Texas Instruments | Selectable GTL Voltage Reference (Rev. A) | Datasheet | Texas Instruments Selectable GTL Voltage Reference (Rev. A) Datasheet

Texas Instruments Selectable GTL Voltage Reference (Rev. A) Datasheet
SN74GTL3004
www.ti.com .................................................................................................................................................. SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008
SELECTABLE GTL VOLTAGE REFERENCE
FEATURES
1
•
•
•
•
•
•
VDD Range: 3.0 V to 3.6 V
VTT Range: 1 V to 1.3 V
Provides Selectable GTL VREF
– 0.615 × VTT
– 0.63 × VTT
– 0.65 × VTT
– 0.67 × VTT
±1% Resistor Ratio Tolerance
Ambient Temperature Range: –40°C to 85°C
ESD Protection Exceeds the Following Levels
Tests (Tested Per JESD-22):
– 2500-V Human-Body Model
(A114-B, Class II)
– 250-V Machine Model (A115-A)
– 1500-V Charged-Device Model (C101)
DCK PACKAGE
(TOP VIEW)
VDD
1
6
VTT
GND
2
5
GTL_REF
S0
3
4
S1
DESCRIPTION/ORDERING INFORMATION
The SN74GTL3004 provides for a selectable GTL Voltage Reference (GTL VREF). The value of the GTL VREF can
be adjusted using S0 and S1 select pins.
The S0 and S1 pins contain glitch-suppression circuitry for excellent noise immunity. When left floating, the S0
and S1 control input pins have 100-kΩ pullups that set the GTL VREF default value to the 0.67 × VTT ratio
(S0 = 1 and S1 =1).
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
SOT (SC70) – DCK
(1) (2)
Tape and reel
ORDERABLE PART NUMBER
SN74GTL3004DCKR
TOP-SIDE MARKING
2TK
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
SN74GTL3004
SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008 .................................................................................................................................................. www.ti.com
LOGIC DIAGRAM
VTT
R1
N1
R2
N2
R3
GTL_REF
N3
R4
N4
VCC
R5
100 kΩ
100 kΩ
S0
Control
Logic
S1
FUNCTION TABLE
2
S1
S0
RATIO SET
0
0
0.615 × VTT
0
1
0.63 × VTT
1
0
0.65 × VTT
1
1
0.67 × VTT
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74GTL3004
SN74GTL3004
www.ti.com .................................................................................................................................................. SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008
ABSOLUTE MINIMUM AND MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VDD
Power supply voltage range
–0.3
4.6
V
VTT
Termination voltage range (2)
–0.3
4.6
V
–0.3
VDD + 0.3
V
–0.3
VDD + 0.3
VIN
Control input voltage range
(2)
VGTL_REF Resistor output voltage range (2)
UNIT
V
IIK
Input clamp current
VIN < 0
–18
mA
IOK
Output clamp current
VO < 0
–18
mA
Continuous current through VDD or GND
θJA
Package thermal impedance (3)
Tstg
Storage temperature range
(1)
(2)
(3)
DCK package
–65
100
mA
259
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
PARAMETER
MIN
TYP
MAX
UNIT
VDD
Power supply voltage
3
3.3
3.6
V
VTT
Termination voltage
1
1.1
1.3
V
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI
Control input voltage
IOUT
IGTL_REF, GTL_REF output current
PW
Control input pulse width
110
TA
Operating free-air temperature
–40
(1)
VDD × 0.65
V
VDD × 0.35
0
0
V
VDD
V
10
µA
ns
°C
85
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow of Floating CMOS Inputs, literature number SCBA004.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range, TA = –40°C to 85°C, VDD = 3.3 V ±10%, GND = 0 V
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
Control
VDD = 3.6 V, IIN = –18 mA
IIN
Control
VDD = 3.6 V, VIN = GND
IDD
TYP
MAX
VDD = 3.6 V, VIN = GND, IO = 0 mA
R
End-to-end resistance
GTL VREF accuracy (1)
(1)
MIN
VDD = 3.6 V, VTT = 1.1 V, IO = 0 mA
4.25
7.12
UNIT
–1.8
V
43
µA
85
µA
10.6
kΩ
IO = 0 µA, See Figure 1
–1
1
IO = 10 µA, See Figure 1
–7
7
%
GTL VREF accuracy is used to compare measured GTL_VREF voltage versus expected GTL_VREF voltage as determined by control
inputs S0 and S1. The resistor ratio tolerance is incorporated into this parameter.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range,, TA = –40°C to 85°C, VDD = 3.3 V ±10%, GND = 0 V
(unless otherwise noted)
PARAMETER
PSR
TEST CONDITIONS
Power supply rejection
MIN
TYP
MAX
–58
Pulse rejection
dB
40
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74GTL3004
UNIT
ns
3
SN74GTL3004
SCBS873A – FEBRUARY 2008 – REVISED APRIL 2008 .................................................................................................................................................. www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
VTT
R1
N1
GTL_VREF accuracy is used to compare measured GTL_VREF
voltage versus expected GTL_VREF voltage as determined by
control inputs S0 and S1.
R2
N2
VREF
R3
S1
S0
Calculated VREF
0
0
0.615 X VTT
0
1
0.63 X VTT
1
0
0.65 X VTT
1
1
0.67 X VTT
N3
R4
N4
R5
% Accuracy = (((VREF measured/VREF calculated) – 1)/100)
S0
Logic
S1
Figure 1. GTL_REF Accuracy
4
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74GTL3004
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
SN74GTL3004DCKR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
SC70
DCK
6
3000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
2TK
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Jun-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74GTL3004DCKR
Package Package Pins
Type Drawing
SC70
DCK
6
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
9.2
Pack Materials-Page 1
2.3
B0
(mm)
K0
(mm)
P1
(mm)
2.55
1.2
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Jun-2011
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74GTL3004DCKR
SC70
DCK
6
3000
205.0
200.0
33.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising