Texas Instruments | SN74ALVCH16271 (Rev. G) | Datasheet | Texas Instruments SN74ALVCH16271 (Rev. G) Datasheet

Texas Instruments SN74ALVCH16271 (Rev. G) Datasheet
SN74ALVCH16271
12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES017G – JULY 1995 – REVISED SEPTEMBER 2004
FEATURES
•
•
•
•
DGG OR DL PACKAGE
(TOP VIEW)
Member of the Texas Instruments Widebus™
Family
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
OEA
LE1B
2B3
GND
2B2
2B1
VCC
A1
A2
A3
GND
A4
A5
A6
A7
A8
A9
GND
A10
A11
A12
VCC
1B1
1B2
GND
1B3
LE2B
SEL
DESCRIPTION/ORDERING INFORMATION
This 12-bit to 24-bit bus exchanger is designed for
1.65-V to 3.6-V VCC operation.
The SN74ALVCH16271 is intended for applications in
which two separate data paths must be multiplexed
onto, or demultiplexed from, a single data path. This
device is particularly suitable as an interface
between conventional DRAMs and high-speed
microprocessors.
A data is stored in the internal A-to-B registers on the
low-to-high transition of the clock (CLK) input,
provided that the clock-enable (CLKENA) inputs are
low. Proper control of these inputs allows two
sequential 12-bit words to be presented as a 24-bit
word on the B port.
Transparent latches in the B-to-A path allow
asynchronous operation to maximize memory access
throughput. These latches transfer data when the
latch-enable (LE) inputs are low. The select (SEL)
line selects 1B or 2B data for the A outputs. Data flow
is controlled by the active-low output enables (OEA,
OEB).
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
OEB
CLKENA2
2B4
GND
2B5
2B6
VCC
2B7
2B8
2B9
GND
2B10
2B11
2B12
1B12
1B11
1B10
GND
1B9
1B8
1B7
VCC
1B6
1B5
GND
1B4
CLKENA1
CLK
line
space
To ensure the high-impedance state during power up or power down, the output enables should be tied to VCC
through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the
driver.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
ORDERING INFORMATION
PACKAGE (1)
TA
-40°C to 85°C
SSOP - DL
TSSOP - DGG
(1)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
Tube
SN74ALVCH16271DL
Tape and reel
SN74ALVCH16271DLR
Tape and reel
SN74ALVCH16271DGGR ALVCH16271
ALVCH16271
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2004, Texas Instruments Incorporated
SN74ALVCH16271
12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES017G – JULY 1995 – REVISED SEPTEMBER 2004
FUNCTION TABLES
line space
OUTPUT ENABLE
INPUTS
OUTPUTS
OEA
OEB
A
1B, 2B
H
H
Z
Z
Active
H
L
Z
L
H
Active
Z
L
L
Active
Active
A-TO-B STORAGE (OEB = L)
INPUTS
CLKENA1
(1)
CLKENA2
OUTPUTS
CLK
A
1B
X
1B0
2B
(1)
2B0 (1)
H
H
X
L
X
↑
L
L
X
L
X
↑
H
H
X
X
L
↑
L
X
L
X
L
↑
H
A0
H
Output level before the indicated steady-state input conditions were established
B-TO-A STORAGE (OEA = L)
INPUTS
(1)
2
LE
SEL
1B
2B
OUTPUT
A
H
X
X
X
A0 (1)
H
X
X
X
A0 (1)
L
H
L
X
L
L
H
H
X
H
L
L
X
L
L
L
L
X
H
H
Output level before the indicated steady-state input conditions were
established
SN74ALVCH16271
12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES017G – JULY 1995 – REVISED SEPTEMBER 2004
LOGIC DIAGRAM (POSITIVE LOGIC)
CLK
29
2
LE1B
27
LE2B
CLKENA1
30
55
CLKENA2
56
OEB
28
SEL
LE
23
1
1B1
1D
OEA
G1
1
8
A1
LE
1
6
1D
2B1
CE
C1
1D
CE
C1
1D
1 of 12 Channels
3
SN74ALVCH16271
12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES017G – JULY 1995 – REVISED SEPTEMBER 2004
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage range
MIN
MAX
-0.5
4.6
Except I/O ports (2)
-0.5
4.6
I/O ports (2) (3)
-0.5
VCC + 0.5
-0.5
VCC + 0.5
UNIT
V
VI
Input voltage range
VO
Output voltage range (2) (3)
IIK
Input clamp current
VI < 0
-50
mA
IOK
Output clamp current
VO < 0
-50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
DGG package
64
DL package
56
-65
150
V
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 4.6 V maximum.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
3.6
UNIT
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
Low-level input voltage
VCC = 2.3 V to 2.7 V
0.7
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
VCC = 2.7 V to 3.6 V
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
4
V
0.8
VCC = 1.65 V
-4
VCC = 2.3 V
-12
VCC = 2.7 V
-12
VCC = 3 V
-24
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
24
-40
mA
mA
10
ns/V
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74ALVCH16271
12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES017G – JULY 1995 – REVISED SEPTEMBER 2004
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = -100 µA
1.65 V to 3.6 V
1.65 V
IOH = -6 mA
2.3 V
2
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = -24 mA
3V
2
IOL = 100 µA
IOH = -12 mA
II(hold)
V
1.65 V to 3.6 V
0.2
1.65 V
0.45
IOL = 6 mA
2.3 V
0.4
2.3 V
0.7
IOL = 24 mA
2.7 V
0.4
3V
0.55
3.6 V
VI = 0.58 V
1.65 V
25
VI = 1.07 V
1.65 V
-25
VI = 0.7 V
2.3 V
45
VI = 1.7 V
2.3 V
-45
VI = 0.8 V
3V
75
3V
-75
VI = 0 to 3.6
VO = VCC or GND
ICC
VI = VCC or GND,
IO = 0
∆ICC
One input at VCC - 0.6 V,
Other inputs at VCC or GND
µA
µA
3.6 V
±500
3.6 V
±10
µA
3.6 V
40
µA
3 V to 3.6 V
750
µA
V (2)
IOZ (3)
V
±5
VI = VCC or GND
VI = 2 V
UNIT
1.2
IOL = 4 mA
IOL = 12 mA
II
MAX
VCC - 0.2
IOH = -4 mA
VOH
VOL
MIN TYP (1)
VCC
Ci
Control inputs
VI = VCC or GND
3.3 V
3.5
pF
Cio
A or B ports
VO = VCC or GND
3.3 V
9
pF
(1)
(2)
(3)
All typical values are at VCC = 3.3 V, TA = 25°C.
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
For I/O ports, the parameter IOZ includes the input leakage current.
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3)
VCC = 2.5 V
± 0.2 V
MIN
fclock
Clock frequency
tw
Pulse duration, CLK high or low
tsu
th
Setup time
Hold time
MAX
VCC = 2.7 V
MIN
130
MAX
VCC = 3.3 V
± 0.3 V
MIN
130
130
3.3
3.3
3.3
A before CLK↑
2.6
2.1
1.7
B before LE
1.7
1.5
1.3
CLKEN before CLK↑
1.6
1.3
1
A after CLK↑
0.6
0.6
0.7
B after LE
0.9
0.9
1.1
1
0.9
0.9
CLKEN after CLK↑
UNIT
MAX
MHz
ns
ns
ns
5
SN74ALVCH16271
12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES017G – JULY 1995 – REVISED SEPTEMBER 2004
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3)
PARAMETER
VCC = 3.3 V
± 0.3 V
TO
(OUTPUT)
VCC = 1.8 V
CLK
B
8
1
6.2
5
1
7
1
5.3
4.7
1.4
4
7
1
6
5.9
1.4
4.8
7
1.1
6.4
6.2
1.3
5.2
TYP
fmax
tpd
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
MIN
VCC = 2.7 V
MAX
130
B
LE
A
SEL
MIN
MAX
130
MIN
UNIT
MAX
130
MHz
4.3
ns
ten
OEB or OEA
B or A
8
1
6
6.1
1
5.1
ns
tdis
OEB or OEA
B or A
7
1.4
5.4
4.6
1.7
4.2
ns
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
TEST CONDITIONS
A to B
Cpd
Power dissipation capacitance
B to A
6
VCC = 2.5 V VCC = 3.3 V
TYP
TYP
Outputs enabled
92
105
Outputs disabled
61
76
39
43
11
13
Outputs enabled
Outputs disabled
CL = 0,
f = 10 MHz
UNIT
pF
SN74ALVCH16271
12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES017G – JULY 1995 – REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VCC = 1.8 V
2 × VCC
1 kΩ
From Output
Under Test
S1
Open
TEST
tpd
tPLZ/tPZL
tPHZ/tPZH
GND
CL = 30 pF
(see Note A)
1 kΩ
S1
Open
2 × VCC
GND
LOAD CIRCUIT
tw
VCC
Timing
Input
VCC/2
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC/2
VCC/2
0V
tPLH
Output
Control
(low-level
enabling)
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
tPLZ
VCC
VCC/2
tPZH
VOH
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC
VCC/2
tPZL
VCC
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
0V
0V
tsu
Output
VCC
VCC/2
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.15 V
VOL
tPHZ
VCC/2
VOH
VOH − 0.15 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
7
SN74ALVCH16271
12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES017G – JULY 1995 – REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VCC = 2.5 V ± 0.2 V
2 × VCC
500 Ω
From Output
Under Test
S1
Open
TEST
tpd
tPLZ/tPZL
tPHZ/tPZH
GND
CL = 30 pF
(see Note A)
500 Ω
S1
Open
2 × VCC
GND
LOAD CIRCUIT
tw
VCC
Timing
Input
VCC/2
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC/2
VCC/2
0V
tPLH
Output
Control
(low-level
enabling)
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
tPLZ
VCC
VCC/2
tPZH
VOH
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC
VCC/2
tPZL
VCC
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
0V
0V
tsu
Output
VCC
VCC/2
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.15 V
VOL
tPHZ
VCC/2
VOH
VOH − 0.15 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 2. Load Circuit and Voltage Waveforms
8
SN74ALVCH16271
12-BIT TO 24-BIT MULTIPLEXED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES017G – JULY 1995 – REVISED SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
VCC = 2.7 V AND 3.3 V ± 0.3 V
6V
500 Ω
From Output
Under Test
S1
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
tw
LOAD CIRCUIT
2.7 V
2.7 V
Timing
Input
1.5 V
Input
1.5 V
0V
1.5 V
0V
tsu
VOLTAGE WAVEFORMS
PULSE DURATION
th
2.7 V
Data
Input
1.5 V
1.5 V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
Output
Control
(low-level
enabling)
1.5 V
0V
tPZL
2.7 V
Input
1.5 V
1.5 V
0V
tPLH
VOH
Output
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
Output
Waveform 1
S1 at 6 V
(see Note B)
tPLZ
3V
1.5 V
VOL + 0.3 V
VOL
tPZH
tPHL
1.5 V
Output
Waveform 2
S1 at GND
(see Note B)
tPHZ
VOH
1.5 V
VOH − 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 3. Load Circuit and Voltage Waveforms
9
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
74ALVCH16271DGGRE4
ACTIVE
TSSOP
DGG
56
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ALVCH16271
SN74ALVCH16271DGGR
ACTIVE
TSSOP
DGG
56
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
ALVCH16271
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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25-Sep-2019
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74ALVCH16271DGGR TSSOP
DGG
56
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
8.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
15.6
1.8
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ALVCH16271DGGR
TSSOP
DGG
56
2000
367.0
367.0
45.0
Pack Materials-Page 2
PACKAGE OUTLINE
DGG0056A
TSSOP - 1.2 mm max height
SCALE 1.200
SMALL OUTLINE PACKAGE
C
8.3
TYP
7.9
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
54X 0.5
56
1
14.1
13.9
NOTE 3
2X
13.5
28
B
6.2
6.0
29
56X
0.27
0.17
0.08
1.2 MAX
C A
B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
TYPICAL
4222167/A 07/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
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EXAMPLE BOARD LAYOUT
DGG0056A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
56X (1.5)
SYMM
1
56
56X (0.3)
54X (0.5)
(R0.05)
TYP
SYMM
28
29
(7.5)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222167/A 07/2015
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DGG0056A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
56X (1.5)
SYMM
1
56
56X (0.3)
54X (0.5)
(R0.05) TYP
SYMM
29
28
(7.5)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4222167/A 07/2015
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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