Texas Instruments | DRV120 Single-Channel Relay, Solenoid, Valve Low-Side Driver With Current Regulation (Rev. C) | Datasheet | Texas Instruments DRV120 Single-Channel Relay, Solenoid, Valve Low-Side Driver With Current Regulation (Rev. C) Datasheet

Texas Instruments DRV120 Single-Channel Relay, Solenoid, Valve Low-Side Driver With Current Regulation (Rev. C) Datasheet
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DRV120
SLVSBG3C – JUNE 2012 – REVISED JUNE 2016
DRV120 Single-Channel Relay, Solenoid, Valve Low-Side Driver
With Current Regulation
1 Features
3 Description
•
The DRV120 device is a PWM current driver for
solenoids. The device is designed to regulate the
current with a well-controlled waveform to guarantee
activation and to reduce power dissipation at the
same time. The solenoid current is ramped up fast to
ensure opening of the valve or relay. After the initial
ramping, solenoid current is kept at peak value to
ensure the correct operation, after which it is reduced
to a lower hold level in order to avoid thermal
problems and reduce power dissipation.
1
•
•
•
•
•
•
•
Integrated MOSFET With PWM to Control
Solenoid Current
– Integrated Sense Resistor for Regulating
Solenoid Current
Fast Ramp-Up of Solenoid Current to Guarantee
Activation
Solenoid Current is Reduced in Hold Mode for
Lower Power and Thermal Dissipation
Peak Current, Keep Time at Peak Current, Hold
Current, and PWM Clock Frequency Can Be Set
Externally. They Can Also Be Operated at
Nominal Values Without External Components.
Internal Supply Voltage Regulation
– Up to 28-V External Supply
Protection
– Thermal Shutdown
– Undervoltage Lockout (UVLO)
– Maximum Ramp Time
– Optional STATUS Output
Operating Temperature Range: –40ºC to 105ºC
8-Pin and 14-Pin TSSOP Package Options
•
The DRV120 can operate from an external 6-V to
28-V supply.
Device Information(1)
PART NUMBER
DRV120
PACKAGE
BODY SIZE (NOM)
TSSOP (14)
5.00 mm × 4.40 mm
TSSOP (8)
3.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
The peak current duration is set with an external
capacitor. The current ramp peak and hold levels, as
well as PWM frequency, can independently be set
with external resistors. External setting resistors can
also be omitted, if the default values for the
corresponding parameters are suitable for the
application.
Electromechanical Drivers: Solenoids, Valves,
Relays
White Goods, Solar, Transportation
ISOLENOID vs Time
ISOLENOID
IPEAK
IHOLD
t
tKEEP
EN
t
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV120
SLVSBG3C – JUNE 2012 – REVISED JUNE 2016
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
6.1
6.2
6.3
6.4
6.5
6.6
3
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 7
7.3 Feature Description................................................... 7
7.4 Device Functional Modes.......................................... 9
8
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 10
9 Power Supply Recommendations...................... 12
10 Layout................................................................... 12
10.1 Layout Guidelines ................................................. 12
10.2 Layout Example .................................................... 12
11 Device and Documentation Support ................. 13
11.1
11.2
11.3
11.4
11.5
11.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
13
13
13
13
13
13
12 Mechanical, Packaging, and Orderable
Information ........................................................... 13
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (July 2015) to Revision C
Page
•
Changed the title of the data sheet ........................................................................................................................................ 1
•
Changed the minimum ROSC value in the fPWM equation from 66.67 kΩ to 160 kΩ................................................................ 9
•
Changed the PWM Clock Frequency Setting graph............................................................................................................... 9
•
Added the Receiving Notification of Documentation Updates section ................................................................................. 13
Changes from Revision A (August 2012) to Revision B
•
2
Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
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5 Pin Configuration and Functions
PW Package
8-Pin TSSOP
Top View
PW Package
14-Pin TSSOP
Top View
KEEP
1
8
EN
PEAK
2
7
OSC
3
VIN
4
NC
1
14
NC
OUT
KEEP
2
13
EN
6
NC
PEAK
3
12
STATUS
5
GND
HOLD
4
11
OUT
OSC
5
10
NC
NC
6
9
NC
VIN
7
8
GND
Pin Functions
PIN
NO.
NAME
I/O
DESCRIPTION
8-PIN PW (1)
14-PIN PW
EN
8
13
I
Enable
GND
5
8
—
Ground
HOLD
-
4
I
Hold current set
KEEP
1
2
I
Keep time set
NC
6
1, 6, 9, 10,
14
—
OSC
3
5
I
PWM frequency set
OUT
7
11
O
Controlled current sink
PEAK
2
3
I
Peak current set
STATUS
-
12
O
Open-drain fault indicator
VIN
4
7
I
6-V to 28-V supply
(1)
No connect
In the 8-pin package, the HOLD pin is not bonded out. For this package, the HOLD mode is configured to default (internal) settings.
6 Specifications
6.1 Absolute Maximum Ratings
See
(1)
and
(2)
MIN
MAX
UNIT
Input voltage
–0.3
28
V
Voltage on EN, STATUS, PEAK, HOLD, OSC, SENSE, RAMP
–0.3
7
V
Voltage on OUT
–0.3
28
V
TJ
Operating virtual junction temperature
–40
125
°C
Tstg
Storage temperature
–65
150
°C
VIN
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground pin.
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6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins (2)
±500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
IOUT
Average solenoid DC current
VIN
Supply voltage
6
12
CIN
Input capacitor
1
4.7
L
Solenoid inductance
TA
Operating ambient temperature
MAX
UNIT
125
mA
26
V
µF
1
H
–40
105
°C
6.4 Thermal Information
DRV120
THERMAL METRIC (1)
PW [TSSOP]
UNIT
8 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
183.8
122.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
69.2
51.2
°C/W
RθJB
Junction-to-board thermal resistance
112.6
64.3
°C/W
ψJT
Junction-to-top characterization parameter
10.4
6.5
°C/W
ψJB
Junction-to-board characterization parameter
110.9
63.7
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
N/A
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
VIN = 14 V, TA = –40°C to 105°C, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
IQ
Standby current
EN = 0, VIN = 14 V
100
150
Quiescent current
EN = 1, VIN = 14 V
300
400
1.7
2.5
Ω
20
25
kHz
µA
CURRENT DRIVER
ROUT
OUT to GND resistance
IOUT = 200 mA
fPWM
PWM frequency
OSC = GND
DMAX
Maximum PWM duty cycle
100
%
DMIN
Minimum PWM duty cycle
9
%
tD
Start-up delay
15
Delay between EN going high until driver enabled (1),
fPWM = 20 kHz
25
50
µs
CURRENT CONTROLLER, INTERNAL SETTINGS
IPEAK
Peak current
PEAK = GND
160
200
240
mA
IHOLD
Hold current
HOLD = GND
40
50
60
mA
CURRENT CONTROLLER, EXTERNAL SETTINGS
tKEEP (2)
Externally set keep time at peak current
IPEAK
Externally set peak current
IHOLD
Externally set hold current
fPWM
Externally set PWM frequency
CKEEP = 1 µF
75
RPEAK = 50 kΩ
250
RPEAK = 200 kΩ
83
RHOLD = 50 kΩ
100
RHOLD = 200 kΩ
33
ROSC = 50 kΩ
60
ROSC = 200 kΩ
20
ms
mA
mA
kHz
LOGIC INPUT LEVELS (EN)
VIL
Input low level
VIH
Input high level
1.65
1.3
REN
Input pullup resistance
350
V
V
500
kΩ
LOGIC OUTPUT LEVELS (STATUS)
VOL
Output low level
Pulldown activated, ISTATUS = 2 mA
IIL
Output leakage current
Pulldown deactivated, V(STATUS) = 5 V
0.3
V
1
µA
UNDERVOLTAGE LOCKOUT
VUVLO
Undervoltage lockout threshold
4.6
V
THERMAL SHUTDOWN
TTSD
Junction temperature shutdown
threshold
160
°C
TTSU
Junction temperature start-up threshold
140
°C
(1)
(2)
Logic HIGH between 4 V and 7 V. Note: absolute maximum voltage rating is 7 V.
Either internal or external tKEEP time setting is selected to be activated during manufacturing of production version of DRV120.
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6.6 Typical Characteristics
Figure 1. Solenoid Current, EN, and PWM vs Time
6
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7 Detailed Description
7.1 Overview
The DRV120 device provides a PWM current converter for use with solenoids. The device provides a quick ramp
to a high peak current value in order to ensure opening of the valve or relay. The peak current is held for a
programmable time and then released to a lower value to maintain the open state of the valve or relay while
reducing the total current consumption. Peak current duration, peak current amount, hold current amount (in the
14-pin package), and PWM frequency can all be controlled by external components or used at default levels by
omitting these components (except peak current duration). Enable and disable of the switch is controlled by the
EN pin which has an internal pullup to VIN. The DRV120 also features a wide VIN range from 6 V to 28 V. Finally,
the 14-pin package features an open-drain pulldown path on the STATUS pin which is enabled as long as
undervoltage lockout or thermal shutdown has not triggered.
7.2 Functional Block Diagram
ROSC
<STATUS>
OSC
1
VS
VS
VIN
LDO
UVLO
Thermal
Shutdown
OSC
LS
500 kW
EN
D1
OUT
PWMCLK
1 uA
PWM
Control
VREF
GND
MUX
VHOLD
1
<RHOLD>
RPEAK
CKEEP
1
KEEP
PEAK
<HOLD>
1
VPEAK
REF
RSENSE
75 mV
Available only in the 14-pin package
7.3 Feature Description
The DRV120 controls the current through the solenoid as shown in Figure 2. Activation starts when EN pin
voltage is pulled high either by an external driver or internal pullup. In the beginning of activation, DRV120 allows
the load current to ramp up to the peak value IPEAK and it regulates it at the peak value for the time, tKEEP, before
reducing it to IHOLD. The load current is regulated at the hold value as long as the EN pin is kept high. The initial
current ramp-up time depends on the inductance and resistance of the solenoid. Once EN pin is driven to GND,
DRV120 allows the solenoid current to decay to zero.
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Feature Description (continued)
ISOLENOID
IPEAK
IHOLD
t
tKEEP
EN
t
Figure 2. Typical Current Waveform Through the Solenoid
tKEEP is set externally by connecting a capacitor to the KEEP pin. A constant current is sourced from the KEEP
pin that is driven into an external capacitor resulting in a linear voltage ramp. When the KEEP pin voltage
reaches 75 mV, the current regulation reference voltage, VREF, is switched from VPEAK to VHOLD. Dependency of
tKEEP from the external capacitor size can be calculated with Equation 1.
ésù
tKEEP éës ùû = CKEEP éëF ùû × 75 × 103 ê ú
ëF û
(1)
The current control loop regulates, cycle-by-cycle, the solenoid current by using an internal current-sensing
resistor and MOSFET switch. During the ON-cycle, current flows from OUT pin to GND pin through the internal
switch as long as voltage across the current-sensing resistor is less than VREF. As soon as the current sensing
voltage is above VREF, the internal switch is immediately turned off until the next ON-cycle is triggered by the
internal PWM clock signal. In the beginning of each ON-cycle, the internal switch is turned on and stays on for at
least the time determined by the minimum PWM signal duty cycle, DMIN.
IPEAK and IHOLD depend on fixed resistance values RPEAK and RHOLD approximately as shown in Figure 3. If the
PEAK pin is connected to ground or if RPEAK or RHOLD is below 33.33 kΩ (typical value), then IPEAK is at its default
value (internal setting) of 200 mA for IPEAK and 50 mA for IHOLD. The IPEAK value can alternatively be set by
connecting an external resistor to ground from the PEAK pin. For example, if a 50-kΩ (= RPEAK) resistor is
connected between PEAK and GND, then the externally set IPEAK level will be 250 mA. If RPEAK = 200 kΩ is, then
the externally set IPEAK level will be 83 mA. In the 8-pin package, IHOLD is set to 50 mA by default. In the 14-pin
package, external settings of IHOLD works in the same way as IPEAK. External settings for IPEAK and IHOLD are
independent of each other. Approximate IPEAK and IHOLD values can be calculated by using Equation 2 and
Equation 3.
250mA
IPEAK =
× 66.67kW ;66.67kW < RPEAK < 550kW
RPEAK
(2)
I
8
HOLD =
100mA
× 66.67kW ;66.67kW < RHOLD < 250kW
RHOLD
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Feature Description (continued)
Figure 3. PEAK and HOLD Mode Current Settings
Frequency of the internal PWM clock signal, PWMCLK, that triggers each ON-cycle can be adjusted by external
resistor, ROSC, connected between OSC and GND. Frequency as a function of resistor value is shown in
Figure 4. Default frequency is used when OSC is connected to GND directly. Use Equation 4 to calculate the
PWM frequency as a function of the external fixed adjustment resistor value (greater than 160 kΩ).
60 kHz
fPWM =
´ 66.67 kW ; 160 kW < ROSC < 2 MW
ROSC
(4)
40
35
30
fPWM (kHz)
160 k:, 25 kHz
25
20
15
(0 to 100 :, 20 kHz)
10
5
0
0
100
200
300
400
ROSC (k:)
500
600
700
D001
Figure 4. PWM Clock Frequency Setting
Open-drain STATUS output is deactivated if either undervoltage lockout or thermal shutdown blocks have
triggered.
7.4 Device Functional Modes
The DRV120 transitions through three different states. The first is the OFF state, where the EN pin is low and the
PWM output is off. The second is the PEAK state, which begins when the EN pin is pulled high by an external
controller or internal pullup, and ends once tKEEP has been reached. During this state, the PWM operates in order
to reach the IPEAK set by the RPEAK. Finally, once tKEEP has been reached, the PWM continues to operate, but at
the IHOLD level. This continues until the EN pin is forced low again and the PWM turns off.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DRV120 device is designed to operate a solenoid valve or relay. A typical DC input design will be outlined in
Typical Application. Approximate resistor and capacitor values for the peak current, hold current, and keep time
will be derived for a sample application.
8.2 Typical Application
VS
LS
1
<STATUS>
D1
VIN
VS
OUT
DRV120
VEN
EN
1
GND
KEEP
CKEEP
<RHOLD>
RPEAK
1
PEAK
OSC
<HOLD>
1
ROSC
Available only in the 14-pin package
Figure 5. Default Configuration
8.2.1 Design Requirements
The key elements to identify here are the system input voltage, peak current, hold current, and peak keep time
values required for the solenoid or relay being used. With these values, approximate RS, RPEAK, RHOLD (for 14-pin
package), and CKEEP values can be determined and the proper FET and diode can be identified. ROSC can be
varied in order to tune the circuit to the chosen solenoid or relay.
8.2.2 Detailed Design Procedure
First, with the known peak current, hold current, and peak keep time values known, the RPEAK, RHOLD (for 14-pin
package), and CKEEP values can be determined. Calculation will proceed based on example values shown in
Table 1.
10
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Table 1. Sample Application Values
VARIABLE
VALUE
Peak current
150 mA
Hold current
50 mA
Keep time
100 ms
RPEAK and RHOLD (if applicable) can be determined using Equation 2 and Equation 3. For the sample values,
RPEAK is set to 111 kΩ and RHOLD can be shorted to GND. TI recommends that a 0-Ω resistor is used for
prototyping in case changes to this value are desired.
Next, CKEEP can be set based on Equation 1, 1.33 µF for the sample values. ROSC can initially be shorted to
GND, but again a 0-Ω resistor is recommended for prototyping. Additionally, a filter on the SENSE line may be
added if it will be in a high-noise environment and is recommended for prototyping. Typical values for this are 1
kΩ and 100 pF.
Finally, a current recirculation diode must be chosen based on the current values defined in Table 1. The current
recirculation diode should be a fast recovery diode.
8.2.3 Application Curves
Lind = 1 H
Rind = 50 Ω
Figure 6. ISOLENOID, EN, and VIN vs Time
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9 Power Supply Recommendations
The input supply range must be at least 6 V and should be below 26 V. An input capacitor of 4.7 µF (typical) is
required as well. Current requirements will be set by the required current from the solenoid.
10 Layout
10.1 Layout Guidelines
The trace for the solenoid or relay current should be wide in order to prevent any unexpected voltage drop. Diode
placement should not be far from the inductor and both should be placed close to the output.
10.2 Layout Example
Figure 7. Layout Schematic
12
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation, see the following:
Current Controlled Driver for 230V AC Solenoids Reference Design
DRV110 and DRV120 Evaluation Modules (EVM)
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Jun-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DRV120APWR
ACTIVE
TSSOP
PW
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 105
120A
DRV120PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 105
120
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
15-Jun-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Jun-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DRV120APWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
DRV120PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Jun-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV120APWR
TSSOP
PW
14
2000
367.0
367.0
35.0
DRV120PWR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
SCALE 2.800
SMALL OUTLINE PACKAGE
C
6.6
TYP
6.2
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
1
3.1
2.9
NOTE 3
2X
1.95
4
5
B
4.5
4.3
NOTE 4
SEE DETAIL A
8X
0.30
0.19
0.1
C A
1.2 MAX
B
(0.15) TYP
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
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EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
1
8
(R0.05)
TYP
SYMM
6X (0.65)
5
4
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
(R0.05) TYP
1
8
SYMM
6X (0.65)
5
4
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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