Texas Instruments | SN74ALVC16334 (Rev. E) | Datasheet | Texas Instruments SN74ALVC16334 (Rev. E) Datasheet

Texas Instruments SN74ALVC16334 (Rev. E) Datasheet
SN74ALVC16334
16-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES128E – FEBRUARY 1998 – REVISED SEPTEMBER 2004
FEATURES
•
•
•
•
•
•
•
•
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Member of the Texas Instruments Widebus™
Family
Operates From 1.65 V to 3.6 V
Max tpd of 3.2 ns at 3.3 V
±24-mA Output Drive at 3.3 V
Ideal for Use in PC100 Register DIMM
Designed to Comply With JEDEC 168-Pin and
200-Pin SDRAM Buffered DIMM Specification
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
OE
Y1
Y2
GND
Y3
Y4
VCC
Y5
Y6
GND
Y7
Y8
Y9
Y10
GND
Y11
Y12
VCC
Y13
Y14
GND
Y15
Y16
NC
DESCRIPTION/ORDERING INFORMATION
This 16-bit universal bus driver is designed for 1.65-V
to 3.6-V VCC operation.
Data flow from A to Y is controlled by the
output-enable (OE) input. The device operates in the
transparent mode when the latch-enable (LE) input is
low. When LE is high, the A data is latched if the
clock (CLK) input is held at a high or low logic level. If
LE is high, the A data is stored in the latch/flip-flop on
the low-to-high transition of CLK. When OE is high,
the outputs are in the high-impedance state.
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
CLK
A1
A2
GND
A3
A4
VCC
A5
A6
GND
A7
A8
A9
A10
GND
A11
A12
VCC
A13
A14
GND
A15
A16
LE
NC − No internal connection
To ensure the high-impedance state during power up
or power down, OE should be tied to VCC through a
pullup resistor; the minimum value of the resistor is
determined by the current-sinking capability of the
driver.
ORDERING INFORMATION
PACKAGE (1)
TA
(1)
TOP-SIDE MARKING
SN74ALVC16334DL
Tape and reel
SN74ALVC16334DLR
TSSOP - DGG
Tape and reel
SN74ALVC16334DGGR
ALVC16334
TVSOP - DGV
Tape and reel
SN74ALVC16334DGVR
VC334
SSOP - DL
-40°C to 85°C
ORDERABLE PART NUMBER
Tube
ALVC16334
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2004, Texas Instruments Incorporated
SN74ALVC16334
16-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES128E – FEBRUARY 1998 – REVISED SEPTEMBER 2004
FUNCTION TABLE
INPUTS
(1)
OE
LE
CLK
A
OUTPUT
Y
H
X
X
X
Z
L
L
X
L
L
L
L
X
H
H
L
H
↑
L
L
L
H
↑
H
H
L
H
L or H
X
Y0 (1)
Output level before the indicated steady-state input conditions
were established
LOGIC DIAGRAM (POSITIVE LOGIC)
1
OE
48
CLK
25
LE
47
1D
A1
C1
2
Y1
CLK
To 15 Other Channels
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
-0.5
4.6
V
VI
Input voltage range (2)
-0.5
4.6
V
-0.5
VCC + 0.5
range (2) (3)
UNIT
VO
Output voltage
IIK
Input clamp current
VI < 0
-50
mA
IOK
Output clamp current
VO < 0
-50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
DGG package
58
DGV package
48
DL package
(1)
(2)
(3)
(4)
2
V
°C/W
63
-65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended
operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 4.6 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
SN74ALVC16334
16-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES128E – FEBRUARY 1998 – REVISED SEPTEMBER 2004
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
High-level input voltage
MAX
3.6
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
Low-level input voltage
VI
Input voltage
VO
Output voltage
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
V
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
0.65 × VCC
VCC = 1.65 V to 1.95 V
VIH
MIN
1.65
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
0
3.6
V
0
VCC
V
VCC = 1.65 V
-4
VCC = 2.3 V
-12
VCC = 2.7 V
-12
VCC = 3 V
-24
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
24
-40
mA
mA
10
ns/V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = -100 µA
1.65 V to 3.6 V
MIN
TYP (1) MAX
1.65 V
1.2
IOH = -6 mA
2.3 V
2
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = -24 mA
3V
2
IOL = 100 µA
1.65 V to 3.6 V
0.2
IOL = 4 mA
1.65 V
0.45
IOL = 6 mA
2.3 V
0.4
2.3 V
0.7
IOH = -12 mA
IOL = 12 mA
IOL = 24 mA
UNIT
VCC - 0.2
IOH = -4 mA
VOH
VOL
VCC
V
2.7 V
0.4
3V
0.55
V
II
VI = VCC or GND
3.6 V
±5
µA
IOZ
VO = VCC or GND
3.6 V
±10
µA
ICC
VI = VCC or GND,
IO = 0
3.6 V
40
µA
One input at VCC - 0.6 V,
Other inputs at VCC or GND
750
µA
∆ICC
Ci
Co
(1)
Control inputs
Data inputs
Outputs
3 V to 3.6 V
VI = VCC or GND
3.3 V
VO = VCC or GND
3.3 V
5
5.5
7.5
pF
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
3
SN74ALVC16334
16-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES128E – FEBRUARY 1998 – REVISED SEPTEMBER 2004
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 2.5 V
± 0.2 V
VCC = 1.8 V
MIN MAX
fclock
tw
tsu
th
(1)
Setup time
Hold time
MAX
(1)
Clock frequency
Pulse duration
MIN
VCC = 2.7 V
MIN
MAX
150
VCC = 3.3 V
± 0.3 V
MIN
150
150
LE low
(1)
3.3
3.3
3.3
CLK high or low
(1)
3.3
3.3
3.3
Data before CLK↑
(1)
1.4
1.7
1.5
CLK high
(1)
1.2
1.6
1.3
CLK low
(1)
1.4
1.5
1.2
(1)
0.9
0.9
0.9
(1)
1.1
1.1
1.1
Data before LE↑
Data after CLK↑
Data after LE↑
CLK high or low
UNIT
MAX
MHz
ns
ns
ns
This information was not available at the time of publication.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
VCC = 1.8 V
TO
(OUTPUT)
MIN
(1)
fmax
A
tpd
LE
Y
CLK
(1)
TYP
VCC = 2.5 V
± 0.2 V
VCC = 2.7 V
VCC = 3.3 V
± 0.3 V
MIN
MIN
MIN
MAX
150
MAX
150
UNIT
MAX
150
MHz
(1)
1
3.7
3.6
1.1
3.3
(1)
1
4.8
5
1.3
4.4
(1)
ns
1
4.4
4.5
1
4.1
ten
OE
Y
(1)
1
5.4
5.4
1.1
4.6
ns
tdis
OE
Y
(1)
1
4.1
4.5
1.7
4.4
ns
This information was not available at the time of publication.
SWITCHING CHARACTERISTICS
from 0°C to 65°C, CL = 50 pF
FROM
(INPUT)
PARAMETER
A
tpd
VCC = 3.3 V
± 0.15 V
TO
(OUTPUT)
Y
CLK
UNIT
MIN
MAX
1.2
3.2
1.1
4
ns
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd Power dissipation capacitance
(1)
4
TEST CONDITIONS
Outputs enabled
Outputs disabled
CL = 0,
This information was not available at the time of publication.
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
(1)
31
36
(1)
7
11
UNIT
pF
SN74ALVC16334
16-BIT UNIVERSAL BUS DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES128E – FEBRUARY 1998 – REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUT
VCC
1.8 V
2.5 V ± 0.2 V
2.7 V
3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
tw
VI
Timing
Input
VM
VM
VM
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VM
VM
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VLOAD/2
VM
tPZH
VOH
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPHL
VM
VI
VM
tPZL
VI
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VI
Data
Input
VM
0V
0V
tsu
Output
VI
VM
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VOH
VM
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ALVC16334DGGRE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ALVC16334DGGRG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ALVC16334DGVRE4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ALVC16334DGVRG4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC16334DGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC16334DGVR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC16334DL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVC16334DLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ALVC16334DGGR
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
SN74ALVC16334DGVR
TVSOP
DGV
48
2000
330.0
16.4
7.1
10.2
1.6
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ALVC16334DGGR
TSSOP
DGG
48
2000
346.0
346.0
41.0
SN74ALVC16334DGVR
TVSOP
DGV
48
2000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
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