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Texas Instruments 14-24-Logic-EVM User guides
User's Guide
SCEU014 – October 2018
14-24-Logic-EVM User's Guide
This user’s guide contains support documentation for the 14-24-Logic Evaluation Module (EVM). Included
is a description of how to set up and configure the EVM, the printed circuit board (PCB) layout, the
schematic, and the bill of materials (BOM) of the 14-24-Logic-EVM.
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Contents
Introduction ..................................................................................................................
Hardware .....................................................................................................................
Board Layout ................................................................................................................
Bill of Materials ..............................................................................................................
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2
5
5
List of Figures
6
.....................................................................................................
...............................................................................................
Fully Populated Section .....................................................................................................
Shunt Usage for Device Evaluation .......................................................................................
Shunt Usage for 16-pin Device ............................................................................................
14-24-Logic-EVM Layout ...................................................................................................
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Package and Pin Support Table
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14-24-Logic-EVM PCB
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14-Pin Device in D Package
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List of Tables
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14-24-Logic-EVM Kit Contents ............................................................................................
Bill of Materials ...............................................................................................................
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Trademarks
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Introduction
The 14-24-Logic-EVM is a generic EVM developed to support leaded Logic devices in the PW, DB, D,
DW, NS, N, P, and DGV packages. This EVM can be used to evaluate any device in the package family
and pin counts described in Table 1. The PCB can be broken down into six sections with each section
supporting certain packages indicated on the board. This EVM allows the user to have a great amount of
flexibility when evaluating leaded Logic devices.
Table 1. Package and Pin Support Table
TI Package Name
Package Family
# of Pins
PW
TSSOP
14, 16, 20, 24
DB
SSOP
14, 16, 20, 24
NS
SOP
14, 16, 20, 24
DGV
TVSOP
14, 16, 20, 24
D
SOIC
14, 16, 20, 24
DW
SOIC
14, 16, 20, 24
N
PDIP
14, 16, 20
P
PDIP
14, 16, 20
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Introduction
1.1
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Kit Contents
Table 2. 14-24-Logic-EVM Kit Contents
1.2
Item
Description
Quantity
14-24-Logic-EVM
PCB
1
Headers
12 position, 100-mil (2.54 mm), thru-hole
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Features
The 14-24-Logic-EVM has the following features:
• Multiple package support
• Breadboard compatible
• Easy-to-use / Flexible evaluation
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Hardware
2.1
PCB Overview
Figure 1. 14-24-Logic-EVM PCB
The 14-24-Logic-EVM PCB is designed to be straightforward for new users to begin evaluating leaded
Logic devices. This section will highlight a few aspects of the PCB that are helpful to the user.
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•
•
•
•
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Board breakable into six sections with inclusion of v-scored grooves
Each section has headers connected to device pins, VCC, and GND
Dashed lines included to assist with the placement of devices with less than 24 pins
Designated supply inputs which can support thru-hole test points
Bypass capacitor footprint included for device VCC
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Hardware
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2.2
Hardware Setup
This section will cover the six steps to take when evaluating a leaded Logic device using this EVM.
1. Identify the package you will be using for the device being evaluated. As stated previously, this EVM
has six sections each of which contains a footprint in which a logic device can be placed. Break off the
selected section (optional).
2. Solder down the device. Some sections support multiple packages so carefully solder down the device
to make sure it is aligned properly. If a device with less than 24 pins is being evaluated, it should be
placed towards the top of the footprint.
3. Ensure device VCC pin is connected to the bypass capacitor. If pin 1 of the device is connected to pin 1
of the footprint then it will be connected correctly. Figure 2 shows an example of a 14-pin device in the
D package placed correctly on the EVM.
Figure 2. 14-Pin Device in D Package
4. Interface with device pins. The kit includes six 12-pin headers which will allow the user to fully populate
a single section. An example of this, with the addition of test points and a bypass capacitor for the
supply, can be seen in Figure 3.
Figure 3. Fully Populated Section
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Hardware
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5. The device VCC pin will need to be connected to the VCC of the EVM. If using the headers, this can be
accomplished using a simple shunt. If the headers are not being used then a simple solder bridge can
be formed from the I/O header pad to the VCC header pad.
6. Repeat step 5 for the GND pin and any unused input pins of the device. Figure 4 shows an example of
how to use shunts to both power the device and tie unused inputs to a defined logic state to prevent
them from floating. For more information on why it is important to avoid floating inputs, see the
Implications of Slow or Floating CMOS Inputs application report.
Figure 4. Shunt Usage for Device Evaluation
Figure 5. Shunt Usage for 16-pin Device
Figure 5 is included to highlight that the GND shunt will shift up as the device pin count decreases even
though the VCC will always be shunted in the top right assuming the device is placed correctly.
4
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Board Layout
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3
Board Layout
Figure 6. 14-24-Logic-EVM Layout
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Bill of Materials
This section will provide information on the components that can be used with the 14-24-Logic-EVM.
Other components can be used as long as they are able to fit the provided plated holes and pads.
Table 3. Bill of Materials
Item
Value
Description
Package Reference
Part Number
Manufacturer
0.1 µF
CAP, CERM, 0.1 µF,
50 V, ± 20%, X7R, 0805
0805
08055C104MAT2A
AVX
Header
Header, 2.54 mm, 12×1,
Gold, TH
Header, 2.54 mm, 12×1,
TH
PBC12SABN
Sullins Connector
Solutions
Red Test
Point
Test Point, Multipurpose,
Red, TH
Red Multipurpose
Testpoint
5010
Keystone
Black Test
Point
Test Point, Multipurpose,
Black, TH
Black Multipurpose
Testpoint
5011
Keystone
Bypass
Capacitor
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