Texas Instruments | SN54ABT162827A, SN74ABT162827A (Rev. F) | Datasheet | Texas Instruments SN54ABT162827A, SN74ABT162827A (Rev. F) Datasheet

Texas Instruments SN54ABT162827A, SN74ABT162827A (Rev. F) Datasheet
SCBS248F − JULY 1993 − REVISED JUNE 2004
D Members of the Texas Instruments
D
D
D
D
D
D
D
D
SN54ABT162827A . . . WD PACKAGE
SN74ABT162827A . . . DGG OR DL PACKAGE
(TOP VIEW)
Widebus  Family
Output Ports Have Equivalent 25-Ω Series
Resistors, So No External Resistors Are
Required
High-Impedance State During Power Up
and Power Down
Typical VOLP (Output Ground Bounce)
<1 V at VCC = 5 V, TA = 25°C
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Ioff and Power-Up 3-State Support Hot
Insertion
Flow-Through Architecture Optimizes PCB
Layout
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD-17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
1OE1
1Y1
1Y2
GND
1Y3
1Y4
VCC
1Y5
1Y6
1Y7
GND
1Y8
1Y9
1Y10
2Y1
2Y2
2Y3
GND
2Y4
2Y5
2Y6
VCC
2Y7
2Y8
GND
2Y9
2Y10
2OE1
description/ordering information
The ’ABT162827A devices are noninverting
20-bit buffers composed of two 10-bit buffers with
separate output-enable signals. For either 10-bit
buffer, the two output-enable (1OE1 and 1OE2, or
2OE1 and 2OE2) inputs must both be low for the
corresponding Y outputs to be active. If either
output-enable input is high, the outputs of that
10-bit buffer are in the high-impedance state.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1OE2
1A1
1A2
GND
1A3
1A4
VCC
1A5
1A6
1A7
GND
1A8
1A9
1A10
2A1
2A2
2A3
GND
2A4
2A5
2A6
VCC
2A7
2A8
GND
2A9
2A10
2OE2
The outputs, which are designed to source or sink
up to 12 mA, include equivalent 25-Ω series
resistors to reduce overshoot and undershoot.
ORDERING INFORMATION
TA
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
SSOP − DL
TSSOP − DGG
Tube
SN74ABT162827ADL
Tape and reel
SN74ABT162827ADLR
Tape and reel
SN74ABT162827ADGGR
TOP-SIDE
MARKING
ABT162827A
ABT162827A
−55°C to 125°C
CFP − WD
Tube
SNJ54ABT162827AWD
SNJ54ABT162827AWD
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright  2004, Texas Instruments Incorporated
!" #$%&'() %$)*!)" +
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1
SCBS248F − JULY 1993 − REVISED JUNE 2004
description/ordering information (continued)
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
To ensure the high-impedance state during power up or power down, OE shall be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each 10-bit buffer)
INPUTS
A
OUTPUT
Y
OE1
OE2
L
L
L
L
L
L
H
H
H
X
X
Z
X
H
X
Z
logic diagram (positive logic)
1
1OE1
1OE2
1A1
28
2OE1
2OE2
56
55
2
1Y1
2A1
29
42
To Nine Other Channels
15
2Y1
To Nine Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . −0.5 V to 5.5 V
Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCBS248F − JULY 1993 − REVISED JUNE 2004
recommended operating conditions (see Note 3)
SN54ABT162827A
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
∆t/∆V
Input transition rise or fall rate
∆t/∆VCC
TA
Power-up ramp rate
200
Operating free-air temperature
−55
High-level input voltage
SN74ABT162827A
2
2
0.8
Input voltage
0
Low-level output current
VCC
−3
V
V
0.8
0
UNIT
VCC
−12
V
V
mA
8
12
mA
10
10
ns/V
µs/V
200
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
+ !),$-'*!$) %$)%(-)" .-$#&%" !) ( ,$-'*!6( $#("!5) .*"( $, #(6(0$.'()1 +*-*%(-!"!% #** *)# $(".(%!,!%*!$)" *-( #("!5) 5$*0"1 (2*" )"-&'()" -("(-6(" ( -!5 $
%*)5( $- #!"%$)!)&( ("( .-$#&%" 3!$& )$!%(1
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3
SCBS248F − JULY 1993 − REVISED JUNE 2004
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = −18 mA
IOH = −1 mA
VCC = 5 V,
VCC = 4.5 V
VOL
VCC = 4.5 V
Vhys
II
MIN
TA = 25°C
TYP†
MAX
SN54ABT162827A
MIN
−1.2
MAX
SN74ABT162827A
MIN
−1.2
−1.2
3.35
3.35
3.35
IOH = −1 mA
IOH = −3 mA
3.85
3.85
3.85
3.1
3.1
3.1
IOH = −12 mA
IOL = 8 mA
2.6*
UNIT
V
V
2.6
0.4
IOL = 12 mA
0.8
0.65
0.8*
0.8
100
VCC = 0 to 5.5 V, VI = VCC or GND
VCC = 0 to 2.1 V,
VO = 0.5 V to 2.7 V, OE = X
IOZPU
V
mV
±1
±1
±1
µA
±50
±50
±50
µA
±50
±50
±50
µA
IOZPD
VCC = 2.1 V to 0,
VO = 0.5 V to 2.7 V, OE = X
IOZH‡
VCC = 2.1 V to 5.5 V,
VO = 2.7 V, OE ≥ 2 V
10
10
10
µA
IOZL‡
VCC = 2.1 V to 5.5 V,
VO = 0.5 V, OE ≥ 2 V
−10
−10
−10
µA
Ioff
VCC = 0, VI or VO ≤ 4.5 V
VCC = 5.5 V,
Outputs high
VO = 5.5 V
±100
µA
50
µA
−100
mA
ICEX
IO§
ICC
∆ICC¶
Data
inputs
Control
inputs
Ci
Co
±100
50
−25
−75
−100
50
VCC = 5.5 V,
VO = 2.5 V
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
Outputs high
2
−25
−100
2
−25
2
Outputs low
32
32
32
Outputs disabled
2
2
2
VCC = 5.5 V,
Outputs enabled
One input at 3.4 V,
Other inputs at
Outputs disabled
VCC or GND
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
1
1.5
1
0.05
1
0.05
1.5
1.5
1.5
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
mA
pF
7
pF
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%*)5( $- #!"%$)!)&( ("( .-$#&%" 3!$& )$!%(1
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mA
4
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ The parameters IOZH and IOZL include the input leakage current.
§ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
4
MAX
• DALLAS, TEXAS 75265
SCBS248F − JULY 1993 − REVISED JUNE 2004
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A
Y
tPZH
tPZL
OE
Y
tPHZ
tPLZ
OE
Y
PARAMETER
VCC = 5 V,
TA = 25°C
SN54ABT162827A
SN74ABT162827A
MIN
TYP
MAX
MIN
MAX
MIN
MAX
1
2.1
3.6
1
4.1
1
3.9
1.1
2.8
4.2
1.1
5
1.1
4.7
1.5
3.4
6.3
1.5
7.2
1.5
6.9
1.6
3.5
5.3
1.6
6.6
1.6
6.3
2.1
4.1
6.5
2.1
6.8
2.1
6.6
1.5
3.5
5.9
1.5
7.3
1.5
6.3
UNIT
ns
ns
ns
+ !),$-'*!$) %$)%(-)" .-$#&%" !) ( ,$-'*!6( $#("!5) .*"( $, #(6(0$.'()1 +*-*%(-!"!% #** *)# $(".(%!,!%*!$)" *-( #("!5) 5$*0"1 (2*" )"-&'()" -("(-6(" ( -!5 $
%*)5( $- #!"%$)!)&( ("( .-$#&%" 3!$& )$!%(1
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5
SCBS248F − JULY 1993 − REVISED JUNE 2004
PARAMETER MEASUREMENT INFORMATION
7V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
LOAD CIRCUIT
3V
Timing Input
1.5 V
0V
tw
tsu
3V
Input
1.5 V
1.5 V
th
3V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
VOH
1.5 V
Output
1.5 V
VOL
VOH
Output
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPLZ
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLH
tPHL
1.5 V
tPZL
tPHL
tPLH
3V
Output
Control
Output
Waveform 2
S1 at Open
(see Note B)
1.5 V
tPZH
3.5 V
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ABT162827ADGGRE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABT162827ADGGRG4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABT162827ADLRG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162827ADGGR
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162827ADL
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162827ADLG4
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT162827ADLR
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74ABT162827ADGGR TSSOP
SN74ABT162827ADLR
SSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGG
56
2000
330.0
24.4
8.6
15.6
1.8
12.0
24.0
Q1
DL
56
1000
330.0
32.4
11.35
18.67
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ABT162827ADGGR
TSSOP
DGG
56
2000
346.0
346.0
41.0
SN74ABT162827ADLR
SSOP
DL
56
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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