Texas Instruments | SN74ALVCH16374 (Rev. L) | Datasheet | Texas Instruments SN74ALVCH16374 (Rev. L) Datasheet

Texas Instruments SN74ALVCH16374 (Rev. L) Datasheet
www.ti.com
FEATURES
•
•
•
•
•
•
•
Member of the Texas Instruments Widebus™
Family
Operates From 1.65 to 3.6 V
Max tpd of 4.2 ns at 3.3 V
±24-mA Output Drive at 3.3 V
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
DESCRIPTION/ORDERING INFORMATION
This 16-bit edge-triggered D-type flip-flop is designed
for 1.65-V to 3.6-V VCC operation.
The SN74ALVCH16374 is particularly suitable for
implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers. It can be used as
two 8-bit flip-flops or one 16-bit flip-flop. On the
positive transition of the clock (CLK) input, the
Q outputs of the flip-flop take on the logic levels at
the data (D) inputs. OE can be used to place the
eight outputs in either a normal logic state (high or
low logic levels) or the high-impedance state. In the
high-impedance state, the outputs neither load nor
drive the bus lines significantly. The high-impedance
state and the increased drive provide the capability to
drive bus lines without need for interface or pullup
components.
SN74ALVCH16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
SCES021L – JULY 1995 – REVISED SEPTEMBER 2004
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1OE
1Q1
1Q2
GND
1Q3
1Q4
VCC
1Q5
1Q6
GND
1Q7
1Q8
2Q1
2Q2
GND
2Q3
2Q4
VCC
2Q5
2Q6
GND
2Q7
2Q8
2OE
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1CLK
1D1
1D2
GND
1D3
1D4
VCC
1D5
1D6
GND
1D7
1D8
2D1
2D2
GND
2D3
2D4
VCC
2D5
2D6
GND
2D7
2D8
2CLK
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while
the outputs are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2004, Texas Instruments Incorporated
SN74ALVCH16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES021L – JULY 1995 – REVISED SEPTEMBER 2004
ORDERING INFORMATION
PACKAGE (1)
TA
Tape and reel
SN74ALVCH16374DLR
TSSOP - DGG
Tape and reel
SN74ALVCH16374DGGR
ALVCH16374
TVSOP - DGV
Tape and reel
SN74ALVCH16374DGVR
VH374
VFBGA - GQL
Tape and reel
VFBGA - ZQL (Pb-free)
(1)
TOP-SIDE MARKING
SN74ALVCH16374DL
SSOP - DL
-40°C to 85°C
ORDERABLE PART NUMBER
Tube
ALVCH16374
SN74ALVCH16374KR
VH374
74ALVCH16374ZQLR
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guideline are available at
www.ti.com/sc/package.
GQL OR ZQL PACKAGE
(TOP VIEW)
TERMINAL ASSIGNMENTS (1)
1
2
3
4
5
6
A
1OE
NC
NC
NC
NC
1CLK
A
B
1Q2
1Q1
GND
GND
1D1
1D2
B
C
1Q4
1Q3
VCC
VCC
1D3
1D4
C
D
1Q6
1Q5
GND
GND
1D5
1D6
D
E
1Q8
1Q7
1D7
1D8
1
2
3
4
5
6
E
F
G
H
F
2Q1
2Q2
2D2
2D1
G
2Q3
2Q4
GND
GND
2D4
2D3
H
2Q5
2Q6
VCC
VCC
2D6
2D5
J
2Q7
2Q8
GND
GND
2D8
2D7
K
2OE
NC
NC
NC
NC
2CLK
J
K
(1)
NC - No internal connection
FUNCTION TABLE
(each flip-flop)
INPUTS
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
LOGIC DIAGRAM (POSITIVE LOGIC)
1OE
1CLK
1D1
1
2OE
48
47
2CLK
C1
2
1D
To Seven Other Channels
Pin numbers shown are for the DGG, DGV, and DL packages.
2
1Q1
24
25
C1
2D1
36
1D
To Seven Other Channels
13
2Q1
SN74ALVCH16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES021L – JULY 1995 – REVISED SEPTEMBER 2004
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
-0.5
4.6
V
VI
Input voltage range (2)
-0.5
4.6
V
VO
Output voltage range (2) (3)
-0.5
VCC + 0.5
IIK
Input clamp current
VI < 0
IOK
Output clamp current
VO < 0
IO
Continuous output current
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
mA
-50
mA
±50
mA
±100
mA
DGG package
70
DGV package
58
DL package
63
GQL/ZQL package
V
-50
°C/W
42
-65
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 4.6 V, maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
3.6
Low-level input voltage
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
VCC = 1.65 V
-4
VCC = 2.3 V
-12
VCC = 2.7 V
-12
VCC = 3 V
-24
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
24
-40
mA
mA
10
ns/V
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74ALVCH16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES021L – JULY 1995 – REVISED SEPTEMBER 2004
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = -100 µA
1.65 V to 3.6 V
1.65 V
IOH = -6 mA
2.3 V
2
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = -24 mA
3V
2
IOL = 100 µA
IOH = -12 mA
II(hold)
0.2
1.65 V
0.45
IOL = 6 mA
2.3 V
0.4
2.3 V
0.7
1.65 V
25
1.65 V
-25
VI = 0.7 V
2.3 V
45
VI = 1.7 V
2.3 V
-45
VI = 0.8 V
3V
75
3V
-75
VI = VCC or GND,
IO = 0
∆ICC
One input at VCC - 0.6 V,
Other inputs at VCC or GND
(1)
(2)
V
µA
µA
3.6 V
±500
3.6 V
±10
µA
3.6 V
40
µA
3 V to 3.6 V
750
µA
V (2)
ICC
Outputs
±5
VI = 1.07 V
VO = VCC or GND
Co
0.55
VI = 0.58 V
VI = 0 to 3.6
Data inputs
0.4
3V
3.6 V
IOZ
Control inputs
2.7 V
VI = VCC or GND
VI = 2 V
Ci
V
1.65 V to 3.6 V
IOL = 24 mA
UNIT
1.2
IOL = 4 mA
IOL = 12 mA
II
MAX
VCC - 0.2
IOH = -4 mA
VOH
VOL
MIN TYP (1)
VCC
VI = VCC or GND
3.3 V
VO = VCC or GND
3.3 V
3
pF
6
7
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
MIN
fclock
TYP
VCC = 2.5 V
± 0.2 V
MIN
(1)
Clock frequency
MAX
VCC = 2.7 V
MIN
150
MAX
VCC = 3.3 V
± 0.3 V
MIN
150
UNIT
MAX
150
MHz
tw
Pulse duration, CLK high or low
(1)
3.3
3.3
3.3
ns
tsu
Setup time, data before CLK↑
(1)
2.1
2.2
1.9
ns
th
Hold time, data after CLK↑
(1)
0.6
0.5
0.5
ns
(1)
4
This information was not available at the time of publication.
SN74ALVCH16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES021L – JULY 1995 – REVISED SEPTEMBER 2004
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
VCC = 1.8 V
TO
(OUTPUT)
MIN
(1)
fmax
tpd
(1)
TYP
CLK
VCC = 2.5 V
± 0.2 V
MIN
VCC = 2.7 V
MAX
150
MIN
MAX
150
(1)
1
5.3
4.9
1
6.2
1
5.3
ten
OE
Q
tdis
OE
Q
(1)
MIN
UNIT
MAX
150
Q
(1)
VCC = 3.3 V
± 0.3 V
MHz
1
4.2
ns
5.9
1
4.8
ns
4.7
1.2
4.3
ns
This information was not available at the time of publication.
OPERATING CHARACTERISTICS
TA = 25°C
TEST
CONDITIONS
PARAMETER
Cpd Power dissipation capacitance
(1)
Outputs enabled
Outputs disabled
CL = 50 pF, f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
(1)
31
30
(1)
16
18
UNIT
pF
This information was not available at the time of publication.
5
SN74ALVCH16374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES021L – JULY 1995 – REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUT
VCC
1.8 V
2.5 V ± 0.2 V
2.7 V
3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
tw
VI
Timing
Input
VM
VM
VM
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VM
VM
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VLOAD/2
VM
tPZH
VOH
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPHL
VM
VI
VM
tPZL
VI
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VI
Data
Input
VM
0V
0V
tsu
Output
VI
VM
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VOH
VM
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
27-Dec-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
74ALVCH16374DGGRE4
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ALVCH16374
74ALVCH16374ZQLR
NRND
BGA
MICROSTAR
JUNIOR
ZQL
56
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
VH374
SN74ALVCH16374DGGR
ACTIVE
TSSOP
DGG
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ALVCH16374
SN74ALVCH16374DGVR
ACTIVE
TVSOP
DGV
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VH374
SN74ALVCH16374DL
ACTIVE
SSOP
DL
48
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ALVCH16374
SN74ALVCH16374DLR
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ALVCH16374
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
27-Dec-2019
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
74ALVCH16374ZQLR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000
330.0
16.4
4.8
7.3
1.5
8.0
16.0
Q1
SN74ALVCH16374DGGR TSSOP
DGG
48
2000
330.0
24.4
8.6
13.0
1.8
12.0
24.0
Q1
SN74ALVCH16374DGVR TVSOP
DGV
48
2000
330.0
16.4
7.1
10.2
1.6
12.0
16.0
Q1
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
SN74ALVCH16374DLR
SSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
74ALVCH16374ZQLR
BGA MICROSTAR
JUNIOR
ZQL
56
1000
350.0
350.0
43.0
SN74ALVCH16374DGGR
TSSOP
DGG
48
2000
367.0
367.0
45.0
SN74ALVCH16374DGVR
TVSOP
DGV
48
2000
367.0
367.0
38.0
SN74ALVCH16374DLR
SSOP
DL
48
1000
367.0
367.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OUTLINE
ZQL0056A
JRBGA - 1 mm max height
SCALE 2.100
PLASTIC BALL GRID ARRAY
4.6
4.4
B
A
BALL A1 CORNER
7.1
6.9
1 MAX
C
SEATING PLANE
0.35
TYP
0.15
BALL TYP
0.1 C
3.25 TYP
(0.625) TYP
SYMM
K
(0.575) TYP
J
H
G
5.85
TYP
SYMM
F
E
D
C
56X
NOTE 3
B
A
0.65 TYP
BALL A1 CORNER
1
2
3
4
5
0.45
0.35
0.15
0.08
C B A
C
6
0.65 TYP
4219711/B 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. No metal in this area, indicates orientation.
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EXAMPLE BOARD LAYOUT
ZQL0056A
JRBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
(0.65) TYP
56X ( 0.33)
2
1
3
4
5
6
A
(0.65) TYP
B
C
D
E
SYMM
F
G
H
J
K
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
0.05 MAX
METAL UNDER
SOLDER MASK
0.05 MIN
EXPOSED METAL
( 0.33)
METAL
( 0.33)
SOLDER MASK
OPENING
EXPOSED METAL
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4219711/B 01/2017
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99).
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EXAMPLE STENCIL DESIGN
ZQL0056A
JRBGA - 1 mm max height
PLASTIC BALL GRID ARRAY
56X ( 0.33)
(0.65) TYP
1
2
3
4
5
6
A
(0.65) TYP
B
C
D
E
SYMM
F
G
H
J
K
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4219711/B 01/2017
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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