Texas Instruments | 8-Bit Parallel-Load Shift Register (Rev. A) | Datasheet | Texas Instruments 8-Bit Parallel-Load Shift Register (Rev. A) Datasheet

Texas Instruments 8-Bit Parallel-Load Shift Register (Rev. A) Datasheet
SCLS538A − AUGUST 2003 − REVISED APRIL 2008
D Qualified for Automotive Applications
D ESD Protection Exceeds 2000 V Per
D
D
D
D
D
D
D
D
D
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 80-µA Max ICC
Typical tpd = 13 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Synchronous Load
Direct Overriding Clear
Parallel-to-Serial Conversion
D OR PW PACKAGE
(TOP VIEW)
SER
A
B
C
D
CLK INH
CLK
GND
description/ordering information
1
16
2
15
3
14
4
13
5
12
6
11
VCC
SH/LD
H
QH
G
F
E
CLR
This parallel-in or serial-in, serial-out register
7
10
features gated clock (CLK, CLK INH) inputs and an
8
9
overriding clear (CLR) input. The parallel-in or
serial-in modes are established by the shift / load
(SH/LD) input. When high, SH/LD enables the serial (SER) data input and couples the eight flip-flops for serial
shifting with each clock (CLK) pulse. When low, the parallel (broadside) data inputs are enabled, and
synchronous loading occurs on the next clock pulse. During parallel loading, serial data flow is inhibited.
Clocking is accomplished on the low-to-high-level edge of CLK through a 2-input positive-NOR gate, permitting
one input to be used as a clock-enable or clock-inhibit function. Holding either CLK or CLK INH high inhibits
clocking; holding either low enables the other clock input. This allows the system clock to be free running, and
the register can be stopped on command with the other clock input. CLK INH should be changed to the high
level only when CLK is high. CLR overrides all other inputs, including CLK, and resets all flip-flops to zero.
ORDERING INFORMATION{
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE‡
TA
TOP-SIDE
MARKING
SOIC − D
Tape and reel
SN74HC166AIDRQ1
TSSOP − PW
Tape and reel
SN74HC166AIPWRQ1
HC166AI
HC166AI
† For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2008, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS538A − AUGUST 2003 − REVISED APRIL 2008
FUNCTION TABLE
OUTPUTS
INPUTS
INTERNAL
CLR
SH/LD
CLK INH
CLK
SER
PARALLEL
A...H
QA
QB
QH
L
X
X
X
X
X
L
L
L
H
X
L
L
X
X
QA0
QB0
QH0
H
L
L
↑
X
a...h
a
b
h
H
H
L
↑
H
X
H
QAn
QGn
H
H
L
↑
L
X
L
QAn
QGn
H
X
H
↑
X
X
QA0
QB0
QH0
logic diagram (positive logic)
A
SH/LD
SER
15
B
2
C
D
3
4
1D
C1
R
1D
C1
R
E
F
G
H
5
10
11
12
14
1D
C1
R
1D
C1
R
1D
C1
R
1D
C1
R
1D
C1
R
1
6
CLK INH
7
CLK
9
CLR
1D
C1
R
13
QH
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS538A − AUGUST 2003 − REVISED APRIL 2008
typical clear, shift, load, inhibit, and shift sequence
CLK
CLK INH
CLR
SER
SH/LD
Parallel
Inputs
A
H
B
L
C
H
D
L
E
H
F
L
G
H
H
H
QH
Serial Shift
Clear
H
Inhibit
H
L
H
L
H
L
H
Serial Shift
Load
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS538A − AUGUST 2003 − REVISED APRIL 2008
recommended operating conditions (see Note 3)
VCC
Supply voltage
VIH
VCC = 2 V
VCC = 4.5 V
High-level input voltage
2
5
6
3.15
V
V
0.5
1.35
V
1.8
0
Output voltage
VCC
VCC
0
VCC = 2 V
VCC = 4.5 V
Input transition rise/fall time
UNIT
4.2
Input voltage
∆t/∆v†
MAX
VCC = 4.5 V
VCC = 6 V
Low-level input voltage
VI
VO
NOM
1.5
VCC = 6 V
VCC = 2 V
VIL
MIN
V
V
1000
500
ns
VCC = 6 V
400
TA
Operating free-air temperature
−40
85
°C
† If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced
grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally,
the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
VOL
II
ICC
TEST CONDITIONS
MIN
2V
1.9
1.998
1.9
IOH = −20 µA
4.4
4.499
4.4
6V
5.9
5.999
5.9
IOH = −4 mA
IOH = −5.2 mA
4.5 V
3.98
4.3
3.84
6V
5.48
VI = VIH or VIL
5.8
MAX
UNIT
V
5.34
2V
0.002
0.1
0.1
IOL = 20 µA
4.5 V
0.001
0.1
0.1
6V
0.001
0.1
0.1
IOL = 4 mA
IOL = 5.2 mA
4.5 V
0.17
0.26
0.33
6V
0.15
0.26
0.33
6V
±0.1
±100
±1000
nA
8
80
µA
10
10
pF
VI = VIH or VIL
VI = VCC or 0
VI = VCC or 0,
TA = 25°C
MIN
TYP
MAX
4.5 V
IO = 0
Ci
4
VCC
6V
2 V to 6 V
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
V
SCLS538A − AUGUST 2003 − REVISED APRIL 2008
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC
fclock
Clock frequency
CLR low
tw
SH/LD high before CLK↑
SER before CLK↑
tsu
Setup time
CLK INH low before CLK↑
Data before CLK↑
CLR inactive before CLK↑
SH/LD high after CLK↑
SER after CLK
CLK↑
th
Data after CLK
CLK↑
POST OFFICE BOX 655303
MAX
2V
6
5
31
25
6V
36
29
2V
100
125
4.5 V
20
25
6V
17
21
2V
80
100
4.5 V
16
20
6V
14
17
2V
145
180
4.5 V
29
36
6V
25
31
2V
80
100
4.5 V
16
20
6V
14
17
2V
100
125
4.5 V
20
25
6V
17
21
2V
80
100
4.5 V
16
20
6V
14
17
2V
40
50
4.5 V
8
10
6V
7
9
2V
0
0
4.5 V
0
0
6V
0
0
2V
5
5
4.5 V
5
5
6V
5
5
2V
0
0
4.5 V
0
0
6V
0
0
Hold time
CLK INH high after CLK↑
MIN
4.5 V
Pulse duration
CLK high or low
TA = 25°C
MIN
MAX
2V
5
5
4.5 V
5
5
6V
5
5
• DALLAS, TEXAS 75265
UNIT
MHz
ns
ns
ns
5
SCLS538A − AUGUST 2003 − REVISED APRIL 2008
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tPHL
tpd
CLR
QH
CLK
QH
tt
Any
VCC
MIN
TA = 25°C
TYP
MAX
MIN
2V
6
11
5
4.5 V
31
36
25
6V
36
45
29
MAX
UNIT
MHz
2V
62
120
150
4.5 V
18
24
30
6V
13
20
26
2V
75
150
190
4.5 V
15
30
38
6V
13
26
32
2V
38
75
95
4.5 V
8
15
19
6V
6
13
16
ns
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
6
TEST CONDITIONS
Power dissipation capacitance
No load
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TYP
50
UNIT
pF
SCLS538A − AUGUST 2003 − REVISED APRIL 2008
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
VCC
High-Level
Pulse
Test
Point
50%
50%
0V
tw
CL = 50 pF
(see Note A)
VCC
Low-Level
Pulse
50%
50%
0V
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
VCC
50%
50%
0V
tPLH
Reference
Input
VCC
50%
In-Phase
Output
50%
10%
0V
tsu
Data
Input 50%
10%
90%
tr
tPHL
VCC
50%
10% 0 V
90%
90%
tr
th
90%
tPHL
Out-of-Phase
Output
90%
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
tPLH
50%
10%
tf
tf
VOH
50%
10%
VOL
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. For clock inputs, fmax is measured when the input duty cycle is 50%.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
SN74HC166AIDRQ1
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC166AI
SN74HC166AIPWRG4Q1
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HC166AI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74HC166A-Q1 :
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
• Enhanced Product: SN74HC166A-EP
NOTE: Qualified Version Definitions:
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74HC166AIPWRG4Q1 TSSOP
PW
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
12.4
Pack Materials-Page 1
6.9
B0
(mm)
K0
(mm)
P1
(mm)
5.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74HC166AIPWRG4Q1
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
NOTE 3
4.55
8
9
B
0.30
0.19
0.1
C A B
16X
4.5
4.3
NOTE 4
1.2 MAX
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0 -8
0.75
0.50
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
1
16
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
1
16X (0.45)
16
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising