Texas Instruments | SN74AVCA406L Voltage-Translation Transceiver (Rev. B) | Datasheet | Texas Instruments SN74AVCA406L Voltage-Translation Transceiver (Rev. B) Datasheet

Texas Instruments SN74AVCA406L Voltage-Translation Transceiver (Rev. B) Datasheet
SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
www.ti.com
SCES634B – JANUARY 2006 – REVISED JUNE 2006
FEATURES
•
•
•
Transceiver for Memory Card Interface
[MultiMediaCard (MMC), Secure Digital (SD),
Memory Stick™ Compliant Products]
Configurable I/O Switching Levels With
Dual-Supply Pins Operating Over Full 1.2-V to
3.6-V Power-Supply Range
For Low-Power Operation, A and B Ports Are
Placed in High-Impedance State When Either
Supply Voltage Is Switched Off
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 6000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
The SN74AVCA406L is a transceiver for interfacing microprocessors with MultiMediaCards (MMCs), secure
digital (SD) cards, and Memory Stick™ compliant products.
Two supply-voltage pins allow the A-port and B-port input switching thresholds to be configured separately. The
A port is designed to track VCCA, while the B port is designed to track VCCB. VCCA and VCCB can accept any
supply voltage from 1.2 V to 3.6 V.
If either VCC is switched off (VCCA = 0 V and/or VCCB = 0 V), all outputs are placed in the high-impedance state to
conserve power.
The SN74AVCA406L enables system designers to easily interface low-voltage microprocessors to different
memory cards operating at higher voltages.
The SN74AVCA406L is available in two 0.5-mm-pitch ball grid array (BGA) packages. The 20-ball package has
dimensions of 3 mm × 2.5 mm, and the 24-ball package measures 3 mm × 3 mm. Memory cards are widely
used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low
static power consumption and small package size make the SN74AVCA406L an ideal choice for these
applications.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
UFBGA – GXY
Reel of 2500
SN74AVCA406LGXYR
WV406
UFBGA – ZXY (Pb-Free)
Reel of 2500
SN74AVCA406LZXYR
WV406
MicroStar Junior™ BGA – GQS
Reel of 2500
SN74AVCA406LGQSR
WM406L
MicroStar Junior™ BGA – ZQS
(Pb-Free)
Reel of 2500
SN74AVCA406LZQSR
WM406L
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar Junior is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
www.ti.com
SCES634B – JANUARY 2006 – REVISED JUNE 2006
GXY OR ZXY PACKAGE
(TOP VIEW)
A B C D
TERMINAL ASSIGNMENTS
(20-Ball GXY/ZXY Package)
A
B
C
D
5
5
VCCA
CMD-dir
DAT0-dir
VCCB
4
4
DAT3A
DAT2A
DAT2B
DAT3B
3
3
CLKA
GND
GND
CLKB
2
2
DAT1A
DAT0A
CMDB
DAT0B
1
1
CLK-f
CMDA
DAT123-dir
DAT1B
GQS OR ZQS PACKAGE
(TOP VIEW)
1
2
3
4
TERMINAL ASSIGNMENTS
(24-Ball GQS/ZQS Package)
5
1
2
3
4
5
A
A
DAT2A
CMD-dir
DAT0-dir
RSV
DAT2B
B
B
DAT3A
VCCA
VCCB
DAT3B
C
C
CLKA
RSV
GND
GND
CLKB
D
D
DAT0A
CMDA
RSV
CMDB
DAT0B
E
E
DAT1A
CLK-f
DAT123-dir
RSV
DAT1B
REFERENCE DESIGN
VCCA
VCCB
U1A
U2
VDDA
DAT0-dir
DAT0
DAT123-dir
DAT1
DAT2
DAT3
CMD-dir
CMD
CLK
CLKin
GND
WP
CD
Processor
SD/SDIO MMC
A5
C5
B2
C1
A2
B4
A4
B5
B1
A3
A1
C3
B3
VCCA
DAT0-dir
DAT0A
DAT123-dir
DAT1A
DAT2A
DAT3A
CMD-dir
CMDA
CLKA
CLK-f
GND
GND
VCCB
D5
D2 DAT0B
DAT0B
DAT1B D1 DAT1B
DAT2B C4 DAT2B
DAT3B D4 DAT3B
C2 CMDB
CMDB
D3 CLKB
CLKB
CLKB
DAT0B
DAT1B
CD
WP
SN74AVCA406LZXYR
WP
CD
Figure 1. Interfacing With SD/SDIO Card
2
VCCB
C1
0.1 mA
R1
R2
R3
R4
R5
R6
R7
C4
0.1 mA
VCCA
100 k
100 k
100 k
100 k
100 k
100 k
100 k
C3
0.1 mA
VCCB
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J1
DAT2B
DAT3B
CMDB
0
1
2
3
4
5
6
7
8
9
10
11
12
13
DAT2
DAT3
CMD
VSS1
VDD
CLK
VSS2
DAT0
DAT1
WP/CD (Physical)
CD (Physical)
GND
GND
WP (Physical)
54794-0978
SD/SDIO Card
Connector
SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
www.ti.com
SCES634B – JANUARY 2006 – REVISED JUNE 2006
PIN DESCRIPTION
GXY/ZXY
NO.
GQS/ZQS
NO.
NAME
A1
E2
CLK-f
A2
E1
DAT1A
A3
C1
CLKA
A4
B1
DAT3A
A5
B3
VCCA
B1
D2
CMDA
Command bit connected to host. Referenced to VCCA.
I/O
B2
D1
DAT0A
Data bit 1 connected to host. Referenced to VCCA.
I/O
B3
C4
GND
B4
A1
DAT2A
Data bit 3 connected to host. Referenced to VCCA.
I/O
Direction control for command bit (CMDA/CMDB)
Input
Direction control for DAT1A/B, DAT2A/B, and DAT3A/B
Input
FUNCTION
Clock feedback to host for resynchronizing data. Used in OMAP processors.
Leave unconnected if not used.
Data bit 2 connected to host. Referenced to VCCA.
Clock signal connected to host. Referenced to VCCA.
Data bit 4 connected to host. Referenced to VCCA.
A-port supply voltage. VCCA powers all A-port I/Os and control inputs.
B5
A2
CMD-dir
E3
DAT123-dir
C2
D4
CMDB
C3
C3
GND
C4
A5
DAT2B
C5
A3
DAT0-dir
D1
E5
DAT1B
Data bit 2 connected to memory card. Referenced to VCCB.
D2
D5
DAT0B
Data bit 1 connected to memory card. Referenced to VCCB.
D3
C5
CLKB
D4
B5
DAT3B
VCCB
D5
B4
B2
NA
A4, C2, D3,
E4
Output
I/O
Input
I/O
Power
Ground
C1
NA
TYPE
Command bit connected to memory card. Referenced to VCCB.
I/O
Ground
Data bit 3 connected to memory card. Referenced to VCCB
Direction control for DAT0A/DAT0B
Clock signal connected to memory card. Referenced to VCCB.
Data bit 4 connected to memory card. Referenced to VCCB.
B-port supply voltage. VCCB powers all B-port I/Os.
I/O
Input
I/O
I/O
Output
I/O
Power
Depopulated ball
RSV
Reserved (for possible future functionality). Leave unconnected.
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SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
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SCES634B – JANUARY 2006 – REVISED JUNE 2006
FUNCTION TABLES
OUTPUT CIRCUITS
CONTROL INPUT
CMD-dir
CMDA
CMDB
High
Hi-Z
Enabled
CMDA to CMDB
Low
Enabled
Hi-Z
CMDB to CMDA
CONTROL INPUT
DAT0-dir
OUTPUT CIRCUITS
OPERATION
FUNCTION
DAT0A
DAT0B
High
Hi-Z
Enabled
DAT0A to DAT0B
Low
Enabled
Hi-Z
DAT0B to DAT0A
CONTROL INPUT
DAT123-dir
DAT1A,
DAT2A,
DAT3A
DAT1B,
DAT2B,
DAT3B
FUNCTION
High
Hi-Z
Enabled
OUTPUT CIRCUITS
DAT1A to DAT1B
DAT2A to DAT2B
DAT3A to DAT3B
DAT1B to DAT1A
Low
Enabled
Hi-Z
DAT2B to DAT2A
DAT3B to DAT3A
4
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SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
www.ti.com
SCES634B – JANUARY 2006 – REVISED JUNE 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
CMD-dir
CMDB
CMDA
DAT0-dir
DAT0B
DAT0A
DAT123-dir
DAT1A
DAT1B
DAT2A
DAT2B
DAT3A
DAT3B
CLKA
CLKB
CLK-f
VCCA
VCCB
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SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
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SCES634B – JANUARY 2006 – REVISED JUNE 2006
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
Supply voltage range
VI
Input voltage range (2)
MIN
MAX
–0.5
4.6
I/O ports (A port)
–0.5
4.6
I/O ports (B port)
–0.5
4.6
Control inputs
–0.5
4.6
A port
–0.5
4.6
B port
–0.5
4.6
A port
–0.5 VCCA + 0.5
B port
–0.5 VCCB + 0.5
V
V
VO
Voltage range applied to any output
in the high-impedance or power-off state (2)
VO
Voltage range applied to any output in the high or low state (2) (3)
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through VCCA, VCCB, or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
6
UNIT
GQS/ZQS package
171.6
GXY/ZXY package
193
–65
150
V
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
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MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
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SCES634B – JANUARY 2006 – REVISED JUNE 2006
Recommended Operating Conditions
(1) (2) (3)
VCCI
VCCO
MIN
MAX
UNIT
VCCA
Supply voltage
1.2
3.6
V
VCCB
Supply voltage
1.2
3.6
V
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
VI/O
Input/output voltage
IOH
All inputs (4)
All
2
V
1.2 V to 1.95 V
VCCI × 0.35
1.95 V to 2.7 V
0.7
2.7 V to 3.6 V
0.8
3.6
0
VCCO
3-state
0
3.6
Low-level output current (B port)
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(4)
1.7
2.7 V to 3.6 V
0
High-level output current (B port)
IOL
1.95 V to 2.7 V
Active state
Low-level output current (A port)
IOH
VCCI × 0.65
Control inputs
High-level output current (A port)
IOL
(1)
(2)
(3)
inputs (4)
1.2 V to 1.95 V
1.2 V
–1
1.4 V to 1.6 V
–1
1.65 V to 1.95 V
–2
2.3 V to 2.7 V
–4
3 V to 3.6 V
–8
1.2 V
1
1.4 V to 1.6 V
1
1.65 V to 1.95 V
2
2.3 V to 2.7 V
4
3 V to 3.6 V
8
1.2 V
–1
1.4 V to 1.6 V
–2
1.65 V to 1.95 V
–4
2.3 V to 2.7 V
–8
3 V to 3.6 V
–16
1.2 V
1
1.4 V to 1.6 V
2
1.65 V to 1.95 V
4
2.3 V to 2.7 V
8
3 V to 3.6 V
16
–40
V
V
V
mA
mA
mA
mA
5
ns/V
85
°C
VCCI is the VCC associated with the input port.
VCCO is the VCC associated with the output port.
All unused data inputs of the device must be held at VCCI or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CMD-dir, DAT0-dir, and DAT123-dir are referenced to VCCA.
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SCES634B – JANUARY 2006 – REVISED JUNE 2006
Electrical Characteristics (1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCCB
1.2 V to 3.6 V
1.2 V to 3.6 V
1.2 V
1.2 V
1.4 V
1.4 V
1.05
1.65 V
1.65 V
1.2
IOH = –4 mA
2.3 V
2.3 V
1.75
IOH = –8 mA
3V
3V
2.3
IOL = 100 µA
1.2 V to 3.6 V
1.2 V to 3.6 V
1.2 V
1.2 V
1.4 V
1.4 V
0.35
1.65 V
1.65 V
0.45
2.3 V
2.3 V
0.55
IOH = –100 µA
IOH = –1 mA
VOH
A port
IOH = –2 mA
VI = VIH
IOL = 1 mA
VOL
A port
IOL = 2 mA
VI = VIL
IOL = 4 mA
IOL = 8 mA
IOH = –100 µA
IOH = –1 mA
VOH
B port
IOH = –2 mA
IOH = –4 mA
VI = VIH
IOH = –8 mA
B port
1.1
1.4 V
1.4 V
1.05
1.65 V
1.65 V
1.2
2.3 V
2.3 V
1.75
2.3
V
1.4 V
0.35
1.65 V
1.65 V
0.45
IOL = 8 mA
2.3 V
2.3 V
0.55
IOL = 16 mA
3V
3V
0.7
1.2 V to 3.6 V
1.2 V to 3.6 V
±1
IOL = 4 mA
VI = VIL
A or B port
VO = VCCO or
GND,
VI = VCCI or GND
See function
table for input
states when
outputs are Hi Z
VI = VCCI or GND,
IO = 0
VI = VCCI or GND,
VI = VCCI or GND,
VI = VCCA or GND
IO = 0
IO = 0
A port
VO = VCCA or GND
B port
VO = VCCB or GND
0.2
0.07
0V
0 V to 3.6 V
±5
0 V to 3.6 V
0V
±5
3.6 V
3.6 V
±5
1.2 V to 3.6 V
1.2 V to 3.6 V
10
3.6 V
0V
10
0V
3.6 V
–1
1.2 V to 3.6 V
1.2 V to 3.6 V
10
3.6 V
0V
–1
0V
3.6 V
10
1.2 V to 3.6 V
1.2 V to 3.6 V
15
1.8 V
3V
Clock input
8
0.7
1.4 V
IOL = 2 mA
1.8 V
VCCO is the VCC associated with the output port.
VCCI is the VCC associated with the input port.
All typical values are at TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
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3V
V
VCCO – 0.2
1.2 V
IOZ (4)
(1)
(2)
(3)
(4)
0.07
1.2 V
VI or VO = 0 to 3.6 V
Cio
0.2
3V
A or B port
Ci
V
1.2 V to 3.6 V
Ioff
Control
inputs
1.2 V
1.1
3V
VI = VCCA or GND
ICCA + ICCB
1.2 V
UNIT
VCCO – 0.2
1.2 V to 3.6 V
Control
inputs
ICCB
3V
1.2 V to 3.6 V
MAX
IOL = 100 µA
II
ICCA
3V
1.2 V to 3.6 V
MIN TYP (3)
IOH = –16 mA
IOL = 1 mA
VOL
TA = 25°C
VCCA
1.5
2
2
2.5
2.5
3
2.5
3
V
µA
µA
µA
µA
µA
µA
pF
pF
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MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
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SCES634B – JANUARY 2006 – REVISED JUNE 2006
Output Slew Rates
(1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
FROM
VCCA = 1.8 V ± 0.15 V,
VCCB = 3 V ± 0.3 V
TO
MIN
(1)
(2)
UNIT
MAX
tr
10%
90%
3 (2)
ns
tf
90%
10%
3 (2)
ns
Values are characterized, but not production tested.
Using CL = 15 pF on the B side and CL = 7 pF on the A side
Typical Switching Characteristics
TA = 25°C, VCCA = 1.2 V (see Figure 2)
PARAMETER
tpd
(1)
VCCB =
1.2 V
VCCB =
1.5 V
VCCB =
1.8 V
VCCB =
2.5 V
VCCB =
3V
VCCB =
3.3 V
TYP
TYP
TYP
TYP
TYP
TYP
3.8
3
2.6
2.5
2.5
2.6
4.6
4.2
4
3.9
3.9
3.8
CLKB
3.8
3
2.6
2.5
2.5
2.6
CLK-f
8.4
7.2
6.6
6.4
6.4
6.4
CMDA
CMDB
3.8
3
2.6
2.5
2.5
2.6
CMDB
CMDA
4.6
4.2
4
3.9
3.9
3.8
B
4.8
4
3.7
3.4
3.4
3.4
A
4.5
4.4
5
5.4
5.4
5.4
B
6.3
5.2
5.6
4.8
4.8
6.1
A
4.8
4.6
5.3
5.4
5.4
5.3
FROM
(INPUT)
TO
(OUTPUT)
A
B
B
A
CLKA
ten (1)
DIR
tdis (1)
DIR
UNIT
ns
ns
ns
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (see Figure 2)
PARAMETER
tpd
(1)
FROM
(INPUT)
TO
(OUTPUT)
A
B
VCCB =
1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
TYP
MIN
MAX
B
3.4
1.1
A
3.8
1.4
CLKB
3.4
1.1
5.6
1
CLK-f
7.2
2.6
11.6
2.3
CMDA
CMDB
3.4
1.1
5.6
1
CMDB
CMDA
3.8
1.4
6
1.3
B
4
1.3
7.7
A
3.5
1.4
7
B
5.7
1.9
A
3.4
1.2
CLKA
ten (1)
DIR
tdis (1)
DIR
MIN
MAX
5.6
1
6
1.3
VCCB = 2.5 V
± 0.2 V
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
MIN
MAX
MIN
MAX
MIN
MAX
4.8
1
3.9
0.9
3.9
0.9
3.8
5.6
1.3
5.2
0.5
5.2
0.3
5.2
4.8
1
3.9
0.9
3.9
0.9
3.8
10.4
2.3
9.1
1.3
9.1
1.2
9
4.8
1
3.9
0.9
3.9
0.9
3.8
5.6
1.3
5.2
0.5
5.2
0.3
5.2
1.1
6.9
0.8
6.1
0.8
6
0.8
5.9
1.5
7.4
1.7
8.2
1.7
8.2
1.7
7.7
8.9
2.1
10.4
1.8
8.7
1.7
8.5
2.4
11.4
7
1.2
6.8
1.2
6.9
1.2
6.5
1.2
6.6
UNIT
ns
ns
ns
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
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SCES634B – JANUARY 2006 – REVISED JUNE 2006
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (see Figure 2)
PARAMETER
tpd
(1)
FROM
TO
(INPUT) (OUTPUT)
VCCB =
1.2 V
TYP
VCCB = 1.5 V
± 0.1 V
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN MAX
VCCB = 2.5 V
± 0.2 V
MIN
MAX
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
MIN MAX
MIN
MAX
A
B
3.2
1
5.2
0.8
4.4
0.7
3.5
0.6
3.4
0.7
3.1
B
A
3.4
1.1
5.2
1
4.8
0.9
4.3
0.3
4.3
0.2
4.3
CLKB
3.2
1
5.2
0.8
4.4
0.7
3.5
0.6
3.4
0.7
3.1
CLK-f
6.5
2.1
10.4
1.8
9.1
1.7
7.8
0.9
7.7
0.9
7.4
CMDA
CMDB
3.2
1
5.2
0.8
4.4
0.7
3.5
0.6
3.4
0.7
3.1
CMDB
CMDA
3.4
1.1
5.2
1
4.8
0.9
4.3
0.3
4.3
0.2
4.3
B
3.5
1.2
6.8
0.9
6
0.7
5.1
0.7
5
0.7
4.8
A
2.9
1.1
4.7
1.1
5.2
1.4
5.1
1.4
5.1
1.4
5.3
B
5.3
1.6
8.4
2
9.5
1.6
8.2
1.4
8.1
2.2
8.2
A
3.6
1.3
7.7
1.2
7.9
1.3
7.5
1.3
7.5
1.3
7.6
CLKA
ten (1)
DIR
tdis(1)
DIR
UNIT
ns
ns
ns
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (see Figure 2)
PARAMETER
tpd
(1)
10
FROM
(INPUT)
TO
(OUTPUT)
A
B
VCCB =
1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
B
3
0.8
4.7
0.7
3.8
0.6
2.9
0.4
2.7
0.5
2.5
A
3
0.9
4.4
0.7
3.9
0.6
3.3
0.3
3.2
0.3
3.2
CLKB
3
0.8
4.7
0.7
3.8
0.6
2.9
0.4
2.7
0.5
2.5
CLK-f
6
1.7
9.1
1.4
7.7
1.1
6.2
0.7
5.9
0.8
5.7
CMDA
CMDB
3
0.8
4.7
0.7
3.8
0.6
2.9
0.4
2.7
0.5
2.5
CMDB
CMDA
3
0.9
4.4
0.7
3.9
0.6
3.3
0.3
3.2
0.3
3.2
B
3.1
1
5.7
0.8
4.8
0.5
3.9
0.5
3.7
0.5
3.6
A
2.2
0.7
3.5
0.6
4.3
1.2
4.4
0.7
4.6
0.4
4.7
B
4.6
1.4
7.6
1.8
8.4
1.3
7.2
1.3
7.1
2
7.5
A
2.6
0.9
5.6
0.9
5.4
1
5.5
0.9
5.5
0.9
5.8
CLKA
ten (1)
DIR
tdis
DIR
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
Submit Documentation Feedback
UNIT
MIN MAX
ns
ns
ns
SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
www.ti.com
SCES634B – JANUARY 2006 – REVISED JUNE 2006
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (see Figure 2)
PARAMETER
tpd
(1)
FROM
(INPUT)
TO
(OUTPUT)
A
B
VCCB =
1.2 V
VCCB = 1.5 V
± 0.1 V
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3 V
± 0.3 V
TYP
MIN
MAX
MIN
MAX
MIN
MAX
B
2.8
0.8
4.5
0.6
3.6
0.4
2.7
0.4
A
2.9
0.8
4.3
0.6
3.7
0.5
3
0.5
CLKB
2.8
0.8
4.5
0.6
3.6
0.4
2.7
CLK-f
5.7
1.6
8.8
1.2
7.3
0.9
CMDA
CMDB
2.8
0.8
4.5
0.6
3.6
CMDB
CMDA
2.9
0.8
4.3
0.6
3.7
B
3
1
5.1
0.6
A
2
0.6
3.1
B
4.4
1.4
A
3.7
1.5
CLKA
ten (1)
DIR
tdis (1)
DIR
MIN MAX
VCCB = 3.3 V
± 0.3 V
MIN
MAX
2.7
0.3
2.3
3
0.1
2.7
0.4
2.7
0.3
2.3
5.7
0.9
5.7
0.4
5
0.4
2.7
0.4
2.7
0.3
2.3
0.5
3
0.5
3
0.1
2.7
4.3
0.5
3.4
0.5
3.4
0.4
3
0.6
5.4
0.7
5.4
0.7
5.4
0.5
5.4
7.4
1.8
8.3
1.2
7
1.2
7
2
7.3
8.1
1.5
7.9
1.5
7.9
1.5
7.9
1.5
8
UNIT
ns
ns
ns
DIR refers to CMD-dir, DAT0-dir, and DAT123-dir.
Typical Frequency and Output Skew
TA = 25°C, VCCA = 1.2 V (see Figure 2)
PARAMETER
Clock
tmax
Data
tsk(o)
Channel
to
channel
VCCB = 3 V
VCCB = 3.3 V
TYP
TYP
TYP
TYP
TYP
TYP
CLKB
95
95
95
95
95
95
CLK-f
95
95
95
95
95
95
A
B
95
95
95
95
95
95
B
A
95
95
95
95
95
95
A
B
0.5
0.4
0.4
0.3
0.5
0.5
ns
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
UNIT
FROM
(INPUT)
CLKA
TO
(OUTPUT)
VCCB = 1.2 V VCCB = 1.5 V VCCB = 1.8 V VCCB = 2.5 V
UNIT
MHz
Maximum Frequency and Output Skew
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (see Figure 2)
PARAMETER
Clock
fmax
Data
Channel
tsk(o) to
channel
FROM
(INPUT)
TO
(OUTPUT)
VCCB =
1.2 V
TYP
VCCB = 1.5 V
± 0.1 V
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
MAX
MIN MAX
MIN
CLKB
95
95
95
95
95
95
CLK-f
95
95
95
95
95
95
A
B
95
95
95
95
95
95
B
A
95
95
95
95
95
95
DIR
B
0.3
CLKA
0.3
0.3
Submit Documentation Feedback
0.3
0.5
MAX
MHz
0.4
ns
11
SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
www.ti.com
SCES634B – JANUARY 2006 – REVISED JUNE 2006
Maximum Frequency and Output Skew
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (see Figure 2)
PARAMETER
Clock
fmax
Data
tsk(o)
Channel
to
channel
FROM
(INPUT)
TO
(OUTPUT)
VCCB =
1.2 V
VCCB = 1.5 V
± 0.1 V
TYP
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
MAX
VCCB = 3 V
± 0.3 V
MIN MAX
VCCB = 3.3 V
± 0.3 V
MIN
CLKB
95
95
95
95
95
95
CLK-f
95
95
95
95
95
95
A
B
95
95
95
95
95
95
B
A
95
95
95
95
95
95
DIR
B
0.3
CLKA
0.3
0.3
0.3
UNIT
MAX
MHz
0.5
0.3
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
ns
Maximum Frequency and Output Skew
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (see Figure 2)
PARAMETER
Clock
fmax
Data
tsk(o)
Channel
to
channel
FROM
(INPUT)
TO
(OUTPUT)
VCCB =
1.2 V
VCCB = 1.5 V
± 0.1 V
TYP
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
MAX
MIN MAX
MIN
CLKB
95
95
95
95
95
95
CLK-f
95
95
95
95
95
95
A
B
95
95
95
95
95
95
B
A
95
95
95
95
95
95
DIR
B
0.3
CLKA
0.3
0.3
0.2
UNIT
MAX
MHz
0.6
0.3
VCCB = 3 V
± 0.3 V
VCCB = 3.3 V
± 0.3 V
ns
Maximum Frequency and Output Skew
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (see Figure 2)
PARAMETER
Clock
fmax
Data
Channel
tsk(o) to
channel
12
FROM
(INPUT)
TO
(OUTPUT)
VCCB =
1.2 V
TYP
VCCB = 1.5 V
± 0.1 V
MIN
MAX
VCCB = 1.8 V
± 0.15 V
MIN
MAX
VCCB = 2.5 V
± 0.2 V
MIN
MAX
MIN MAX
MIN
CLKB
95
95
95
95
95
95
CLK-f
95
95
95
95
95
95
A
B
95
95
95
95
95
95
B
A
95
95
95
95
95
95
DIR
B
0.3
CLKA
0.3
0.4
Submit Documentation Feedback
0.3
0.6
UNIT
MAX
MHz
0.4
ns
SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
www.ti.com
SCES634B – JANUARY 2006 – REVISED JUNE 2006
Operating Characteristics
TA = 25°C
PARAMETER
CpdA (1)
CpdB (1)
(1)
A-port
input,
B-port
output
B-port
input,
A-port
output
A-port
input,
B-port
output
B-port
input,
A-port
output
TEST
CONDITIONS
VCCA =
VCCB = 1.2 V
VCCA =
VCCB = 1.5 V
VCCA =
VCCB = 1.8 V
VCCA =
VCCB = 2.5 V
VCCA =
VCCB = 3 V
VCCA =
VCCB = 3.3 V
TYP
TYP
TYP
TYP
TYP
TYP
1.9
2
2.1
2.4
2.7
2.9
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
UNIT
pF
4.4
4.5
4.6
4.7
4.8
4.9
5.3
5.4
5.4
5.7
5.8
5.9
CL = 0,
f = 10 MHz,
tr = tf = 1 ns
pF
0.3
0.3
0.4
0.5
0.6
0.6
Power dissipation capacitance per transceiver
Submit Documentation Feedback
13
SN74AVCA406L
MMC, SD CARD, Memory Stick™ VOLTAGE-TRANSLATION TRANSCEIVER
www.ti.com
SCES634B – JANUARY 2006 – REVISED JUNE 2006
PARAMETER MEASUREMENT INFORMATION
2 × VCCO
RL
From Output
Under Test
S1
Open
GND
CL
(see Note A)
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCCO
GND
RL
LOAD CIRCUIT
VCCO
CL
RL
VTP
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
15 pF
15 pF
15 pF
15 pF
2 kΩ
2 kΩ
2 kΩ
2 kΩ
0.1 V
0.15 V
0.15 V
0.3 V
VCCA
Output
Control
(low-level
enabling)
VCCA/2
VCCA/2
0V
tPZL
VCCI
Input
VCCI/2
VCCI/2
0V
tPLH
Output
tPHL
VOH
VCCO/2
VOL
VCCO/2
tPLZ
VCCO
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
VCCO/2
VOL + VTP
VOL
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
tPHZ
VCCO/2
VOH – VTP
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 Ω, dv/dt ≥ 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
Figure 2. Load Circuit and Voltage Waveforms
14
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
6-Jan-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
SN74AVCA406LGQSR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GQS
24
2500
TBD
SNPB
Level-1-240C-UNLIM
SN74AVCA406LGXYR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GXY
20
2500
TBD
SNPB
Level-1-240C-UNLIM
SN74AVCA406LZQSR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQS
24
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74AVCA406LZXYR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZXY
20
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Jan-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74AVCA406LGQSR
BGA MI
CROSTA
R JUNI
OR
GQS
24
2500
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q1
SN74AVCA406LGXYR
BGA MI
CROSTA
R JUNI
OR
GXY
20
2500
330.0
12.4
2.8
3.3
1.0
4.0
12.0
Q2
SN74AVCA406LZQSR
BGA MI
CROSTA
R JUNI
OR
ZQS
24
2500
330.0
12.4
3.3
3.3
1.6
8.0
12.0
Q1
SN74AVCA406LZXYR
BGA MI
CROSTA
R JUNI
OR
ZXY
20
2500
330.0
12.4
2.8
3.3
1.0
4.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Jan-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74AVCA406LGQSR
BGA MICROSTAR
JUNIOR
GQS
24
2500
340.5
338.1
20.6
SN74AVCA406LGXYR
BGA MICROSTAR
JUNIOR
GXY
20
2500
340.5
338.1
20.6
SN74AVCA406LZQSR
BGA MICROSTAR
JUNIOR
ZQS
24
2500
340.5
338.1
20.6
SN74AVCA406LZXYR
BGA MICROSTAR
JUNIOR
ZXY
20
2500
340.5
338.1
20.6
Pack Materials-Page 2
MECHANICAL DATA
MPBG127B – APRIL 2000 – REVISED FEBRUARY 2002
GQS (S-PBGA-N24)
PLASTIC BALL GRID ARRAY
3,10
SQ
2,90
2,00 TYP
0,50
E
0,50
D
2,00 TYP
C
B
A
1
A1 Corner
2
3
4
5
Bottom View
0,77
0,71
1,00 MAX
Seating Plane
0,35
0,25
0,05 M
0,25
0,15
0,08
4201012/D 01/02
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
MicroStar JuniortBGA configuration
Falls within JEDEC MO-225
MicroStar Junior is a trademark of Texas Instruments.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
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DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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Copyright © 2009, Texas Instruments Incorporated
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