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Texas Instruments SN74ABT16373A-EP Datasheet
SN74ABT16373A-EP
16-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCBS810 – MARCH 2006
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
•
(1)
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
Extended Temperature Performance of
–55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product Change Notification
Qualification Pedigree (1)
Member of the Texas Instruments Widebus™
Family
State-of-the-Art EPIC-IIB™ BiCMOS Design
Significantly Reduces Power Dissipation
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 5 V, TA = 25°C
High-Impedance State During Power Up and
Power Down
Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
High-Drive Outputs (–24-mA IOH, 48-mA IOL)
Plastic 300-mil Shrink Small-Outline (DL)
Package
DL PACKAGE
(TOP VIEW)
1OE
1Q1
1Q2
GND
1Q3
1Q4
VCC
1Q5
1Q6
GND
1Q7
1Q8
2Q1
2Q2
GND
2Q3
2Q4
VCC
2Q5
2Q6
GND
2Q7
2Q8
2OE
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1LE
1D1
1D2
GND
1D3
1D4
VCC
1D5
1D6
GND
1D7
1D8
2D1
2D2
GND
2D3
2D4
VCC
2D5
2D6
GND
2D7
2D8
2LE
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold-compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
The SN74ABT16373A-EP is a 16-bit transparent D-type latch with 3-state outputs designed specifically for
driving highly capacitive or relatively low-impedance loads. The SN74ABT16373A-EP is particularly suitable for
implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
ORDERING INFORMATION
PACKAGE (1)
TA
–55°C to 125°C
(1)
SSOP – DL
Tape and reel
ORDERABLE PART NUMBER
CABT16373AMDLREP
TOP-SIDE MARKING
ABT16373AMEP
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus, EPIC-IIB are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
SN74ABT16373A-EP
16-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCBS810 – MARCH 2006
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The SN74ABT16373A-EP can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input
is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels
set up at the D inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or
low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the
bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines
without need for interface or pullup components.
OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74ABT16373A-EP is characterized for operation from –55°C to 125°C.
FUNCTION TABLE
(each 8-bit section)
INPUTS
2
OE
LE
D
OUTPUT
Q
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
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SN74ABT16373A-EP
16-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCBS810 – MARCH 2006
LOGIC SYMBOL(1)
1OE
1LE
2OE
2LE
1D1
1D2
1D3
1D4
1D5
1D6
1D7
1D8
2D1
2D2
2D3
2D4
2D5
2D6
2D7
2D8
(1)
1
1EN
48
C3
24
2EN
25
C4
47
3D
2
1
46
3
44
5
43
6
41
8
40
9
38
11
37
12
36
13
4D
2
35
14
33
16
32
17
30
19
29
20
27
22
26
23
1Q1
1Q2
1Q3
1Q4
1Q5
1Q6
1Q7
1Q8
2Q1
2Q2
2Q3
2Q4
2Q5
2Q6
2Q7
2Q8
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
LOGIC DIAGRAM (POSITIVE LOGIC)
1OE
1LE
1D1
1
2OE
48
47
2LE
C1
1D
2
1Q1
24
25
C1
2D1
36
To Seven Other Channels
1D
13
2Q1
To Seven Other Channels
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3
SN74ABT16373A-EP
16-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCBS810 – MARCH 2006
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
7
V
VI
Input voltage range (2)
–0.5
7
V
VO
Voltage range applied to any output in the high or power-off state
–0.5
5.5
V
IO
Current into any output in the low state
96
mA
IIK
Input clamp current
VI < 0
–18
mA
IOK
Output clamp current
VO < 0
–50
mA
θJA
Package thermal impedance (3)
94
°C/W
Tstg
Storage temperature range
150
°C
(1)
(2)
(3)
–65
UNIT
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD 51.
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
IOH
IOL
∆t/∆v
Input transition rise or fall rate
MIN
MAX
4.5
5.5
2
V
V
VCC
V
High-level output current
–24
mA
Low-level output current
48
mA
10
ns/V
0
Outputs enabled
200
TA
–55
4
V
0.8
∆t/∆VCC Power-up ramp rate
(1)
UNIT
Operating free-air temperature
Unused inputs must be held high or low to prevent them from floating.
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µs/V
125
°C
SN74ABT16373A-EP
16-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCBS810 – MARCH 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
VOH
VOL
TA = 25°C
TEST CONDITIONS
MIN TYP (1)
MIN MAX
MAX
VCC = 4.5 V,
II = –18 mA
–1.2
VCC = 4.5 V,
IOH = –3 mA
2.5
2.5
VCC = 5 V,
IOH = –3 mA
3
3
VCC = 4.5 V,
IOH = –24 mA
2
2
VCC = 4.5 V,
IOL = 48 mA
–1.2
0.55
Vhys
UNIT
V
V
0.55
V
100
II
VCC = 0 to 5.5 V,
VI = VCC or GND
(2)
VCC = 0 to 2.1 V,
VO = 0.5 V to 2.7 V,
IOZPD (2)
VCC = 2.1 V to 0,
VO = 0.5 V to 2.7 V,
IOZH
VCC = 2.1 V to 5.5 V,
VO = 2.7 V,
IOZL
VCC = 2.1 V to 5.5 V,
VO = 0.5 V,
VCC = 0,
VI or VO ≤ 4.5 V
VCC = 5.5 V,
VO = 5.5 V
VCC = 5.5 V,
VO = 2.5 V
VCC = 5.5 V, IO = 0,
VI = VCC or GND
IOZPU
Ioff
ICEX
Outputs high
IO (3)
±1
±1
µA
OE = X
±50
±50
µA
OE = X
±50
±50
µA
OE ≥ 2 V
10
10
µA
OE ≥ 2 V
–10
–10
µA
Outputs low
µA
±100
–50
–100
Outputs high
ICC
mV
Outputs disabled
50
50
µA
–180
–50 –180
mA
2
2
85
85
2
2
1.5
1.5
mA
∆ICC (4)
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
Ci
VI = 2.5 V or 0.5 V
3.5
pF
Co
VO = 2.5 V or 0.5 V
9.5
pF
(1)
(2)
(3)
(4)
mA
All typical values are at VCC = 5 V.
This parameter is characterized, but not production tested.
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Timing Requirements
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1)
VCC = 5 V,
TA = 25°C
MIN
MIN
MAX
UNIT
MAX
tw
Pulse duration, LE high
3.3
3.3
ns
tsu
Setup time, data before LE↓
1.5
2.4
ns
th
Hold time, data after LE↓
1
2.2
ns
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5
SN74ABT16373A-EP
16-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCBS810 – MARCH 2006
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted)
(see Figure 1)
PARAMETER
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
6
FROM
(INPUT)
TO
(OUTPUT)
D
Q
LE
Q
OE
Q
OE
Q
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VCC = 5 V,
TA = 25°C
MIN
MAX
5.3
1.4
6.5
4
5.4
2
6.5
1.7
4.1
5.7
1.7
7
2.3
4.3
5.6
2.3
6.3
1.1
3.4
5
1.1
6.4
1.5
3.5
4.9
1.5
5.8
2.4
5.1
7.1
2.4
8.3
1.6
4.4
6.3
1.6
8
MIN
TYP
MAX
1.4
3.7
2
UNIT
ns
ns
ns
ns
SN74ABT16373A-EP
16-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCBS810 – MARCH 2006
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
S1
7V
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
3V
th
3V
Input
1.5 V
1.5 V
0V
Data Input
1.5 V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
3V
1.5 V
Input
1.5 V
0V
tPLH
1.5 V
1.5 V
VOL
tPHL
1.5 V
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLH
VOH
Output
3V
Output
Control
tPHL
VOH
Output
1.5 V
Output
Waveform 2
S1 at Open
(see Note B)
1.5 V
3.5 V
VOL + 0.3 V
VOL
tPHZ
tPZH
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
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7
SN74ABT16373A-EP
16-BIT TRANSPARENT D-TYPE LATCH
WITH 3-STATE OUTPUTS
www.ti.com
SCBS810 – MARCH 2006
APPLICATION INFORMATION
100000
Years Estimated Life
10000
1000
Electromigration Fail Mode
100
10
Wirebond Voiding
Fail Mode
1
0.1
80
90
100
110
120
130
140
150
160
Continuous Tj – °C
Figure 2. CABT16373AMDLREP Operating Life Derating Chart
8
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170
180
PACKAGE OPTION ADDENDUM
www.ti.com
31-May-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
CABT16373AMDLREP
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ABT16373AMEP
V62/06628-01XE
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ABT16373AMEP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-May-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74ABT16373A-EP :
• Catalog: SN74ABT16373A
• Military: SN54ABT16373A-EP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Mar-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CABT16373AMDLREP
Package Package Pins
Type Drawing
SSOP
DL
48
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
32.4
Pack Materials-Page 1
11.35
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
16.2
3.1
16.0
32.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Mar-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CABT16373AMDLREP
SSOP
DL
48
1000
367.0
367.0
55.0
Pack Materials-Page 2
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