Texas Instruments | Hex Inverters With Open-Drain Outputs (Rev. C) | Datasheet | Texas Instruments Hex Inverters With Open-Drain Outputs (Rev. C) Datasheet

Texas Instruments Hex Inverters With Open-Drain Outputs (Rev. C) Datasheet
CD54ACT05,, CD74ACT05
HEX INVERTERS
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCHS311C – JANUARY 2001 – REVISED JANUARY 2007
FEATURES
•
•
•
•
•
CD54ACT05 . . . F PACKAGE
CD74ACT05 . . . E OR M PACKAGE
(TOP VIEW)
Inputs Are TTL-Voltage Compatible
Speed of Bipolar F, AS, and S, With
Significantly Reduced Power Consumption
Fanout to 15 F Devices
SCR-Latchup-Resistant CMOS Process and
Circuit Design
Exceeds 2-kV ESD Protection Per
MIL-STD-883, Method 3015
1A
1Y
2A
2Y
3A
3Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
6A
6Y
5A
5Y
4A
4Y
DESCRIPTION/ORDERING INFORMATION
The 'ACT05 devices contain six independent inverters. These devices perform the Boolean function Y = A. The
open-drain outputs require pullup resistors to perform correctly, and can be connected to other open-drain
outputs to implement active-low wired-OR or active-high wired-AND functions.
ORDERING INFORMATION
PACKAGE (1)
TA
PDIP – E
–55°C to 125°C
SOIC – M
CDIP – F
(1)
ORDERABLE PART NUMBER
Tube of 25
CD74ACT05E
Tube of 50
CD74ACT05M
Reel of 2500
CD74ACT05M96
Reel of 1000
CD54ACT05F3A
TOP-SIDE MARKING
CD74ACT05E
ACT05M
CD54ACT05F3A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH INVERTER)
INPUT
A
A
OUTPUT
Y
H
L
L
Z
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2001–2007, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are
tested unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
CD54ACT05,, CD74ACT05
HEX INVERTERS
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCHS311C – JANUARY 2001 – REVISED JANUARY 2007
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
–0.5
6
UNIT
VCC
Supply voltage range
IIK
Input clamp current (2)
VI < 0 or VI > VCC
±20
mA
IOK
Output clamp current (2)
VO < 0
–50
mA
IO
Continuous current
±50
mA
θJA
Package thermal impedance (3)
Tstg
Storage temperature range
(1)
(2)
(3)
E package
80
M package
86
–65
V
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
TA = 25°C
–40°C TO
85°C
–55°C TO
125°C
MIN
MAX
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
4.5
5.5
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
0
VCC
0
VCC
VO
Output voltage
0
5.5
0
5.5
IOL
Low-level output current
24
24
∆t/∆v
Input transition rise or fall rate
10
10
(1)
2
2
UNIT
V
2
0.8
V
0.8
0.8
V
0
VCC
V
0
5.5
V
24
mA
10
ns/V
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOL
II
ICC
∆ICC
TEST CONDITIONS
VI = VIH or VIL
VCC
TA = 25°C
–40°C TO
85°C
–55°C TO
125°C
MIN
MIN
MIN
2
MAX
IOL = 50 mA
4.5 V
0.1
0.1
IOL = 24 mA
4.5 V
0.36
0.44
IOL = 50 mA (1)
5.5 V
IOL = 75 mA (1)
5.5 V
UNIT
MAX
0.1
0.5
1.65
V
1.65
VI = VCC or GND
5.5 V
±0.1
±1
±1
VI = VCC or GND, IO = 0
5.5 V
4
40
80
µA
2.4
2.8
3
mA
10
10
10
pF
VI = VCC– 2.1 V
4.5 V to 5.5 V
Ci
(1)
MAX
µA
Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage
to minimize power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive
capability at 125°C.
Submit Documentation Feedback
CD54ACT05,, CD74ACT05
HEX INVERTERS
WITH OPEN-DRAIN OUTPUTS
www.ti.com
SCHS311C – JANUARY 2001 – REVISED JANUARY 2007
ACT INPUT LOAD TABLE
(1)
Input
Unit Load
A
0.18
(1)
Unit load is ∆ICC limit specified in
electrical characteristics table
(e.g., 2.4 mA at 25°C).
Switching Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see
Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
A or B
Y
tPZL
tPLZ
–40°C TO
85°C
–55°C TO
125°C
MIN
MAX
MIN
2.4
8.5
2.3
9.3
2.8
9.8
2.7
10.8
UNIT
MAX
ns
Operating Characteristics
VCC = 5 V, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TYP
UNIT
105
pF
PARAMETER MEASUREMENT INFORMATION
2 × VCC
From Output
Under Test
CL = 50 pF
(see Note A)
R1 =
500 Ω†
S1
VCC
50% VCC
Input
50% VCC
0V
R2 = 500 Ω†
tPZL
tPLZ
≈VCC
50% VCC
Output
†
When VCC = 1.5 V, R1 = R2 = 1 kΩ
20% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
LOAD CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
C. The outputs are measured one at a time, with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
Submit Documentation Feedback
3
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-9068601QCA
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9068601QC
A
CD54ACT05F3A
CD54ACT05F3A
ACTIVE
CDIP
J
14
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-9068601QC
A
CD54ACT05F3A
CD74ACT05E
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74ACT05E
CD74ACT05EE4
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74ACT05E
CD74ACT05M
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT05M
CD74ACT05M96
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT05M
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD54ACT05, CD74ACT05 :
• Catalog: CD74ACT05
• Military: CD54ACT05
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD74ACT05M96
Package Package Pins
Type Drawing
SOIC
D
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
9.0
2.1
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74ACT05M96
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
J0014A
CDIP - 5.08 mm max height
SCALE 0.900
CERAMIC DUAL IN LINE PACKAGE
PIN 1 ID
(OPTIONAL)
A
4X .005 MIN
[0.13]
.015-.060 TYP
[0.38-1.52]
1
14
12X .100
[2.54]
14X .014-.026
[0.36-0.66]
14X .045-.065
[1.15-1.65]
.010 [0.25] C A B
.754-.785
[19.15-19.94]
8
7
B
.245-.283
[6.22-7.19]
.2 MAX TYP
[5.08]
C
.13 MIN TYP
[3.3]
SEATING PLANE
.308-.314
[7.83-7.97]
AT GAGE PLANE
.015 GAGE PLANE
[0.38]
0 -15
TYP
14X .008-.014
[0.2-0.36]
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
www.ti.com
EXAMPLE BOARD LAYOUT
J0014A
CDIP - 5.08 mm max height
CERAMIC DUAL IN LINE PACKAGE
(.300 ) TYP
[7.62]
SEE DETAIL A
SEE DETAIL B
1
14
12X (.100 )
[2.54]
SYMM
14X ( .039)
[1]
8
7
SYMM
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
.002 MAX
[0.05]
ALL AROUND
(.063)
[1.6]
METAL
( .063)
[1.6]
SOLDER MASK
OPENING
METAL
(R.002 ) TYP
[0.05]
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
DETAIL A
DETAIL B
SCALE: 15X
13X, SCALE: 15X
4214771/A 05/2017
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertising