Texas Instruments | High Speed CMOS Logic Octal D-Type Flip-Flop, 3-State, Positive-Edge Triggered (Rev. A) | Datasheet | Texas Instruments High Speed CMOS Logic Octal D-Type Flip-Flop, 3-State, Positive-Edge Triggered (Rev. A) Datasheet

Texas Instruments High Speed CMOS Logic Octal D-Type Flip-Flop, 3-State, Positive-Edge Triggered (Rev. A) Datasheet
SCLS570A − FEBRUARY 2004 − REVISED APRIL 2008
D
D
D
D
D
D
D
Qualified for Automotive Applications
Buffered Inputs
Common 3-State Output-Enable Control
3-State Outputs
Bus-Line Driving Capability
Typical Propagation Delay (Clock to Q):
15 ns at VCC = 5 V, CL = 15 pF, TA = 255C
Fanout (Over Temperature Range)
− Standard Outputs . . . 10 LSTTL Loads
− Bus Driver Outputs . . . 15 LSTTL Loads
D Significant Power Reduction Compared to
D
D
D
LSTTL Logic ICs
VCC Voltage = 4.5 V to 5.5 V
Direct LSTTL Input Logic Compatibility,
VIL = 0.8 V (Max), VIH = 2 V (Min)
CMOS Input Compatibility, Il v 1 mA at VOL,
VOH
M OR PW PACKAGE
(TOP VIEW)
OE
D0
D1
D2
D3
D4
D5
D6
D7
GND
D Balanced Propagation Delay and Transition
Times
description/ordering information
The CD74HCT574 is an octal D-type flip-flop with
3-state outputs and the capability to drive 15 LSTTL
loads. The eight edge-triggered flip-flops enter data
into their registers on the low-to-high transition of the
clock (CP). The output enable (OE) controls the
3-state outputs and is independent of the register
operation. When OE is high, the outputs are in the
high-impedance state.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
CP
ORDERING INFORMATION{
PACKAGE‡
TA
−40°C to 125°C
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SOIC − M
Tape and reel
CD74HCT574QM96Q1
HCT574Q
TSSOP − PW
Tape and reel
CD74HCT574QPWRQ1
HCT574Q
† For the most current package and ordering information, see the Package Option Addendum at the end of
this document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2008, Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($%
%$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',(
$(%$2 #++ )#!#"($(!%-
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1
SCLS570A − FEBRUARY 2004 − REVISED APRIL 2008
FUNCTION TABLE
INPUTS
OE
CP
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
L
X
Q0
H
X
X
Z
NOTE: H = High voltage level (steady state)
L = Low voltage level (steady state)
X = Don’t care
↑ = Transition from low to high level
Q0 = Level before the indicated
steady-state
conditions
were
established
Z = High-impedance state
logic diagram (positive logic)
D0
D1
D
CP
D2
D
Q
CP
D3
D
Q
CP
D4
D
Q
D5
D
CP
Q
CP
D6
D
Q
CP
D7
D
Q
CP
D
CP
Q
Q
CP
OE
Q0
2
Q1
Q2
POST OFFICE BOX 655303
Q3
Q4
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Q5
Q6
Q7
SCLS570A − FEBRUARY 2004 − REVISED APRIL 2008
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < −0.5 V or VI > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < −0.5 V or VO > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Drain current per output, IO (VO > −0.5 V or VO < VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Output source or sink current per output, IO (VO > −0.5 V or VO < VCC + 0.5 V) . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND, ICC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Lead temperature (during soldering):
At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max . . . . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages referenced to GND unless otherwise specified.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
MAX
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
Output voltage
tt
Input transition (rise and fall) time
High-level input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
2
UNIT
V
V
0.8
V
VCC
VCC
V
0
VCC = 2 V
VCC = 4.5 V
0
1000
0
500
VCC = 6 V
0
400
V
ns
TA
Operating free-air temperature
−40
125
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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SCLS570A − FEBRUARY 2004 − REVISED APRIL 2008
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
CMOS loads
VOH
VI = VIH or VIL
VOL
VI = VIH or VIL
TTL loads
II
IOZ
VI = VCC or GND
VI = VIL or VIH,
VO = VCC or GND
ICC
VI = VCC or GND
TTL loads
CMOS loads
∆ICC
VI = VCC − 2.1 V,
CIN
CL = 50 pF
VCC
−0.02
4.5 V
4.4
4.4
−6
4.5 V
3.98
3.7
0.02
4.5 V
0.1
0.1
6
4.5 V
0.26
0.4
0
5.5 V
±0.1
±1
µA
6V
±0.5
±10
µA
8
160
µA
360
490
µA
10
10
pF
20
20
pF
0
MIN
TYP
MAX
5.5 V
4.5 V
to
5.5 V
See Note 4
TA = −40°C
TO 125°C
TA = 25°C
IO
(mA)
100
COUT
3-state
NOTE 4: For dual-supply systems, theoretical worst-case (VI = 2.4 V, VCC = 5.5 V) specification is 1.8 mA.
MIN
UNIT
MAX
V
V
HCT input loading
TYPE
’574
INPUT
UNIT LOADS†
D0−D7
0.4
CP
0.75
OE
0.6
† Unit load is ∆ICC limit specified in electrical
characteristics table, e.g., 360 µA max at 25°C.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
PARAMETER
VCC
TA = 25°C
TA = −40°C
TO 125°C
MIN
MIN
MAX
UNIT
MAX
fmax
tw
Maximum clock frequency
4.5 V
30
20
MHz
Clock pulse duration
4.5 V
16
24
ns
tsu
th
Setup time, data before clock↑
4.5 V
12
18
ns
Hold time, data after clock↑
4.5 V
5
5
ns
4
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SCLS570A − FEBRUARY 2004 − REVISED APRIL 2008
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
CP
Q
tdis
OE
Q
ten
OE
Q
PARAMETER
tt
fmax
Q
CP
LOAD
CAPACITANCE
VCC
CL = 50 pF
4.5 V
CL = 15 pF
5V
CL = 50 pF
4.5 V
CL = 15 pF
5V
CL = 50 pF
4.5 V
CL = 15 pF
5V
CL = 50 pF
4.5 V
CL = 15 pF
5V
TA = −40°C
TO 125°C
TA = 25°C
MIN
TYP
MAX
33
MIN
UNIT
MAX
50
ns
15
28
42
ns
11
30
45
ns
12
12
18
60
ns
MHz
operating characteristics, VCC = 5 V, TA = 25°C, input tr, tf = 6 ns
PARAMETER
Cpd
TYP
Power dissipation capacitance (see Note 5)
47
UNIT
pF
NOTE 5: Cpd is used to determine the dynamic power consumption (PD), per package.
PD = (CPD × VCC2 × fI) + Σ (CL × VCC2 × fO)
fI = input frequency
fO = output frequency
CL = output load capacitance
VCC = supply voltage
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SCLS570A − FEBRUARY 2004 − REVISED APRIL 2008
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
RL = 1 kΩ
From Output
Under Test
CL
(see Note A)
S1
VCC
Open
TEST
GND
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
CL
(see Note A)
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
3V
1.3 V
Timing Input
tw
tsu
3V
Input
1.3 V
0V
th
3V
1.3 V
1.3 V
Data Input
1.3 V
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
3V
1.3 V
Input
1.3 V
0V
tPLH
In-Phase
Output
tPHL
1.3 V
VOH
VOL
tPHL
Out-of-Phase
Output
1.3 V
3V
Output
Control
Output
Waveform 1
S1 at VCC
(see Note B)
1.3 V
0V
tPZL
1.3 V
tPLZ
≈VCC
1.3 V
tPZH
tPLH
VOH
1.3 V
VOL
1.3 V
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
10%
VOL
tPHZ
1.3 V
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
F. tPLH and tPHL are the same as tpd.
G. tPLZ and tPHZ are the same as tdis.
H. tPZH and tPZL are the same as ten.
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CD74HCT574QM96G4Q1
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HCT574Q1
CD74HCT574QPWRG4Q1
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HCT574Q1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD74HCT574-Q1 :
• Catalog: CD74HCT574
• Enhanced Product: CD74HCT574-EP
• Military: CD54HCT574
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CD74HCT574QM96G4Q1
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
CD74HCT574QPWRG4Q
1
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74HCT574QM96G4Q1
SOIC
DW
20
2000
367.0
367.0
45.0
CD74HCT574QPWRG4Q1
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
DW0020A
SOIC - 2.65 mm max height
SCALE 1.200
SOIC
C
10.63
TYP
9.97
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
20
1
13.0
12.6
NOTE 3
18X 1.27
2X
11.43
10
11
B
7.6
7.4
NOTE 4
20X
0.51
0.31
0.25
C A B
2.65 MAX
0.33
TYP
0.10
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.3
0.1
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
www.ti.com
EXAMPLE BOARD LAYOUT
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220724/A 05/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
11
10
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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