Texas Instruments | SN54HC7002, SN74HC7002 (Rev. F) | Datasheet | Texas Instruments SN54HC7002, SN74HC7002 (Rev. F) Datasheet

Texas Instruments SN54HC7002, SN74HC7002 (Rev. F) Datasheet
 SCLS033F − MARCH 1984 − REVISED NOVEMBER 2004
D
D
D
D
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Typical tpd = 14 ns
Low Power Consumption, 20-µA Max ICC
Low Input Current of 1 µA Max
Operation From Very Slow Input
Transitions
Temperature-Compensated Threshold
Levels
High Noise Immunity
SN54HC7002 . . . J OR W PACKAGE
SN74HC7002 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
1A
1B
1Y
2A
2B
2Y
GND
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
4B
4A
4Y
3B
3A
3Y
description/ordering information
SN54HC7002 . . . FK PACKAGE
(TOP VIEW)
1B
1A
NC
VCC
4B
In these devices, each circuit functions as a
quadruple NOR gate. They perform the Boolean
function Y = A • B or Y = A + B in positive logic.
However, because of the Schmitt action, the
inputs have different input threshold levels for
positive- and negative-going signals.
1Y
NC
2A
NC
2B
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3B
2Y
GND
NC
3Y
3A
These circuits are temperature compensated and
can be triggered from the slowest of input ramps
and still give clean jitter-free output signals.
4
NC − No internal connection
ORDERING INFORMATION
PDIP − N
SN74HC7002N
Tube of 50
SN74HC7002D
Reel of 2500
SN74HC7002DR
Reel of 250
SN74HC7002DT
Reel of 2000
SN74HC7002NSR
Tube of 90
SN74HC7002PW
Reel of 2000
SN74HC7002PWR
Reel of 250
SN74HC7002PWT
CDIP − J
Tube of 25
SNJ54HC7002J
SNJ54HC7002J
CFP − W
Tube of 150
SNJ54HC7002W
SNJ54HC7002W
LCCC - FK
Tube of 55
SNJ54HC7002FK
SOP − NS
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube of 25
SOIC − D
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74HC7002N
HC7002
HC7002
HC7002
SNJ54HC7002FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
!"#$%& "!&'& &(!)$'!& "#))%& ' !( *#+,"'!& '%- )!#" "!&(!)$ !
*%"("'!& *%) % %)$ !( %.' &)#$%& '&') /'))'&0)!#"!& *)!"%&1 !% &! &%"%'),0 &",#% %&1 !( ',,
*')'$%%)POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS033F − MARCH 1984 − REVISED NOVEMBER 2004
FUNCTION TABLE
(each gate)
INPUTS
A
B
OUTPUT
Y
H
X
L
X
H
L
L
L
H
logic diagram (positive logic)
A
Y
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC7002
SN74HC7002
UNIT
MIN
NOM
MAX
MIN
NOM
MAX
5
6
2
5
6
V
VCC
VI
Supply voltage
2
Input voltage
0
0
0
VCC
VCC
V
Output voltage
VCC
VCC
0
VO
TA
−55
125
−40
85
°C
Operating free-air temperature
V
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
&(!)$'!& "!&"%)& *)!#" & % (!)$'2% !)
%1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%)
*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 !
"'&1% !) "!&&#% %% *)!#" /!# &!"%-
2
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• DALLAS, TEXAS 75265
SCLS033F − MARCH 1984 − REVISED NOVEMBER 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
VT+
VT−
MAX
SN74HC7002
MIN
MAX
2V
0.7
1.2
1.5
0.7
1.5
0.7
1.5
4.5 V
1.55
2.5
3.15
1.55
3.15
1.55
3.15
6V
2.1
3.3
4.2
2.1
4.2
2.1
4.2
2V
0.3
0.6
1
0.3
1
0.3
1
4.5 V
0.9
1.6
2.45
0.9
2.45
0.9
2.45
6V
1.2
2
3.2
1.2
3.2
1.2
3.2
UNIT
V
V
0.6
1.2
0.2
1.2
0.2
1.2
0.4
0.9
2.1
0.4
2.1
0.4
2.1
6V
0.5
1.3
2.5
0.5
2.5
0.5
2.5
2V
1.9
1.998
1.9
1.9
IOH = −20 µA
4.5 V
4.4
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
IOH = −4 mA
IOH = −5.2 mA
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
5.34
2V
0.002
0.1
0.1
0.1
IOL = 20 µA
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
2
40
20
µA
10
10
10
pF
IOL = 4 mA
IOL = 5.2 mA
VI = VCC or 0
VI = VCC or 0,
MIN
0.2
VI = VIH or VIL
II
ICC
SN54HC7002
2V
VI = VIH or VIL
VOL
TA = 25°C
TYP
MAX
4.5 V
VT+ − VT−
VOH
MIN
IO = 0
6V
Ci
2 V to 6 V
3
V
V
V
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
TYP
MAX
SN54HC7002
SN74HC7002
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
2V
60
130
195
163
tpd
A or B
Y
4.5 V
18
26
39
33
6V
14
22
33
28
2V
28
75
110
95
4.5 V
8
15
22
19
6V
6
13
19
16
tt
Any
MIN
MAX
MIN
MAX
UNIT
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance per gate
No load
TYP
20
UNIT
pF
&(!)$'!& "!&"%)& *)!#" & % (!)$'2% !)
%1& *'% !( %2%,!*$%&- ')'"%)" '' '& !%)
*%"("'!& ')% %1& 1!',- %.' &)#$%& )%%)2% % )1 !
"'&1% !) "!&&#% %% *)!#" /!# &!"%-
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3
SCLS033F − MARCH 1984 − REVISED NOVEMBER 2004
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
Test
Point
Input
VCC
50%
50%
0V
CL = 50 pF
(see Note A)
tPLH
In-Phase
Output
LOAD CIRCUIT
50%
10%
tPHL
90%
90%
tr
Input
50%
10%
90%
90%
tr
VCC
50%
10% 0 V
tPHL
Out-of-Phase
Output
90%
tf
VOH
50%
10%
VOL
tf
tPLH
50%
10%
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time, with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
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PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74HC7002D
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC7002
SN74HC7002DG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC7002
SN74HC7002DR
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC7002
SN74HC7002DT
ACTIVE
SOIC
D
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC7002
SN74HC7002N
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC7002N
SN74HC7002NE4
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN74HC7002N
SN74HC7002PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC7002
SN74HC7002PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
HC7002
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2019
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Nov-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74HC7002DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74HC7002DT
SOIC
D
14
250
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Nov-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74HC7002DR
SOIC
D
14
2500
367.0
367.0
38.0
SN74HC7002DT
SOIC
D
14
250
210.0
185.0
35.0
Pack Materials-Page 2
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