Texas Instruments | SN54LV138A, SN74LV138A (Rev. L) | Datasheet | Texas Instruments SN54LV138A, SN74LV138A (Rev. L) Datasheet

Texas Instruments SN54LV138A, SN74LV138A (Rev. L) Datasheet
SN54LV138A, SN74LV138A
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
www.ti.com
SCLS395L – APRIL 1998 – REVISED AUGUST 2005
FEATURES
SN54LV138A . . . J OR W PACKAGE
SN74LV138A . . . D, DB, DGV, NS
OR PW PACKAGE
(TOP VIEW)
2
16
15
3
14
4
13
5
12
6
11
7
10
8
9
•
SN54LV138A . . . FK PACKAGE
(TOP VIEW)
VCC
Y0
Y1
Y2
Y3
Y4
Y5
Y6
B
C
G2A
G2B
G1
Y7
1
16
B
A
NC
VCC
Y0
SN74LV138A . . . RGY PACKAGE
(TOP VIEW)
2
15
3
4
14
13
5
12
6
11
10
7
8
9
C
G2A
NC
G2B
G1
Y0
Y1
Y2
Y3
Y4
Y5
4
3 2 1 20 19
18
5
6
17
16
7
8
15
14
9 10 11 12 13
Y1
Y2
NC
Y3
Y4
Y7
GND
NC
Y6
Y5
1
•
VCC
A
B
C
G2A
G2B
G1
Y7
GND
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Y6
•
•
A
•
2-V to 5.5-V VCC Operation
Max tpd of 9.5 ns at 5 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on All
Ports
GND
•
•
•
NC − No internal connection
DESCRIPTION/ORDERING INFORMATION
The 'LV138A devices are 3-line to 8-line decoders/demultiplexers designed for 2-V to 5.5-V VCC operation.
ORDERING INFORMATION
PACKAGE (1)
TA
QFN – RGY
SN74LV138ARGYR
Tube of 40
SN74LV138AD
Reel of 2500
SN74LV138ADR
SOP – NS
Reel of 2000
SN74LV138ANSR
74LV138A
SSOP – DB
Reel of 2000
SN74LV138ADBR
LV138A
Tube of 90
SN74LV138APW
Reel of 2000
SN74LV138APWR
TSSOP – PW
–55°C to 125°C
(1)
TOP-SIDE MARKING
Reel of 1000
SOIC – D
–40°C to 85°C
ORDERABLE PART NUMBER
LV138A
LV138A
LV138A
Reel of 250
SN74LV138APWT
TVSOP – DGV
Reel of 2000
SN74LV138ADGVR
LV138A
CDIP – J
Tube of 25
SNJ54LV138AJ
SNJ54LV138AJ
CFP – W
Tube of 150
SNJ54LV138AW
SNJ54LV138AW
LCCC – FK
Tube of 55
SNJ54LV138AFK
SNJ54LV138AFK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
Copyright © 1998–2005, Texas Instruments Incorporated
SN54LV138A, SN74LV138A
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
www.ti.com
SCLS395L – APRIL 1998 – REVISED AUGUST 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
These devices are designed for high-performance memory-decoding or data-routing applications requiring very
short propagation delay times. In high-performance memory systems, these decoders can be used to minimize
the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the
delay times of these decoders and the enable time of the memory usually are less than the typical access time of
the memory. This means that the effective system delay introduced by the decoder is negligible.
The conditions at the binary-select inputs (A, B, C) and the three enable inputs (G1, G2A, G2B) select one of
eight output lines. The two active-low (G2A, G2B) and one active-high (G1) enable inputs reduce the need for
external gates or inverters when expanding. A 24-line decoder can be implemented without external inverters
and a 32-line decoder requires only one inverter. An enable input can be used as a data input for demultiplexing
applications.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
FUNCTION TABLE
2
ENABLE INPUTS
SELECT INPUTS
G1
G2A
G2B
C
B
A
Y0
Y1
Y20
OUTPUTS
Y3
Y4
Y5
Y6
Y7
X
H
X
X
X
X
H
H
H
H
H
H
H
H
X
X
H
X
X
X
H
H
H
H
H
H
H
H
L
X
X
X
X
X
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
H
H
H
H
H
H
H
H
L
L
L
L
H
H
L
H
H
H
H
H
H
H
L
L
L
H
L
H
H
L
H
H
H
H
H
H
L
L
L
H
H
H
H
H
L
H
H
H
H
H
L
L
H
L
L
H
H
H
H
L
H
H
H
H
L
L
H
L
H
H
H
H
H
H
L
H
H
H
L
L
H
H
L
H
H
H
H
H
H
L
H
H
L
L
H
H
H
H
H
H
H
H
H
H
L
SN54LV138A, SN74LV138A
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
www.ti.com
SCLS395L – APRIL 1998 – REVISED AUGUST 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
15
A
1
14
Select
Inputs
B
13
3
12
11
10
Enable
Inputs
6
4
G2A
G2B
Y1
2
C
G1
Y0
9
7
Y2
Y3
Data
Outputs
Y4
Y5
Y6
Y7
5
Pin numbers shown are for the D, DB, DGV, J, NS, PW, RGY, and W packages.
3
SN54LV138A, SN74LV138A
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
www.ti.com
SCLS395L – APRIL 1998 – REVISED AUGUST 2005
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
7
V
VI
Input voltage range (2)
–0.5
7
V
–0.5
7
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Output voltage range (2) (3)
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
VO = 0 to VCC
±25
mA
±50
mA
Continuous current through VCC or GND
D
package (4)
73
DB package (4)
θJA
Package thermal impedance
82
DGV package (4)
120
NS package (4)
64
PW package (4)
108
RGY package (5)
Tstg
(1)
(2)
(3)
(4)
(5)
4
Storage temperature range
V
°C/W
39
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 5.5 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7
The package thermal impedance is calculated in accordance with JESD 51-5.
SN54LV138A, SN74LV138A
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
www.ti.com
SCLS395L – APRIL 1998 – REVISED AUGUST 2005
Recommended Operating Conditions
(1)
SN54LV138A (2)
VCC
Supply voltage
VCC = 2 V
VIH
High-level input voltage
MIN
MAX
2
5.5
Low-level input voltage
MIN
MAX
2
5.5
1.5
1.5
VCC = 2.3 V to 2.7 V
VCC × 0.7
VCC × 0.7
VCC = 3 V to 3.6 V
VCC × 0.7
VCC × 0.7
VCC = 4.5 V to 5.5 V
VCC × 0.7
VCC × 0.7
VCC = 2 V
VIL
SN74LV138A
UNIT
V
V
0.5
0.5
VCC = 2.3 V to 2.7 V
VCC × 0.3
VCC × 0.3
VCC = 3 V to 3.6 V
VCC × 0.3
VCC × 0.3
VCC = 4.5 V to 5.5 V
VCC × 0.3
VCC × 0.3
V
VI
Input voltage
0
5.5
0
5.5
VO
Output voltage
0
VCC
0
VCC
V
–50
–50
µA
VCC = 2.3 V to 2.7 V
–2
–2
VCC = 3 V to 3.6 V
–6
–6
–12
–12
50
50
2
2
VCC = 2 V
IOH
High-level output current
VCC = 4.5 V to 5.5 V
VCC = 2 V
IOL
Low-level output current
∆t/∆v Input transition rise or fall rate
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
6
6
VCC = 4.5 V to 5.5 V
12
12
VCC = 2.3 V to 2.7 V
200
200
VCC = 3 V to 3.6 V
100
100
20
20
VCC = 4.5 V to 5.5 V
TA
(1)
(2)
Operating free-air temperature
–55
125
–40
85
V
mA
µA
mA
ns/V
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Product Preview
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VOH
TEST CONDITIONS
IOH = –50 µA
2 V to 5.5 V
IOH = –2 mA
2.3 V
IOH = –6 mA
IOH = –12 mA
VOL
SN54LV138A (1)
MIN
SN74LV138A
TYP MAX
MIN
VCC – 0.1
VCC – 0.1
2
2
3V
2.48
2.48
4.5 V
3.8
TYP MAX
3.8
2 V to 5.5 V
0.1
0.1
IOL = 2 mA
2.3 V
0.4
0.4
IOL = 6 mA
3V
0.44
0.44
4.5 V
II
VI = 5.5 V or GND
ICC
VI = VCC or GND,
Ioff
VI or VO = 0 to 5.5 V
Ci
VI = VCC or GND
IO = 0
UNIT
V
IOL = 50 µA
IOL = 12 mA
(1)
VCC
V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
20
20
µA
0
5
5
µA
3.3 V
2.1
2.1
pF
Product Preview
5
SN54LV138A, SN74LV138A
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
www.ti.com
SCLS395L – APRIL 1998 – REVISED AUGUST 2005
Switching Characteristics
over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
MAX
MIN
MAX
MIN
MAX
A, B, or C
11.7 (2)
17.6 (2)
1 (2)
21 (2)
1
21
G1
12.3 (2)
19.2 (2)
1 (2)
22 (2)
1
22
11.4 (2)
18.2 (2)
1 (2)
21 (2)
1
21
14.9
21.4
1
25
1
25
15.7
22.6
1
26
1
26
14.8
22
1
25
1
25
CL = 15 pF
A, B, or C
G1
Y
CL = 50 pF
G2A or G2B
(1)
(2)
SN74LV138A
TYP
Y
MIN
G2A or G2B
tpd
SN54LV138A (1)
TA = 25°C
UNIT
ns
ns
Product Preview
On products compliant to MIL-PRF-38535, this parameter is not production tested.
Switching Characteristics
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
tpd
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
SN74LV138A
TYP
MAX
MIN
MAX
MIN
MAX
A, B, or C
8.1 (2)
11.4 (2)
1 (2)
13.5 (2)
1
13.5
G1
8.4 (2)
12.8 (2)
1 (2)
15 (2)
1
15
G2A or G2B
7.8 (2)
11.4 (2)
1 (2)
13.5 (2)
1
13.5
A, B, or C
10.3
15.8
1
18
1
18
10.6
16.3
1
18.5
1
18.5
10
14.9
1
17
1
17
Y
G1
Y
MIN
CL = 15 pF
CL = 50 pF
G2A or G2B
(1)
(2)
SN54LV138A (1)
TA = 25°C
UNIT
ns
ns
Product Preview
On products compliant to MIL-PRF-38535, this parameter is not production tested.
Switching Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
MAX
MIN
MAX
MIN
MAX
A, B, or C
5.6 (2)
8.1 (2)
1 (2)
9.5 (2)
1
9.5
G1
5.7 (2)
8.1 (2)
1 (2)
9.5 (2)
1
9.5
5.4 (2)
8.1 (2)
1 (2)
9.5 (2)
1
9.5
7
10.1
1
11.5
1
11.5
7.1
10.1
1
11.5
1
11.5
6.8
10.1
1
11.5
1
11.5
Y
CL = 15 pF
A, B, or C
G1
Y
G2A or G2B
(1)
(2)
CL = 50 pF
MIN
SN74LV138A
TYP
G2A or G2B
tpd
SN54LV138A (1)
TA = 25°C
UNIT
ns
ns
Product Preview
On products compliant to MIL-PRF-38535, this parameter is not production tested.
Operating Characteristics
TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
f = 10 MHz
VCC
TYP
3.3 V
16.8
5V
19.1
UNIT
pF
SN54LV138A, SN74LV138A
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
www.ti.com
SCLS395L – APRIL 1998 – REVISED AUGUST 2005
PARAMETER MEASUREMENT INFORMATION
VCC
From Output
Under Test
Test
Point
RL = 1 kΩ
From Output
Under Test
CL
(see Note A)
S1
Open
TEST
GND
CL
(see Note A)
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
tPHL
50% VCC
tPHL
50% VCC
VOL
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
0V
tPLZ
≈VCC
Output
Waveform 1
S1 at VCC
(see Note B)
50% VCC
tPZH
tPLH
50% VCC
50% VCC
tPZL
VOH
In-Phase
Output
Out-of-Phase
Output
0V
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuits and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74LV138AD
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LV138A
SN74LV138ADBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LV138A
SN74LV138ADGVR
ACTIVE
TVSOP
DGV
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LV138A
SN74LV138ADR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LV138A
SN74LV138ANSR
ACTIVE
SO
NS
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
74LV138A
SN74LV138APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LV138A
SN74LV138APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LV138A
SN74LV138APWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
LV138A
SN74LV138APWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LV138A
SN74LV138APWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
LV138A
SN74LV138ARGYR
ACTIVE
VQFN
RGY
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
LV138A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74LV138ADGVR
TVSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
8.0
12.0
Q1
DGV
16
2000
330.0
12.4
6.8
4.0
1.6
W
Pin1
(mm) Quadrant
SN74LV138ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74LV138ANSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74LV138APWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV138APWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV138APWRG4
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV138APWT
TSSOP
PW
16
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74LV138ARGYR
VQFN
RGY
16
3000
330.0
12.4
3.8
4.3
1.5
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LV138ADGVR
TVSOP
DGV
16
2000
367.0
367.0
35.0
SN74LV138ADR
SOIC
D
16
2500
333.2
345.9
28.6
SN74LV138ANSR
SO
NS
16
2000
367.0
367.0
38.0
SN74LV138APWR
TSSOP
PW
16
2000
367.0
367.0
35.0
SN74LV138APWR
TSSOP
PW
16
2000
364.0
364.0
27.0
SN74LV138APWRG4
TSSOP
PW
16
2000
367.0
367.0
35.0
SN74LV138APWT
TSSOP
PW
16
250
367.0
367.0
35.0
SN74LV138ARGYR
VQFN
RGY
16
3000
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
NOTE 3
4.55
8
9
B
0.30
0.19
0.1
C A B
16X
4.5
4.3
NOTE 4
1.2 MAX
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0 -8
0.75
0.50
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
1
16
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
1
16X (0.45)
16
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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