-V Human-Body Model (A114-B)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
±8-kV Contact Discharge IEC 61000-4-2 ESD
(B-port)
YFP PACKAGE
(TOP VIEW)
1 2 3 4
A
B
C
D
E
TERMINAL ASSIGNMENTS
1
2
3
4
A
DAT2A
VCCA
WP
DAT2B
B
DAT3A
CD
VCCB
DAT3B
C
CMDA
GND
GND
CMDB
D
DAT0A
CLKA
CLKB
DAT0B
E
DAT1A
CLK-f
EN
DAT1B
DESCRIPTION/ORDERING INFORMATION
The TXS0206 is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD)
cards, and Memory Stick™ cards. It includes a high-speed level translator along with ESD protection and EMI
filtering circuitry.
The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full
range of 1.1 V to 3.6 V. The TXS0206 enables system designers to easily interface applications processors or
digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.
Memory card standards recommend high-ESD protection for devices that connect directly to the external memory
card. To meet this need, the TXS0206 incorporates ±8-kV Contact Discharge protection on the card side.
The TXS0206 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of
1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used
in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static
power consumption and small package size make the TXS0206 an ideal choice for these applications.
ORDERING INFORMATION (1)
TA
–40°C to 85°C
(1)
(2)
(3)
PACKAGE (2)
WCSP – YFP (Pb-free)
Tape and reel
ORDERABLE PART NUMBER
TXS0206YFPR
TOP-SIDE MARKING (3)
_ _ _3T_
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated
TXS0206
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
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REFERENCE DESIGN
VCCA
VCCB
C3
0.1 µF
U1A
VCCB
C4
0.1 µF
C1
0.1 µF
J1
U2
VDDA
DAT0
DAT1
DAT2
DAT3
CMD
CLK
CLKin
GND
WP
A2
D1
E1
A1
B1
C1
D2
E2
C2
C3
VCCA
VCCB
DAT0A
DAT1A
DAT2A
DAT3A
CMDA
CLKA
CLK-f
B3
D4 DAT0B
DAT0B
DAT1B E4 DAT1B
DAT2B A4 DAT2B
DAT3B B4 DAT3B
C4 CMDB
CMDB
D3 CLKB
CLKB
GND
A3 WP
WP
B2 CD
CD
GND
CD
Processor
SD/SDIO MMC
DAT2B
DAT3B
CMDB
CLKB
DAT0B
DAT1B
CD
WP
0
1
2
3
4
5
6
7
8
9
10
11
12
13
DAT2
DAT3
CMD
VSS1
VDD
CLK
VSS2
DAT0
DAT1
WP/CD (Physical)
CD (Physical)
GND
GND
WP (Physical)
54794-0978
SD/SDIO Card
Connector
TXS0206
Figure 1. Interfacing With SD/SDIO Card
2
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SCES697C – AUGUST 2009 – REVISED JANUARY 2010
VCCA
VCCB
C3
0.1 µF
U1A
VCCB
C4
0.1 µF
C1
0.1 µF
U2
VDDA
DAT0
DAT1
DAT2
DAT3
CMD
CLK
CLKin
GND
A2
D1
E1
A1
B1
C1
D2
E2
C2
C3
VCCA
VCCB
DAT0A
CMDB
2
DAT1B
3
E4 DAT1B
DAT1B
A4 DAT2B
DAT2B
B4 DAT3B
DAT3B
DAT0B
4
DAT2B
5
CD
6
C4 CMDB
CMDB
D3 CLKB
CLKB
DAT3B
7
CLKB
8
DAT0B
DAT3A
CMDA
CLKA
CLK-f
GND
9
GND
CD
CD
Memory Stick™
Controller
D4 DAT0B
DAT1A
DAT2A
1
B3
B2 CD
10
TXS0206
VSS
BS
DATA1 (see Note)
DATA0/SDIO (see Note)
DATA2 (see Note)
INS
DATA3 (see Note)
SCLK
VCC
VSS
Memory Stick™
Connector
NOTE: The TXS0206 has integrated pullup resistor values that dynamically change value depending on whether a low or
high signal is being transmitted through the device. When the output is low, the TXS0206 internal pullup value is
40 kΩ, and when the output is high, the internal pullup value change to a value of 4 kΩ. For MSA and MSH Memory
Stick™ memory cards, to ensure that a valid VIH (i.e., receiver input voltage high) is achieved, the internal pulldown
resistors for these memory cards are not smaller than a 10-kΩ value. See the Application Information section of this
data sheet, which explains the impact of adding too heavy (i.e., <10-kΩ value) of a pulldown resistor to the data lines
of the TXS0206 device and the resulting 4-kΩ pullup/10-kΩ pulldown voltage divider network, which has a direct
impact on the VIH of the signal being sent into the Memory Stick™.
Figure 2. Interfacing With Memory Stick™ Card
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TXS0206
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
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ESD – ±8-kV Contact Discharge
ESD – 2 kV
1.8 V
A Side
B Side
2.9 V
CLK
CLK
Feedback CLK
CMD
CMD
Data 0–3
CPU
Data 0–3
Level-Shifter
Integrated
ASIP
Antenna
Pins 10, 11
EN
WP, CD
MMC, SD Card,
or MS Card
WP, CD 1.8-V Pullup
WP, CD
Integrated Pullup/Pulldown Resistors
Figure 3. Typical Application Circuit
LOGIC TABLE
4
EN
TRANSLATOR I/Os
L
Disabled, pulled to VCCA, VCCB through 40 kΩ
H
Active
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SCES697C – AUGUST 2009 – REVISED JANUARY 2010
TERMINAL FUNCTIONS
TERMINAL
TYPE
DESCRIPTION
NO.
NAME
A1
DAT2A
I/O
Data bit 2 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA.
A2
VCCA
Pwr
A-port supply voltage. VCCA powers all A-port I/Os and control inputs.
A3
WP
O
Connected to write protect on the mechanical connector. The WP pin has an internal 100-kΩ pullup
resistor to VCCA.
A4
DAT2B
I/O
Data bit 2 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB.
B1
DAT3A
I/O
Data bit 3 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA.
B2
CD
O
Connected to card detect on the mechanical connector. The CD pin has an internal 100-kΩ pullup resistor
to VCCA.
B3
VCCB
Pwr
B-port supply voltage. VCCB powers all B-port I/Os.
B4
DAT3B
I/O
Data bit 3 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB.
C1
CMDA
I/O
Command bit connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA.
C2, C3
GND
Ground
C4
CMDB
I/O
Command bit connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB.
D1
DAT0A
I/O
Data bit 0 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA.
D2
CLKA
I
Clock signal connected to host. Referenced to VCCA.
D3
CLKB
O
Clock signal connected to memory card. Referenced to VCCB.
D4
DAT0B
I/O
Data bit 0 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB.
E1
DAT1A
I/O
Data bit 1 connected to host. Referenced to VCCA. Includes a 40-kΩ pullup resistor to VCCA.
E2
CLK-f
O
Clock feedback to host for resynchronizing data to a processor. Leave unconnected if not used.
E3
EN
I
Enable/disable control. Pull EN low to place all outputs in Hi-Z state. Referenced to VCCA.
E4
DAT1B
I/O
Data bit 1 connected to memory card. Referenced to VCCB. Includes a 40-kΩ pullup resistor to VCCB.
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TXS0206
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
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VCCA
VCCB
EN
CLKA
CLKB
CLK-f
VCCA
VCCB
One-Shot
R1
R2
Translator
One-Shot
CMDA
CMDB
Gate Control
One-Shot
Translator
One-Shot
VCCA
VCCB
One-Shot
R1
R2
Translator
One-Shot
DAT0A
DAT0B
Gate Control
One-Shot
Translator
One-Shot
VCCA
VCCB
One-Shot
R1
R2
Translator
One-Shot
DAT1A
DAT1B
Gate Control
One-Shot
Translator
One-Shot
VCCA
VCCB
One-Shot
R1
R2
Translator
One-Shot
DAT2A
DAT2B
Gate Control
One-Shot
Translator
One-Shot
VCCA
VCCB
One-Shot
R1
R2
Translator
One-Shot
DAT3A
DAT3B
Gate Control
One-Shot
Translator
One-Shot
VCCA
100 kW
WP
100 kW
CD
Figure 4. Logic Diagram
6
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SCES697C – AUGUST 2009 – REVISED JANUARY 2010
VCCB
R7
R8
R9
R10 R11
HOST
CARD
R1
CLKB
CLK
R2
CMD
CMDB
R3
Data0
DAT0B
R4
DAT1B
Data1
R5
DAT2B
Data2
R6
Data3
DAT3B
GND
GND
RESISTORS
BIDIRECTIONAL ZENER DIODES
R1, R2, R3, R4, R5, R6
40 Ω
Vbr min
14 V at 1 mA
Tolerance
±20%
Line capacitance
<20 pF
R7, R8, R9, R10, R11
40 kΩ
Tolerance
±30%
Figure 5. ASIP Block Diagram
VCCA
RCD
RWP
WP
CD
RESISTORS
RWP, RCD
100 kΩ
Tolerance
±30%
Figure 6. WP, CD Pullup Resistors
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TXS0206
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ABSOLUTE MAXIMUM RATINGS (1)
Level Translator
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCCA
Supply voltage range
–0.5
4.6
V
VCCB
Supply voltage range
–0.5
4.6
V
I/O ports (A port)
–0.5
4.6
I/O ports (B port)
–0.5
4.6
Control inputs
–0.5
4.6
A port
–0.5
4.6
B port
–0.5
4.6
A port
–0.5
4.6
B port
–0.5
4.6
VI
Input voltage range
V
VO
Voltage range applied to any output in the high-impedance or power-off
state
VO
Voltage range applied to any output in the high or low state
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
150
°C
Continuous current through VCCA or GND
Tstg
(1)
Storage temperature range
–65
V
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS
UNIT
θJA
(1)
8
Package thermal impedance (1)
117
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
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SCES697C – AUGUST 2009 – REVISED JANUARY 2010
RECOMMENDED OPERATING CONDITIONS (1)
Level Translator
MIN
MAX
VCCA
Supply voltage
VCCA
1.1
3.6
V
VCCB
Supply voltage
1.1
3.6
V
VIH
High-level input
voltage
VCCI – 0.2
VCCI
VCCI x 0.65
VCCI
0
0.15
Low-level input
voltage
VIL
VO
Output voltage
IOH
A-Port CMD and
DATA I/Os
B-Port CMD and
DATA I/Os
1.1 V to 1.95 V
1.1 V to 1.95 V
1.95 V to 3.6 V
1.95 V to 3.6 V
EN and CLKA
1.1 V to 3.6 V
1.1 V to 3.6 V
A-Port CMD and
DATA I/Os
B-Port CMD and
DATA I/Os
1.1 V to 1.95 V
1.1 V to 1.95 V
1.95 V to 3.6 V
1.95 V to 3.6 V
EN and CLKA
1.1 V to 3.6 V
1.1 V to 3.6 V
0
VCCI x 0.35
Active state
0
VCCO
3-state
0
3.6
High-level output current (CLK-f output)
IOL
VCCB
Low-level output current (CLK-f output)
1.1 V to 3.6 V
–100
1.1 V to 1.3 V
–0.5
1.4 V to 1.6 V
1.65 V to 1.95 V
–2
–4
3 V to 3.6 V
–8
1.1 V to 3.6 V
100
1.1 V to 1.3 V
0.5
1.65 V to 1.95 V
2
IOL
Low-level output current (CLK output)
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
1.1 V to 3.6 V
1.1 V to 3.6 V
V
μA
mA
μA
mA
4
3 V to 3.6 V
High-level output current (CLK output)
V
1
1.1 V to 3.6 V
2.3 V to 2.7 V
IOH
V
–1
1.1 V to 3.6 V
2.3 V to 2.7 V
1.4 V to 1.6 V
UNIT
8
1.1 V to 3.6 V
–100
1.1 V to 1.3 V
–0.5
1.4 V to 1.6 V
–1
1.65 V to 1.95 V
–2
2.3 V to 2.7 V
–4
3 V to 3.6 V
–8
1.1 V to 3.6 V
100
1.1 V to 1.3 V
0.5
1.4 V to 1.6 V
1
1.65 V to 1.95 V
2
2.3 V to 2.7 V
4
3 V to 3.6 V
8
–40
μA
mA
μA
mA
5
ns/V
85
°C
All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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TXS0206
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ELECTRICAL CHARACTERISTICS
Level Translator
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
A port
(CLK-f output)
VOH
A port
(DAT and CMD
outputs)
A port
(CLK-f output)
VOL
A port
(DAT and CMD
outputs)
TEST CONDITIONS
VCCA
VCCB
MIN
IOH = –100 μA
1.1 V to 3.6 V
IOH = –0.5 mA
1.1 V
0.8
IOH = –1 mA
1.4 V
1.05
IOH = –2 mA
1.65 V
IOH = –4 mA
2.3 V
IOH = –8 mA
3V
IOH = –20 μA
1.1 V to 3.6 V
IOL = 100 μA
1.1 V to 3.6 V
IOL = 0.5 mA
1.1 V
B port
(CLK output)
B port
(DAT output)
(1)
10
MAX
1.2
1.1 V to 3.6 V
V
1.75
2.3
VCCA × 0.8
VCCA × 0.8
0.35
IOL = 1 mA
1.4 V
IOL = 2 mA
1.65 V
IOL = 4 mA
2.3 V
0.55
IOL = 8 mA
0.35
3V
0.7
1.1 V to 3.6 V
0.45
IOL = 135 μA
0.4
IOL = 180 μA
0.4
IOL = 220 μA
1.1 V to 3.6 V
0.4
IOL = 300 μA
V
V
0.4
0.55
IOH = –100 μA
1.1 V to 3.6 V
IOH = –0.5 mA
1.1 V
0.8
IOH = –1 mA
1.4 V
1.05
1.65 V
1.2
IOH = –4 mA
2.3 V
1.75
IOH = –8 mA
3V
2.3
IOH = –20 μA
1.1 V to 3.6 V
IOH = –2 mA
UNIT
VCCA * 0.8
IOL = 400 μA
VOH
TYP (1)
1.1 V to 3.6 V
VCCA × 0.8
V
VCCA × 0.8
All typical values are at TA = 25°C.
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ELECTRICAL CHARACTERISTICS
Level Translator (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
B port
TEST CONDITIONS
VCCA
TYP (1)
MAX
1.1 V to 3.6 V
IOL = 0.5 mA
1.1 V
0.35
IOL = 1 mA
1.4 V
0.35
1.65 V
0.45
2.3 V
0.55
1.1 V to 3.6 V
IOL = 2 mA
IOL = 8 mA
B port
(DAT output)
MIN
IOL = 100 μA
IOL = 4 mA
VOL
VCCB
3V
0.7
IOL = 135 μA
1.1 V to 3.6 V
0.4
IOL = 180 μA
1.4 V
0.4
IOL = 220 μA
1.1 V to 3.6 V
UNIT
VCCA × 0.8
1.65 V
0.4
IOL = 300 μA
2.3 V
0.4
IOL = 400 μA
3V
0.55
V
V
1.1 V to 3.6 V
±1
μA
ICCA
VI = VCCI or GND,
IO = 0
1.1 V to 3.6 V
1.1 V to 3.6 V
6
μA
ICCB
VI = VCCI or GND,
IO = 0
1.1 V to 3.6 V
1.1 V to 3.6 V
5
μA
II
Cio
Ci
Control inputs
VI = VCCA or GND
A port
5.5
6.5
B port
15
17.5
3.5
4.5
3
4
Control inputs
Clock input
VI = VCCA or GND
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TIMING REQUIREMENTS
VCCA = 1.2 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
MIN
Command
Data rate
Clock
Data
Command
tW
Pulse
duration Clock
Data
VCCB = 1.5 V
± 0.1 V
MAX
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
VCCB = 2.5 V
± 0.2 V
MAX
MIN MAX
VCCB = 3.3 V
± 0.3 V
MIN
UNIT
MAX
Push-pull driving
30
40
40
40
40
Open-drain driving
0.9
1
1
1
1
30
40
50
60
60
MHz
30
40
40
40
40
Mbps
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
33
25
25
25
Mbps
25
ns
1
1
1
1
1
μs
16.7
12.5
10
8.3
8.3
ns
33
25
25
25
25
ns
TIMING REQUIREMENTS
VCCA = 1.5 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
MIN
Command
Data rate
Clock
Data
tW
Command
Pulse
duration Clock
Data
Push-pull driving
MAX
Push-pull driving
Open-drain driving
Push-pull driving
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
VCCB = 2.5 V
± 0.2 V
MAX
MIN MAX
VCCB = 3.3 V
± 0.3 V
MIN
UNIT
MAX
30
60
60
60
60
1
1
1
1
1
50
60
60
60
60
MHz
30
60
60
60
60
Mbps
Open-drain driving
Push-pull driving
VCCB = 1.5 V
± 0.1 V
Mbps
33
17
17
17
17
ns
1
1
1
1
1
μs
10
8.3
8.3
8.3
8.3
ns
33
17
17
17
17
ns
TIMING REQUIREMENTS
VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
MIN
Command
Data rate
Clock
Data
Command
tW
Pulse
duration Clock
Data
12
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
VCCB = 1.5 V
± 0.1 V
MAX
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
VCCB = 2.5 V
± 0.2 V
MAX
MIN MAX
VCCB = 3.3 V
± 0.3 V
MIN
UNIT
MAX
30
60
60
60
60
1
1
1
1
1
50
60
60
60
60
MHz
60
Mbps
30
60
60
60
Mbps
33
17
17
17
17
ns
1
1
1
1
1
μs
10
8.3
8.3
8.3
8.3
ns
33
17
17
17
17
ns
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TXS0206
TXS0206
www.ti.com
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
TIMING REQUIREMENTS
VCCA = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
MIN
Command
Data rate
Clock
Data
Command
tW
Pulse
duration Clock
Data
Push-pull driving
MAX
Push-pull driving
Push-pull driving
MAX
MIN
VCCB = 2.5 V
± 0.2 V
MAX
MIN MAX
VCCB = 3.3 V
± 0.3 V
MIN
UNIT
MAX
60
60
60
60
1
1
1
1
1
60
60
60
60
60
MHz
30
60
60
60
60
Mbps
33
Open-drain driving
MIN
VCCB = 1.8 V
± 0.15 V
30
Open-drain driving
Push-pull driving
VCCB = 1.5 V
± 0.1 V
17
17
17
Mbps
17
ns
1
1
1
1
1
μs
8.3
8.3
8.3
8.3
8.3
ns
33
17
17
17
17
ns
TIMING REQUIREMENTS
VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted)
VCCB = 1.2 V
± 0.1 V
MIN
Command
Data rate
Clock
Data
tW
Command
Pulse
duration Clock
Data
MAX
VCCB = 1.5 V
± 0.1 V
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
VCCB = 2.5 V
± 0.2 V
MAX
MIN MAX
VCCB = 3.3 V
± 0.3 V
MIN
UNIT
MAX
Push-pull driving
30
60
60
60
60
Open-drain driving
0.9
1
1
1
1
55
55
55
55
55
MHz
30
60
60
60
60
Mbps
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
Mbps
33
17
17
17
17
ns
1
1
1
1
1
μs
9
9
9
9
9
ns
33
17
17
17
17
ns
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Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TXS0206
13
TXS0206
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
www.ti.com
SWITCHING CHARACTERISTICS
VCCA = 1.2 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB
= 1.2 V
± 0.1 V
MIN
Push-pull driving
CMDA
CMDB
ten
tdis
CMDB
CMDA
15.3
MIN
10.4
UNIT
MAX
10.8
3.4
11.5
3.3
10.6
3.2
10.3
Open-drain driving
(L-to-H)
204
308
164
256
133
224
95
175
71
147
19.7
15.1
13.4
12
11.2
Open-drain driving
(H-to-L)
4.7
19.4
3.8
12.4
3.4
10.5
3.1
9.2
2.9
9.4
Open-drain driving
(L-to-H)
211
353
170
304
139
282
101
243
77
204
12.3
11.5
10.9
11.7
12.6
11.2
10.7
11.1
DATxB
DATxA
CLKA
CLK-f
Push-pull driving
18.2
14.3
12.8
11.5
10.6
37.9
30.7
26.8
24.7
EN
B-port
24.2
Push-pull driving
1
1
1
1
EN
1
A-port
Push-pull driving
1
1
1
1
1
EN
B-port
Push-pull driving
68
55
46
40
38
EN
A-port
Push-pull driving
62
56
48
40
37
CLK-f rise time
CLKB rise time
CLK-f fall time
CMDB fall time
CLKB fall time
DATxB fall time
Channel-to-channel
skew
Command
Clock
Data
14
10.8
MAX
15.9
DATxA fall time
Max data rate
MIN
15.6
CMDA fall time
tSK(O)
12.2
MAX
12.6
CLKB
DATxB rise time
tfB
MIN
3.7
DATxB
CMDB rise time
tfA
MAX
VCCB
= 3.3 V
± 0.3 V
16.6
CLKA
DATxA rise time
trB
MIN
VCCB
= 2.5 V
± 0.2 V
4.1
DATxA
CMDA rise time
trA
MAX
VCCB
= 1.8 V
± 0.15 V
Open-drain driving
(H-to-L)
Push-pull driving
tpd
VCCB
= 1.5 V
± 0.1 V
Push-pull driving
Push-pull driving
Push-pull driving
1.7
14.1
1.5
13
1.5
12.7
1.6
12.2
1.9
Open-drain driving
170
260
128
205
96
171
57
120
32
91
0.6
10.6
0.6
10.9
0.6
12
0.6
12.3
0.6
12.7
11.5
Push-pull driving
1.7
13.7
1.5
12.6
1.5
12
1.6
11.6
1.9
1.9
12.4
2.3
9.2
1.9
7.3
1.8
6.7
1.7
3.9
Open-drain driving
175
300
145
261
118
245
86
214
66
181
1
7.7
0.8
7.1
0.8
6.2
1.7
4.8
1.7
4.3
2.9
11.8
2.3
8.9
1.9
7.4
0.9
4.7
0.4
6.8
1
8
1
5.4
1
4.5
1
3.9
0.8
4
2.3
8.3
1.9
4.9
1.7
4.4
1.6
3.9
1.6
3.7
1
5.8
1
4.6
1
4.1
1
3.8
1
4
Push-pull driving
Open-drain driving
Push-pull driving
1.8
8
1.3
5.4
1
4.5
1
3.9
1
3.8
Push-pull driving
2.1
7.9
1.8
5.2
1.7
4.6
1.6
4.5
1.5
4.3
Open-drain driving
1.9
8.3
1.5
5.9
1.3
5.1
1.1
4.3
1
4.2
2
7.1
1.8
5.4
1.8
4.5
1.7
4
1.6
3.9
2.1
8.5
1.1
6.4
0.9
5
1
3.9
1.1
4.8
Push-pull driving
Push-pull driving
μs
ns
11.9
Push-pull driving
Push-pull driving
ns
ns
ns
ns
ns
1
1
1
1
1
Push-pull driving
30
40
40
40
40
Open-drain driving
0.9
1
1
1
1
30
40
50
60
60
MHz
30
40
40
40
40
Mbps
Push-pull driving
Submit Documentation Feedback
ns
Mbps
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TXS0206
TXS0206
www.ti.com
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
SWITCHING CHARACTERISTICS
VCCA = 1.5 V ± 0.1 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB
= 1.2 V
± 0.1 V
MIN
Push-pull driving
CMDA
CMDB
ten
tdis
CMDB
CMDA
12
6.9
MAX
MIN
6.1
UNIT
MAX
6
2.9
7.6
2.7
6.6
2.7
6.5
Open-drain driving
(L-to-H)
192
297
191
295
157
252
112
180
83
138
15.2
9.8
8
6.8
6.3
Open-drain driving
(H-to-L)
3.7
20.4
2.9
11.8
2.5
9.4
2.2
7.3
2.1
6.6
Open-drain driving
(L-to-H)
199
337
196
316
162
282
117
214
87
177
8.7
7.7
6.1
6.2
12.5
8.9
7.2
6.2
6.1
DATxB
DATxA
CLKA
CLK-f
Push-pull driving
13.9
9.2
7.6
6.5
6.1
29
20
16
13
EN
B-port
12
Push-pull driving
1
1
1
1
EN
1
A-port
Push-pull driving
1
1
1
1
1
EN
B-port
Push-pull driving
57
53
46
39
37
EN
A-port
Push-pull driving
58
54
46
38
35
CLK-f rise time
CLKB rise time
CLK-f fall time
DATxA fall time
CMDB fall time
CLKB fall time
DATxB fall time
Channel-to-channel
skew
Command
Max data rate
MIN
12.3
CMDA fall time
tSK(O)
8.6
MAX
8.7
CLKB
DATxB rise time
tfB
MIN
3.2
DATxB
CMDB rise time
tfA
MAX
VCCB
= 3.3 V
± 0.3 V
12.8
CLKA
DATxA rise time
trB
MIN
VCCB
= 2.5 V
± 0.2 V
3.7
DATxA
CMDA rise time
trA
MAX
VCCB
= 1.8 V
± 0.15 V
Open-drain driving
(H-to-L)
Push-pull driving
tpd
VCCB
= 1.5 V
± 0.1 V
Clock
Data
Push-pull driving
Push-pull driving
Push-pull driving
1.6
10.5
0.4
9.5
0.2
8.9
0.4
8.3
1
Open-drain driving
166
254
157
247
121
203
74
127
44
85
0.5
5.5
0.5
5.5
0.5
6.2
0.5
7
0.5
7.2
8.3
Push-pull driving
2
10.3
0.7
9.4
0.5
8.9
0.6
8.4
0.7
1.9
11.2
2
8
1.9
6.5
0.5
5.6
0.5
3.1
Open-drain driving
157
273
163
264
135
253
96
196
71
165
1.3
7.5
0.6
6.7
0.4
5.9
1.5
4.9
1.9
4.3
2.2
10.9
2
8.4
1.7
6.9
0.8
5
0.6
4
Push-pull driving
1.5
5.5
1.3
3.8
0.9
2.9
0.8
2.3
0.8
2.3
Open-drain driving
2.3
8
2
4.8
1.8
4.2
1.7
3.7
1.6
3.5
0.4
3.9
0.4
3.7
0.4
4
0.4
3.7
0.4
6.8
0.8
6
0.6
4.8
0.1
4.1
0.1
3.8
0.1
3.8
1
11.6
1.5
7.1
1.5
5.8
1.4
5.4
1.6
3.6
1.7
5.2
1.5
3.8
1.2
3
1
2.3
0.9
2.3
1.1
10.8
1
8.8
1.8
6
1.7
4.1
1.6
3.9
1.1
13.3
1.2
7.7
1.2
6.5
2.3
4.3
2.5
4.2
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
μs
ns
7.9
Push-pull driving
Push-pull driving
ns
ns
ns
ns
ns
Push-pull driving
1
1
1
1
1
Push-pull driving
30
60
60
60
60
1
1
1
1
1
50
60
60
60
60
MHz
30
60
60
60
60
Mbps
Open-drain driving
Push-pull driving
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ns
Mbps
15
TXS0206
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
www.ti.com
SWITCHING CHARACTERISTICS
VCCA = 1.8 V ± 0.15 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB
= 1.2 V
± 0.1 V
MIN
Push-pull driving
CMDA
CMDB
ten
tdis
CMDB
CMDA
11.3
MIN
4.6
UNIT
MAX
4.4
2.7
6.5
2.5
5.5
2.4
5.1
Open-drain driving
(L-to-H)
179
286
183
288
168
286
121
201
89
151
13.2
8.3
6.5
5.2
4.8
Open-drain driving
(H-to-L)
3.5
19.7
2.8
11.1
2.4
8.6
2.1
6.4
2
5.7
Open-drain driving
(L-to-H)
186
323
190
304
173
303
125
215
93
166
7.7
6.2
4.7
4.5
7.5
5.8
4.7
4.4
DATxB
DATxA
CLKA
CLK-f
Push-pull driving
12.1
7.9
6.3
5
4.6
25.1
16.5
12
8.9
EN
B-port
7.9
Push-pull driving
1
1
1
1
EN
1
A-port
Push-pull driving
1
1
1
1
1
EN
B-port
Push-pull driving
39
37
37
35
35
EN
A-port
Push-pull driving
49
47
47
38
35
CLK-f rise time
CLKB rise time
CLK-f fall time
CMDB fall time
CLKB fall time
DATxB fall time
Channel-to-channel
skew
Command
Clock
Data
16
5.7
MAX
11.7
DATxA fall time
Max data rate
MIN
11.6
CMDA fall time
tSK(O)
7.3
MAX
7.6
CLKB
DATxB rise time
tfB
MIN
2.9
DATxB
CMDB rise time
tfA
MAX
VCCB
= 3.3 V
± 0.3 V
11.8
CLKA
DATxA rise time
trB
MIN
VCCB
= 2.5 V
± 0.2 V
3.4
DATxA
CMDA rise time
trA
MAX
VCCB
= 1.8 V
± 0.15 V
Open-drain driving
(H-to-L)
Push-pull driving
tpd
VCCB
= 1.5 V
± 0.1 V
Push-pull driving
Push-pull driving
Push-pull driving
1.8
8.4
1.2
6.8
1.1
5.9
1.1
5.9
1.6
Open-drain driving
154
246
155
262
135
238
85
150
52
99
0.4
4
0.4
4.3
0.4
4.7
0.4
4.5
0.4
4.1
6.1
Push-pull driving
1.9
8.6
1.2
7.1
0.9
6.8
1
6.3
1.3
1.8
10.2
2
7.7
1.7
6.5
1
5.2
1.7
3.1
Open-drain driving
137
251
148
245
141
251
100
184
73
142
1.5
7.3
0.7
6.6
0.4
5.9
1.5
4.9
1.9
4.3
2.3
10.3
1.8
8
1.5
6.8
0.9
5.2
0.2
5
Push-pull driving
0.6
4.5
0.4
3.8
0.2
3.3
0.2
2.9
0.2
3.1
Open-drain driving
2.3
7.9
2
4.8
1.8
4.2
1.7
3.7
1.6
3.5
0.1
2
0.2
2.2
0.7
1.6
0.7
1.5
0.1
3
1
4.3
0.8
3.6
1
2.7
0.1
2.7
0.2
2.6
1
10.3
1.4
6.8
1.8
5.4
1.6
5
1.6
3.6
1.4
4
1.3
3
1.2
2.6
0.9
1.9
0.8
1.8
1.1
10.8
1
10.3
1.4
6.3
1.8
4.2
1.7
4
1
11.8
15
7
1.2
6.3
1.6
4.9
0.8
3.6
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
μs
ns
5.8
Push-pull driving
Push-pull driving
ns
ns
ns
ns
ns
Push-pull driving
1
1
1
1
1
Push-pull driving
30
60
60
60
60
1
1
1
1
1
50
60
60
60
60
MHz
30
60
60
60
60
Mbps
Open-drain driving
Push-pull driving
Submit Documentation Feedback
ns
Mbps
Copyright © 2009–2010, Texas Instruments Incorporated
Product Folder Link(s): TXS0206
TXS0206
www.ti.com
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
SWITCHING CHARACTERISTICS
VCCA = 2.5 V ± 0.2 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB
= 1.2 V
± 0.1 V
MIN
Push-pull driving
CMDA
CMDB
ten
tdis
CMDB
CMDA
trB
tfA
2.1
4.1
Open-drain driving
(L-to-H)
156
253
162
258
149
261
126
249
98
190
tfB
Max data rate
2.3
7.9
2
5.7
1.9
4.8
Open-drain driving
(L-to-H)
163
295
169
273
158
274
131
261
99
202
1
EN
A-port
Push-pull driving
EN
B-port
EN
A-port
Clock
Data
3.6
10.5
Push-pull driving
Command
4.1
2.7
B-port
Channel-to-channel
skew
5.6
19.2
EN
CLKB fall time
7.4
3.5
23.7
DATxB fall time
tSK(O)
12.5
Open-drain driving
(H-to-L)
11.5
CMDB fall time
3.3
4.4
Push-pull driving
DATxA fall time
3.7
UNIT
MAX
2.2
CLK-f
CLK-f fall time
MIN
5.5
DATxA
CMDA fall time
4.9
MAX
2.4
CLKA
DATxB rise time
MIN
6.7
DATxB
CLKB rise time
6.5
MAX
2.7
CLKB
CMDB rise time
MIN
VCCB
= 3.3 V
± 0.3 V
10.9
DATxB
DATxA rise time
MAX
VCCB
= 2.5 V
± 0.2 V
3.2
CLKA
CLK-f rise time
MIN
10.6
DATxA
CMDA rise time
trA
MAX
VCCB
= 1.8 V
± 0.15 V
Open-drain driving
(H-to-L)
Push-pull driving
tpd
VCCB
= 1.5 V
± 0.1 V
Push-pull driving
10.8
6.8
5.4
3.7
3.4
10.9
6.7
5
3.7
3.3
7.1
5.4
3.9
3.5
14.9
10.2
6.8
5.7
1
1
1
1
1
1
1
1
1
Push-pull driving
48
45
45
38
36
Push-pull driving
45
38
38
38
35
Push-pull driving
Push-pull driving
1.9
4.7
1.7
4.4
1.7
3.8
1.9
3.2
2.3
3.3
Open-drain driving
135
216
136
237
121
228
96
201
62
141
0.8
1.6
0.3
1.9
0.6
1.8
0.7
1.5
0.7
1.3
4.2
Push-pull driving
1.9
6.1
1.8
4.5
1.7
4.1
1.9
4
1.8
Push-pull driving
1.7
10.8
2.9
7.6
1.8
6.6
1.5
5.2
1.5
3.8
Open-drain driving
102
205
116
197
112
207
101
214
76
165
1.6
7.3
0.5
6.8
0.4
5.8
1.6
5
1.7
4.4
Push-pull driving
2.2
10.3
1.9
7.9
1.8
6.6
1.4
5.3
0.9
4.4
Push-pull driving
0.4
2.4
0.4
1.6
0.4
1.5
0.5
1.5
0.3
1.4
Open-drain driving
2.2
7.6
1.9
4.8
1.8
4.2
1.7
3.7
1.6
3.5
0.3
2.2
0.3
2.7
0.3
2.6
0.3
2.4
0.3
2.8
Push-pull driving
0.4
4
0.4
3.6
0.4
3.2
0.5
2.9
0.3
2.6
Push-pull driving
1
13.4
1.8
7.2
1.7
6.3
1.6
5.6
1.6
3.7
Open-drain driving
1
2.3
1
1.7
1
1.7
1
1.6
0.8
1.4
1.1
12.7
1
11.3
0.9
8.7
1.8
4.5
1.7
4.1
1
16
0.7
9
08
7
0.8
4.9
0.2
4
Push-pull driving
ns
μs
ns
ns
ns
ns
ns
Push-pull driving
1
1
1
1
1
Push-pull driving
30
60
60
60
60
1
1
1
1
1
50
60
60
60
60
MHz
30
60
60
60
60
Mbps
Open-drain driving
Push-pull driving
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ns
Mbps
17
TXS0206
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
www.ti.com
SWITCHING CHARACTERISTICS
VCCA = 3.3 V ± 0.3 V
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
VCCB
= 1.2 V
± 0.1 V
MIN
Push-pull driving
CMDA
CMDB
ten
tdis
CMDB
CMDA
12.5
MIN
3.8
UNIT
MAX
3.2
2.4
5.2
2.1
4.1
2
3.7
Open-drain driving
(L-to-H)
136
212
141
235
129
235
112
233
101
201
10.7
6.6
5.1
3.4
3
Open-drain driving
(H-to-L)
4.3
16.4
3.3
8.7
2.8
6.6
2.4
4.6
2.2
3.6
Open-drain driving
(L-to-H)
142
273
148
246
139
248
122
248
105
212
6.5
4.8
3.5
3.1
6.9
5.1
3.7
3.2
DATxB
DATxA
CLKA
CLK-f
Push-pull driving
23.6
14.4
9.6
6.2
5.1
17.1
9.1
6.8
4.8
EN
B-port
4.2
Push-pull driving
1
1
1
1
EN
1
A-port
Push-pull driving
1
1
1
1
1
EN
B-port
Push-pull driving
38
34
34
34
34
EN
A-port
Push-pull driving
45
37
36
36
35
CLK-f rise time
CLKB rise time
CLK-f fall time
CMDB fall time
CLKB fall time
DATxB fall time
Channel-to-channel
skew
Command
Clock
Data
18
5.3
MAX
11.5
DATxA fall time
Max data rate
MIN
10.8
CMDA fall time
tSK(O)
7.2
MAX
6.4
CLKB
DATxB rise time
tfB
MIN
2.7
DATxB
CMDB rise time
tfA
MAX
VCCB
= 3.3 V
± 0.3 V
10.6
CLKA
DATxA rise time
trB
MIN
VCCB
= 2.5 V
± 0.2 V
3.2
DATxA
CMDA rise time
trA
MAX
VCCB
= 1.8 V
± 0.15 V
Open-drain driving
(H-to-L)
Push-pull driving
tpd
VCCB
= 1.5 V
± 0.1 V
Push-pull driving
Push-pull driving
Push-pull driving
0.7
5.6
0.7
5
0.7
4.2
0.8
4.1
1
4.2
Open-drain driving
117
178
118
213
104
206
85
194
74
155
0.7
1.5
0.5
1.7
0.7
1.5
0.7
1.4
0.7
1.4
3
Push-pull driving
0.9
5
1.1
3.9
1.3
3.4
1.4
3.3
1.1
Push-pull driving
1.7
10.8
2.3
7.4
2.2
6.4
2
5
1.9
4
Open-drain driving
69
167
84
156
83
167
79
185
79
166
1
7.7
0.3
7.1
0.5
5.9
1.6
5.1
1.9
4.4
2.1
10.5
2
7.9
2
6.6
1.8
5.3
1
14
0.3
2.8
0.4
2.4
0.4
2
0.4
2
1
2.3
2
7.6
1.8
5
1.7
4.4
1.6
3.9
1.6
3.7
0.6
1.3
0.6
1.3
0.6
1.3
0.6
1.3
0.6
1.3
0.3
2.7
0.4
2.3
0.4
1.4
0.4
1.8
0.5
1.7
1
13.3
0.7
7.9
0.9
6.2
0.8
6.3
1
5
0.7
1.5
0.7
1.4
0.8
1.4
0.9
1.3
0.9
1.3
1
15.5
1
9.1
0.9
7.8
0.9
5.1
0.9
4.3
1
15
0.9
6.8
0.9
6.8
0.8
6.9
0.8
5
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
Open-drain driving
Push-pull driving
Push-pull driving
ns
μs
ns
ns
ns
ns
ns
1
1
1
1
1
Push-pull driving
30
60
60
60
60
Open-drain driving
0.9
1
1
1
1
55
55
55
55
55
MHz
30
60
60
60
60
Mbps
Push-pull driving
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Mbps
Copyright © 2009–2010, Texas Instruments Incorporated
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TXS0206
www.ti.com
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 1.2 V
PARAMETER
TEST
CONDITIONS
1.5 V
1.8 V
2.5 V
3V
3.3 V
15
15
14.9
14.9
15
15
6.3
6.4
6.5
6.5
6.5
6.5
12.5
12.3
12.3
12.1
12
11.9
0.2
0.2
0.2
0.3
0.3
0.3
1.2
1.2
1.2
1.2
1.2
1.2
B-port input,
DATA
A-port
Disabled
output
0.2
0.2
0.2
0.3
0.3
0.3
A-port input,
DATA
B-port
Enabled
output
26.2
27.3
28.2
29.7
30
31.2
25.7
25.6
25.6
26.4
27
28.1
13.7
12.2
11.4
12
12.5
12.9
CLK
A-port input, Enabled
B-port
DATA
output
Enabled
CpdA
CpdB
(1)
B-port input,
DATA
A-port
Enabled
output
CLK
A-port input, Disabled
B-port
DATA
output
Disabled
(1)
CLK
B-port input, Enabled
A-port
DATA
output
Enabled
A-port input,
DATA
B-port
Disabled
output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
UNIT
pF
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
pF
CLK
B-port input, Disabled
A-port
DATA
output
Disabled
(1)
VCCB TYP
1.2 V
0.6
0.5
0.5
0.5
0.5
0.6
0.6
0.5
0.5
0.5
0.5
0.6
1.2
1.2
1.2
1
1
0.9
Power dissipation capacitance per transceiver
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 1.5 V
PARAMETER
TEST
CONDITIONS
CLK
A-port input, Enabled
B-port
DATA
output
Enabled
CpdA
(1)
B-port input,
DATA
A-port
Enabled
output
CLK
A-port input, Disabled
B-port
DATA
output
Disabled
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
B-port input,
DATA
A-port
Disabled
output
(1)
VCCB TYP
1.2 V
1.5 V
1.8 V
2.5 V
3V
3.3 V
15
15
15
14.9
14.9
14.9
6.4
6.3
6.2
6
6
6
13.2
12.3
12.2
12
12
11.9
0.1
0.1
0.1
0.1
0.1
0.1
1.2
1.2
1.2
1.2
1.2
1.2
0.1
0.1
0.1
0.1
0.1
0.1
UNIT
pF
Power dissipation capacitance per transceiver
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TXS0206
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
www.ti.com
OPERATING CHARACTERISTICS (continued)
TA = 25°C, VCCA = 1.5 V
PARAMETER
TEST
CONDITIONS
A-port input,
DATA
B-port
Enabled
output
CpdB
(1)
CLK
B-port input, Enabled
A-port
DATA
output
Enabled
A-port input,
DATA
B-port
Disabled
output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
VCCB TYP
1.2 V
1.5 V
1.8 V
2.5 V
3V
3.3 V
25.8
26.3
27.3
29.2
29.2
30.6
25.8
25.6
25.6
26.2
26.2
27.2
13.7
12.3
11.4
12
12
12.8
UNIT
pF
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
1.2
1.2
1.1
1
1
0.9
1.2 V
1.5 V
1.8 V
2.5 V
3V
3.3 V
15.2
15.1
15.1
15
15
15
6.7
6.2
5.8
5.4
5.4
5.3
13.9
13.1
12.4
12.1
12
11.9
0.1
0.1
0.1
0.1
0.1
0.1
1.3
1.3
1.3
1.3
1.3
1.3
B-port input,
DATA
A-port
Disabled
output
0.1
0.1
0.1
0.1
0.1
0.1
A-port input,
DATA
B-port
Enabled
output
25.9
26.1
26.7
28.8
28.8
30.3
25.8
25.6
25.6
26.2
26.2
27
13.6
12.2
11.5
12.1
12.1
12.9
0.2
0.1
0.1
0.1
0.1
0.1
0.2
0.1
0.1
0.1
0.1
0.1
1.2
1.2
1.1
1
1
0.8
CLK
B-port input, Disabled
A-port
DATA
output
Disabled
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 1.8 V
PARAMETER
TEST
CONDITIONS
CLK
A-port input, Enabled
B-port
DATA
output
Enabled
CpdA
CpdB
(1)
B-port input,
DATA
A-port
Enabled
output
CLK
A-port input, Disabled
B-port
DATA
output
Disabled
(1)
CLK
B-port input, Enabled
A-port
DATA
output
Enabled
A-port input,
DATA
B-port
Disabled
output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
CLK
B-port input, Disabled
A-port
DATA
output
Disabled
(1)
20
VCCB TYP
UNIT
pF
pF
Power dissipation capacitance per transceiver
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TXS0206
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SCES697C – AUGUST 2009 – REVISED JANUARY 2010
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 2.5 V
PARAMETER
TEST
CONDITIONS
1.5 V
1.8 V
2.5 V
3V
3.3 V
16.2
16
15.9
15.8
15.8
15.7
7.3
6.5
5.9
5.5
5.4
5.3
15.3
14.6
14
13
12.8
12.5
0.1
0.1
0.1
0.1
0.1
0.1
1.3
1.3
1.3
1.3
1.3
1.3
B-port input,
DATA
A-port
Disabled
output
0.1
0.1
0.1
0.1
0.1
0.1
A-port input,
DATA
B-port
Enabled
output
25.6
25.8
26.2
27.6
29
29.5
25.9
25.7
25.7
26.2
26.5
26.9
13.6
12.2
11.5
12.3
12.7
13.2
CLK
A-port input, Enabled
B-port
DATA
output
Enabled
CpdA
CpdB
(1)
B-port input,
DATA
A-port
Enabled
output
CLK
A-port input, Disabled
B-port
DATA
output
Disabled
(1)
CLK
B-port input, Enabled
A-port
DATA
output
Enabled
A-port input,
DATA
B-port
Disabled
output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
UNIT
pF
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
pF
CLK
B-port input, Disabled
A-port
DATA
output
Disabled
(1)
VCCB TYP
1.2 V
0.3
0.1
0.1
0.1
0.1
0.1
0.3
0.1
0.1
0.1
0.1
0.1
1.2
1.2
1.1
1
0.9
0.8
Power dissipation capacitance per transceiver
OPERATING CHARACTERISTICS
TA = 25°C, VCCA = 3.3 V
PARAMETER
TEST
CONDITIONS
CLK
A-port input, Enabled
B-port
DATA
output
Enabled
CpdA
(1)
B-port input,
DATA
A-port
Enabled
output
CLK
A-port input, Disabled
B-port
DATA
output
Disabled
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
B-port input,
DATA
A-port
Disabled
output
(1)
VCCB TYP
1.2 V
1.5 V
1.8 V
2.5 V
3V
3.3 V
18.3
17.7
17.5
17.3
17.2
17.1
8.1
7
6.2
5.7
5.6
5.6
17
16.1
15.6
14.8
14.4
14
0.1
0.1
0.1
0.1
0.1
0.1
1.3
1.3
1.3
1.3
1.3
1.3
0.1
0.1
0.1
0.1
0.1
0.1
UNIT
pF
Power dissipation capacitance per transceiver
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TXS0206
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
www.ti.com
OPERATING CHARACTERISTICS (continued)
TA = 25°C, VCCA = 3.3 V
PARAMETER
TEST
CONDITIONS
A-port input,
DATA
B-port
Enabled
output
CpdB
(1)
CLK
B-port input, Enabled
A-port
DATA
output
Enabled
A-port input,
DATA
B-port
Disabled
output
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
1.2 V
1.5 V
1.8 V
2.5 V
3V
3.3 V
25.2
25.6
26
27.1
28
28.5
26
25.8
25.8
26.3
26.8
27
13.7
12.1
11.4
12.2
12.7
13.2
UNIT
pF
0.3
0.1
0.1
0.1
0.1
0.1
0.3
0.1
0.1
0.1
0.1
0.1
1.2
1.2
1.1
1
0.9
0.8
Attenuation (dB)
CLK
B-port input, Disabled
A-port
DATA
output
Disabled
VCCB TYP
Frequency (Hz)
Figure 7. Typical ASIP EMI Filter Frequency Response
22
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TXS0206
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SCES697C – AUGUST 2009 – REVISED JANUARY 2010
PARAMETER MEASUREMENT INFORMATION
VCCI
VCCO
VCCI
VCCO
DUT
IN
DUT
IN
OUT
OUT
1 MW
15 pF
1 MW
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × VCCO
50 kW
From Output
Under Test
15 pF
S1
Open
50 kW
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
TEST
S1
tPZL/tPLZ
tPHZ/tPZH
2 × VCCO
Open
tw
VCCI
VCCI/2
Input
VCCI/2
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VCCA
Output
Control
(low-level
enabling)
VCCA/2
0V
tPLZ
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VCCO/2
0.9 y VCCO
0.1 y VCCO
tr
VOH
VCCO/2
VOL
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VCCA/2
VCCO
VCCO/2
0.1 y VCCO
VOL
tPHZ
tPZH
VOH
0.9 y VCCO
VCCO/2
0V
tf
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
J. All parameters and waveforms are not applicable to all devices.
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TXS0206
SCES697C – AUGUST 2009 – REVISED JANUARY 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 8. Load Circuit and Voltage Waveforms
24
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TXS0206
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SCES697C – AUGUST 2009 – REVISED JANUARY 2010
APPLICATION INFORMATION
The TXS0206 has integrated pullup resistors on the data and command ports and their values dynamically
change. When the port is in a low signal state, there is a nominal pullup resistor value of 40 kΩ, and power
consumption is minimized. When the port is in a high signal state, the nominal pullup resistor value changes to 4
kΩ, and simultaneous switching performance is improved as a result. The threshold at which the resistance
changes is approximately VCCx/2.
When using the TXS0206 device with MMCs, SD, and Memory Stick™ to ensure that a valid receiver input
voltage high (VIH) is achieved, the value of any pulldown resistors (external or internal to a memory card) must
not be smaller than a 10-kΩ value. The impact of adding too heavy (i.e., <10-kΩ value) a pulldown resistor to the
data and command lines of the TXS0206 device and the resulting 4-kΩ pullup / 10-kΩ pulldown voltage divider
network has a direct impact on the VIH of the signal being sent into the memory card and its associated logic.
The resulting VIH voltage for the 10-kΩ pulldown resistor value would be:
VCC × 10 kΩ / (10 kΩ+ 4 kΩ) = 0.714 × VCC
This is marginally above a valid input high voltage for a 1.8-V signal (i.e., 0.65 × VCC).
The resulting VIH voltage for 20-kΩ pulldown resistor value would be:
VCC × 20 kΩ / (20 kΩ + 4 kΩ) = 0.833 × VCC
Which is above the valid input high voltage for a 1.8-V signal of 0.65 × VCC.
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25
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
TXS0206YFPR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
DSBGA
YFP
20
3000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
(3T2 ~ 3TR)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-May-2015
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TXS0206YFPR
Package Package Pins
Type Drawing
SPQ
DSBGA
3000
YFP
20
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
180.0
8.4
Pack Materials-Page 1
1.66
B0
(mm)
K0
(mm)
P1
(mm)
2.06
0.56
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Sep-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXS0206YFPR
DSBGA
YFP
20
3000
182.0
182.0
20.0
Pack Materials-Page 2
D: Max = 1.988 mm, Min =1.928 mm
E: Max = 1.588 mm, Min =1.527 mm
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