Texas Instruments | DRV8880 2-A Stepper Motor Driver With AutoTune™ (Rev. C) | Datasheet | Texas Instruments DRV8880 2-A Stepper Motor Driver With AutoTune™ (Rev. C) Datasheet

Texas Instruments DRV8880 2-A Stepper Motor Driver With AutoTune™ (Rev. C) Datasheet
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DRV8880
SLVSD18C – JUNE 2015 – REVISED AUGUST 2017
DRV8880 2-A Stepper Motor Driver With AutoTune™
1 Features
2 Applications
•
•
•
•
•
•
•
1
•
•
•
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Microstepping Stepper Motor Driver
– STEP/DIR Interface
– Up to 1/16 Microstepping Indexer
– Non-Circular and Standard ½ Step Modes
6.5- to 45-V Operating Supply Voltage Range
Multiple Decay Modes to Support Any Motor
– AutoTune™
– Mixed Decay
– Slow Decay
– Fast Decay
Adaptive Blanking Time for Smooth Stepping
Configurable Off-Time PWM Chopping
– 10-, 20-, or 30-μs Off-Time
3.3-V, 10-mA LDO Regulator
Low-Current Sleep Mode (28 µA)
Small Package and Footprint
– 28 HTSSOP (PowerPAD™)
– 28 WQFN
Protection Features
– VM Undervoltage Lockout (UVLO2)
– Logic Undervoltage (UVLO1)
– Charge Pump Undervoltage (CPUV)
– Overcurrent Protection (OCP)
– Latched OCP Mode
– Retry OCP Mode
– Thermal Shutdown (TSD)
– Fault Condition Indication Pin (nFAULT)
Automatic Teller and Money Handling Machines
Video Security Cameras
Multi-Function Printers and Document Scanners
3D Printers
Office Automation Machines
Factory Automation and Robotics
3 Description
The DRV8880 is a bipolar stepper motor driver for
industrial applications. The device has two N-channel
power MOSFET H-bridge drivers and a microstepping
indexer. The DRV8880 is capable of driving 2.0 A fullscale current or 1.4-A rms current (with proper PCB
ground plane for thermal dissipation and at 24 V and
TA = 25°C).
AutoTune™ automatically tunes stepper motors for
optimal current regulation performance and
compensates for motor variation and aging effects.
Additionally slow, fast, and mixed decay modes are
available.
The STEP/DIR pins provide a simple control
interface. The device can be configured in full-step up
to 1/16- step modes. A low-power sleep mode is
provided for very low quiescent current standby using
a dedicated nSLEEP pin.
Internal protection functions are provided for
undervoltage, charge pump faults, overcurrent, shortcircuits, and overtemperature. Fault conditions are
indicated by a nFAULT pin.
Device Information(1)
PART NUMBER
DRV8880
PACKAGE
BODY SIZE (NOM)
HTSSOP (28)
9.70 mm × 4.40 mm
WQFN (28)
5.50 mm × 3.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified System Diagram
Microstepping Current Waveform
6.5 to 45 V
Full-scale current
µš}dµv ¡
1/16 µstep
M
2.0 A
+
2.0 A
-
Output Current
Controller
Decay mode
Stepper
Motor Driver
-
Step size
RMS current
DRV8880
+
STEP/DIR
AOUT
BOUT
Step Input
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV8880
SLVSD18C – JUNE 2015 – REVISED AUGUST 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
5
5
5
6
6
8
9
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Indexer Timing Requirements...................................
Typical Characteristics ..............................................
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 30
8
Application and Implementation ........................ 31
8.1 Application Information............................................ 31
8.2 Typical Application ................................................. 31
9
Power Supply Recommendations...................... 35
9.1 Bulk Capacitance Sizing ......................................... 35
10 Layout................................................................... 36
10.1 Layout Guidelines ................................................. 36
10.2 Layout Example .................................................... 36
11 Device and Documentation Support ................. 37
11.1
11.2
11.3
11.4
11.5
11.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
37
37
37
37
37
37
12 Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (August 2017) to Revision C
•
Page
Changed the maximum value for VREF from V3P3 + 0.5 V to 4.1 V in the Absolute Maximum Ratings table .................... 5
Changes from Revision A (July 2015) to Revision B
Page
•
Added the Power Supplies and Input Pins section .............................................................................................................. 27
•
Added the Receiving Notification of Documentation Updates section ................................................................................. 37
Changes from Original (June 2015) to Revision A
Page
•
Updated device status to production data ............................................................................................................................. 1
•
Updated from "PowerPAD" to "thermal pad" ......................................................................................................................... 4
2
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SLVSD18C – JUNE 2015 – REVISED AUGUST 2017
5 Pin Configuration and Functions
PWP PowerPAD™ Package
28-Pin HTSSOP
Top View
8
9
10
11
23
22
21
20
19
18
12
17
13
16
14
15
25
26
24
2
23
3
22
Thermal Pad - GND
7
24
1
4
5
6
7
8
21
20
19
18
17
9
16
10
15
TRQ1
M0
M1
STEP
DIR
ENABLE
DECAY0
DECAY1
nFAULT
nSLEEP
14
6
VCP
VM
AOUT1
AISEN
AOUT2
BOUT2
BISEN
BOUT1
VM
GND
13
5
CPH
CPL
GND
TRQ0
25
27
26
4
28
3
GND
TRQ0
TRQ1
M0
M1
STEP
DIR
ENABLE
DECAY0
DECAY1
nFAULT
nSLEEP
TOFF
V3P3
12
27
11
28
2
ATE
VREF
V3P3
TOFF
1
Thermal Pad - GND
CPL
CPH
VCP
VM
AOUT1
AISEN
AOUT2
BOUT2
BISEN
BOUT1
VM
GND
ATE
VREF
RHR Package
28-Pin WQFN With Exposed Thermal Pad
Top View
Pin Functions
PIN
NAME
TYPE
PWP
RHR
CPL
1
27
CPH
2
28
VCP
3
1
O
VM
4, 11
2, 9
PWR
AOUT1
5
3
AOUT2
7
5
AISEN
6
4
BOUT2
8
6
BOUT1
10
8
BISEN
9
12, 28
GND
PWR
DESCRIPTION
Charge pump switching
pins
Connect a VM rated, 0.1-µF ceramic capacitor between
CPH and CPL
Charge pump output
Connect a 16 V, 0.47 µF ceramic capacitor to VM
Power supply
Connect to motor supply voltage; bypass to GND with two
0.1 µF (for each pin) plus one bulk capacitor rated for VM
H-bridge outputs, drives one winding of a stepper motor
O
Winding A output
O
Winding A sense
O
Winding B output
7
O
Winding B sense
Requires sense resistor to GND; value sets peak current
in winding B
10, 26
PWR
Device ground
Must be connected to ground
Logic high enables AutoTune operation; when logic low,
the decay mode is set through the DECAYx pins;
AutoTune must be pulled high prior to power-up or coming
out of sleep, or else tied to V3P3 in order to enable
AutoTune; internal pulldown; see AutoTune
Requires sense resistor to GND; value sets peak current
in winding A
H-bridge outputs, drives one winding of a stepper motor
ATE
13
11
I
AutoTune enable pin
VREF
14
12
I
Full scale current
reference input
V3P3
15
13
PWR
Internal regulator
Internal supply voltage; bypass to GND with a 6.3 V, 0.47
µF ceramic capacitor; up to 10 mA external load
TOFF
16
14
I
Decay mode off time set
Sets the off-time during current chopping; tri-level pin
nSLEEP
17
15
I
Sleep mode input
Logic high to enable device; logic low to enter low-power
sleep mode; internal pulldown
nFAULT
18
16
O
Fault indication pin
Pulled logic low with fault condition; open-drain output
requires an external pullup
DECAY1
19
17
DECAY0
20
18
I
Decay mode setting pins
ENABLE
21
19
I
Enable driver input
Logic high to enable device outputs and internal indexer;
logic low to disable; internal pulldown
DIR
22
20
I
Direction input
Logic level sets the direction of stepping; internal pulldown
Voltage on this pin sets the full scale chopping current.
Sets the decay mode; see description section; tri-level pin
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Pin Functions (continued)
PIN
NAME
PWP
RHR
STEP
23
21
M1
24
22
M0
25
23
TRQ1
26
24
TRQ0
27
25
PAD
PAD
PAD
4
TYPE
DESCRIPTION
A rising edge causes the indexer to advance one step;
internal pulldown
I
Step input
I
Microstepping mode
setting pins
Sets the step mode; full, 1/2, 1/4, 1/8, 1/16; tri-level pin
I
Torque DAC current
scalar
Scales the current by 100%, 75%, 50%, or 25%; internal
pulldown
Thermal pad
Must be connected to ground
PWR
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range referenced with respect to GND (unless otherwise noted)
Power supply voltage (VM)
(1)
MIN
MAX
UNIT
–0.3
50
V
Power supply voltage ramp rate (VM)
0
2
V/µs
Charge pump voltage (VCP, CPH)
–0.3
VM + 12
V
Charge pump negative switching pin (CPL)
–0.3
VM
V
Internal regulator voltage (V3P3)
–0.3
3.8
V
0
10
mA
–0.3
7.0
V
Internal regulator current output (V3P3)
Control pin voltage (STEP, DIR, ENABLE, nSLEEP, nFAULT, M0, M1, DECAY0,
DECAY1, TRQ0, TRQ1, ATE)
Open drain output current (nFAULT)
0
10
mA
Reference input pin voltage (VREF)
–0.3
4.1
V
Continuous phase node pin voltage (AOUT1, AOUT2, BOUT1, BOUT2)
–0.7
VM + 0.7
V
–0.55
0.55
V
Continuous shunt amplifier input pin voltage (AISEN, BISEN)
(2)
Peak drive current (AOUT1, AOUT2, BOUT1, BOUT2, AISEN, BISEN)
Internally limited
A
Operating junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Transients of ±1 V for less than 25 ns are acceptable
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
UNIT
±4000
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
V
±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
MAX
6.5
(1)
45
UNIT
V
0
5.3
V
0.3
(2)
V3P3
VM
Power supply voltage range
VIN
Digital pin voltage range
VREF
Reference rms voltage range
ƒPWM
Applied STEP signal
0
100
(3)
kHz
IV3P3
V3P3 external load current
0
10
(4)
mA
IFS
Motor full scale current
0
2.0
A
Irms
Motor rms current
0
1.4
A
TA
Operating ambient temperature
–40
125
°C
(1)
(2)
(3)
(4)
V
Internal logic and indexer remain active down to VUVLO2 (4.9 V maximum) even though the output H-bridges are disabled
Operational at VREF ≈ 0 to 0.3 V, but accuracy is degraded
STEP input can operate up to 1 MHz, but system bandwidth is limited by the motor load
Power dissipation and thermal limits must be observed
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6.4 Thermal Information
DRV8880
THERMAL METRIC
(1)
PWP (HTSSOP)
RHR (WQFN)
28 PINS
28 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
33.1
37.5
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
16.6
23.0
°C/W
RθJB
Junction-to-board thermal resistance
14.4
8.0
°C/W
ψJT
Junction-to-top characterization parameter
0.4
0.2
°C/W
ψJB
Junction-to-board characterization parameter
14.2
7.8
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.3
1.7
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLIES (VM, V3P3)
VM
VM operating voltage
IVM
VM operating supply current
IVMQ
VM sleep mode supply current
6.5
nSLEEP high; ENABLE high; no motor
load; VM = 24 V
8
nSLEEP low; VM = 24 V; TA = 25°C
45
V
18
mA
28
nSLEEP low; VM = 24 V; TA = 125°C
77
(1)
μA
tSLEEP
Sleep time
nSLEEP low to sleep mode
100
μs
tWAKE
Wake-up time
nSLEEP high to output transition
1.5
ms
tON
Turn-on time
VM > VUVLO2 to output transition
1.5
ms
V3P3
LDO regulator voltage
External load 0 to 10 mA
3.6
V
2.9
3.3
CHARGE PUMP (VCP, CPH, CPL)
VCP
VCP operating voltage
ƒVCP
(1)
Charge pump switching
frequency
VM > 12 V
VM + 11.5
VUVLO2 < VM < 12 V
VM > VUVLO2
V
2×VM – 1.5
175
715
kHz
0
0.6
V
5.3
LOGIC-LEVEL INPUTS (STEP, DIR, ENABLE, nSLEEP, TRQ0, TRQ1, ATE)
VIL
Input logic low voltage
VIH
Input logic high voltage
1.6
VHYS
Input logic hysteresis
100
IIL
Input logic low current
VIN = 0 V
IIH
Input logic high current
VIN = 5.0 V
RPD
Pulldown resistance
Measured between the pin and GND
100
kΩ
tPD
Propagation delay
STEP input to current change
450
ns
V
mV
–1
50
1
μA
100
μA
TRI-LEVEL INPUTS (M0, M1, DECAY0, DECAY1, TOFF)
VIL
Tri-level input logic low voltage
VIZ
Tri-level input Hi-Z voltage
VIH
Tri-level input logic high voltage
VHYS
Tri-level input hysteresis
IIL
Tri-level input logic low current
VIN = 0 V
IIZ
Tri-level input Hi-Z current
VIN = 1.3 V
15
μA
IIH
Tri-level input logic high current
VIN = 3.3 V
85
μA
RPD
Tri-level pulldown resistance
Measured between the pin and GND
40
kΩ
RPU
Tri-level pullup resistance
Measured between V3P3 and the pin
45
kΩ
(1)
6
0
0.6
1.1
1.6
V
V
5.3
100
V
mV
–55
–35
μA
Specified by design and characterization data
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CONTROL OUTPUTS (nFAULT)
VOL
Output logic low voltage
IO = 4 mA
IOH
Output logic high leakage
External pullup resistor to 3.3 V
–1
0.5
V
1
μA
MOTOR DRIVER OUTPUTS (AOUT1, AOUT2, BOUT1, BOUT2)
VM = 24 V, I = 1 A, TA = 25°C
RDS(ON)
High-side FET on resistance
VM = 24 V, I = 1 A, TA = 125°C
330
(1)
400
VM = 6.5 V, I = 1 A, TA = 25°C
VM = 6.5 V, I = 1 A, TA = 125°C
(1)
500
VM = 24 V, I = 1 A, TA = 25°C
RDS(ON)
Low-side FET on resistance
VM = 24 V, I = 1 A, TA = 125°C
mΩ
560
300
(1)
370
VM = 6.5 V, I = 1 A, TA = 25°C
VM = 6.5 V, I = 1 A, TA = 125°C
440
430
400
370
(1)
tRISE
Output rise time
VM = 24 V, 50 Ω load from xOUTx to
GND
tFALL
Output fall time
VM = 24 V, 50 Ω load from VM to
xOUTx
tDEAD
Output dead time
Vd
Body diode forward voltage
450
(2)
IOUT = 0.5 A
mΩ
490
70
ns
70
ns
200
ns
0.7
1
V
PWM CURRENT CONTROL (VREF, AISEN, BISEN)
VTRIP
xISENSE trip voltage, full scale
TRQ at 100%, VREF = 3.3 V
500
TRQ at 75%, VREF = 3.3 V
375
TRQ at 50%, VREF = 3.3 V
250
TRQ at 25%, VREF = 3.3 V
TRQ at 100% (TRQ0 = 0, TRQ1 = 0)
AV
Amplifier attenuation
tOFF
PWM off-time
mV
125
6.25
6.58
6.91
TRQ at 75% (TRQ0 = 1, TRQ1 = 0)
6.2
6.56
6.92
TRQ at 50% (TRQ0 = 0, TRQ1 = 1)
6.09
6.51
6.94
TRQ at 25% (TRQ0 = 1, TRQ1 = 1)
5.83
6.38
6.93
TOFF Logic Low
20
TOFF Logic High
30
TOFF Hi-Z
10
V/V
μs
1.8
tBLANK
PWM blanking time
1.5
See Table 9 for details
µs
1.2
0.9
PROTECTION CIRCUITS
VM falling; UVLO2 report
5.8
6.4
VM rising; UVLO2 recovery
6.1
6.5
VM falling; logic disabled
4.5
4.9
VM rising; logic enabled
4.8
5
VUVLO2
VM undervoltage lockout
VUVLO1
Logic undervoltage
VUVLO,HYS
undervoltage hysteresis
VCPUV
Charge pump undervoltage
VCPUV,HYS
CP undervoltage hysteresis
Rising to falling threshold
50
IOCP
Overcurrent protection trip level
Current through any FET
2.5
3.6
VOCP
Sense pin overcurrent trip level
Voltage at AISEN or BISEN
0.9
1.25
V
tOCP
Overcurrent deglitch time
2
μs
(2)
Rising to falling threshold
100
V
V
mV
VCP falling; CPUV report
VM + 1.8
VCP rising; CPUV recovery
VM + 1.9
V
mV
A
Specified by design and characterization data
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Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
tRETRY
TEST CONDITIONS
MIN
Overcurrent retry time
TYP
MAX
0.5
TTSD
(2)
Thermal shutdown temperature
Die temperature TJ
THYS
(2)
Thermal shutdown hysteresis
Die temperature TJ
2
150
UNIT
ms
°C
35
°C
6.6 Indexer Timing Requirements
NO.
(1)
MIN
MAX
UNIT
(1)
MHz
1
ƒSTEP
Step frequency
2
tWH(STEP)
Pulse duration, STEP high
470
ns
3
tWL(STEP)
Pulse duration, STEP low
470
ns
4
tSU(DIR, Mx)
Setup time, DIR or Mx to STEP rising
200
ns
5
tH(DIR,
Hold time, DIR or Mx to STEP rising
200
ns
Mx)
1
STEP input can operate up to 1 MHz, but system bandwidth is limited by the motor load
1
2
3
STEP
DIR, Mx
4
5
Figure 1. Timing Diagram
8
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6.7 Typical Characteristics
6.35
6.5
6.45
6.4
6.35
6.3
6.25
6.2
6.15
6.1
6.05
6
5.95
5.9
5.85
5.8
6.3
6.25
Supply Current IVM (mA)
Supply Current IVM (mA)
Over recommended operating conditions (unless otherwise noted)
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
5
10
15
20
25
30
Supply Voltage VM (V)
35
40
6.2
6.15
6.1
6.05
6
5.95
5.9
5.85
5.75
-40
45
Figure 2. Supply Current over VM
26
25
Sleep Current IVMQ (PA)
Sleep Current IVMQ (PA)
24
22
20
18
16
14
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
8
9
12
15
18
21
24
27
Supply Voltage VM (V)
30
120
140
D002
33
24
23.5
23
22.5
22
21
-40
36
VM = 24 V
VM = 12 V
-20
0
D003
Figure 4. Sleep Current over VM
20
40
60
80
100
Ambient Temperature T A (qC)
120
140
D004
Figure 5. Sleep Current over Temperature
550
700
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
600
500
High-Side RDS(ON) (m:)
650
High-Side RDS(ON) (m:)
20
40
60
80
100
Ambient Temperature T A (qC)
24.5
21.5
6
6
0
Figure 3. Supply Current over Temperature
25.5
10
-20
D001
28
12
VM = 24 V
VM = 12 V
5.8
550
500
450
400
350
450
400
350
300
300
250
250
200
5
10
15
20
25
30
35
Supply Voltage VM (V)
40
45
50
200
-40
D005
Figure 6. High-Side RDS(ON) over VM
-20
0
20
40
60
80
100
Ambient Temperature T A (qC)
120
140
D006
Figure 7. High-Side RDS(ON) over Temperature (VM = 12 V)
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Typical Characteristics (continued)
Over recommended operating conditions (unless otherwise noted)
600
480
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
500
450
Low-Side RDS(ON) (m:)
Low-Side RDS(ON) (m:)
550
450
400
350
300
250
5
10
15
20
25
30
35
Supply Voltage VM (V)
40
45
360
330
300
270
210
-40
50
-20
0
D007
Figure 8. Low-Side RDS(ON) over VM
20
40
60
80
100
Ambient Temperature T A (qC)
120
140
D008
Figure 9. Low-Side RDS(ON) over Temperature (VM = 12 V)
3.36
0.5
TRQ = 00
TRQ = 01
TRQ = 10
TRQ = 11
0.45
0.4
3.355
3.35
0.35
V3P3 Voltage (V)
xISEN Full-Scale Trip Voltage (V)
390
240
200
0.3
0.25
0.2
0.15
3.345
3.34
3.335
3.33
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
0.1
3.325
0.05
3.32
0
0
0.5
1
1.5
2
2.5
VREF Pin Voltage (V)
3
3.5
0
D009
Figure 10. xISEN Full-Scale Trip Voltage over VREF Input
10
420
1
2
3
4
5
6
V3P3 Load (mA)
7
8
9
10
D010
Figure 11. V3P3 Regulator over Load (VM = 24 V)
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7 Detailed Description
7.1 Overview
The DRV8880 is an integrated motor driver solution for bipolar stepper motors. The device integrates two NMOS
H-bridges, current regulation circuitry, and a microstepping indexer. The DRV8880 can be powered with a supply
voltage between 6.5 and 45 V, and is capable of providing an output current up to 2.5 A peak current, 2.0 A fullscale current, or 1.4 A rms current. Actual operable full-scale and rms current will depend on ambient
temperature, supply voltage, and PCB ground plane size. Between VM = 6.4 V and VM = 4.9 V the H-bridge
outputs are shut down, but the internal logic remains active in order to prevent missed steps.
A simple STEP/DIR interface allows easy interfacing to the controller circuit. The internal indexer is able to
execute high-accuracy microstepping without requiring the processor to control the current level. The indexer is
capable of full step and half step as well as microstepping to 1/4, 1/8, and 1/16. In addition to the standard half
stepping mode, a non-circular 1/2-stepping mode is avaialble for increased torque output at higher motor rpm.
The current regulation is highly configurable, with several decay modes of operation. The decay mode can be
selected as a fixed slow, slow/mixed, mixed, slow/fast, or fast decay. The slow/mixed decay mode uses slow
decay on increasing steps and mixed decay on decreasing steps. Similarly, the slow/fast decay mode uses slow
decay on increasing steps and fast decay on decreasing steps.
In addition, an AutoTune mode can be used which automatically adjusts the decay setting to minimize current
ripple while still reacting quickly to step changes. This feature greatly simplifies stepper driver integration into a
motor drive system.
The PWM off-time, tOFF, can be adjusted to 10, 20, or 30 µs.
An adaptive blanking time feature automatically scales the minimum drive time with output current. This helps
alleviate zero-crossing distortion by limiting the drive time at low-current steps.
A torque DAC feature allows the controller to scale the output current without needing to scale the analog
reference voltage input VREF. The torque DAC is accessed using digital input pins. This allows the controller to
save power by decreasing the current consumption when not required.
A low-power sleep mode is included which allows the system to save power when not driving the motor.
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7.2 Functional Block Diagram
VM
0.1 µF
VM
VM
0.1 µF
+
bulk
VM
0.47 µF
VM
Power
VCP
AutoTune
AOUT1
CPH
0.1 µF
Charge
Pump
CPL
+
Step
Motor
VM
AOUT2
V3P3
10 mA
OffGate
time
Drive
PWM
3.3-V LDO
0.47 µF
+
STEP
DIR
AISEN
+
Core Logic
VREF
-
TRQ[1:0]
RSENSE
ENABLE
4
nSLEEP
SINE DAC
1/Av
Control
Inputs
ATE
TRQ[1:0]
-
VM
V3P3
M[1:0]
V3P3
BOUT1
DECAY[1:0]
Indexer
V3P3
TOFF
Analog
Input
VREF
OffGate
time
Drive
PWM
VM
BOUT2
Protection
Overcurrent
Output
nFAULT
+
Undervoltage
Thermal
GND
12
VREF
4
SINE DAC
TRQ[1:0]
BISEN
RSENSE
1/Av
GND PPAD
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7.3 Feature Description
Table 1 lists the recommended values of the external components.
Table 1. External Components
COMPONENT
PIN 1
PIN 2
CVM1
VM
GND
0.1-µF ceramic capacitor rated for VM per VM pin
CVM1
VM
GND
Bulk electrolytic capacitor rated for VM, recommended value is 100
µF, see Bulk Capacitance Sizing
CVCP
VCP
VM
16-V, 0.47-µF ceramic capacitor
CSW
CPH
CPL
0.1-µF X7R capacitor rated for VM
GND
6.3-V, 0.47-µF ceramic capacitor
CV3P3
RnFAULT
(1)
RECOMMENDED
V3P3
VMCU
(1)
nFAULT
RAISEN
AISEN
GND
RBISEN
BISEN
GND
> 5 kΩ pullup
Sense resistor, see Sense Resistor
VMCU is not a pin on the DRV8880, but a supply voltage pullup is required for open-drain output nFAULT; nFAULT may be pulled up to
V3P3
7.3.1 Stepper Motor Driver Current Ratings
Stepper motor drivers can be classified using three different numbers to describe the output current: peak, rms,
and full-scale.
7.3.1.1 Peak Current Rating
The peak current in a stepper driver is limited by the overcurrent protection trip threshold IOCP. The peak current
describes any transient duration current pulse, for example when charging capacitance, when the overall duty
cycle is very low. In general the minimum value of IOCP specifies the peak current rating of the stepper motor
driver. For the DRV8880, the peak current rating is 2.5 A per bridge.
7.3.1.2 RMS Current Rating
The rms (average) current is determined by the thermal considerations of the IC. The rms current is calculated
based on the RDS(ON), rise and fall time, PWM frequency, device quiescent current, and package thermal
performance in a typical system at 25°C. The real operating rms current may be higher or lower depending on
heatsinking and ambient temperature. For the DRV8880, the rms current rating is 1.4 A per bridge.
7.3.1.3 Full-Scale Current Rating
The full-scale current describes the top of the sinusoid current waveform while microstepping. Since the
sineusoid amplitude is related to the rms current, the full-scale current is also determined by the thermal
considerations of the IC. The full-scale current rating is approximately √2 × Irms. The full-scale current is set by
VREF, the sense resistor, and Torque DAC when configuring the DRV8880 , see Current Regulation for details.
For the DRV8880, the full-scale current rating is 2.0 A per bridge.
Full-scale current
Output Current
RMS current
AOUT
BOUT
Step Input
Figure 12. Full-Scale and rms Current
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7.3.2 PWM Motor Drivers
The DRV8880 contains drivers for two full H-bridges. A block diagram of the circuitry is shown in Figure 13.
VM
xOUT1
+
PWM
Logic
Gate
Drive
Step
Motor
VM
Device
Logic
xOUT2
4
TRQ[1:0]
SINE DAC
-
xISEN
+
VREF
+
RSENSE
1/Av
Figure 13. PWM Motor Driver Block Diagram
7.3.3 Microstepping Indexer
Built-in indexer logic in the DRV8880 allows a number of different stepping configurations. The Mx pins are used
to configure the stepping format as shown in Table 2.
Table 2. Microstepping Settings
M1
M0
STEP MODE
0
0
Full step (2-phase excitation) with 71%
current
0
1
Non-circular 1/2 step
1
0
1/2 step
1
1
1/4 step
0
Z
1/8 step
1
Z
1/16 step
Z
0
Reserved
Z
1
Reserved
Z
Z
Reserved
Table 3 shows the relative current and step directions for full-step through 1/16-step operation. The AOUT
current is the sine of the electrical angle; BOUT current is the cosine of the electrical angle. Positive current is
defined as current flowing from xOUT1 to xOUT2 while driving.
At each rising edge of the STEP input the indexer travels to the next state in the table. The direction is shown
with the DIR pin logic high. If the DIR pin is logic low, the sequence is reversed.
Note that if the step mode is changed while stepping, the indexer will advance to the next valid state for the new
MODE setting at the rising edge of STEP.
The home state is an electrical angle of 45°. This state is entered after power-up, after exiting logic undervoltage
lockout, or after exiting sleep mode. This is shown in Table 3 with the highlighted row.
14
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Table 3. Microstepping Relative Current Per Step
FULL
STEP
1/2 STEP
1/4 STEP
1/8 STEP
1/16 STEP
ELECTRICAL ANGLE
(°)
AOUT CURRENT
(% full-scale)
BOUT CURRENT
(% full-scale)
1
1
1
1
0.000°
0%
100%
2
5.625°
10%
100%
3
11.250°
20%
98%
4
16.875°
29%
96%
5
22.500°
38%
92%
6
28.125°
47%
88%
7
33.750°
56%
83%
8
39.375°
63%
77%
9
45.000°
71%
71%
10
50.625°
77%
63%
11
56.250°
83%
56%
12
61.875°
88%
47%
13
67.500°
92%
38%
14
73.125°
96%
29%
15
78.750°
98%
20%
16
84.375°
100%
10%
17
90.000°
100%
0%
18
95.625°
100%
–10%
19
101.250°
98%
–20%
20
106.875°
96%
–29%
21
112.500°
92%
–38%
22
118.125°
88%
–47%
23
123.750°
83%
–56%
24
129.375°
77%
–63%
25
135.000°
71%
–71%
26
140.625°
63%
–77%
27
146.250°
56%
–83%
28
151.875°
47%
–88%
29
157.500°
38%
–92%
30
163.125°
29%
–96%
31
168.750°
20%
–98%
32
174.375°
10%
–100%
33
180.000°
0%
–100%
34
185.625°
–10%
–100%
35
191.250°
–20%
–98%
36
196.875°
–29%
–96%
37
202.500°
–38%
–92%
38
208.125°
–47%
–88%
39
213.750°
–56%
–83%
40
219.375°
–63%
–77%
41
225.000°
–71%
–71%
42
230.625°
–77%
–63%
43
236.250°
–83%
–56%
44
241.875°
–88%
–47%
45
247.500°
–92%
–38%
46
253.125°
–96%
–29%
47
258.750°
–98%
–20%
2
2
3
4
1
2
3
5
6
4
7
8
3
5
9
10
6
11
12
2
4
7
13
14
8
15
16
5
9
17
18
10
19
20
3
6
11
21
22
12
23
24
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Table 3. Microstepping Relative Current Per Step (continued)
FULL
STEP
1/2 STEP
1/4 STEP
1/8 STEP
7
13
25
1/16 STEP
ELECTRICAL ANGLE
(°)
AOUT CURRENT
(% full-scale)
BOUT CURRENT
(% full-scale)
48
264.375°
–100%
–10%
49
270.000°
–100%
0%
50
275.625°
–100%
10%
51
281.250°
–98%
20%
52
286.875°
–96%
29%
53
292.500°
–92%
38%
54
298.125°
–88%
47%
55
303.750°
–83%
56%
56
309.375°
–77%
63%
57
315.000°
–71%
71%
58
320.625°
–63%
77%
59
326.250°
–56%
83%
60
331.875°
–47%
88%
61
337.500°
–38%
92%
62
343.125°
–29%
96%
63
348.750°
–20%
98%
64
354.375°
–10%
100%
1
360.000°
0%
100%
26
14
27
28
4
8
15
29
30
16
31
32
1
1
1
Non-circular 1/2–step operation is shown in Table 4. This stepping mode consumes more power than circular
1/2-step operation, but provides a higher torque at high motor rpm.
Table 4. Non-Circular 1/2-Stepping Current
NON-CIRCULAR
1/2 STEP
16
ELECTRICAL ANGLE
(°)
AOUT CURRENT
(% FULL-SCALE)
BOUT CURRENT
(% FULL-SCALE)
1
0°
0
100
2
45°
100
100
3
90°
100
0
4
135°
100
-100
5
180°
0
-100
6
225°
–100
-100
7
270°
–100
0
8
315°
–100
100
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7.3.4 Current Regulation
The current through the motor windings is regulated by an adjustable fixed-off-time PWM current regulation
circuit. When an H-bridge is enabled, current rises through the winding at a rate dependent on the DC voltage,
inductance of the winding, and the magnitude of the back EMF present. After the current hits the current
chopping threshold, the bridge enters a decay mode for a fixed period of time to decrease the current, which is
configurable between 10 and 30 µs through the tri-level input TOFF. After the off time expires, the bridge is reenabled, starting another PWM cycle.
Table 5. Off-Time Settings
TOFF
OFF-TIME tOFF
0
20 µs
1
30 µs
Z
10 µs
The PWM chopping current is set by a comparator which compares the voltage across a current sense resistor
connected to the xISEN pin with a reference voltage. To generate the reference voltage for the current chopping
comparator, the output of a sine lookup table is applied to a sine-weighted DAC, whose full-scale output voltage
is set by VREF. This voltage is attenuated by a factor of Av. In addition, the TRQx pins further scale the
reference.
VM
xOUT1
+
PWM
Logic
Gate
Drive
Step
Motor
VM
Device
Logic
xOUT2
4
TRQ[1:0]
SINE DAC
-
xISEN
+
VREF
+
RSENSE
1/Av
Figure 14. Current Regulation Block Diagram
The full-scale (100%) chopping current is calculated as follows:
VREF (V) u TRQ (%) VREF (V) u TRQ (%)
I FS (A)
A V u RSENSE (:)
6.6 u RSENSE (:)
(1)
The TRQx pins are the inputs to a Torque DAC used to scale the output current. The current scalar value for
different inputs is shown below.
Table 6. Torque DAC Settings
TRQ1
TRQ0
CURRENT SCALAR
(TRQ)
EFFECTIVE
ATTENUATION
1
1
25%
26.4 V/V
1
0
50%
13.2 V/V
0
1
75%
8.8 V/V
0
0
100%
6.6 V/V
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Table 7 gives the xISEN trip voltage at a given DAC code and TRQ[1:0] setting for 1/16 step mode. In this table,
VREF = 3.3 V.
Table 7. xISEN Trip Voltages over Torque DAC and Microsteps
18
TORQUE DAC TRQ[1:0] SETTING
1/16 STEP (SINE
DAC CODE)
00 – 100%
01 – 75%
10 – 50%
11 – 25%
16
500.0 mV
375.0 mV
250.0 mV
125.0 mV
15
490.0 mV
367.5 mV
245.0 mV
122.5 mV
14
480.0 mV
360.0 mV
240.0 mV
120.0 mV
13
460.0 mV
345.0 mV
230.0 mV
115.0 mV
12
440.0 mV
330.0 mV
220.0 mV
110.0 mV
11
415.0 mV
311.3 mV
207.5 mV
103.8 mV
10
385.0 mV
288.8 mV
192.5 mV
96.3 mV
9
355.0 mV
266.3 mV
177.5 mV
88.8 mV
8
315.0 mV
236.3 mV
157.5 mV
78.8 mV
7
280.0 mV
210.0 mV
140.0 mV
70.0 mV
6
235.0 mV
176.3 mV
117.5 mV
58.8 mV
5
190.0 mV
142.5 mV
95.0 mV
47.5 mV
4
145.0 mV
108.8 mV
72.5 mV
36.3 mV
3
100.0 mV
75.0 mV
50.0 mV
25.0 mV
2
50.0 mV
37.5 mV
25.0 mV
12.5 mV
1
0.0 mV
0.0 mV
0.0 mV
0.0 mV
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7.3.5 Decay Modes
A fixed decay mode is selected by setting the tri-level DECAYx pins as shown in Table 8. Please note that if the
ATE pin is logic high, the DECAYx pins are ignored and AutoTune is used.
Table 8. Decay Mode Settings
DECAY1
DECAY0
INCREASING STEPS
DECREASING STEPS
0
0
Slow Decay
Slow Decay
0
1
Slow Decay
Mixed Decay: 2 tBLANK
1
0
Slow Decay
Mixed Decay: 30% Fast
1
1
Mixed Decay: 30% Fast
Mixed Decay: 30% Fast
0
Z
Slow Decay
Mixed Decay: 60% Fast
1
Z
Slow Decay
Fast Decay
Z
0
Mixed Decay: 1 tBLANK
Mixed Decay: 30% Fast
Z
1
Mixed Decay: 60% Fast
Mixed Decay: 60% Fast
Z
Z
Fast Decay
Fast Decay
Increasing and decreasing current are defined in the chart below. For the Slow/Mixed decay mode, the decay
mode is set as slow during increasing current steps and mixed decay during decreasing current steps. In full step
mode, the increasing step decay mode is always used.
Figure 15. Definition of Increasing and Decreasing Steps
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7.3.5.1 Mode 1: Slow Decay for Increasing and Decreasing Current
Increasing Phase Current (A)
ITRIP
tBLANK
tOFF
tBLANK
tOFF
tDRIVE
Decreasing Phase Current (A)
tDRIVE
ITRIP
tBLANK
tOFF
tDRIVE
tBLANK
tOFF
tDRIVE
tBLANK
tDRIVE
Figure 16. Slow/Slow Decay Mode
During slow decay, both of the low-side FETs of the H-bridge are turned on, allowing the current to be
recirculated.
Slow decay exhibits the least current ripple of the decay modes for a given tOFF. However on decreasing current
steps, slow decay will take a long time to settle to the new ITRIP level because the current decreases very
slowly.
In cases where current is held for a long time (no input in the STEP pin) or at very low stepping speeds, slow
decay may not properly regulate current because no back-EMF is present across the motor windings. In this
state, motor current can rise very quickly, and may require a large off-time. In some cases this may cause a loss
of current regulation, and a more aggressive decay mode is recommended.
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7.3.5.2 Mode 2: Slow Decay for Increasing Current, Mixed Decay for Decreasing current
Increasing Phase Current (A)
ITRIP
tBLANK
tOFF
tBLANK
tOFF
tDRIVE
Decreasing Phase Current (A)
tDRIVE
tBLANK
tDRIVE
ITRIP
tBLANK
tDRIVE
tFAST
tBLANK
tOFF
tFAST
tDRIVE
tOFF
Figure 17. Slow/Mixed Decay Mode
Mixed decay begins as fast decay for a time, followed by slow decay for the remainder of tOFF. In this mode,
mixed decay only occurs during decreasing current. Slow decay is used for increasing current.
This mode exhibits the same current ripple as slow decay for increasing current, since for increasing current, only
slow decay is used. For decreasing current, the ripple is larger than slow decay, but smaller than fast decay. On
decreasing current steps, mixed decay will settle to the new ITRIP level faster than slow decay.
In cases where current is held for a long time (no input in the STEP pin) or at very low stepping speeds, slow
decay may not properly regulate current because no back-EMF is present across the motor windings. In this
state, motor current can rise very quickly, and may require a large off-time. In some cases this may cause a loss
of current regulation, and a more aggressive decay mode is recommended.
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7.3.5.3 Mode 3: Mixed Decay for Increasing and Decreasing Current
Increasing Phase Current (A)
ITRIP
tOFF
tBLANK
tOFF
tDRIVE
Decreasing Phase Current (A)
tDRIVE
tBLANK
tDRIVE
ITRIP
tBLANK
tDRIVE
tFAST
tBLANK
tOFF
tFAST
tDRIVE
tOFF
Figure 18. Mixed/Mixed Decay Mode
Mixed decay begins as fast decay for a time, followed by slow decay for the remainder of tOFF. In this mode,
mixed decay occurs for both increasing and decreasing current steps.
This mode exhibits ripple larger than slow decay, but smaller than fast decay. On decreasing current steps,
mixed decay will settle to the new ITRIP level faster than slow decay.
In cases where current is held for a long time (no input in the STEP pin) or at very low stepping speeds, slow
decay may not properly regulate current because no back-EMF is present across the motor windings. In this
state, motor current can rise very quickly, and requires an excessively large off-time. Increasing/decreasing
mixed decay mode allows the current level to stay in regulation when no back-EMF is present across the motor
windings.
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7.3.5.4 Mode 4: Slow Decay for Increasing Current, Fast Decay for Decreasing current
Increasing Phase Current (A)
ITRIP
tBLANK
tOFF
tBLANK
tOFF
tBLANK
tDRIVE
tDRIVE
tDRIVE
Decreasing Phase Current (A)
Please note that these graphs are not the same scale; tOFF is the same
ITRIP
tBLANK
tOFF
tBLANK
tDRIVE
tOFF
tDRIVE
tBLANK
tOFF
tDRIVE
Figure 19. Slow/Fast Decay Mode
During fast decay, the polarity of the H-bridge is reversed. The H-bridge will be turned off as current approaches
zero in order to prevent current flow in the reverse direction. In this mode, fast decay only occurs during
decreasing current. Slow decay is used for increasing current.
Fast decay exhibits the highest current ripple of the decay modes for a given tOFF. Transition time on decreasing
current steps is much faster than slow decay since the current is allowed to decrease much faster.
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7.3.5.5 Mode 5: Fast Decay for Increasing and Decreasing Current
Increasing Phase Current (A)
ITRIP
tBLANK
tOFF
tBLANK
tOFF
tBLANK
tDRIVE
Decreasing Phase Current (A)
tDRIVE
tOFF
tDRIVE
ITRIP
tBLANK
tOFF
tDRIVE
tBLANK
tOFF
tBLANK
tDRIVE
tOFF
tDRIVE
Figure 20. Fast/Fast Decay Mode
During fast decay, the polarity of the H-bridge is reversed. The H-bridge will be turned off as current approaches
zero in order to prevent current flow in the reverse direction.
Fast decay exhibits the highest current ripple of the decay modes for a given tOFF. Transition time on decreasing
current steps is much faster than slow decay since the current is allowed to decrease much faster.
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7.3.6 AutoTune
To enable the AutoTune mode, pull the ATE pin logic high. Ensure the DECAYx pins are logic low. The
AutoTune mode is registered internally when exiting from sleep mode or the power-up sequence. The ATE pin
can be shorted to V3P3 to pull it logic high for this purpose.
AutoTune greatly simplifies the decay mode selection by automatically configuring the decay mode between
slow, mixed, and fast decay. In mixed decay, AutoTune dynamically adjusts the fast decay percentage of the
total mixed decay time. This feature eliminates motor tuning by automatically determining the best decay setting
that results in the lowest ripple for the motor.
The decay mode setting is optimized iteratively each PWM cycle. If the motor current overshoots the target trip
level, then the decay mode becomes more aggressive (add fast decay percentage) on the next cycle in order to
prevent regulation loss. If there is a long drive time to reach the target trip level, the decay mode becomes less
aggressive (remove fast decay percentage) on the next cycle in order to operate with less ripple and more
efficiently. On falling steps, AutoTune will automatically switch to fast decay in order to reach the next step
quickly.
AutoTune will automatically adjust the decay scheme based on operating factors like:
• Motor winding resistance and inductance
• Motor aging effects
• Motor dynamic speed and load
• Motor supply voltage variation
• Motor back-EMF difference on rising and falling steps
• Step transitions
• Low-current vs. high-current dI/dt
7.3.7 Adaptive Blanking Time
After the current is enabled in an H-bridge, the voltage on the xISEN pin is ignored for a period of time before
enabling the current sense circuitry. Note that the blanking time also sets the minimum drive time of the PWM.
The blanking time is automatically scaled so that the drive time is reduced at lower current steps.
The time tBLANK is determined by the sine DAC code and the torque DAC setting. The timing information for
tBLANK is given in Table 9.
Table 9. Adaptive Blanking Time Settings over Torque DAC and Microsteps
SINE DAC CODE
TORQUE DAC TRQ[1:0] SETTING
00 – 100%
01 – 75%
10 – 50%
11 – 25%
16
1.80 µs
1.50 µs
1.50 µs
1.20 µs
15
1.80 µs
1.50 µs
1.50 µs
1.20 µs
14
1.80 µs
1.50 µs
1.50 µs
1.20 µs
13
1.80 µs
1.50 µs
1.50 µs
1.20 µs
12
1.80 µs
1.50 µs
1.50 µs
1.20 µs
11
1.80 µs
1.50 µs
1.50 µs
1.20 µs
10
1.80 µs
1.50 µs
1.50 µs
1.20 µs
9
1.80 µs
1.50 µs
1.50 µs
1.20 µs
8
1.50 µs
1.50 µs
1.20 µs
0.90 µs
7
1.50 µs
1.50 µs
1.20 µs
0.90 µs
6
1.50 µs
1.50 µs
1.20 µs
0.90 µs
5
1.50 µs
1.50 µs
1.20 µs
0.90 µs
4
1.20 µs
1.20 µs
0.90 µs
0.90 µs
3
1.20 µs
1.20 µs
0.90 µs
0.90 µs
2
0.90 µs
0.90 µs
0.90 µs
0.90 µs
1
0.90 µs
0.90 µs
0.90 µs
0.90 µs
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7.3.8 Charge Pump
A charge pump is integrated in order to supply a high-side NMOS gate drive voltage. The charge pump requires
a capacitor between the VM and VCP pins. Additionally a low-ESR ceramic capacitor is required between pins
CPH and CPL.
VM
0.47 µF
VCP
VM
CPH
0.1 µF
VM
CPL
Charge
Pump
Figure 21. Charge Pump Diagram
7.3.9 LDO Voltage Regulator
An LDO regulator is integrated into the DRV8880. It can be used to provide the supply voltage for low-current
devices. For proper operation, bypass V3P3 to GND using a ceramic capacitor.
The V3P3 output is nominally 3.3 V. When the V3P3 LDO current load exceeds 10 mA, the LDO will behave like
a constant current source. The output voltage will drop significantly with currents greater than 10 mA.
VM
+
-
3.3 V
V3P3
0.47 µF
10 mA
max
Figure 22. LDO Diagram
If a digital input needs to be tied permanently high (that is, M or TOFF), it is preferable to tie the input to V3P3
instead of an external regulator. This will save power when VM is not applied or in sleep mode: V3P3 is disabled
and current will not be flowing through the input pulldown resistors. For reference, logic level inputs have a
typical pulldown of 100 kΩ, and tri-level inputs have a typical pulldown of 40 kΩ.
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7.3.10 Logic and Tri-Level Pin Diagrams
The diagram below gives the input structure for logic-level pins STEP, DIR, ENABLE, nSLEEP, TRQ0, TRQ1,
and ATE:
V3P3
100 kŸ
Figure 23. Logic-level Input Pin Diagram
Tri-level logic pins TOFF, M0, M1, DECAY0, and DECAY1 have the following structure:
V3P3
+
V3P3
t
45 kŸ
V3P3
40 kŸ
+
t
Figure 24. Tri-level Input Pin Diagram
7.3.11 Power Supplies and Input Pins
The control pins and reference input pin can be driven within the recommended operating conditions without the
VM power supply present, or when the device is in sleep mode.
Each control pin has a weak pulldown resistor to ground. TI recommends setting the inputs to a logic low when in
sleep mode to minimize current through the pulldown resistors.
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7.3.12 Protection Circuits
The DRV8880 is fully protected against undervoltage, charge pump undervoltage, overcurrent, and
overtemperature events.
7.3.13 VM UVLO (UVLO2)
If at any time the voltage on the VM pin falls below the VM undervoltage lockout threshold voltage (VUVLO2), all
FETs in the H-bridge will be disabled, the charge pump will be disabled, and the nFAULT pin will be driven low.
Operation will resume when VM rises above the UVLO2 threshold. The nFAULT pin will be released after
operation has resumed.
The indexer position is not reset by this fault even though the output drivers are disabled. The indexer position is
maintained and internal logic remains active until VM falls below the logic undervoltage threshold (VUVLO1).
7.3.14 Logic Undervoltage (UVLO1)
If at any time the voltage on the VM pin falls below the logic undervoltage threshold voltage (VUVLO1), the internal
logic is reset, and the V3P3 regulator is disabled. Operation will resume when VM rises above the UVLO1
threshold. The nFAULT pin is logic low during this state since it is pulled low upon encountering VM
undervoltage. Decreasing VM below this undervoltage threshold will reset the indexer position.
7.3.15 VCP Undervoltage Lockout (CPUV)
If at any time the voltage on the VCP pin falls below the charge pump undervoltage lockout threshold voltage, all
FETs in the H-bridge will be disabled and the nFAULT pin will be driven low. Operation will resume when VCP
rises above the CPUV threshold. The nFAULT pin will be released after operation has resumed.
7.3.16 Thermal Shutdown (TSD)
If the die temperature exceeds safe limits, all FETs in the H-bridge will be disabled and the nFAULT pin will be
driven low. Once the die temperature has fallen to a safe level operation will automatically resume. The nFAULT
pin will be released after operation has resumed.
7.3.17 Overcurrent Protection (OCP)
An analog current limit circuit on each FET limits the current through the FET by removing the gate drive. If this
analog current limit persists for longer than tOCP, all FETs in the H-bridge will be disabled and nFAULT will be
driven low. In addition to this FET current limit, an overcurrent condition is also detected if the voltage at xISEN
exceeds VOCP.
The overcurrent fault response can be set to either latched mode or retry mode:
V3P3
5.1 kŸ
V3P3
ENABLE
ENABLE
Device
Logic
FAULTn
Figure 25. Latched OCP Mode
FAULTn
Short
Detect
Device
Logic
Figure 26. Retry OCP Mode
In latched mode, operation will resume after the ENABLE pin is brought logic low for at least 1 μs to reset the
output driver. The nFAULT pin will be released after ENABLE is returned logic high. Removing and re-applying
VM or toggling nSLEEP will also reset the latched fault.
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In retry mode, the driver will be re-enabled after the OCP retry period (tRETRY) has passed. nFAULT becomes
high again after the retry time. If the fault condition is still present, the cycle repeats. If the fault is no longer
present, normal operation resumes and nFAULT remains deasserted.
A microcontroller can retain control of the ENABLE pin while in retry mode if it is operated like an open-drain
output. Many microcontrollers support this. When the DRV8880 is operating normally, configure the MCU GPIO
as an input. In this state, the MCU can detect whenever nFAULT is pulled low. In order to disable the DRV8880
output, configure the GPIO output state as low, and then configure the GPIO as an output.
Alternatively, a logic-level FET may be used to create an open drain external to the MCU. In this case, an
additional MCU GPIO may be required in order to monitor the nFAULT pin.
V3P3
V3P3
DRV8880
MCU
DRV8880
MCU
5.1 kŸ
5.1 kŸ
ENABLE
ENABLE
Device
Logic
FAULTn
Device
Logic
FAULTn
Figure 27. Methods For Operating in Retry Mode
Table 10. Fault Condition Summary
CONDITION
ERROR
REPORT
H-BRIDGE
CHARGE
PUMP
INDEXER
V3P3
RECOVERY
VM undervoltage
(UVLO2)
VM < VUVLO2
(max 6.4 V)
nFAULT
Disabled
Disabled
Operating
Operating
VM > VUVLO2
(max 6.5 V)
Logic undervoltage
(UVLO1)
VM < VUVLO2
(max 4.9 V)
None
Disabled
Disabled
Disabled
Operating
VM > VUVLO2
(max 4.8 V)
VCP undervoltage
(CPUV)
VCP < VCPUV
(typ VM + 1.8 V)
nFAULT
Disabled
Operating
Operating
Operating
VCP > VCPUV
(typ VM + 1.9 V)
Thermal Shutdown
(TSD)
TJ > TTSD
(min 150°C)
nFAULT
Disabled
Operating
Operating
Operating
TJ < TTSD - THYS
(THYS typ 35°C)
IOUT > IOCP
(min 2.5 A)
VxISEN > VOCP
(min 0.9 V)
nFAULT
Disabled
Operating
Operating
Operating
ENABLE
-ortRETRY
FAULT
Overcurrent
(OCP)
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7.4 Device Functional Modes
The DRV8880 internal logic, indexer, and charge pump are operating unless the nSLEEP pin is brought logic
low. In sleep mode the charge pump is disabled, the H-bridge FETs are disabled Hi-Z, and the V3P3 regulator is
disabled. tSLEEP must elapse after a falling edge on the nSLEEP pin before the device is in sleep mode. The
DRV8880 is brought out of sleep mode automatically if nSLEEP is brought logic high. tWAKE must elapse before
the outputs change state after wake-up.
If the ENABLE pin is brought logic low, the H-bridge outputs are disabled, but the charge pump and internal logic
will remian active. A rising edge on STEP will advance the indexer, but the outputs will not change state until
ENABLE brought logic high.
When VM falls below the VM undervoltage lockout threshold VUVLO2, the output driver and charge pump are
disabled, but the internal logic and V3P3 remain active. In this mode, STEP inputs will advance the indexer, but
the outputs will remain disabled. If VM falls below the logic undervoltage threshold VUVLO1, the internal logic is
reset and the indexer will lose position.
Table 11. Functional Modes Summary
CONDITION
H-BRIDGE
CHARGE PUMP
INDEXER
V3P3
Operating
6.5 V < VM < 45 V
nSLEEP pin = 1
ENABLE pin = 1
Operating
Operating
Operating
Operating
Disabled
6.5 V < VM < 45 V
nSLEEP pin = 1
ENABLE pin = 0
Disabled
Operating
Operating
Operating
Sleep mode
5.0 V < VM < 45 V
nSLEEP pin = 0
Disabled
Disabled
Disabled
Disabled
VM undervoltage (UVLO2)
Disabled
Disabled
Operating
Operating
Logic undervoltage (UVLO1)
Disabled
Disabled
Disabled
Operating
VCP undervoltage (CPUV)
Disabled
Operating
Operating
Operating
Thermal shutdown (TSD)
Disabled
Operating
Operating
Operating
Overcurrent (OCP)
Disabled
Operating
Operating
Operating
Fault encountered
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DRV8880 is used in stepper control.
8.2 Typical Application
The following design procedure can be used to configure the DRV8880.
DRV8880PWP
28
1
GND
CPL
TRQ0
CPH
27
26
VM
3
TRQ1
VCP
25
0.47 µF
4
M0
VM
M1
AOUT1
STEP
AISEN
DIR
AOUT2
ENABLE
BOUT2
24
0.1 µF
5
250 mŸ
6
Step
Motor
7
21
+
22
-
23
8
20
+
DECAY0
BISEN
DECAY1
BOUT1
nFAULT
VM
nSLEEP
GND
-
250 mŸ
9
19
10
18
11
17
10 kŸ
0.1 µF
2
VM
12
16
0.1 µF
13
TOFF
ATE
V3P3
VREF
15
+
100 µF
14
R1
0.47 µF
R2
Figure 28. Typical Application Schematic
8.2.1 Design Requirements
Table 12 gives design input parameters for system design.
Table 12. Design Parameters
DESIGN PARAMETER
REFERENCE
EXAMPLE VALUE
Supply voltage
VM
24 V
Motor winding resistance
RL
0.8 Ω/phase
LL
1.4 mH/phase
θstep
1.8°/step
Motor winding inductance
Motor full step angle
Target microstepping level
Target motor speed
nm
1/8 step
v
120 rpm
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Table 12. Design Parameters (continued)
DESIGN PARAMETER
Target full-scale current
REFERENCE
EXAMPLE VALUE
IFS
1.5 A
8.2.2 Detailed Design Procedure
8.2.2.1 Stepper Motor Speed
The first step in configuring the DRV8880 requires the desired motor speed and microstepping level. If the target
application requires a constant speed, then a square wave with frequency ƒstep must be applied to the STEP pin.
If the target motor speed is too high, the motor will not spin. Make sure that the motor can support the target
speed.
For a desired motor speed (v), microstepping level (nm), and motor full step angle (θstep),
v (rpm) u 360 (q / rot)
¦step VWHSV V
Tstep (q / step) u nm (steps / microstep) u 60 (s / min)
(2)
θstep can be found in the stepper motor data sheet or written on the motor itself.
For the DRV8880, the microstepping level is set by the Mx pins and can be any of the settings in the table below.
Higher microstepping will mean a smother motor motion and less audible noise, but will increase switching
losses and require a higher ƒstep to achieve the same motor speed.
Table 13. Microstepping Indexer Settings
M1
M0
STEP MODE
0
0
Full step (2-phase excitation) with 71%
current
0
1
Non-circular 1/2 step
1
0
1/2 step
1
1
1/4 step
0
Z
1/8 step
1
Z
1/16 step
Example: Target 120 rpm at 1/8 microstep mode. The motor is 1.8°/step
120 rpm u 360q / rot
¦step VWHSV V
N+]
1.8q / step u 1/ 8 steps / microstep u 60 s / min
(3)
8.2.2.2 Current Regulation
In a stepper motor, the full-scale current (IFS) is the maximum current driven through either winding. This quantity
will depend on the TRQ pins, the VREF analog voltage, and the sense resistor value (RSENSE). During stepping,
IFS defines the current chopping threshold (ITRIP) for the maximum current step.
VREF (V) u TRQ (%) VREF (V) u TRQ (%)
IFS (A)
A v u RSENSE (:)
6.6 u RSENSE (:)
(4)
TRQ is a DAC used to scale the output current. The current scalar value for different inputs is shown below.
Table 14. Torque DAC Settings
32
TRQ1
TRQ0
CURRENT SCALAR (TRQ)
1
1
25%
1
0
50%
0
1
75%
0
0
100%
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Example: If the desired full-scale current is 1.5 A
Set RSENSE = 100 mΩ, assume TRQ = 100%.
VREF would have to be 0.99 V.
Create a resistor divider from V3P3 (3.3 V) to set VREF ≈ 0.99 V.
Set R2 = 10 kΩ, set R1 = 22 kΩ
Note that IFS must also follow the equation below in order to avoid saturating the motor. VM is the motor supply
voltage, and RL is the motor winding resistance.
VM (V)
IFS (A)
RL (:) 2 u RDS(ON) (:) RSENSE (:)
(5)
8.2.2.3 Decay Modes
The DRV8880 supports several different decay modes: slow decay, fast decay, mixed decay, and AutoTune. The
current through the motor windings is regulated using an adjustable fixed-time-off scheme. This means that after
any drive phase, when a motor winding current has hit the current chopping threshold (ITRIP), the DRV8880 will
place the winding in one of the decay modes for tOFF. After tOFF, a new drive phase starts. For fixed decay modes
(slow, fast, and mixed), the best setting can be determined by operating the motor and choosing the best setting.
8.2.2.4 Sense Resistor
For optimal performance, it is important for the sense resistor to be:
• Surface-mount
• Low inductance
• Rated for high enough power
• Placed closely to the motor driver
The power dissipated by the sense resistor equals Irms 2 × R. For example, if the rms motor current is 1.4A and a
250 mΩ sense resistor is used, the resistor will dissipate 1.4 A2 × 0.25 Ω = 0.49 W. The power quickly increases
with higher current levels.
Resistors typically have a rated power within some ambient temperature range, along with a derated power curve
for high ambient temperatures. When a PCB is shared with other components generating heat, margin should be
added. It is always best to measure the actual sense resistor temperature in a final system, along with the power
MOSFETs, as those are often the hottest components.
Because power resistors are larger and more expensive than standard resistors, it is common practice to use
multiple standard resistors in parallel, between the sense node and ground. This distributes the current and heat
dissipation.
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8.2.3 Application Curves
34
Figure 29. Mixed Decay 30% Fast on Increasing and
Decreasing Steps
Figure 30. Slow Decay on Increasing and Decreasing
Steps
Figure 31. Slow Decay on Increasing and Mixed Decay
30% Fast on Decreasing Steps
Figure 32. AutoTune
Figure 33. Mixed Decay 30% Fast on Increasing and
Decreasing Steps
Figure 34. AutoTune
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9 Power Supply Recommendations
The DRV8880 is designed to operate from an input voltage supply (VM) range between 6.5 V and 45 V. The
device has an absolute maximum rating of 50 V. A 0.1-µF ceramic capacitor rated for VM must be placed at
each VM pin as close to the DRV8880 as possible. In addition, a bulk capacitor must be included on VM.
9.1 Bulk Capacitance Sizing
Having appropriate local bulk capacitance is an important factor in motor drive system design. It is generally
beneficial to have more bulk capacitance, while the disadvantages are increased cost and physical size.
The amount of local capacitance needed depends on a variety of factors, including:
• The highest current required by the motor system
• The power supply’s capacitance and ability to source current
• The amount of parasitic inductance between the power supply and motor system
• The acceptable voltage ripple
• The type of motor used (brushed DC, brushless DC, stepper)
• The motor braking method
The inductance between the power supply and motor drive system will limit the rate current can change from the
power supply. If the local bulk capacitance is too small, the system will respond to excessive current demands or
dumps from the motor with a change in voltage. When adequate bulk capacitance is used, the motor voltage
remains stable and high current can be quickly supplied.
The data sheet generally provides a recommended value, but system-level testing is required to determine the
appropriate sized bulk capacitor.
The voltage rating for bulk capacitors should be higher than the operating voltage, to provide margin for cases
when the motor transfers energy to the supply.
Power Supply
Parasitic Wire
Inductance
Motor Drive System
VM
+
±
+
Motor
Driver
GND
Local
Bulk Capacitor
IC Bypass
Capacitor
Figure 35. Setup of Motor Drive System With External Power Supply
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10 Layout
10.1 Layout Guidelines
Each VM terminal must be bypassed to GND using a low-ESR ceramic bypass capacitors with recommended
values of 0.1 μF rated for VM. These capacitors should be placed as close to the VM pins as possible with a
thick trace or ground plane connection to the device GND pin.
The VM pin must be bypassed to ground using a bulk capacitor rated for VM. This component may be an
electrolytic.
A low-ESR ceramic capacitor must be placed in between the CPL and CPH pins. A value of 0.1 μF rated for VM
is recommended. Place this component as close to the pins as possible.
A low-ESR ceramic capacitor must be placed in between the VM and VCP pins. A value of 0.47 μF rated for 16
V is recommended. Place this component as close to the pins as possible.
Bypass V3P3 to ground with a ceramic capacitor rated 6.3 V. Place this bypassing capacitor as close to the pin
as possible.
The current sense resistors should be placed as close as possible to the device pins in order to minimize trace
inductance between the pin and resistor.
10.2 Layout Example
+
0.1 µF
CPL
GND
CPH
TRQ0
VCP
TRQ1
0.1 µF
RAISEN
VM
M0
AOUT1
M1
0.47 µF
AISEN
STEP
AOUT2
DIR
BOUT2
ENABLE
RBISEN
BISEN
DECAY0
BOUT1
DECAY1
VM
nFAULT
GND
nSLEEP
ATE
TOFF
VREF
V3P3
0.1 µF
0.1 µF
Figure 36. Layout Recommendation
36
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
• Texas Instruments, PowerPAD™ Thermally Enhanced Package application report
• Texas Instruments, PowerPAD™ Made Easy application report
• Texas Instruments, Current Recirculation and Decay Modes application report
• Texas Instruments, Calculating Motor Driver Power Dissipation application report
• Texas Instruments, Understanding Motor Driver Current Ratings application report
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
AutoTune, PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2015–2017, Texas Instruments Incorporated
Product Folder Links: DRV8880
37
PACKAGE OPTION ADDENDUM
www.ti.com
14-Aug-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DRV8880PWP
ACTIVE
HTSSOP
PWP
28
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
DRV8880
DRV8880PWPR
ACTIVE
HTSSOP
PWP
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
DRV8880
DRV8880RHRR
ACTIVE
WQFN
RHR
28
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV8880
DRV8880RHRT
ACTIVE
WQFN
RHR
28
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
DRV8880
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
14-Aug-2017
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DRV8880PWPR
HTSSOP
PWP
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
DRV8880RHRR
WQFN
RHR
28
3000
330.0
DRV8880RHRT
WQFN
RHR
28
250
180.0
12.4
3.8
5.8
1.2
8.0
12.0
Q1
12.4
3.8
5.8
1.2
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV8880PWPR
HTSSOP
PWP
28
2000
350.0
350.0
43.0
DRV8880RHRR
WQFN
RHR
28
3000
367.0
367.0
35.0
DRV8880RHRT
WQFN
RHR
28
250
210.0
185.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PWP 28
TM
PowerPAD TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
4.4 x 9.7, 0.65 mm pitch
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224765/A
www.ti.com
PACKAGE OUTLINE
PWP0028C
TM
PowerPAD TSSOP - 1.2 mm max height
SCALE 2.000
SMALL OUTLINE PACKAGE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX
AREA
SEATING
PLANE
26X 0.65
28
1
2X
9.8
9.6
NOTE 3
8.45
14
15
B
0.30
0.19
0.1
C A B
28X
4.5
4.3
SEE DETAIL A
(0.15) TYP
2X 0.95 MAX
NOTE 5
14
15
2X 0.2 MAX
NOTE 5
0.25
GAGE PLANE
1.2 MAX
5.18
4.48
THERMAL
PAD
0 -8
0.15
0.05
0.75
0.50
DETAIL A
A 20
TYPICAL
28
1
3.1
2.4
4223582/A 03/2017
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
PWP0028C
TM
PowerPAD TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(3.4)
NOTE 9
(3.1)
METAL COVERED
BY SOLDER MASK
SYMM
28X (1.5)
1
28X (0.45)
28
SEE DETAILS
(R0.05) TYP
(5.18)
26X (0.65)
(0.6)
SYMM
(9.7)
NOTE 9
SOLDER MASK
DEFINED PAD
(1.2) TYP
( 0.2) TYP
VIA
15
14
(1.2) TYP
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4223582/A 03/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
10. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
PWP0028C
TM
PowerPAD TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(3.1)
BASED ON
0.125 THICK
STENCIL
28X (1.5)
METAL COVERED
BY SOLDER MASK
1
28
28X (0.45)
(R0.05) TYP
26X (0.65)
(5.18)
BASED ON
0.125 THICK
STENCIL
SYMM
15
14
SYMM
(5.8)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
0.125
0.15
0.175
3.47 X 5.79
3.10 X 5.18 (SHOWN)
2.83 X 4.73
2.62 X 4.38
4223582/A 03/2017
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
GENERIC PACKAGE VIEW
RHR 28
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
3.5 x 5.5, 0.5 mm pitch
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4210249/B
www.ti.com
PACKAGE OUTLINE
RHR0028A
WQFN - 0.8 mm max height
SCALE 2.700
PLASTIC QUAD FLATPACK - NO LEAD
3.6
3.4
A
B
PIN 1 INDEX AREA
0.5
0.3
5.6
5.4
0.3
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
0.8 MAX
C
0.08
0.05
0.00
SEATING PLANE
2±0.1
2X 1.5
(0.2) TYP
EXPOSED
THERMAL PAD
14
11
24X 0.5
10
15
2X
4.5
4±0.1
SEE TERMINAL
DETAIL
1
PIN 1 ID
(OPTIONAL)
24
28
25
28X
28X
0.5
0.3
0.3
0.2
0.1
0.05
C A
B
4219075/A 11/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RHR0028A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(2)
SYMM
28X (0.6)
25
28
28X (0.25)
1
24
24X (0.5)
(0.66)
TYP
SYMM
(5.3)
(4)
( 0.2) TYP
VIA
15
10
11
14
(0.75) TYP
(3.3)
LAND PATTERN EXAMPLE
SCALE:15X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4219075/A 11/2014
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RHR0028A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
(0.55) TYP
28
25
28X (0.6)
28X (0.25)
1
24
24X (0.5)
(1.32)
TYP
SYMM
(5.3)
METAL
TYP
6X (1.12)
15
10
14
11
6X (0.89)
(3.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
75% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4219075/A 11/2014
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
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TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
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warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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