Texas Instruments | SN74ALVCH16344 (Rev. H) | Datasheet | Texas Instruments SN74ALVCH16344 (Rev. H) Datasheet

Texas Instruments SN74ALVCH16344 (Rev. H) Datasheet
SN74ALVCH16344
1-BIT TO 4-BIT ADDRESS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES054H – SEPTEMBER 1995 – REVISED SEPTEMBER 2004
FEATURES
•
•
•
•
DGG OR DL PACKAGE
(TOP VIEW)
Member of the Texas Instruments Widebus™
Family
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
OE1
1B1
1B2
GND
1B3
1B4
VCC
1A
2B1
2B2
GND
2B3
2B4
2A
3A
3B1
3B2
GND
3B3
3B4
4A
VCC
4B1
4B2
GND
4B3
4B4
OE2
DESCRIPTION/ORDERING INFORMATION
This 1-bit to 4-bit address driver is designed for
1.65-V to 3.6-V VCC operation.
The SN74ALVCH16344 is used in applications in
which four separate memory locations must be
addressed by a single address.
To ensure the high-impedance state during power up
or power down, OE should be tied to VCC through a
pullup resistor; the minimum value of the resistor is
determined by the current-sinking capability of the
driver.
Active bus-hold circuitry holds unused or undriven
inputs at a valid logic state. Use of pullup or pulldown
resistors with the bus-hold circuitry is not
recommended.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
OE4
8B1
8B2
GND
8B3
8B4
VCC
8A
7B1
7B2
GND
7B3
7B4
7A
6A
6B1
6B2
GND
6B3
6B4
5A
VCC
5B1
5B2
GND
5B3
5B4
OE3
ORDERING INFORMATION
PACKAGE (1)
TA
-40°C to 85°C
SSOP - DL
TSSOP - DGG
(1)
ORDERABLE PART NUMBER
Tube
SN74ALVCH16344DL
Tape and reel
SN74ALVCH16344DLR
Tape and reel
SN74ALVCH16344DGGR
TOP-SIDE MARKING
ALVCH16344
ALVCH16344
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OE
A
OUTPUT
Bn
L
H
H
L
L
L
H
H
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2004, Texas Instruments Incorporated
SN74ALVCH16344
1-BIT TO 4-BIT ADDRESS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES054H – SEPTEMBER 1995 – REVISED SEPTEMBER 2004
LOGIC DIAGRAM (POSITIVE LOGIC)
OE4
56
29
OE3
OE2
OE1
28
1
2
3
1A
34
1B1
5B1
33
1B2
8
5A
5
6
9
31
1B3
5B3
30
1B4
41
2B1
10
2A
6A
12
13
16
17
6B1
6B2
42
38
2B3
37
2B4
48
3B1
47
3B2
15
6B3
6B4
7B1
7B2
43
3A
7A
19
20
23
45
3B3
44
3B4
55
4B1
24
7B3
7B4
8B1
54
4B2
21
4A
8B2
49
8A
26
27
2
5B4
40
2B2
14
5B2
36
4B3
4B4
52
51
8B3
8B4
SN74ALVCH16344
1-BIT TO 4-BIT ADDRESS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES054H – SEPTEMBER 1995 – REVISED SEPTEMBER 2004
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
-0.5
4.6
V
VI
Input voltage range (2)
-0.5
4.6
V
VO
Output voltage range (2) (3)
-0.5
VCC + 0.5
IIK
Input clamp current
VI < 0
IOK
Output clamp current
VO < 0
IO
Continuous output current
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
mA
-50
mA
±50
mA
±100
mA
DGG package
64
DL package
56
-65
V
-50
150
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 4.6 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
3.6
Low-level input voltage
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
VCC = 1.65 V
-4
VCC = 2.3 V
-12
VCC = 2.7 V
-12
VCC = 3 V
-24
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
24
-40
mA
mA
10
ns/V
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74ALVCH16344
1-BIT TO 4-BIT ADDRESS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES054H – SEPTEMBER 1995 – REVISED SEPTEMBER 2004
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = -100 µA
1.65 V to 3.6 V
1.65 V
IOH = -6 mA
2.3 V
2
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = -24 mA
3V
2
IOL = 100 µA
IOH = -12 mA
V
0.2
1.65 V
0.45
IOL = 6 mA
2.3 V
0.4
2.3 V
0.7
2.7 V
0.4
3V
0.55
±5
VI = VCC or GND
3.6 V
VI = 0.58 V
1.65 V
25
VI = 1.07 V
1.65 V
-25
VI = 0.7 V
2.3 V
45
VI = 1.7 V
2.3 V
-45
VI = 0.8 V
3V
75
3V
-75
VI = 2 V
UNIT
1.2
1.65 V to 3.6 V
IOL = 24 mA
II(hold)
MAX
IOL = 4 mA
IOL = 12 mA
II
TYP (1)
VCC - 0.2
IOH = -4 mA
VOH
VOL
MIN
V
µA
µA
3.6 V
±500
IOZ
VO = VCC or GND
3.6 V
±10
µA
ICC
VI = VCC or GND, IO = 0
3.6 V
40
µA
∆ICC
One input at VCC - 0.6 V, Other inputs at VCC or GND
3 V to 3.6 V
750
µA
VI = 0 to 3.6
Ci
Co
(1)
(2)
Control inputs
Data inputs
Outputs
V (2)
VI = VCC or GND
3.3 V
VO = VCC or GND
3.3 V
2.5
pF
3.5
4
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
VCC = 1.8 V
A
B
TYP
VCC = 2.5 V
± 0.2 V
MIN
MAX
(1)
1
VCC = 2.7 V
UNIT
MAX
4.6
4.6
1.4
4
ns
1
6.2
6.2
1.2
5.1
ns
1
5.1
4.4
1.2
4
ns
tsk(o) (2)
0.35
ns
(3)
0.5
ns
ten
OE
B
(1)
tdis
OE
B
(1)
This information was not available at the time of publication.
Skew between outputs of same bank and same package (same transition)
Skew between outputs of all banks and same package (A1 through A8 tied together)
MIN
VCC = 3.3 V
± 0.3 V
MIN
tsk(o)
4
TO
(OUTPUT)
MAX
tpd
(1)
(2)
(3)
FROM
(INPUT)
SN74ALVCH16344
1-BIT TO 4-BIT ADDRESS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES054H – SEPTEMBER 1995 – REVISED SEPTEMBER 2004
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd
(1)
Power dissipation capacitance
per bit (four outputs switching)
TEST CONDITIONS
Outputs enabled
Outputs disabled
CL = 50 pF, f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
(1)
68
84
(1)
11
14
UNIT
pF
This information was not available at the time of publication.
5
SN74ALVCH16344
1-BIT TO 4-BIT ADDRESS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES054H – SEPTEMBER 1995 – REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUT
VCC
1.8 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
tw
VI
Timing
Input
VM
VM
VM
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VM
VM
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VLOAD/2
VM
tPZH
VOH
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPHL
VM
VI
VM
tPZL
VI
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VI
Data
Input
VM
0V
0V
tsu
Output
VI
VM
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VOH
VM
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74ALVCH16344DGGR
ACTIVE
TSSOP
DGG
56
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ALVCH16344
SN74ALVCH16344DL
ACTIVE
SSOP
DL
56
20
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ALVCH16344
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74ALVCH16344DGGR TSSOP
DGG
56
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
8.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
15.6
1.8
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ALVCH16344DGGR
TSSOP
DGG
56
2000
367.0
367.0
45.0
Pack Materials-Page 2
PACKAGE OUTLINE
DGG0056A
TSSOP - 1.2 mm max height
SCALE 1.200
SMALL OUTLINE PACKAGE
C
8.3
TYP
7.9
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
54X 0.5
56
1
14.1
13.9
NOTE 3
2X
13.5
28
B
6.2
6.0
29
56X
0.27
0.17
0.08
1.2 MAX
C A
B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
TYPICAL
4222167/A 07/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
DGG0056A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
56X (1.5)
SYMM
1
56
56X (0.3)
54X (0.5)
(R0.05)
TYP
SYMM
28
29
(7.5)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222167/A 07/2015
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DGG0056A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
56X (1.5)
SYMM
1
56
56X (0.3)
54X (0.5)
(R0.05) TYP
SYMM
29
28
(7.5)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4222167/A 07/2015
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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