Texas Instruments | Octal Buffer and Line Driver With 3-State Output (Rev. A) | Datasheet | Texas Instruments Octal Buffer and Line Driver With 3-State Output (Rev. A) Datasheet

Texas Instruments Octal Buffer and Line Driver With 3-State Output (Rev. A) Datasheet
SCLS509A − JUNE 2003 − REVISED FEBRUARY 2008
D Qualified for Automotive Applications
D ESD Protection Exceeds 1000 V Per
D
D
D
D
D
D
D
D
PW PACKAGE
(TOP VIEW)
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Operating Voltage Range of 4.5 V to 5.5 V
High-Current Outputs Drive Up To 15
LSTTL Loads
Low Power Consumption, 80-µA Max ICC
Typical tpd = 13 ns
±6-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
1
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
description/ordering information
This octal buffer and line driver is designed specifically to improve both the performance and density of 3-state
memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HCT244 device is
organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device
passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
ORDERING INFORMATION†
TA
ORDERABLE
PART NUMBER
PACKAGE‡
TOP-SIDE
MARKING
−40°C to 125°C
TSSOP − PW
Tape and reel
SN74HCT244QPWRQ1
HT244Q
† For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
FUNCTION TABLE
(each buffer/driver)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2008, Texas Instruments Incorporated
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POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
logic diagram (positive logic)
1OE
1A1
1A2
1A3
1A4
1
2OE
2
18
4
16
6
14
8
12
1Y1
2A1
1Y2
2A2
1Y3
2A3
1Y4
2A4
19
11
9
13
7
15
5
17
3
2Y1
2Y2
2Y3
2Y4
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
NOM
MAX
4.5
5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
∆t/∆v
Output voltage
0
High-level input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
Input transition rise/fall time
2
UNIT
V
V
0.8
V
VCC
VCC
V
500
ns
V
TA
Operating free-air temperature
−40
125
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VOH
VI = VIH or VIL
IOH = −20 µA
IOH = −6 mA
4.5 V
VOL
VI = VIH or VIL
IOL = 20 µA
IOL = 6 mA
4.5 V
II
IOZ
VI = VCC or 0
VO = VCC or 0,
ICC
VI = VCC or 0,
∆ICC†
MIN
TA = 25°C
TYP
MAX
MIN
4.4
4.499
4.4
3.98
4.3
3.7
MAX
UNIT
V
0.001
0.1
0.1
0.17
0.26
0.4
5.5 V
±0.1
±100
±1000
nA
VI = VIH or VIL
IO = 0
5.5 V
±0.01
±0.5
±10
µA
8
160
µA
One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC
5.5 V
1.4
2.4
3
mA
3
10
10
pF
5.5 V
4.5 V
to 5.5 V
Ci
V
† This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
OE
Y
tdis
OE
Y
tt
Y
VCC
TA = 25°C
MIN
TYP
MAX
MIN
MAX
4.5 V
15
28
42
5.5 V
13
25
38
4.5 V
21
35
53
5.5 V
19
32
48
4.5 V
19
35
53
5.5 V
18
32
48
4.5 V
8
12
18
5.5 V
7
11
16
UNIT
ns
ns
ns
ns
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tpd
A
Y
ten
OE
Y
tt
Y
VCC
TA = 25°C
MIN
TYP
MAX
MIN
MAX
4.5 V
21
45
68
5.5 V
18
40
61
4.5 V
25
52
79
5.5 V
22
47
71
4.5 V
17
42
63
5.5 V
14
38
57
UNIT
ns
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per buffer/driver
POST OFFICE BOX 655303
No load
• DALLAS, TEXAS 75265
TYP
40
UNIT
pF
3
PARAMETER MEASUREMENT INFORMATION
VCC
From Output
Under Test
CL
(see Note A)
PARAMETER
S1
Test
Point
tPZH
ten
RL
S2
1 kΩ
tPZL
tPHZ
tdis
tPLZ
−−
LOAD CIRCUIT
2.7 V
2.7 V
S1
S2
50 pF
or
150 pF
Open
Closed
Closed
Open
Open
Closed
Closed
Open
Open
Open
1 kΩ
tpd or tt
Input 1.3 V
0.3 V
CL
RL
50 pF
50 pF
or
150 pF
3V
1.3 V
0.3 V 0 V
tr
tf
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
3V
Input
1.3 V
Output
Control
(Low-Level
Enabling)
1.3 V
0V
tPLH
In-Phase
Output
1.3 V
10%
tPHL
90%
90%
tr
tPHL
Out-ofPhase
Output
90%
VOH
1.3 V
10% V
OL
tf
tPLH
1.3 V
10%
1.3 V
10%
tf
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES
3V
1.3 V
1.3 V
0V
tPZL
Output
Waveform 1
(See Note B)
tPLZ
≈VCC
1.3 V
10%
tPZH
Output
Waveform 2
(See Note B)
VOL
tPHZ
1.3 V
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
SN74HCT244QPWRG4Q1
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
HT244Q
SN74HCT244QPWRQ1
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
HT244Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74HCT244-Q1 :
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
• Catalog: SN74HCT244
• Enhanced Product: SN74HCT244-EP
• Military: SN54HCT244
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Oct-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74HCT244QPWRG4Q
1
TSSOP
PW
20
2000
330.0
16.4
6.95
7.0
1.4
8.0
16.0
Q1
SN74HCT244QPWRQ1
TSSOP
PW
20
2000
330.0
16.4
6.95
7.0
1.4
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Oct-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74HCT244QPWRG4Q1
TSSOP
PW
20
2000
367.0
367.0
38.0
SN74HCT244QPWRQ1
TSSOP
PW
20
2000
367.0
367.0
38.0
Pack Materials-Page 2
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