Texas Instruments | DRV8823 4-Bridge Serial Interface Motor Driver (Rev. E) | Datasheet | Texas Instruments DRV8823 4-Bridge Serial Interface Motor Driver (Rev. E) Datasheet

Texas Instruments DRV8823 4-Bridge Serial Interface Motor Driver (Rev. E) Datasheet
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DRV8823
SLVS913E – JANUARY 2009 – REVISED JANUARY 2016
DRV8823 4-Bridge Serial Interface Motor Driver
1 Features
3 Description
•
The DRV8823 provides an integrated motor driver
solution for printers and other office automation
equipment applications.
1
•
•
•
•
•
•
PWM Motor Driver With Four H-Bridges
– Drives Two Stepper Motors, One Stepper and
Two DC Motors, or Four DC Motors
– Up to 1.5-A Current Per Winding
– Low On-Resistance
– Programmable Maximum Winding Current
– Three-Bit Winding Current Control Allows up to
Eight Current Levels
– Selectable Slow or Mixed Decay Modes
8- to 32-V Operating Supply Voltage Range
Internal Charge Pump for Gate Drive
Built-in 3.3-V Reference
Serial Digital Control Interface
Fully Protected Against Undervoltage,
Overtemperature, and Overcurrent Events
Thermally-Enhanced Surface Mount Package
2 Applications
•
•
•
•
•
•
The motor driver circuit includes four H-bridge drivers.
Each of the motor driver blocks employ N-channel
power MOSFETs configured as an H-bridge to drive
the motor windings.
A simple serial interface allows control of all functions
of the motor driver with only a few digital signals. The
devices also provides a low-power sleep function.
The motor drivers provide PWM current control
capability. The current is programmable, based on an
externally supplied reference voltage and an external
current sense resistor. In addition, eight current levels
(set through the serial interface) allow microstepping
with bipolar stepper motors.
Internal shutdown functions are provided for
overcurrent protection (OCP), short-circuit protection,
undervoltage lockout, and overtemperature.
The DRV8823 is packaged in a 48-pin HTSSOP
package (eco-friendly: RoHS and no Sb/Br).
Printers
Scanners
Office Automation Machines
Gaming Machines
Factory Automation
Robotics
Device Information(1)
PART NUMBER
DRV8823
PACKAGE
HTSSOP (48)
BODY SIZE (NOM)
6.10 mm × 12.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
8 V to 32 V
4
Serial
Interface
DRV8823
+
M
1.5 A
RESETn
±
SLEEPn
Controller
+
2
1.5 A
VREF
V3P3
±
Dual Stepper Motor
Driver
+
M
1.5 A
±
Fault
Protection
+
±
1.5 A
Current
Regulation
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV8823
SLVS913E – JANUARY 2009 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
5
5
5
5
6
7
7
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Dissipation Ratings ...................................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 13
7.5 Programming........................................................... 16
8
Application and Implementation ........................ 17
8.1 Application Information............................................ 17
8.2 Typical Application ................................................. 17
9 Power Supply Recommendations...................... 20
10 Layout................................................................... 20
10.1 Layout Guidelines ................................................. 20
10.2 Layout Example .................................................... 21
10.3 Thermal Considerations ........................................ 22
11 Device and Documentation Support ................. 24
11.1
11.2
11.3
11.4
11.5
Documentation Support .......................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
24
24
24
24
24
12 Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (January 2014) to Revision E
•
2
Page
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
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5 Pin Configuration and Functions
DCA Package
48-Pin HTSSOP
Top View
VM
VM
AOUT2
AISEN
AOUT1
NC
CP1
CP2
VCP
PGND
PGND
Solder These
PGND
Pins to Copper
PGND
Heatsink Area
PGND
PGND
V3P3
ABVREF
CDVREF
TEST
DOUT2
DISEN
DOUT1
VM
VM
48
47
1
2
3
46
4
5
45
6
44
43
7
42
8
9
41
40
10
39
11
38
12
13
37
14
15
35
34
16
33
17
18
32
19
20
30
29
21
28
22
23
24
27
26
36
31
25
BOUT1
BISEN
BOUT2
SCS
NC
RESETn
SLEEPn
NC
NC
PGND
PGND
Solder These
PGND
Pins to Copper
PGND
Heatsink Area
PGND
PGND
SCLK
TEST
SDATA
SSTB
TEST
TEST
COUT1
CISEN
COUT2
Pin Functions
PIN
NAME
NO.
I/O (1)
DESCRIPTION
—
Motor supply voltage (multiple pins)
Connect all VM pins together to motor supply voltage.
Bypass to GND with several 0.1-μF, 35-V ceramic capacitors.
—
3.3-V regulator output
Bypass to GND with 0.47-μF, 6.3-V ceramic capacitor.
—
Power ground (multiple pins)
Connect all PGND pins to GND and solder to copper heatsink
areas.
Charge pump flying capacitor
Connect a 0.01-μF capacitor between CP1 and CP2
Charge pump storage capacitor
Connect a 0.1-μF, 16-V ceramic capacitor to VM
Sets current trip threshold.
EXTERNAL COMPONENTS OR CONNECTIONS
POWER AND GROUND
1
2
VM
23
24
V3P3
16
GND
10 to 15
34 to 39
CP1
7
I/O
CP2
8
I/O
VCP
9
I/O
ABVREF
17
I
Bridge A and B current set
reference voltage
AOUT1
5
O
Bridge A output 1
AOUT2
3
O
Bridge A output 2
Connect to first coil of bipolar stepper motor 1, or DC motor
winding.
ISENA
4
—
Bridge A current sense
Connect to current sense resistor for bridge A.
BOUT1
48
O
Bridge B output 1
BOUT2
46
O
Bridge B output 2
Connect to second coil of bipolar stepper motor 1, or DC motor
winding.
ISENB
47
—
Bridge B current sense
Connect to current sense resistor for bridge B.
MOTOR DRIVERS
(1)
Directions: I = Input, O = Output, OZ = Tri-state output, OD = Open-drain output, I/O = Input/output, PU = Internal pullup
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Pin Functions (continued)
PIN
NAME
NO.
I/O (1)
DESCRIPTION
EXTERNAL COMPONENTS OR CONNECTIONS
CDVREF
18
I
Bridge C and D current set
reference voltage
COUT1
27
O
Bridge C output 1
COUT2
25
O
Bridge C output 2
Connect to first coil of bipolar stepper motor 2, or DC motor
winding.
ISENC
26
—
Bridge C current sense
Connect to current sense resistor for bridge C.
DOUT1
22
O
Bridge D output 1
DOUT2
20
O
Bridge D output 2
Connect to second coil of bipolar stepper motor 2, or DC motor
winding.
ISEND
22
—
Bridge D current sense
Connect to current sense resistor for bridge D.
Sets current trip threshold.
SERIAL INTERFACE
SDATA
31
I
Serial data input
Data is clocked in on rising edge of SCLK.
SCLK
33
I
Serial input clock
Logic high enables serial data to be clocked in.
SCS
45
I
Serial chip select
Logic high latches serial data.
SSTB
30
I
Serial data strobe
Active low resets serial interface and disables outputs.
RESETn
43
I
Reset input
Active-low input disables outputs and charge pump.
SLEEPn
42
I
Sleep input
I
Test inputs
TEST PINS
19
TEST
28
29
Do not connect these pins (used for factory test only).
32
4
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted) (1)
VM
(2)
MIN
MAX
UNIT
Power supply voltage
–0.3
34
V
(3)
–0.5
5.75
V
1.5
A
VI
Logic input voltage
IO(peak)
Peak motor drive output current, t < 1 μs
IO
Motor drive output current (4)
PD
Continuous total power dissipation
TJ
Operating virtual junction temperature
–40
150
°C
TA
Operating ambient temperature
–40
85
°C
Tstg
Storage temperature
–60
150
°C
(1)
(2)
(3)
(4)
Internally limited
See Dissipation Ratings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
Input pins may be driven in this voltage range regardless of presence or absence of VM.
Power dissipation and thermal limits must be observed.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VM
Motor power supply voltage range
IMOT
Continuous motor drive output current (1)
VREF
(1)
(2)
VREF input voltage
NOM
8
1
(2)
1
MAX
UNIT
32
V
1.5
A
4
V
Power dissipation and thermal limits must be observed.
Operational at VREF between 0 and 1 V, but accuracy is degraded.
6.4 Thermal Information
DRV8823
THERMAL METRIC (1)
DCA (HTSSOP)
UNIT
48 PINS
RθJA
Junction-to-ambient thermal resistance
31.3
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
16.3
°C/W
RθJB
Junction-to-board thermal resistance
15
°C/W
ψJT
Junction-to-top characterization parameter
0.6
°C/W
ψJB
Junction-to-board characterization parameter
14.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
0.6
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLIES
IVM
VM operating supply current
VM = 24 V, no loads
5
8
mA
VUVLO
VM undervoltage lockout voltage
VM rising
6.5
8
V
VCP
Charge pump voltage
Relative to VM
12
VV3P3
VV3P3 output voltage
3.2
3.3
V
3.4
V
0.7
V
LOGIC-LEVEL INPUTS (INTERNAL PULLDOWNS)
VIL
Input low voltage
VIH
Input high voltage
VHYS
Input hysteresis
IIN
Input current
(internal pulldown current)
2
0.3
V
0.45
VIN = 3.3 V
0.6
V
100
μA
OVERTEMPERATURE PROTECTION
TTSD
Thermal shutdown temperature
Die temperature
150
°C
MOTOR DRIVERS
Rds(on)
Motor 1 FET on resistance
(each individual FET)
VM = 24 V, IO = 0.8 A, TJ = 25°C
0.25
VM = 24 V, IO = 0.8 A, TJ = 85°C
0.31
Rds(on)
Motor 2 FET on resistance
(each individual FET)
VM = 24 V, IO = 0.8 A, TJ = 25°C
0.3
VM = 24 V, IO = 0.8 A, TJ = 85°C
0.38
IOFF
Off-state leakage current
fPWM
Motor PWM frequency (1)
tBLANK
ITRIP blanking time (2)
tF
Output fall time
50
300
ns
tR
Output rise time
50
300
ns
IOCP
Overcurrent protect level
1.5
4.5
A
tOCP
Overcurrent protect trip time
tMD
Mixed decay percentage
45
50
0.37
0.45
μA
55
kHz
μs
μs
2.5
Measured from beginning of PWM cycle
Ω
±12
3.75
3
Ω
75%
CURRENT CONTROL
IREF
xVREF input current
ΔICHOP
(1)
(2)
6
Chopping current accuracy
xVREF = 3.3 V
–3
3
xVREF = 2.5 V, derived from V3P3; 71%
to 100% current
–5%
5%
xVREF = 2.5 V, derived from V3P3; 20%
to 56% current
–10%
10%
μA
Factory option 100 kHz.
Factory options for 2.5, 5, or 6.25 μs.
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6.6 Timing Requirements
over operating free-air temperature range (unless otherwise noted)
NO.
MIN
MAX
UNIT
1
tCYC
Clock cycle time
62
ns
2
tCLKH
Clock high time
25
ns
3
tCLKL
Clock low time
25
ns
4
tSU(SDATA)
Setup time, SDATA to SCLK
5
ns
5
tH(DATA)
Hold time, SDATA to SCLK
1
ns
6
tSU(SCS)
Setup time, SCS to SCLK
5
ns
7
tH(SCS)
Hold time, SCS to SCLK
1
ns
6.7 Dissipation Ratings
RθJA
DERATING FACTOR
ABOVE TA = 25°C
TA < 25°C
TA = 70°C
TA = 85°C
Low-K (1)
75.7°C/W
13.2 mW/°C
1.65 W
1.06 W
0.86 W
Low-K (2)
32°C/W
31.3 mW/°C
3.91 W
2.50 W
2.03 W
30.3°C/W
33 mW/°C
4.13 W
2.48 W
2.15 W
22.3°C/W
44.8 mW/°C
5.61 W
3.59 W
2.91 W
BOARD
High-K (3)
High-K
(1)
(2)
(3)
(4)
PACKAGE
DCA
(4)
The JEDEC low-K board used to derive this data was a 76-mm × 114-mm, 2-layer, 1.6-mm thick PCB with no backside copper.
The JEDEC low-K board used to derive this data was a 76-mm × 114-mm, 2-layer, 1.6-mm thick PCB with 25-cm2, 2-oz copper on back
side.
The JEDEC high-K board used to derive this data was a 76-mm × 114-mm, 4-layer, 1.6-mm thick PCB with no backside copper and
solid 1-oz internal ground plane.
The JEDEC high-K board used to derive this data was a 76-mm × 114-mm, 4-layer, 1.6-mm thick PCB with 25-cm2, 1-oz copper on
backside and solid 1-oz internal ground plane.
1
SCLK
2
3
Data
Invalid
SDATA
4
5
SCS
6
7
Figure 1. Timing Diagram
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5.20
5.20
5.00
5.00
Supply Current (mA)
Supply Current (mA)
6.8 Typical Characteristics
4.80
4.60
4.40
4.20
8V
4.00
24 V
4.80
4.60
-40°C
4.40
0°C
4.20
25°C
4.00
70°C
27 V
85°C
3.80
3.80
-40°C
0°C
25°C
70°C
85°C
8V
Temperature (ƒC)
Figure 2. Supply Current vs Temperature
27 V
C002
Figure 3. Supply Current vs Supply Voltage
45.00
45.00
40.00
Charge Pump Voltage (V)
40.00
Charge Pump Voltage (V)
24 V
Supply Voltage (V)
C001
35.00
30.00
8V
25.00
24 V
27 V
20.00
35.00
30.00
25.00
-40°C
20.00
0°C
15.00
25°C
10.00
15.00
5.00
10.00
0.00
70°C
85°C
-40°C
0°C
25°C
70°C
8V
85°C
Temperature (ƒC)
27 V
600.00
500.00
500.00
400.00
400.00
Rdson (mŸ)
600.00
300.00
200.00
300.00
200.00
8V
100.00
8V
100.00
24 V
24 V
27 V
27 V
0.00
0.00
-40°C
0°C
25°C
70°C
85°C
Temperature (ƒC)
-40°C
0°C
25°C
70°C
85°C
Temperature (ƒC)
C007
Figure 6. LS Rdson Aout2 vs Temperature
8
C006
Figure 5. Charge Pump Voltage vs Supply Voltage
Figure 4. Charge Pump Voltage vs Temperature
Rdson (mŸ)
24 V
Supply Voltage (V)
C005
C008
Figure 7. LS Rdson Aout1 vs Temperature
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600.00
600.00
500.00
500.00
400.00
400.00
Rdson (mŸ)
Rdson (mŸ)
Typical Characteristics (continued)
300.00
200.00
300.00
200.00
8V
100.00
8V
100.00
24 V
24 V
27 V
27 V
0.00
0.00
-40°C
0°C
25°C
70°C
85°C
Temperature (ƒC)
-40°C
Figure 8. HS Rdson Aout2 vs Temperature
0°C
25°C
70°C
85°C
Temperature (ƒC)
C009
C010
Figure 9. HS Rdson Aout1 vs Temperature
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7 Detailed Description
7.1 Overview
The DRV8823 is a dual stepper motor driver solution for applications that require independent control of two
different motors. The device integrates four NMOS H-bridges, a microstepping indexer, and various fault
protection features. The DRV8823 can be powered with a supply voltage between 8 and 32 V, and is capable of
providing an output current up to 1.5 A full scale. Actual full-scale current will depend on ambient temperature,
supply voltage and PCB ground size.
A serial data interface is included to control all functions of the motor driver. Current regulation through all four Hbridges is achieved using three register bits per H-bridge. The three register bits are used to scale the current in
each bridge as a percentage of the full-scale current set by VREF input pin and sense resistor. The current
regulation is configurable with two different decay modes, fixed slow and mixed.
The gate drive to each FET in all four H-Bridges is controlled to prevent any cross-conduction (shoot through
current) during transitions.
10
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7.2 Functional Block Diagram
CP1
Dig.
VCC
V3P3
Charge
Pump and
Gate Drive
Regulator
3.3 V
Regulator
0.47 μF
6.3 V
0.01 μF
35 V
CP2
24 V
VCP
VGD
0.1 μF
16 V 24 V
VCP
VM
ABVREF
AOUT1
PWM H-Bridge
Driver A
AOUT2
Step
Motor
AISEN
24 V
VM
SDATA
BOUT1
PWM H-Bridge
Driver B
SCLK
BOUT2
SCS
SSTB
Serial
Interface
and
Logic
BISEN
24 V
RESETn
VM
SLEEPn
COUT1
PWM H-Bridge
Driver C
COUT2
Step
Motor
CISEN
24 V
VM
DOUT1
PWM H-Bridge
Driver D
CDVREF
DOUT2
DISEN
OCP
Thermal
Shutdown
Oscillator
UVLO
RESET
GND
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7.3 Feature Description
7.3.1 PWM Motor Drivers
The DRV8823 contains four H-bridge motor drivers with current-control PWM circuitry. Figure 10 shows a block
diagram with drivers A and B of the motor control circuitry (as typically used to drive a bipolar stepper motor).
Drivers C and D are the same as A and B (though the RDS(ON) of the output FETs is different).
VM
OCP
VM
VCP, VGD
AOUT1
From Serial Interface
Predrive
AENBL
Step
Motor
APHASE
AOUT2
ABDECAY
PWM
OCP
AI[2:0]
3
ISENA
–
+
AI[2:0]
A =5
DAC
3
ABVREF
VM
OCP
VM
VCP, VGD
BOUT1
Predrive
BENBL
BOUT2
BPHASE
PWM
OCP
ISENB
–
+
BI[2:0]
A =5
DAC
3
Figure 10. Block Diagram With Drivers A and B
NOTE
The device has multiple VM motor power supply pins. All VM pins must be connected
together to the motor supply voltage.
12
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7.4 Device Functional Modes
ESD
To Logic
Hysteresis
Internal
Pulldown
Figure 11. Logic Inputs
7.4.1 Bridge Control
The xENBL bits in the serial interface registers enable current flow in each H-bridge when set to 1.
The xPHASE bits in the serial interface registers control the direction of current flow through each H-bridge.
Table 1 shows the logic.
Table 1. Bridge Control Logic
xPHASE
xOUT1
xOUT2
1
H
L
0
L
H
7.4.2 Current Regulation
The motor driver employs fixed-frequency PWM current regulation (also called current chopping). When a
winding is activated, the current through it rises until it reaches a threshold, then the current is switched off until
the next PWM period.
The PWM frequency is fixed at 50 kHz, but may also be set to 100 kHz by factory option.
The PWM chopping current is set by a comparator which compares the voltage across a current sense resistor
connected to the xISEN pins, multiplied by a factor of 5, with a reference voltage. The reference voltage is input
from the VREF pin.
The full-scale (100%) chopping current is calculated as follows:
5
(1)
Example:
If a 0.5-Ω sense resistor is used and the VREFx pin is 2.5 V, the full-scale (100%) chopping current is
2.5 V / (5 × 0.5 Ω) = 1 A.
Three serial interface register bits per H-bridge (xI2, xI1, and xI0) are used to scale the current in each bridge as
a percentage of the full-scale current set by the VREF input pin and sense resistance. Table 2 shows the
function of the bits.
Table 2. Bit Functions
xI2
xI1
xI0
Relative Current
(% Full-Scale Chopping Current)
0
0
0
20
0
0
1
38
0
1
0
56
0
1
1
71
1
0
0
83
1
0
1
92
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Table 2. Bit Functions (continued)
Relative Current
(% Full-Scale Chopping Current)
xI2
xI1
xI0
1
1
0
98
1
1
1
100
7.4.3 Blanking Time
After the current is enabled in an H-bridge, the voltage on the xISEN pin is ignored for a fixed period of time
before enabling the current sense circuitry. This blanking time is fixed at 3.75 μs. Note that the blanking time also
sets the minimum on-time of the PWM.
7.4.4 Decay Mode
During PWM current chopping, the H-bridge is enabled to drive through the motor winding until the PWM current
chopping threshold is reached (see case 1 in Figure 12). The current flow direction shown indicates positive
current flow in Figure 12.
After the chopping current threshold is reached, the H-bridge can operate in two different states: fast decay or
slow decay.
In fast-decay mode, after the PWM chopping current level is reached, the H-bridge reverses state to allow
winding current to flow in a reverse direction. As the winding current approaches 0, the bridge is disabled to
prevent any reverse current flow. See case 2 in Figure 12 for fast-decay mode.
In slow-decay mode, winding current is recirculated by enabling both of the low-side FETs in the bridge (see
case 3 in Figure 12).
VM
1 Drive current
1
xOUT2
xOUT1
3
2
Fast decay (reverse)
3
Slow decay (brake)
2
Figure 12. Decay Mode
The DRV8823 supports slow decay and also a mixed-decay mode. Mixed-decay mode begins as fast decay, but
at a fixed period of time (75% of the PWM cycle) it switches to slow decay mode for the remainder of the fixed
PWM period.
14
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The state of the xDECAY bits in the serial interface registers selects whether the device is in slow-decay or
mixed-decay mode. If the xDECAY bit is 0,the device selects slow decay. If the xDECAY bit is 1, the device
selects mixed decay.
7.4.5 Protection Circuits
The DRV8823 is fully protected against undervoltage, overcurrent, and overtemperature events.
7.4.5.1 OCP
All of the drivers in DRV8823 are protected with an OCP circuit.
The OCP circuit includes an analog current limit circuit, which acts by removing the gate drive from each output
FET if the current through it exceeds a preset level. This circuit limits the current to a level that is safe to prevent
damage to the FET.
A digital circuit monitors the analog current limit circuits. If any analog current limit condition exists for longer than
a preset period, all drivers in the device are disabled.
The device is re-enabled upon the removal and re-application of power at the VM pins.
7.4.5.2 Thermal Shutdown (TSD)
If the die temperature exceeds safe limits, all drivers in the device are shut down.
The device remains disabled until the die temperature has fallen to a safe level. After the temperature has fallen,
the device may be re-enabled upon the removal and re-application of power at the VM pin.
7.4.5.3 Undervoltage Lockout (UVLO)
If at any time the voltage on the VM pins falls below the UVLO threshold voltage, all circuitry in the device is
disabled. Operation resumes when VM rises above the UVLO threshold. The indexer logic is reset to its initial
condition in the event of an UVLO.
7.4.5.4 Shoot-Through Current Prevention
The gate drive to each FET in the H-bridge is controlled to prevent any cross-conduction (shoot through current)
during transitions.
7.4.6 Serial Data Transmission
Data transfers consist of sixteen bits of serial data, shifted into the SDATA pin LSB first.
On serial writes to DRV8823, additional clock edges following the final data bit continue to shift data bits into the
data register; therefore, the last 16 bits presented are latched and used.
Select one of two registers by setting bits in an address field in the four upper bits in the serial data transferred
(ADDR in Table 3 and Table 4). One 16-bit register is used to control motor 1 (bridges A and B), and a second
16-bit register is used to control motor 2 (bridges C and D).
Data can only be transferred into the serial interface if the SCS input pin is active high.
Data is initially clocked into a temporary holding register. This data is latched into the motor driver on the rising
edge of the SSTB pin. If the SSTB pin is tied high at all times, the data is latched in after all 16 bits have been
transferred.
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7.5 Programming
7.5.1 Data Format
Table 3. Motor 1 Command (Bridges A and B)
Bit
Name
D15:D12
D11
ADDR
BDECAY
(= 0000)
D10
D9
D8
B12
B11
B10
0
0
D7
D6
D5
BPHASE BENBL ADECAY
D4
D3
D2
D1
D0
A12
A11
A10
0
0
0
0
0
APHASE AENBL
Reset
Value
x
0
0
Bit
D15:D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Name
ADDR
(= 0001)
DDECAY
D12
D11
D10
DPHASE
DENBL
CDECAY
C12
C11
C10
CPHASE
CENBL
Reset
Value
x
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Table 4. Motor 2 Command (Bridges C and D)
SCS
See Note 1
SCLK
See Note 2
SDATA
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
SSTB
Note 1: Any amount of time is allowed between clocks, or groups of clocks, as long as SCS stays active. This allows
8- or 16-bit transfers.
Note 2: If more than 16 clock edges are presented while transferring data (while SCS is still high), data will continue
to be shifted into the data register.
Figure 13. Serial Data Timing Diagram
16
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DRV8823 can be used to drive two bipolar stepper motors.
±
8.2 Typical Application
+
M
±
+
VM
1
2
0.1 µF
100 µF
3
.3 Ÿ
4
5
6
7
0.01 µF
8
0.1 µF
9
10
11
12
13
14
15
16
17
0.1 µF
18
19
20
.3 Ÿ
21
22
23
24
VM
DRV8823
VM
AOUT2
AISEN
BOUT1
BISEN
BOUT2
SCS
AOUT1
NC
NC
RESETn
CP1
SLEEPn
CP2
NC
VCP
NC
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
V3P3
SCLK
ABVREF
TEST
CDVREF
SDATA
TEST
SSTB
DOUT2
TEST
DISEN
TEST
DOUT1
COUT1
VM
CISEN
VM
COUT2
48
47
0.3 Ÿ
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
.3 Ÿ
25
±
±
+
+
M
Figure 14. Typical Application Schematic
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Typical Application (continued)
8.2.1 Design Requirements
Table 5 shows the design parameters.
Table 5. Design Parameters
DESIGN PARAMETER
REFERENCE
EXAMPLE VALUE
Supply voltage
VM
24 V
Motor winding resistance
RL
7.4 Ω/phase
θstep
1.8°/step
Motor full step angle
Target microstepping angle
nm
1/8 step
Target motor speed
V
120 rpm
Target full-scale current
IFS
1A
8.2.2 Detailed Design Procedure
8.2.2.1 Motor Voltage
The appropriate motor voltage will depend on the ratings of the motor selected and the desired torque. A higher
voltage shortens the current rise time in the coils of the stepper motor allowing a greater average torque. Using a
higher voltage also allows the motor to operate at a faster speed than a lower voltage.
8.2.3 Drive Current
The current path running to the motor starts from the supply VM, then goes through the high-side sourcing
NMOS power FET, moves through the inductive winding load of the motor, then through the low-side sinking
NMOS power FET, and finally going through the external sense resistor. Power dissipation losses in both NMOS
power FETs inside of the DRV8823 are shown in the following equation: Equation 2.
P = I2 × (RDS (on) × 2)
(2)
The DRV8823 has been measured to be capable of 1.5-A continuous current with the HTSSOP package at 25°C
on standard FR-4 PCBs. The max continuous current varies based on PCB design and the ambient temperature.
8.2.4 Application Curves
Figure 15. ½ Step Microstepping With Slow Decay
18
Figure 16. 1/8 Step Microstepping With Slow Decay
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Figure 17. ½ Step Microstepping With Mixed Decay
Figure 18. 1/8 Step Microstepping With Mixed Decay
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9 Power Supply Recommendations
Having appropriate local bulk capacitance is an important factor in motor drive system design. It is generally
beneficial to have more bulk capacitance, while the disadvantages are increased cost and physical size.
The amount of local capacitance needed depends on a variety of factors, including:
• The highest current required by the motor system.
• The power supply’s capacitance and ability to source current.
• The amount of parasitic inductance between the power supply and motor system.
• The acceptable voltage ripple.
• The type of motor used (Brushed DC, Brushless DC, Stepper).
• The type of motor used (Brushed DC, Brushless DC, Stepper).
The inductance between the power supply and motor drive system will limit the rate current can change from the
power supply. If the local bulk capacitance is too small, the system will respond to excessive current demands or
dumps from the motor with a change in voltage. When adequate bulk capacitance is used, the motor voltage
remains stable and high current can be quickly supplied.
The data sheet generally provides a recommended value, but system-level testing is required to determine the
appropriate sized bulk capacitor.
Figure 19. Example Setup of Motor Drive System With External Power Supply
10 Layout
10.1 Layout Guidelines
The bulk capacitor should be placed to minimize the distance of the high-current path through the motor driver
device. The connecting metal trace widths should be as wide as possible, and numerous vias should be used
when connecting PCB layers. These practices minimize inductance and allow the bulk capacitor to deliver high
current.
Small-value capacitors should be ceramic, and placed closely to device pins.
The high-current device outputs should use wide metal traces.
The device thermal pad should be soldered to the PCB top-layer ground plane. Multiple vias should be used to
connect to a large bottom-layer ground plane. The use of large metal planes and multiple vias help dissipate the
I2 × RDS(on) heat that is generated in the device.
20
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10.2 Layout Example
+
VM
DRV8823
BOUT1
VM
BISEN
AOUT2
BOUT2
AISEN
SCS
AOUT1
NC
NC
RESETn
CP1
SLEEPn
CP2
NC
VCP
NC
PGND
PGND
PGND
PGND
PGND
PGND
`
PGND
PGND
PGND
PGND
PGND
PGND
V3P3
SCLK
ABVREF
TEST
CDVREF
SDATA
TEST
SSTB
DOUT2
TEST
DISEN
TEST
DOUT1
COUT1
VM
CISEN
VM
COUT2
Figure 20. Typical Layout of DRV8823
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10.3 Thermal Considerations
The DRV8823 has TSD as described in Thermal Shutdown (TSD). If the die temperature exceeds approximately
150°C, the device is disabled until the temperature drops to a safe level.
Any tendency of the device to enter TSD is an indication of excessive power dissipation, insufficient heatsinking,
or too high an ambient temperature.
10.3.1 Power Dissipation
Power dissipation in the DRV8823 is dominated by the power dissipated in the output FET resistance, or RDS(ON).
Average power dissipation when running a stepper motor can be roughly estimated by Equation 3.
PTOT = 4
·
RDS(ON)
·
(IOUT(RMS))
2
where
•
•
•
PTOT is the total power dissipation.
RDS(ON) is the resistance of each FET.
IOUT(RMS) is the RMS output current being applied to each winding.
(3)
IOUT(RMS) is equal to approximately 0.7x the full-scale output current setting. The factor of 4 comes from the fact
that there are two motor windings, and at any instant two FETs are conducting winding current for each winding
(one high side and one low side). Remember that the DRV8823 has two stepper motor drivers, so the power
dissipation of each must be added together to determine the total device power dissipation.
The maximum amount of power that can be dissipated in the DRV8823 depends on ambient temperature and
heatsinking. Use the thermal Dissipation Ratings to estimate the temperature rise for typical PCB constructions.
Note that RDS(ON) increases with temperature, so as the device heats, the power dissipation increases. Take this
into consideration when sizing the heatsink.
10.3.2 Heatsinking
The PowerPAD™ package uses an exposed pad to remove heat from the device. For proper operation, this pad
must be thermally connected to copper on the PCB to dissipate heat. On a multi-layer PCB with a ground plane,
this can be accomplished by adding a number of vias to connect the thermal pad to the ground plane. On PCBs
without internal planes, copper area can be added on either side of the PCB to dissipate heat. If the copper area
is on the opposite side of the PCB from the device, thermal vias are used to transfer the heat between top and
bottom layers.
For details about how to design the PCB, refer to TI application report, PowerPAD™ Thermally Enhanced
Package (SLMA002) and TI application brief, PowerPAD™ Made Easy, (SLMA004) available at www.ti.com.
In general, the more copper area that can be provided, the more power can be dissipated. Figure 21 shows
thermal resistance versus copper plane area for both a single-sided PCB with 2-oz copper heatsink area, and a
4-layer PCB with 1-oz copper and a solid ground plane. Both PCBs are 76 mm × 114 mm, and 1.6-mm thick.
The heatsink effectiveness increases rapidly to about 20 cm2, then levels off somewhat for larger areas.
Six pins on the center of each side of the package are also connected to the device ground. A copper area can
be used on the PCB that connects to the PowerPAD as well as to all the ground pins on each side of the device.
This is especially useful for single-layer PCB designs.
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Thermal Considerations (continued)
70
Thermal Resistance (RΘJA) (°C/W)
65
60
55
50
45
Low-K PCB (2 Layer)
40
35
30
High-K PCB (4 Layer with Ground Plane)
25
20
0
10
20
30
40
50
60
70
80
90
2
Backside Copper Area (cm )
Figure 21. Thermal Resistance vs Copper Plane Area
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
• PowerPAD™ Thermally Enhanced Package, SLMA002
• PowerPAD™ Made Easy, SLMA004
• Current Recirculation and Decay Modes, SLVA321
• Calculating Motor Driver Power Dissipation, SLVA504
• Understanding Motor Driver Current Ratings, SLVA505
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
24
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Aug-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
DRV8823DCA
ACTIVE
HTSSOP
DCA
48
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DRV8823
DRV8823DCAR
ACTIVE
HTSSOP
DCA
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DRV8823
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
27-Aug-2013
OTHER QUALIFIED VERSIONS OF DRV8823 :
• Automotive: DRV8823-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DRV8823DCAR
Package Package Pins
Type Drawing
SPQ
HTSSOP
2000
DCA
48
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
330.0
24.4
Pack Materials-Page 1
8.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.0
1.8
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV8823DCAR
HTSSOP
DCA
48
2000
350.0
350.0
43.0
Pack Materials-Page 2
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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