Texas Instruments | Logic (Rev. AB) | Selection guides | Texas Instruments Logic (Rev. AB) Selection guides

Texas Instruments Logic (Rev. AB) Selection guides
Logic Guide
www.ti.com/logic
2017
Logic Guide
Introduction and Contents
Today’s applications are evolving with
greater functionality and smaller size.
TI’s goal is to help designers easily find
the ideal logic technology or function
they need. Logic families are offered at
every price/performance node along
with benchmark delivery, reliability, and
worldwide support. TI maintains a firm
commitment to remain in the market
with both leading-edge and mature
logic lines.
Introduction
As the world leader in logic, Texas
Instruments (TI) offers a full spectrum
of logic functions and technologies
that range from the mature bipolar and
bipolar complementary metal-oxide
semiconductor (BiCMOS) families to
the latest advanced-CMOS families. TI
offers process technologies with the
logic performance and features needed
in today’s electronic markets while
maintaining support for traditional logic
products.
Table of Contents
Logic Guide 2017
2
Logic Overview
3
4
5
6
7
Logic suppliers have historically focused
on speed and low power as the priorities for product family improvement. As
shown below, improved performance is
offered by many new TI product technologies such as AUC (1.8 V) and ALVC
(3.3 V) depending on operating voltage
requirements. Other technologies such
as AUP focus on delivering “best-inclass” low-power performance.
TI’s product offerings include the
following process technologies or device
families:
• AC, ACT, AHC, AHCT, ALVC, AUC,
AUP, AVC, FCT, HC, HCT, LV-A, LV-AT,
LVC, TVC
• ABT, ABTE, ALB, ALVT, BCT, HSTL,
LVT, LV1T, LV4T
• FB, VME
• ALS, AS, F, LS, S, TTL
8
8
9
9
9
10
10
11
11
11
12
12
12
13
13
13
14
14
15
15
15
CMOS Voltage vs. Speed
25
HC
AHC
Typical Propagation Delay, tpd (ns)
AC
LVA
15
AUC
AUP
ALVC
AUP1T
AVC
LV1T/LV4T
LVC/LVC1G
AC/ACT
AHC/AHCT
HC/HCT
LV-A/LV-AT
ALB
ALVT
LVT
ABT/ABTE
ALS/AS/S/LS
BCT
F
FCT
TTL
CD4000
LVC
Resources
ALVC
16
17
19
AVC
AUC
10
World of TI Logic
IC Basics
Automotive Logic
Introducing the Next Generation
QFN packaging
Technology Functions Matrix
Logic Families
Data sheets can be downloaded from
the TI Web site at www.ti.com or ordered
through your local sales office or TI
authorized distributor. (See back cover.)
20
Introduction and Contents
Package Options
Related Logic Resources
TI Worldwide Technical
Support
5
0
0
1
2
3
4
5
6
7
CMOS Voltage, VCC (V)
2
| Logic
Guide 2017
Texas
Instruments
Texas
Instruments
Logic
Guide
2017 | 2
Logic Overview
World of TI Logic
Some logic families have been in the
marketplace for years, the oldest is well
into its fifth decade. The following section
gives the logic user a visual guide to the
technology families that are available and
their optimal voltage levels.
0.8-V Logic
1.2-V Logic
1.5-V Logic
AUC, AUP
AUC, AUP, AVC
AUC, AUP, AVC
1.8-V Logic
2.5-V Logic
3.3-V Logic
ALVC, AUC, AUP, AVC, LVC, LV1T
ALVC, ALVT, AUC, AUP, AVC,
LV, LV1T, LV-A, LVC
AC, AHC, ALB, ALVC, ALVT,
AUP, AVC, LV, LV-A,
LVC, LVT, LV1T, AUP1T
5-V Logic
ABT, AC/ACT, AHC, AHCT, ALS,
AS, BCT, F, LV, LV1T, LV-A,
LS, S, TTL, CD4000, FCT2
5-V+ Logic
CD4000
Texas Instruments
Logic Guide 2017
|
3
Logic Overview
IC Basics: Comparison of Switching Standards
Shown below are the switching input/
output comparison table and graphic
that illustrate VIH and VIL, which are the
minimum switching levels for guaranteed
operation. Vt is the approximate switching
level and the VOH and VOL levels are the
guaranteed outputs for the VCC specified.
Is VOH higher than VIH?
Is VOL less than VIL?
D
R
5 TTL
5 CMOS
3 LVTTL
2.5 CMOS
1.8 CMOS
5 TTL
Yes
No
Yes*
Yes*
Yes*
5 CMOS
Yes
Yes
Yes*
Yes*
Yes*
3 LVTTL
Yes
No
Yes
Yes*
Yes*
2.5 CMOS
Yes
No
Yes
Yes
Yes*
1.8 CMOS
No
No
No
No
Yes*
R
D
* Requires VIH Tolerance
5V
VCC
2.4
VOH
2.0
VIH
1.5
Vt
0.8
0.4
0
5V
VCC
4.44
VOH
3.5
VIH
2.5
1.5
Vt
VIL
VIL
VOL
GND
5-V TTL
Standard TTL: ABT,
AHCT, HCT, ACT,
bipolar, LV1T, LV4T
4
| Logic
Guide 2017
Texas
Instruments
O.5
0
VOL
GND
5-V CMOS
Rail-to-Rail 5 V
HC, AHC, AC, LV-A,
LV1T, LV4T
3.3 V
VCC
2.4
VOH
2.0
VIH
1.5
Vt
0.8
VIL
0.4
VOL
0
GND
3.3-V LVTTL
LVT, LV1T, LV4T,
LVC, ALVC, AUP,
LV-A, ALVT
2.5 V
VCC
2.3
VOH
1.7
VIH
1.2
Vt
0.7
VIL
0.2
VOL
0
GND
2.5-V CMOS
AUC, AUP, AVC,
ALVC, LVC, ALVT,
LV1T, LV4T
1.8 V
VCC
1.2
VOH
1.17
VIH
0.9
0.0
Vt
VIL
0.45
VOL
0
GND
1.8-V CMOS
AUC, AUP, AVC,
ALVC, LVC,
LV1T, LV4T
Texas
Instruments
Logic
Guide
2017 | 4
Logic Overview
Automotive Logic
Texas Instruments (TI) offers a vast portfolio of automotive logic products that
are compliant to the AEC-Q100 standard.
These devices are applicable for automotive, industrial, and high-reliability systems
and come with world-class support.
Breadth of Product Functions
TI’s automotive logic products include
a wide range in functionality in both
­standard logic and little logic functions
such as single-, dual- and triple-gates.
With more than 125 different standard
gate functions and close to 40 little logic
­functions, TI has one of the most comprehensive portfolios for automotive logic
in the industry. This gives automotive
system designers the flexibility to choose
the functions they need for their target
systems.
Package Offerings
TI’s packaging options for logic products
range from standard SOIC and TSSOP
packages to small-form-factor SC70 and
SOT-23 packages. These logic products
are suitable for a wide spectrum of automotive applications.
Benchmark Lead Times
With a vast network of worldwide wafer
fabs and assembly/test sites, TI supports
automotive customers with benchmark
product lead times. Most TI a
­ utomotive
logic product lead times are six weeks
or less.
Quality Control
All logic products go through a tightly
controlled manufacturing process that
includes quality-control checks geared
to achieve the zero-DPPM requirements
of automotive OEMs.
Reliability
TI’s design-flow checks ensure that
all automotive logic products meet or
exceed long-term reliability expectations.
Supply Continuity
TI has a solid track record of supply
continuity. TI’s first logic products
were introduced in 1964 and are still in
production and supported. Automotive
grade products have been in production
and supported since 1984.
For the full list of TI’s automotive logic
products, please visit www.ti.com/logic
Start Your Future Automotive Designs with TI Logic
Texas Instruments
Logic Guide 2017
|
5
Logic Overview
Introducing the Next Generation QFN Packaging
New Packaging for Space-Constrained Applications
TI’s premier packaging portfolio allows for logic devices to be i­ncorporated into small form factors such as the ever-shrinking wearables, mobile devices, home automation, as well as healthcare and fitness devices. Any customer planning to fit advanced logic
functions into space constrained applications will find the X1QFN and X2SON packages to be a valuable resource for new designs.
X1QFN
X1QFN is a new advanced packaging
series available for 14-, 16-, and 20-pin
devices offered by Texas Instruments
(TI) with a lower propagation delay and
wider operating temperature than any
other QFN package. The 14-pin X1QFN
is just 2.5 x 2.1 x 0.5 mm with 0.4-mm
pitch, a major revolution in the industry
for small-scale packages. Such small
package sizes were previously only
offered for little logic functions such as
single-, dual- and triple-gates, but with
aggressive die shrinking, TI has brought
multi-gate functions to this advanced
small-scale package.
20 PDIP
(N)
QFN 20-pin
4.5 x 3.5 mm
(RGY)
20 SOIC
(DW)
20 SOP
(NS)
20 QSOP
(DBQ)
52%
Smaller
QFN 16-pin
4 x 3.5 mm
(RGY)
20 TVS0P
(DGV)
44%
Smaller
X1QFN 20-pin
3.3 x 2.5 mm
(RWP)
X1QFN 16-pin
2.5 x 2.5 mm
(RWN)
20 TSSOP
(PW)
16 SSOP
(DB)
16 QSOP
(DBQ )
16 TSSOP
(PW)
16 TVSOP
(DGV)
X2SON
TI is not only investing in standard logic
space, but also in popular little logic
functions. TI has released the newest
and smallest next generation X2SON
package (a.k.a. X2QFN) for 5-pin and
6-pin devices. The 5-pin DPW package
is just 0.8 x 0.8 x 0.4 mm (0.5-mm pitch),
whereas the 6-pin DTB package is only
0.8 x 1.0 x 0.4 mm (0.4-mm pitch).
QFN
(DRY)
Smaller
X2SON 5-pin
0.8 x 0.8 mm
(DPW)
Actual
Size
X2SON 6-pin
0.8 x 1.0 mm
(DTB)
X2SON
(DSF)
6
|
Logic Guide 2017
22 to 36%
Smaller
Texas Instruments
Logic Overview
Technology Function Matrix
4
4
AVC
1.8, 3.3
4
1.8, 3.3, 5
4
41
AC
3.3, 5
41
4
AHC
3.3, 5
1
4
4
1
HC
3.3, 5
41
41
LV-A
3.3, 5
1
4
1
ALB
3.3
4
ALVT
3.3
4
GTL
3.3
3.3
VME
3.3
ABT
5
ABTE
5
4
4
41
4
41
4
4
4
41
41
41
41
41
41
4
4
4
41
4
4
4
4
4
41
4
4
41
4
4
4
4
4
41
41
4
41
41
4
4
41
4
4
4
41
1
4
1
4
1
4
4
1
41
41
41
41
41
4
4
1
1
4
1
4
4
4
4
4
4
4
4
4
4
4
4
4
41
4
4
4
4
4
1
41
4
4
41
4
41
4
1
1
4
4
4
4
4
4
4
4
4
4
4
4
4
41
41
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
41
4
41
4
4
4
41
41
41
4
ACT
5
4
AHCT
5
41
4
4
41
4
4
4
41
4
4
1
4
4
41
4
4
4
4
4
4
4
4
41
ALS
5
4
4
4
4
4
4
4
4
4
5
4
4
4
4
4
4
4
4
4
BCT
5
4
4
F
5
4
4
FB
5
4
4
4
4
4
4
4
4
4
4
FCT
5
4
4
4
4
4
4
HCT
5
41
41
4
4
4
4
4
4
4
4
4
4
LS
5
4
4
LV-AT
5
4
4
S
5
4
4
4
4
4
4
4
TTL
4
5
4
5, 10, 12 to 18
41
4
4
4
4
4
4
4
4
4
41
4
4
4
41
4
4
4
4
4
4
41
4
4
4
4
4
4
4
4
1
41
AS
CD4000
BiCMOS
4
4
CMOS
41
Bipolar
4
41
Power-off
Output Disable
4
41
Overvoltagetolerant Inputs
4
4
Series Damping
Resistors
4
4
Bus-Hold
4
4
41
4
41
Power-up 3-State
4
Phase Lock Loops
Digital Comp/
Parity Gen.
Encoders/
Decoders
Shift Registers
Counters
4
4
1.8, 3.3, 5
3.3
4
41
4
LV1T
GTLP
4
4
LVC
LVT
Combination
Logic
4
Schmitt Triggers
1.8, 3.3
1.8, 3.3
4
Process
IOFF (Partial
Power Down)
ALVC
AUP1T
4
Level Translators
4
4
Transceivers
0.8, 1.8, 2.5
0.8, 1.8, 3.3
Special Features
Gates
AUC
AUP
Flip-Flops
Voltage
Configurable
Logic
Families
Buffers/Line
Drivers
Functions
4
4
4
4
41
4
4
4
4
4
4
4
4
41
1
Also available in automotive grade
For product details, click this link for Quick search tab at www.ti.com/logic
Texas Instruments
Logic Guide 2017
|
7
Logic Families
AUC and AUP1G
Advanced Ultra-Low-Voltage CMOS
AUC
Key Features
• 1.8-V optimized performance
• VCC specified at 2.5 V, 1.8 V, and 1.2 V
• 3.6-V I/O tolerance
• Ioff spec for partial power down
• ESD protection
• Low noise
Applications
• Telecommunications equipment
• High-performance workstations
• PCs and networking servers
• Portable consumer electronics
Packaging Options
• BGA MicroStar Junior™
• DSBGA
• LFBGA
• SC70
• SM8
• SON
• SOT-23
•
•
•
•
•
•
SOT
TSSOP
TVSOP
UQFN
US8
VQFN
AUC Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 1.8 V
SN74AUC1G125
2.7
–9/9
1.5
SN74AUC1G32
2.7
–9/9
1.5
SN74AUC245
2.7
–9/9
1.7
SN74AUC1G04
2.7
–9/9
1.2
SN74AUC1G17
2.7
–9/9
1.9
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Advanced Ultra-Low-Power
AUP
Key Features
• Low static-/dynamic-power
consumption
• Wide VCC operating range:
0.8 to 3.6 V
• Input hysteresis allows for slow
input transition
• Best in class for speed-power
optimization
• Ioff spec for partial power down
• ESD protection
Applications
• Mobile phones
• PDAs
• Digital and video cameras
• Digital photo frames
• Embedded PC
• Video communications system
Packaging Options
• DSBGA
• SC70
• SM8
• SON
• SOT-23
•
•
•
•
SOT
UQFN
US8
X2SON
AUP Device Examples
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 3.3 V
ICC (µA)
SN74AUP1G07
Device
3.6
–4/4
3.3
0.9
SN74AUP1G34
3.6
–4/4
4.1
0.9
SN74AUP1G08
3.6
–4/4
4.3
0.9
SN74AUP1G32
3.6
–4/4
4.6
0.9
SN74AUP1G00
3.6
–4/4
4.8
0.9
For full product matrix, click this link for Quick search tab at www.ti.com/logic
8
|
Logic Guide 2017
Texas Instruments
Logic Families
ALVC, AUP1T and AVC
Advanced Low-Voltage CMOS
ALVC
Key Features
• VCC specified at 3.3 V, 2.5 V, and 1.8 V
• Balanced drive
• Bus-hold option
• Low noise
• Damping resistor options
• ESD protection
Packaging Options
• BGA MicroStar Junior™
• LFBGA
• PDIP
• SO
• SOIC
Applications
• Automotive
• Memory Interfaces
• Datapath communication
ALVC Device Examples
Device
•
•
•
•
VCC (V)
Drive (mA)
SN74ALVC125
3.6
–24/24
2.8
SN74ALVCH16373
3.6
–24/24
3.6
SN74ALVC164245
6
–24/24
5.8
SSOP
TSSOP
TVSOP
VQFN
tpd(MAX) (ns) at 3.3 V
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Advanced Ultra-Low-Power
AUP1T
Key Features
• Low voltage input switching levels
of 1.8 V and 2.5 V allows for low
threshold level
• Accepts 1.8-V to 2.5-V logic level
for high or low
• Only requires a single voltage to
achieve level shifting function
• VCC of either 2.5 V or 3.3 V
Applications
• Portable electronics
• Automotive
• Signal conditioning
Packaging Options
• DSBGA
• SON
• SC70
• SOT-23
• X2SON
AUP1T Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 1.8 V
ICC (µA)
SN74AUP1T17
3.6
–4/4
10
0.9
SN74AUP1T08
3.6
–4/4
10.8
0.9
SN74AUP1T32
3.6
–4/4
10.8
0.9
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Advanced Very-Low-Voltage CMOS
AVC
Key Features
• VCC specified at 3.3 V, 2.5 V, and 1.8 V
• 3.3-V I/O tolerance
• Sub-2.0-ns max tpd at 2.5 V
• Bus-hold option
• Ioff for partial power down
• Dynamic output control
Packaging Options
• BGA MicroStar Junior™
• DSBGA
• SC70
• SM8
• SOT-23
• SOT
Applications
• High-performance workstations
• PCs
• Networking servers
• Telecommunication equipment
AVC Device Examples
Device
•
•
•
•
TSSOP
TVSOP
UQFN
US8
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 3.3 V
SN74AVC16245
3.6
–12/12
1.7
SN74AVC16373
3.6
–12/12
2.8
SN74AVC16244
3.6
–12/12
3.5
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Texas Instruments
Logic Guide 2017
|
9
Logic Families
LV1T/LV4T and LVC/LVCxG
Low-Voltage CMOS Technology
LV1T/LV4T
Key Features
• Up/down translation with a single
power rail
• Down translation from up to 5.5-V to
VCC level
• Optimized and balanced output drive
(7 mA at 3.3-V VCC)
• No need for damping resistor
• Lowered switching threshold
Applications
• Computing
• Wearables
• Personal electronics
• Automotive and industrial
• Notebook
Packaging Options
• SC70
• SOT-23
• TSSOP
• VQFN
LV1T/LV4T Device Examples
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 3.3 V
SN74LV1T34
Device
5.0
–8/8
8.0
SN74LV4T125
5.0
–16/16
5.5
SN74LV1T08
5.5
–8/8
5.5
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Low-Voltage CMOS
LVC/LVC1G
Key Features
• VCC specified at 5.5 V, 3.3 V, 2.5 V,
and 1.8 V
• 5-V I/O tolerance
• Series damping resistor option
• Ioff spec for partial power down
• ESD protection
Applications
• Portable electronics
• Telecommunications equipment
• Networking servers
• Routing, clock buffering, and muxing
• Personal computing
Packaging Options
• BGA MicroStar Junior™
• CDIP
• CFP
• DSBGA
• LCCC
• LFBGA
• PDIP
• SC70
• SM8
• SO
• VQFN
•
•
•
•
•
•
•
•
•
•
•
SOIC
SON
SOT/SOT-23
X1QFN
SSOP
TSSOP
TVSOP
UQFN
US8
USON
X2SON
LVC/LVC1xG Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 3.3 V
SN74LVC1G125
5.5
–32/32
4.5
SN74LVC245A
3.6
–24/24
6.3
SN74LVC14A
3.6
–24/24
6.4
SN74LVC1G08
5.5
–32/32
3.6
For full product matrix, click this link for Quick search tab at www.ti.com/logic
10
| Logic
Guide 2017
Texas
Instruments
LogicTexas
GuideInstruments
2017 | 10
Logic Families
AC/ACT, AHC/AHCT and HC/HCT
Advanced CMOS
AC/ACT
Key Features
• Balanced propagation delay
• Inputs are TTL-voltage compatible
(ACT)
• Low power consumption
• ESD protection
• Center VCC pin and GND
configurations minimize high-speed
switching noise
Applications
• Buffer registers
• Defense, aerospace
• Working registers
• I/O ports
Packaging Options
• CDIP
• CFP
• CPGA
• LCCC
• SO
•
•
•
•
SOIC
SSOP
TSSOP
PDIP
AC/ACT Device Examples
Device
VCC (V)
Drive (mA)
SN74ACT245
5.5
–24/24
tpd(MAX) (ns) at 5 V
9.0
SN74AC373
6.0
–24/24
10.5
SN74ACT08
5.5
–24/24
10
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Advanced High-Speed CMOS
AHC/AHCT
Key Features
• Low noise without characteristic
overshoot/undershoot
• Low power consumption
• Small propagation delay (5.5 ns)
• 5 V and input tolerance at 3.3 V
• Pin-for-pin compatibility
Applications
• Industrial
• Defense, aerospace
• Medical
Packaging Options
• CDIP
• CFP
• LCCC
• PDIP
• SC70
• SO
• SOIC
•
•
•
•
•
•
SOT-23
SOT
SSOP
TSSOP
TVSOP
VQFN
AHC/AHCT Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 5 V
SN74AHC245
5.5
–8/8
6.5
SN74AHC123A
5.5
–8/8
14
SN74AHC1G08
5.5
–8/8
7
For full product matrix, click this link for Quick search tab at www.ti.com/logic
High-Speed CMOS
HC/HCT
Key Features
• Low noise without characteristic
overshoot/undershoot
• Low power consumption
• Small propagation delay (5.5 ns)
• TTL voltage-compatible inputs (HCT)
• Balanced propagation delay and transition times
• Wide operating temperature
Applications
• Automotive
• Buffer/storage registers
• Frequency synthesis and multiplication
• Shift registers
• Pattern generators
Packaging Options
• CDIP
• CFP
• TSSOP
• TVSOP
• SO
•
•
•
•
•
SOIC
SSOP
LCCC
PDIP
X1QFN
HC/HCT Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 6 V
SN74HC245
6.0
–7.8/7.8
22
CD74HC123
6.0
–5.2/5.2
68
CD74HC164
6.0
–5.2/5.2
38
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Texas Instruments
Logic Guide 2017
|
11
Logic Families
LV-A/LV-AT, ALB and ALVT
Low Voltage
LV-A/LV-AT
Key Features
• VCC specified at 5.0 V, 3.3 V, and 2.5 V
• Inputs are TTL voltage compatible
(LV-AT)
• 5-V I/O tolerance
• Ioff spec for partial power down
• ESD protection
• Low noise
Applications
• Portable electronics
• Buffer memory address registers
• Bidirectional bus drivers
• I/O ports
Packaging Options
• BGA MicroStar Junior™
• PDIP
• SO
• SOIC
•
•
•
•
SSOP
TSSOP
TVSOP
VQFN
LV-A/LV-AT Device Examples
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 5 V
SN74LV245A
Device
5.5
–16/16
8.5
SN74LV123A
5.5
–12/12
15
SN74LV244AT
5.5
–16/16
9.5
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Advanced Low-Voltage BiCMOS
ALB
Key Features
• State-of-the-art, advanced low-voltage
BiCMOS technology design
for 3.3-V operation
• Schottky diodes on all inputs to eliminate overshoot and undershoot
• Small high-speed switching noise
• Flow-through architecture that optimizes PCB layout
Applications
• Workstations
• Telecommunications equipment
• Advanced peripherals
Packaging Options
• SSOP
• TSSOP
• TVSOP
ALB Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 3.3 V
SN74ALB16244
3.6
–25/25
2.0
SN74ALB16245
3.6
–25/25
2.0
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Advanced Low-Voltage CMOS Technology
ALVT
Key Features
• VCC specified at 3.3 V and 2.5 V
• High-drive output: up to 64 mA
• 5-V I/O tolerance
• Power-up 3 state
• Partial power down (Ioff)
• Hot insertion
• Bus hold
Packaging Options
• BGA MicroStar Junior™
• LFBGA
• SSOP
Applications
• Backplane
• Bus-driving
• Digital logic systems
• TSSOP
• TVSOP
ALVT Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 2.5 V
SN74ALVTHR16245
3.6
–12/12
4.3
SN74ALVTH16374
3.6
–32/64
3.8
SN74ALVTH162244
3.6
–12/12
4.2
SN74ALVTH16373
3.6
–32/64
4.2
For full product matrix, click this link for Quick search tab at www.ti.com/logic
12
|
Logic Guide 2017
Texas Instruments
Logic Families
LVT, ABT/ABTE and ALS/AS/S/LS
Low-Voltage BiCMOS Technology
LVT
Key Features
• 5.5-V maximum input voltage
• Specified 2.7-V to 3.6-V supply voltage
• I/O structures support live insertion
• Rail-to-rail switching for driving CMOS
• tpd < 4.6 ns
• Allows mixed-signal operation
• Low-input leakage current
Applications
• Computing
• Wearables
• Personal electronics
• Automotive and industrial
Packaging Options
• MicroStar BGA™
• BGA MicroStar Junior™
• CDIP
• CFP
• LCCC
• LFBGA
• LQFP
•
•
•
•
•
•
SO
SOIC
SSOP
TSSOP
TVSOP
VQFN
LVT Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 3.3 V
SN74LVTH16245A
3.6
–32/64
3.3
SN74LVTH245A
3.6
–32/64
3.5
SN74LVTH16244A
3.6
–32/64
4.1
SN74LVTH125
3.6
–32/64
3.5
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Advanced BiCMOS Technology
ABT/ABTE
Key Features
• Low power dissipation
• ESD protection
• Distributed VCC and GND pin
configuration minimizes high-speed
noise
• Bus hold on data inputs eliminates
the need for external pullup/pulldown
resistors
Applications
• Buffer registers
• I/O ports
• Working registers
Packaging Options
• CDIP
• CFP
• LCCC
• LQFP
• PDIP
• SO
•
•
•
•
•
SOIC
SSOP
TSSOP
TVSOP
QFN
ABT/ABTE Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 5 V
SN74ABT245B
5.5
–32/64
3.9
SN74ABT125
5.5
–32/64
4.9
SN74ABT244A
5.5
–32/64
4.6
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Schottky Logic
ALS/AS/S/LS
Key Features
• PNP inputs reduce DC loading
• Hysteresis at inputs improves noise
margins
• Low power consumption
• Short propagation delays and high
clock frequencies
• Fully compatible with most TTL circuits
• Wide operating temperature
Applications
• Test and measurement
• Three-state memory address drivers
• Bus-oriented receivers/transceivers
• Balanced transmission lines
Packaging Options
• CDIP
• CFP
• LCCC
• PDIP
•
•
•
•
SO
SOIC
SSOP
TSSOP
ALS/AS/S/LS Device Examples
VCC (V)
Drive (mA)
SN54ALS245A
Device
5.5
–12/12
tpd(MAX) (ns) at 5 V
10
SN74ALS1034
5.5
–15/24
8.0
SN74AS373
5.5
–12/32
6.0
SN74LS07
5.5
40
30
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Texas Instruments
Logic Guide 2017
|
13
Logic Families
BCT and F
BiCMOS Technology
BCT
Key Features
• Low power consumption
• ESD protection
• Distributed VCC and GND pins minimize noise generated by
simultaneous switching of outputs
• Designed to facilitate incident-wave
switching for line impedances of 25 Ω
or greater
• Controlled baseline
Applications
• Asynchronous data bus
communication
• 3-state memory address drivers
• Clock drivers
• Bus-oriented receivers and
transmitters
Packaging Options
• CDIP
• CFP
• LCCC
• PDIP
•
•
•
•
SO
SOIC
SSOP
TSSOP
BCT Device Examples
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 5 V
SN74BCT125A
Device
5.5
–15/64
7.7
SN74BCT2245
5.5
–12/12
7.8
SN74BCT245
5.5
–15/64
7
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Fast Logic
F
Key Features
• Full-carry look-ahead across the four bits
• Systems achieve partial look-ahead
performance with the economy of
ripple carry
• Operational over the full military
temperature range
• Fully synchronous operation for
counting
• Fully independent clock circuit
Applications
• Stacked or pushdown registers
• Buffer storage
• Accumulator registers
• Asynchronous data bus
communication
Packaging Options
• CDIP
• CFP
• LCCC
• PDIP
• SO
• SOIC
• SSOP
F Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 5 V
SN74F245
5.5
–15/64
7.0
SN74F373
5.5
–3/24
13
SN74F04
5.5
–1/20
6
For full product matrix, click this link for Quick search tab at www.ti.com/logic
14
|
Logic Guide 2017
Texas Instruments
Logic Families
FCT, TTL and CD4000
Fast CMOS Technology
FCT
Key Features
• Edge-rate control circuitry for significantly improved noise characteristics
• Ioff supports partial-power-down mode
operation
• ESD protection
• Matched rise and fall times
• Fully compatible with TTL input and
output logic levels
Applications
• Programmable dividers
• Transmission lines
• High-speed, low-power bus
• Bus interface
Packaging Options
• CDIP
• CFP
• LCC
• PDIP
• SOIC
• SSOP
• TSSOP
FCT Device Examples
Device
VCC (V)
Drive (mA)
tpd(MAX) (ns) at 5 V
CD74FCT273
5.25
–15/48
13
CD74FCT245
5.25
–15/64
7.0
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Transistor-Transistor Logic
TTL
Key Features
• Synchronous operation
• Individual preset to each flip-flop
• Fully independent clear input
• Gated output-control lines for enabling
or disabling the outputs
• Load control line
• Diode-clamped inputs
• High noise immunity
• Wide operating temperature
Applications
• High-speed counting designs
• Bus buffer register
• Interfacing with high-level circuits
• Driving high-current loads
Packaging Options
• CDIP
• CFP
• LCCC
• PDIP
• SO
• SOIC
TTL Device Examples
Device
VCC (V)
Drive (mA)
SN7407
5.25
40
tpd(MAX) (ns) at 5 V
30
SN7400
5.25
–0.4/16
5.0
For full product matrix, click this link for Quick search tab at www.ti.com/logic
CMOS Logic
CD4000
Key Features
• Medium-speed operation: tPLH = 60 ns
at VDD = 10 V
• Standardized, symmetrical output
characteristics
• Separate serial outputs synchronous
to both positive and negative clock
edges for cascading
Applications
• Logical comparators
• Adders/subtractors
• Parity generators and checkers
• Serial-to-parallel data conversion
• Remote control holding register
Packaging Options
• CDIP
• SO
• CDIP SB
• SOIC
• CFP
• TSSOP
• PDIP
CD4000 Device Examples
Device
CD4069UB
CD40106B
CD4011B
VCC (V)
Drive (mA)
tpd(MAX) (ns)
18
18
18
–6.8/6.8
–6.8/6.8
–6.8/6.8
60
140
120
For full product matrix, click this link for Quick search tab at www.ti.com/logic
Texas Instruments
Logic Guide 2017
|
15
Resources
Package Options
Pins
PDIP
SOIC
SOP
SSOP
8
P
D
QSOP
10
DGN
DDU
DGK
DCU
DGS
14
16
VSSOP
PW
DCT
PS
TSSOP
D
N
NS
DB
PW
NS
DB
DBQ
PW
NS
DB
DBQ
PW
NS
DB
DBQ
PW
D
NE
DW
N
DW
N
DW
NT
DW
18
20
24
28
DW
DB
DL
38
PW
DBT
48
DL
DGG
DL
DGG
56
64
DGG
16
|
Logic Guide 2017
Texas Instruments
Resources
Package Options
Pins
TVSOP
3
DBZ
4
DCK
DRL
DRT
DPW
DRY DSF
DBV DRL
DRG
DRJ
RSE
9
RSF
DGV
DGV
DGV
DGV
RUE
12
ZXU
VFBGA
ZXY
GQN/ZQN
VFBGA
YFP
YFC
YFP
YZP
ZQS
GQL/ZQL
RWN
RSV
48
54
ZRD
YZP
YFC
YZT
VFBGA
56
GQL/ZQL
72
YFP
83
RGW RGY
RWP
RTW
RGE
RHL
RGE
ZQC
ZAH
YEA/YZA
RUC
RGY
RGT
RGY
RTE
24
RSE
DRC
12
20
YZP
YFP
10
16
YFP
DTB
DQE
14
8
YEA/YZA
YEA/YZA
DCQ
DCN
BGA
24
DRS
DRT
YZP
YFM
Pins
20
6
8
XLGA
YZV
YFP
DZD
DBV
DCK
WCSP
PK
DCY
5
MicroQFN
QFN
(UQFN)
SOT
YFP
ZST
ZRG
VFBGA
96
GKE/ZKE
ZRL
25
YFP
30
YFC
32
RGJ
GKF/ZKF
RSM RHB
RVA
42
56
114
RHH
36
48
VFBGA
DGV
DGV
RHU
RGQ
80
DBB
Texas Instruments
Logic Guide 2017
|
17
Resources
Related Logic Resources
Little Logic Guide
www.ti.com/lit/scyt129
18
|
Logic Guide 2017
Voltage Translation Guide
www.ti.com/lit/scyb018
TI Logic and Linear Products
www.ti.com/lit/slyc125
Texas Instruments
TI Worldwide Technical Support
TI Support
Thank you for your business. Find the answer to your support need or get in
touch with our support center at
www.ti.com/support
China:
http://www.ti.com.cn/guidedsupport/cn/docs/supporthome.tsp
Japan:
http://www.tij.co.jp/guidedsupport/jp/docs/supporthome.tsp
Technical support forums
Search through millions of technical questions and answers at TI’s E2E™
Community (engineer-to-engineer) at
e2e.ti.com
China:
http://www.deyisupport.com/
Japan:
http://e2e.ti.com/group/jp/
TI Training
From technology fundamentals to advanced implementation, we offer
on-demand and live training to help bring your next-generation designs to life.
Get started now at
training.ti.com
China:
http://www.ti.com.cn/general/cn/docs/gencontent.tsp?contentId=71968
Japan:
https://training.ti.com/jp
Important Notice: The products and services of Texas Instruments Incorporated and its
subsidiaries described herein are sold subject to TI’s standard terms and conditions of sale.
Customers are advised to obtain the most current and complete information about TI products and
services before placing orders. TI assumes no liability for applications assistance, customer’s
applications or product designs, software performance, or infringement of patents. The publication
of information regarding any other company’s products or services does not constitute TI’s approval,
warranty or endorsement thereof.
A011617
The platform bar, E2E, MicroStar BGA, MicroStar Junior and NanoStar
are trademarks of Texas Instruments. All other trademarks are the property of their respective owners.
© 2017 Texas Instruments Incorporated
Printed in U.S.A. by (Printer, City, State)
SDYU001AB
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising