Texas Instruments | SN74ALVCH16270 (Rev. G) | Datasheet | Texas Instruments SN74ALVCH16270 (Rev. G) Datasheet

Texas Instruments SN74ALVCH16270 (Rev. G) Datasheet
www.ti.com
SN74ALVCH16270
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
SCES028G – JULY 1995 – REVISED AUGUST 2004
FEATURES
•
•
•
•
•
•
Member of the Texas Instruments Widebus™
Family
EPIC™ (Enhanced-Performance Implanted
CMOS) Submicron Process
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Latch-Up Performance Exceeds 250 mA Per
JESD 17
Package Options Include Plastic Shrink
Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages
DESCRIPTION
This 12-bit to 24-bit registered bus exchanger is
designed for 1.65-V to 3.6-V VCC operation.
The SN74ALVCH16270 is used in applications in
which data must be transferred from a narrow
high-speed bus to a wide lower-frequency bus.
The device provides synchronous data exchange
between the two ports. Data is stored in the internal
registers on the low-to-high transition of the clock
(CLK) input when the appropriate CLKEN inputs are
low. The select (SEL) line selects 1B or 2B data for
the A outputs. For data transfer in the A-to-B
direction, a two-stage pipeline is provided in the
A-to-1B path, with a single storage register in the
A-to-2B path. Proper control of the CLKENA inputs
allows two sequential 12-bit words to be presented
synchronously as a 24-bit word on the B port. Data
flow is controlled by the active-low output enables
(OEA, OEB). The control terminals are registered to
synchronize the bus-direction changes with CLK.
DGG OR DL PACKAGE
(TOP VIEW)
OEA
CLKEN1B
2B3
GND
2B2
2B1
VCC
A1
A2
A3
GND
A4
A5
A6
A7
A8
A9
GND
A10
A11
A12
VCC
1B1
1B2
GND
1B3
CLKEN2B
SEL
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
OEB
CLKENA2
2B4
GND
2B5
2B6
VCC
2B7
2B8
2B9
GND
2B10
2B11
2B12
1B12
1B11
1B10
GND
1B9
1B8
1B7
VCC
1B6
1B5
GND
1B4
CLKENA1
CLK
line
space
To ensure the high-impedance state during power up or power down, a clock pulse should be applied as soon as
possible, and OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined
by the current-sinking capability of the driver. Due to OE being routed through a register, the active state of the
outputs cannot be determined prior to the arrival of the first clock pulse.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN74ALVCH16270 is characterized for operation from -40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus, EPIC are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1995–2004, Texas Instruments Incorporated
SN74ALVCH16270
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES028G – JULY 1995 – REVISED AUGUST 2004
FUNCTION TABLES
line space
OUTPUT ENABLE
INPUTS
OUTPUTS
CLK
OEA
OEB
A
1B, 2B
↑
H
H
Z
Z
↑
H
L
Z
Active
↑
L
H
Active
Z
↑
L
L
Active
Active
A-TO-B STORAGE (OEB = L)
INPUTS
CLKENA1 CLKENA2
L
L
(1)
(2)
H
OUTPUTS
CLK
A
X
H
X
L
L
↑
L
L
↑
H
L
H
H
1B
X
X
2B
1B0
(1)
2B0 (1)
1B0
(1)
2B0 (1)
L
L (2)
L
H
H (2)
H
↑
L
1B0 (1)
L
L
↑
H
1B0 (1)
H
H
X
X
1B0 (1)
2B0 (1)
Output level before the indicated steady-state input conditions were
established
Two CLK edges are needed to propagate data.
B-TO-A STORAGE (OEA = L)
INPUTS
CLKEN1B
CLKEN2B
CLK
SEL
1B
2B
OUTPUT
A
H
X
X
H
X
X
A0 (1)
X
H
X
L
X
X
A0 (1)
L
X
↑
H
L
X
L
L
X
↑
H
H
X
H
X
L
↑
L
X
L
L
X
L
↑
L
X
H
H
(1)
2
Output level before the indicated steady-state input conditions were established
SN74ALVCH16270
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES028G – JULY 1995 – REVISED AUGUST 2004
LOGIC DIAGRAM (POSITIVE LOGIC)
29
CLK
2
CLKEN1B
27
CLKEN2B
CLKENA1
30
55
C1
CLKENA2
56
1D
OEB
28
SEL
OEA
1
CE
1D
C1
1D
C1
G1
A1
1
CE
C1
1D
1D
6
2B1
CE
C1
1D
1B1
CE
1
8
23
C1
1D
CE
C1
1D
1 of 12 Channels
3
SN74ALVCH16270
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES028G – JULY 1995 – REVISED AUGUST 2004
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage
MIN
MAX
-0.5
4.6
Except I/O ports (2)
-0.5
4.6
I/O ports (2) (3)
-0.5
VCC + 0.5
-0.5
VCC + 0.5
UNIT
V
VI
Input voltage range
VO
Output voltage range (2) (3)
IIK
Input clamp current
VI < 0
-50
mA
IOK
Output clamp current
VO < 0
-50
mA
IO
Continuous output current
±50
mA
±100
mA
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
DGG package
81
DL package
74
-65
150
V
V
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 4.6 V maximum.
The package thermal impedance is calculated in accordance with JESD 51.
RECOMMENDED OPERATING CONDITIONS (1)
MIN
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MAX
1.65
UNIT
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
Low-level input voltage
VCC = 2.3 V to 2.7 V
0.7
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
VCC = 2.7 V to 3.6 V
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
4
V
0.8
VCC = 1.65 V
-4
VCC = 2.3 V
-12
VCC = 2.7 V
-12
VCC = 3 V
-24
VCC = 1.65 V
4
VCC = 2.3 V
12
VCC = 2.7 V
12
VCC = 3 V
24
-40
mA
mA
10
ns/V
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74ALVCH16270
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES028G – JULY 1995 – REVISED AUGUST 2004
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = -100 µA
1.65 V to 3.6 V
IOH = -6 mA
2.3 V
2
2.3 V
1.7
2.7 V
2.2
3V
2.4
IOH = -24 mA
3V
2
IOL = 100 µA
V
1.65 V to 3.6 V
0.2
1.65 V
0.45
IOL = 6 mA
2.3 V
0.4
2.3 V
0.7
IOL = 24 mA
2.7 V
0.4
3V
0.55
±5
VI = VCC or GND
3.6 V
VI = 0.58 V
1.65 V
25
VI = 1.07 V
1.65 V
-25
VI = 0.7 V
2.3 V
45
VI = 1.7 V
2.3 V
-45
VI = 0.8 V
3V
75
3V
-75
VI = 2 V
VI = 0 to 3.6
V (2)
IOZ (3)
VO = VCC or GND
ICC
VI = VCC or GND,
IO = 0
∆ICC
One input at VCC - 0.6 V,
Other inputs at VCC or GND
UNIT
1.2
IOL = 4 mA
IOL = 12 mA
II(hold)
MAX
VCC - 0.2
1.65 V
IOH = -12 mA
II
MIN TYP (1)
IOH = -4 mA
VOH
VOL
VCC
V
µA
µA
3.6 V
±500
3.6 V
±10
µA
3.6 V
40
µA
3 V to 3.6 V
750
µA
Ci
Control inputs
VI = VCC or GND
3.3 V
3.5
pF
Cio
A or B ports
VO = VCC or GND
3.3 V
9
pF
(1)
(2)
(3)
All typical values are at VCC = 3.3 V, TA = 25°C.
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
For I/O ports, the parameter IOZ includes the input leakage current.
5
SN74ALVCH16270
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES028G – JULY 1995 – REVISED AUGUST 2004
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3)
VCC = 2.5 V
± 0.2 V
VCC = 1.8 V
MIN
Clock frequency
tw
Pulse duration, CLK high or low
th
Setup time
Hold time
(1)
MIN
MAX
(1)
fclock
tsu
MAX
VCC = 2.7 V
MIN
MAX
150
VCC = 3.3 V
± 0.3 V
MIN
150
150
(1)
3.3
3.3
3.3
A data before CLK↑
(1)
4.1
3.8
3.1
B data before CLK↑
(1)
0.9
1.2
0.9
CLKENA1 or CLKENA2 before CLK↑
(1)
3.5
3.2
2.7
CLKEN1B or CLKEN2B before CLK↑
(1)
3.4
3
2.6
OE data before CLK↑
(1)
4.4
3.9
3.2
A data after CLK↑
(1)
0
0
0.2
B data after CLK↑
(1)
1.4
1
1.7
CLKENA1 or CLKENA2 after CLK↑
(1)
0
0.1
0.3
CLKEN1B or CLKEN2B after CLK↑
(1)
0
0
0.6
OE after CLK↑
(1)
0
0
0.1
UNIT
MAX
MHz
ns
ns
ns
This information was not available at the time of publication.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 3)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 1.8 V
MIN
(1)
fmax
CLK
tpd
(1)
MAX
VCC = 2.5 V
± 0.2 V
MIN
VCC = 2.7 V
MAX
150
MIN
MAX
150
VCC = 3.3 V
± 0.3 V
MIN
UNIT
MAX
150
MHz
B
(1)
1.5
5.9
5.8
1.1
5.1
A
(1)
1.2
5.4
5.4
1
4.7
5.5
ns
SEL
A
(1)
1.4
6.2
6.4
1
ten
CLK
A or B
(1)
1.5
7
6.8
1
6
ns
tdis
CLK
A or B
(1)
1.9
7.2
6.5
1.1
5.8
ns
This information was not available at the time of publication.
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd
(1)
6
Power dissipation
capacitance
Outputs enabled
Outputs disabled
TEST CONDITIONS
CL = 50 pF,
This information was not available at the time of publication.
f = 10 MHz
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
(1)
87
120
(1)
80.5
118
UNIT
pF
SN74ALVCH16270
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES028G – JULY 1995 – REVISED AUGUST 2004
PARAMETER MEASUREMENT INFORMATION
VCC = 1.8 V
2 × VCC
S1
1 kΩ
From Output
Under Test
Open
TEST
tpd
tPLZ/tPZL
tPHZ/tPZH
GND
CL = 30 pF
(see Note A)
1 kΩ
S1
Open
2 × VCC
GND
LOAD CIRCUIT
tw
VCC
Timing
Input
VCC/2
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC/2
VCC/2
0V
tPLH
Output
Control
(low-level
enabling)
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
tPLZ
VCC
VCC/2
tPZH
VOH
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC
VCC/2
tPZL
VCC
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
0V
0V
tsu
Output
VCC
VCC/2
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.15 V
VOL
tPHZ
VCC/2
VOH
VOH − 0.15 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
7
SN74ALVCH16270
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES028G – JULY 1995 – REVISED AUGUST 2004
PARAMETER MEASUREMENT INFORMATION
VCC = 2.5 V ± 0.2 V
2 × VCC
S1
500 Ω
From Output
Under Test
Open
TEST
tpd
tPLZ/tPZL
tPHZ/tPZH
GND
CL = 30 pF
(see Note A)
500 Ω
S1
Open
2 × VCC
GND
LOAD CIRCUIT
tw
VCC
Timing
Input
VCC/2
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC/2
VCC/2
0V
tPLH
Output
Control
(low-level
enabling)
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
tPLZ
VCC
VCC/2
tPZH
VOH
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC
VCC/2
tPZL
VCC
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
0V
0V
tsu
Output
VCC
VCC/2
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.15 V
VOL
tPHZ
VCC/2
VOH
VOH − 0.15 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 2. Load Circuit and Voltage Waveforms
8
SN74ALVCH16270
12-BIT TO 24-BIT REGISTERED BUS EXCHANGER
WITH 3-STATE OUTPUTS
www.ti.com
SCES028G – JULY 1995 – REVISED AUGUST 2004
PARAMETER MEASUREMENT INFORMATION
VCC = 2.7 V AND 3.3 V ± 0.3 V
6V
S1
500 Ω
From Output
Under Test
Open
TEST
tpd
tPLZ/tPZL
tPHZ/tPZH
GND
CL = 50 pF
(see Note A)
500 Ω
S1
Open
6V
GND
LOAD CIRCUIT
tw
2.7 V
2.7 V
Timing
Input
1.5 V
1.5 V
1.5 V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
1.5 V
1.5 V
0V
tPLH
1.5 V
1.5 V
0V
tPLZ
3V
1.5 V
VOL + 0.3 V
tPZH
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
2.7 V
1.5 V
Output
Waveform 1
S1 at 6 V
(see Note B)
tPHL
VOH
Output
Output
Control
(low-level
enabling)
tPZL
2.7 V
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
2.7 V
Data
Input
1.5 V
0V
0V
tsu
1.5 V
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL
tPHZ
VOH
1.5 V
VOH − 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 3. Load Circuit and Voltage Waveforms
9
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ALVCH16270DGGRE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ALVCH16270DGGRG4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ALVCH16270DLG4
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ALVCH16270DLRG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVCH16270DGGR
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVCH16270DL
ACTIVE
SSOP
DL
56
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ALVCH16270DLR
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
20
20
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74ALVCH16270DGGR TSSOP
SN74ALVCH16270DLR
SSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ALVCH16270DGGR
TSSOP
DGG
56
2000
346.0
346.0
41.0
SN74ALVCH16270DLR
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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