Texas Instruments | Octal D-Type Flip-Flop With Clear (Rev. A) | Datasheet | Texas Instruments Octal D-Type Flip-Flop With Clear (Rev. A) Datasheet

Texas Instruments Octal D-Type Flip-Flop With Clear (Rev. A) Datasheet
SCLS578A − MARCH 2004 − REVISED APRIL 2008
D
D
D
D
D
D
D
D
D
D Individual Data Input to Each Flip-Flop
D Applications Include:
Qualified for Automotive Applications
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 160-µA Max ICC
Typical tpd = 13 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Contain Eight Flip-Flops With Single-Rail
Outputs
Direct Clear Input
− Buffer/Storage Registers
− Shift Registers
− Pattern Generators
DW OR PW PACKAGE
(TOP VIEW)
CLR
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
description/ordering information
This circuit is a positive-edge-triggered D-type
flip-flop with a direct clear (CLR) input.
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
CLK
Information at the data (D) inputs meeting the setup
time requirements is transferred to the Q outputs on
the positive-going edge of the clock (CLK) pulse.
Clock triggering occurs at a particular voltage level and is not related directly to the transition time of the
positive-going pulse. When CLK is at either the high or low level, the D input has no effect at the output.
ORDERING INFORMATION{
−40°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE‡
TA
TOP-SIDE
MARKING
SOIC − DW
Reel of 2000
SN74HC273QDWRQ1
TSSOP − PW
Reel of 2000
SN74HC273QPWRQ1
HC273Q
HC273Q
† For the most current package and ordering information, see the Package Option Addendum at the end of
this document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
FUNCTION TABLE
(each flip-flop)
INPUTS
CLR
CLK
D
OUTPUT
Q
L
X
X
L
H
↑
H
H
H
↑
L
L
H
L
X
Q0
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2008, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
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1
SCLS578A − MARCH 2004 − REVISED APRIL 2008
logic diagram (positive logic)
1D
CLK
2D
3
11
3D
4
1D
1D
C1
5D
8
1D
C1
R
CLR
4D
7
1D
C1
R
6D
13
1D
C1
R
7D
14
1D
C1
R
8D
17
1D
C1
R
18
1D
C1
R
C1
R
R
1
2
1Q
5
6
2Q
3Q
9
12
4Q
15
5Q
6Q
16
7Q
19
8Q
logic diagram, each flip-flop (positive logic)
D
C
C
TG
TG
Q
C
C
C
C
TG
CLK(I)
TG
C
C
C
C
R
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCLS578A − MARCH 2004 − REVISED APRIL 2008
recommended operating conditions (see Note 3)
VCC
VIH
Supply voltage
VCC = 2 V
VCC = 4.5 V
High-level input voltage
VI
VO
∆t/∆v
NOM
MAX
2
5
6
3.15
V
0.5
1.35
V
1.8
Input voltage
0
Output voltage
VCC
VCC
0
VCC = 2 V
VCC = 4.5 V
Input transition rise/fall time
V
4.2
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
UNIT
1.5
VCC = 6 V
VCC = 2 V
VIL
MIN
V
V
1000
500
ns
VCC = 6 V
400
TA
Operating free-air temperature
−40
125
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −20 µA
VOH
VI = VIH or VIL
IOH = −4 mA
IOH = −5.2 mA
IOL = 20 µA
VOL
VI = VIH or VIL
IOL = 4 mA
IOL = 5.2 mA
II
ICC
VI = VCC or 0
VI = VCC or 0,
IO = 0
Ci
VCC
MIN
MIN
2V
1.9
1.998
1.9
4.5 V
4.4
4.499
4.4
6V
5.9
5.999
5.9
4.5 V
3.98
4.3
3.7
6V
5.48
5.8
MAX
UNIT
V
5.2
2V
0.002
0.1
0.1
4.5 V
0.001
0.1
0.1
6V
0.001
0.1
0.1
4.5 V
0.17
0.26
0.4
6V
0.15
0.26
0.4
6V
±0.1
±100
±1000
nA
8
160
µA
3
10
10
pF
6V
2 V to 6 V
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TA = 25°C
TYP
MAX
• DALLAS, TEXAS 75265
V
3
SCLS578A − MARCH 2004 − REVISED APRIL 2008
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
fclock
Clock frequency
CLR low
tw
Pulse duration
CLK high or low
Data
tsu
Setup time before CLK↑
CLR inactive
th
CLK↑
Hold time, data after CLK
TA = 25°C
MIN
MAX
MIN
MAX
2V
5
4
4.5 V
27
18
6V
32
21
2V
80
120
4.5 V
16
24
6V
14
20
2V
80
120
4.5 V
16
24
6V
14
20
2V
100
150
4.5 V
20
30
6V
17
25
2V
100
150
4.5 V
20
30
6V
17
25
2V
0
0
4.5 V
0
0
6V
0
0
UNIT
MHz
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tPHL
tpd
CLR
Any
CLK
Any
tt
Any
VCC
MIN
TA = 25°C
TYP
MAX
MIN
2V
5
11
4
4.5 V
27
50
18
6V
32
60
21
MAX
UNIT
MHz
2V
55
160
240
4.5 V
15
32
48
6V
12
27
41
2V
56
160
240
4.5 V
15
32
48
6V
13
27
41
2V
38
75
110
4.5 V
8
15
22
6V
6
13
19
ns
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance per flip-flop
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No load
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TYP
35
UNIT
pF
SCLS578A − MARCH 2004 − REVISED APRIL 2008
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
VCC
High-Level
Pulse
Test
Point
50%
50%
0V
tw
CL = 50 pF
(see Note A)
VCC
Low-Level
Pulse
50%
50%
0V
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
VCC
50%
50%
0V
tPLH
Reference
Input
VCC
50%
In-Phase
Output
50%
10%
0V
tsu
Data
Input 50%
10%
90%
tr
tPHL
VCC
50%
10% 0 V
90%
90%
tr
th
90%
tPHL
Out-of-Phase
Output
90%
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
tPLH
50%
10%
tf
tf
VOH
50%
10%
VOL
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
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5
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74HC273QDWRG4Q1
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HC273Q
SN74HC273QPWRG4Q1
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HC273Q
SN74HC273QPWRQ1
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
HC273Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2017
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74HC273-Q1 :
• Catalog: SN74HC273
• Military: SN54HC273
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Oct-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74HC273QDWRG4Q1
Package Package Pins
Type Drawing
SOIC
SN74HC273QPWRG4Q1 TSSOP
SN74HC273QPWRQ1
TSSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
PW
20
2000
330.0
16.4
6.95
7.0
1.4
8.0
16.0
Q1
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Oct-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74HC273QDWRG4Q1
SOIC
DW
20
2000
367.0
367.0
45.0
SN74HC273QPWRG4Q1
TSSOP
PW
20
2000
367.0
367.0
38.0
SN74HC273QPWRQ1
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
DW0020A
SOIC - 2.65 mm max height
SCALE 1.200
SOIC
C
10.63
TYP
9.97
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
20
1
13.0
12.6
NOTE 3
18X 1.27
2X
11.43
10
11
B
7.6
7.4
NOTE 4
20X
0.51
0.31
0.25
C A B
2.65 MAX
0.33
TYP
0.10
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.3
0.1
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
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EXAMPLE BOARD LAYOUT
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220724/A 05/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
11
10
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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