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Texas Instruments DRV8662 Piezo Haptics Driver Evaluation Module (RevD Silicon) (Rev. B) User guides
User's Guide
SLOU319B – August 2011 – Revised March 2016
DRV8662 Piezo Haptics Driver Evaluation Module
This DRV8662EVM user guide provides instructions for using the DRV8662EVM evaluation module
(EVM). The DRV8662EVM features the fully-differential, high-voltage DRV8662 driver that provides fast
response times and complete control for piezo loads. The DRV8662EVM can be used in-system or as a
stand-alone module for complete evaluation of the DRV8662 driver.
Figure 1. DRV8662EVM
1
2
3
4
5
Contents
Introduction ................................................................................................................... 3
1.1
DRV8662RGP EVM Operating Specifications .................................................................. 3
Quick Start for Stand-Alone Operation .................................................................................... 3
2.1
Powering the Board ................................................................................................ 3
2.2
Connecting a Load.................................................................................................. 4
2.3
Output Waveforms ................................................................................................. 4
General Operation ........................................................................................................... 4
3.1
Power ................................................................................................................. 4
3.2
Boost Converter ..................................................................................................... 5
3.3
Input Modes ......................................................................................................... 7
3.4
Programming the MSP430 ........................................................................................ 9
3.5
Filtering and Adapting PWM Waveforms ...................................................................... 10
3.6
Output ............................................................................................................... 14
Reference ................................................................................................................... 14
4.1
Schematic .......................................................................................................... 15
4.2
PCB Layout ........................................................................................................ 16
4.3
Bill Of Materials .................................................................................................... 19
Related Documentation From Texas Instruments ..................................................................... 21
List of Figures
1
DRV8662EVM ................................................................................................................ 1
All trademarks are the property of their respective owners.
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3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
................................................................................... 5
MSP430 PWM Input Mode ................................................................................................. 7
External PWM Input Mode .................................................................................................. 7
External Analog Input Mode ................................................................................................ 8
I2C Input Mode ............................................................................................................... 9
Filter Response ............................................................................................................. 10
First-Order Input Filter ..................................................................................................... 11
First-Order Frequency Response ........................................................................................ 11
Second-Order Input Filter ................................................................................................. 12
Second-Order Filter Frequency Response.............................................................................. 12
Second-Order, Single-Ended Filter ...................................................................................... 13
Second-Order, Differential Filter.......................................................................................... 13
Single-Ended Input with Dummy Filter .................................................................................. 13
Dummy Filter Waveform................................................................................................... 14
EVM Top X-Ray ............................................................................................................ 16
EVM Top Layer ............................................................................................................. 17
EVM Layer 2 ................................................................................................................ 17
EVM Layer 3 ................................................................................................................ 18
EVM Bottom Layer ......................................................................................................... 18
Boost Voltage Programming Resistors
List of Tables
2
1
EVM Operating Specifications ............................................................................................. 3
2
Default EVM Modes ......................................................................................................... 4
3
Boost Voltage with R4 and R5 ............................................................................................. 5
4
Boost Voltage and Gain Settings .......................................................................................... 6
5
Inductor Selection ............................................................................................................ 6
6
DRV8662EVM MSP430 Pinout ........................................................................................... 10
7
Piezo Actuator Selection .................................................................................................. 14
DRV8662 Piezo Haptics Driver Evaluation Module
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Introduction
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1
Introduction
The DRV8662EVM is a fully-differential, high-voltage piezo actuator driver that provides quick response
times for single layer and multi-layer piezo actuators. The DRV8662 drives piezo loads up to 200 V
differentially using an adjustable 100-V integrated boost converter. The evaluation module contains the
DRV8662RGP piezo haptics driver, an MSP430 microcontroller, and passive components for complete
evaluation. This document contains the EVM schematic, printed circuit board (PCB) images, and a
complete bill of materials (BOM) as well as instructions for operating the EVM.
1.1
DRV8662RGP EVM Operating Specifications
Table 1 lists the EVM operating parameters at room temperature. See the DRV8662 product data sheet
for a comprehensive list of operating parameters and descriptions.
Table 1. EVM Operating Specifications
Parameter
Specification
Supply voltage range, VBAT
3 V to 5.5 V
Power-supply current rating
required
1A
Input voltage, VI
0 V to 3.3 V
Maximum output voltage, VOUT
200 V
WARNING
Care should be taken while handling and evaluating this module
because of high voltages (up to 200 V).
2
Quick Start for Stand-Alone Operation
This section helps you get started quickly by describing the default setup of the DRV8662EVM. The EVM,
by default, generates sample haptic waveforms using an onboard MSP430. During operation, the MSP430
outputs a PWM waveform on the PWM+ and PWM– traces that are connected to the DRV8662 low-pass
input filter. The low-pass filtered signals are then input to the DRV8662. The DRV8662 output appears on
the output terminal block (OUT) which can be connected directly to a high-voltage piezo load. The
pushbutton (TRIG) triggers various software events on the MSP430. When pressed, the button alternates
between the four DRV8662 gain settings, four sample haptic waveforms, and analog input modes. The list
of output waveforms can be found in Table 2.
To set up the EVM using the default configuration, follow the instructions presented below.
2.1
Powering the Board
1. Set the voltage of an external power supply to 3.6 V to 5.5 V.
2. With the power supply off, attach the ground connection of the power supply to the negative terminal of
the VBAT terminal block (VBAT–) and connect the positive supply to the positive terminal of the VBAT
terminal block (VBAT+).
3. Ensure the terminals are connected correctly, then enable the supply.
4. If the power is connected correctly the ACTIVE LED will blink.
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Quick Start for Stand-Alone Operation
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Connecting a Load
1. With the power supply off, connect the negative terminal of the load to OUT– and connect the positive
terminal of the load to OUT+.
2. Ensure the terminals are connected correctly, then enable the supply.
WARNING
Before connecting the load, ensure that the piezo actuator (or other
load) is rated for 200 Vpeak-to-peak. If not, see the section Programming
the Boost Voltage to adjust the DRV8662 maximum output voltage.
2.3
Output Waveforms
The MSP430 has eight different output modes that can be accessed using the pushbutton (TRIG). The
pushbutton will advance to the next mode and continue to cycle through each mode in a loop. Powering
off the EVM resets the board to Mode 1. A description of each mode is shown in Table 2. Use the three
onboard LEDs [GAIN1, GAIN0, and ACTIVE (EN)] to determine the current output mode.
Table 2. Default EVM Modes
Mode
(1)
Description
1
Sample Waveforms
2
External Analog/PWM Input
3
Sample Waveforms
4
External Analog/PWM Input
5
Sample Waveforms
6
External Analog/PWM Input
7
Sample Waveforms
8
External Analog/PWM Input
Gain (dB)
28
VOUT
50
GAIN1
0
GAIN0
0
34
100
0
1
38
150
1
0
40
200
1
1
EN
0 / 1 (1)
1
0 / 1 (1)
1
0 / 1 (1)
1
0 / 1 (1)
1
Enable is high only during waveform output.
NOTE: To optimize the DRV8662 and reduce power losses, use the mode with an output voltage
(VOUT) closest to the actuator voltage requirements. For best performance, adjust the
feedback resistors so that the boost voltage is 5 V greater than the peak voltage requirement
of the actuator. See Table 4 for examples.
3
General Operation
This section guides you though the advanced configurations options of the DRV8662EVM including the
input, output, power supply, internal boost converter, and MSP430 firmware. Use the following sections to
configure the board for your specific application.
3.1
Power
The VBAT rail powers the DRV8662 directly and should be set between 3 V and 5.5 V. The MSP430 (U2)
and level-shifter (U4) are powered by an onboard LDO (U3) with an output voltage of 3.3 V.
To power the board:
1. Set an external power supply between 3.5 V and 5.5 V.
2. Connect the negative terminal of the power supply to VBAT– and the positive terminal of the power
supply to VBAT+.
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3. Verify the terminals are connected correctly, then enable the supply.
To disable the MSP430 (U2) and level-shifter (U4) remove resistor R22 to disconnect the 3.3 V LDO (U3).
NOTE: The DRV8662 is capable of operating down to 3 V. To use the DRV8662EVM at a voltage
lower than 3.3 V, follow the instructions for using an external analog input source and
control.
3.2
Boost Converter
The DRV8662 has a 100-V internal boost converter to drive up to 200 V differentially across the output.
Before connecting the load, ensure the piezo actuator (or other load) is rated for 200 Vpeak-to-peak. If the load
is rated for a lower voltage, see Section 3.2.1 for information about adjusting the maximum output voltage.
3.2.1
Programming the Boost Voltage
The boost output voltage (VBST) is programmed via two external resistors R1 and R2, as shown in
Figure 2. In addition, the DRV8662EVM includes two additional resistors, R4 and R5, which allow the
MSP430 to digitally adjust VBST based on the gain settings. Refer to Table 3 for VBST at each gain
setting and the equivalent low-side resistance.
VBST
DRV8662
R1
FB
R2
R4
R5
GAIN1
GAIN0
Q1
Figure 2. Boost Voltage Programming Resistors
NOTE: R4 and R5 should be removed if adjusting VBST using resistors R1 and R2.
Table 3 lists typical boost voltage values for resistors R4 and R5.
Table 3. Boost Voltage with R4 and R5
GAIN1
GAIN0
VFB Low-Side
Resistance
VBST
0
0
35.7k
30
0
1
19.1k
54
1
0
12.8k
80
1
1
9.8k
105
With only resistors R1 and R2 present, the boost output voltage is given by Equation 1.
VBOOST = VFB 1 +
R1
R2
(1)
where VFB = 1.32 V.
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The maximum boost output voltage is 105 V. VBST should be programmed to a value 5 V greater than the
largest peak voltage expected in the system to allow adequate amplifier headroom. Because the
programming range for the boost voltage extends to 105 V, the current through the resistor divider can
become significant. The sum of the feedback resistors R1 and R2 should be greater than 500 kΩ.
NOTE: When the feedback resistor values are greater than 1 MΩ, PCB contamination may cause
boost voltage inaccuracies. Be sure to keep the board clean from excess solder and flux
when modifying the board.
Table 4 lists typical resistor values for common boost voltage levels.
Table 4. Boost Voltage and Gain Settings
3.2.2
VO (peak-topeak)
R1
R2
GAIN1
GAIN0
VBST
402k
18.2k
0
0
30
50
392k
9.76k
0
1
55
100
768k
13k
1
0
80
150
768k
9.76k
1
1
105
200
Programming the Boost Current Limit
The peak inductor current is set by resistor R3 (REXT). The current limit is not a safety mechanism, but the
highest value current the inductor will see each cycle. The inductor must be capable of handling this
programmed limit during normal operation. The relationship of REXT to ILIM is approximated by Equation 2:
REXT = K
VREF
- RINT
ILIM
(2)
where ILIM is the current limit set by REXT, K = 10500, VREF = 1.35 V and RINT = 60 Ω.
3.2.3
Boost Inductor Selection
Inductor selection plays a critical role in the performance of the DRV8662. The range of recommended
inductor values is 3.3 µH to 22 µH. When a larger inductance is chosen, the DRV8662 boost converter will
automatically run at a lower switching frequency and incur less switching losses; however, the larger
inductors may also have a higher equivalent series resistance (ESR), which will increase the parasitic
inductor losses. Smaller inductances generally have higher saturation currents; therefore, they are better
suited for maximizing the output current of the boost converter. Table 5 lists several sample inductors that
provide adequate performance.
Table 5. Inductor Selection
3.2.4
Manufacturer
Part Number
DCR (Ω)
Inductance (µH)
ISAT (A)
REXT (Ω)
ILIM (A)
Coilcraft
LPS4018-332MLB
0.080
3.3
1.9
7.32k
1.9
Coilcraft
LPS4018-472MLB
0.125
4.7
1.8
7.5k
1.8
TDK
VLS3012T-3R3M1R3
0.100
3.3
1.5
9.31k
1.5
Boost Capacitor Selection
The boost output voltage may be programmed as high as 105 V. A capacitor must have a voltage rating
equivalent to the boost output voltage or higher. A 250-V rated 100-nF capacitor of X5R or X7R type is
recommended for a boost converter voltage of 105 V. The selected capacitor should have a minimum
derated capacitance of 50 nF.
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3.3
Input Modes
The DRV8662 requires either a low-pass filtered PWM waveform or an analog signal to drive piezo loads.
By default, the DRV8662EVM uses the MSP430 PWM input mode with a low-pass filter. This section
describes each input mode in detail and the modifications necessary for operation of each. See the
Filtering and Adapting PWM Waveforms section for more details on adapting the PWM waveform using a
low-pass filter.
The DRV8662EVM supports four input modes for driving the DRV8662:
• MSP430 PWM input: In this mode, the onboard MSP430 (U2) generates a PWM waveform that is sent
through the low-pass input filter to the DRV8662.
• External PWM input: An external source supplies a PWM waveform to the EXTIN header which is
sent through the low-pass input filter to the DRV8662.
• External analog input: An external source supplies an analog waveform (sine wave) to the EXTIN
header. The low-pass input filter may be removed.
• I2C input: An external source supplies an I2C stream that is decoded by the MSP430 to produce a
PWM output waveform. The PWM waveform is then sent through the low-pass input filter to the
DRV8662. This option requires special firmware for decoding the I2C stream.
NOTE: By default, the EVM is configured to use the PWM waveform generated by the MSP430.
Follow the instructions given in Section 3.3.2 if you plan to use an external input source or
change the PWM frequency.
3.3.1
MSP430 PWM Input Mode
Low-Pass
Filter
MSP430
DRV8662
Figure 3. MSP430 PWM Input Mode
When using the DRV8662EVM in MSP430 PWM input mode, the onboard MSP430 generates a
differential PWM signal that is sent through a low-pass filter to the DRV8662. The DRV8662EVM is setup
to use this mode by default. Follow the quick-start instructions (refer to Section 2) for using the
DRV8662EVM in this configuration.
If specific waveforms are needed other than those already on the MSP430, the firmware can be updated.
To update the firmware, download Code Composer Studio (or a third-party MSP430 IDE) and connect the
DRV8662EVM Spy Bi-Wire to the computer. The TI website offers an MSP430 USB-to-JTAG hardware
interface (MSP-FET430UIF) for updating and debugging MSP430 code. Sample code is also available on
the DRV8662 product webpage.
3.3.2
External PWM Input Mode
EXTIN-
Low-Pass
Filter
EXTIN+
DRV8662
Figure 4. External PWM Input Mode
The PWM input mode can be used with an external processor or PWM source. The PWM signal is a
carrier wave (duty-cycle modulated) at a frequency much higher than the analog signal it represents. This
approach is a common and easy way to create haptic waveforms. Using this mode requires an input filter
that transforms the PWM carrier waveform into an analog signal. This transformation is achieved by lowpass filtering the PWM carrier waveform which is at a frequency typically 20 kHz or greater.
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To use an external PWM source to drive the DRV8662, follow these instructions to modify the board.
1. Disconnect the MSP430 output pins from the DRV8662 input pins by removing jumpers JP2 and JP3.
2. Depending on the input source, follow the instructions in the Filtering and Adapting PWM Waveforms
section to adjust the input filter.
3. Connect DRV8662 control signals:
(a) Use the onboard MSP430 to control the EN, GAIN0, and GAIN1 pins. Using the onboard push
button (TRIG), select an external analog/PWM input mode and appropriate gain setting from
Table 2. The MSP430 must be set to an even number output mode with a constant voltage on the
DRV8662 EN, GAIN0, and GAIN1 pins; otherwise, the output will pulse during operation. The
ACTIVE LED will glow solid if a constant voltage waveform is selected.
(b) Use an external controller. Remove resistors R15, R16, and R19 to disconnect the MSP430 from
the EN, GAIN0, and GAIN1 pins. Then solder three control wires to the resistor pads.
4. Connect the positive terminal of the input signal source to EXTIN+ and the negative terminal to
EXTIN–.
5. Enable the power supply.
3.3.3
External Analog Input Mode
EXTINDRV8662
EXTIN+
Figure 5. External Analog Input Mode
To use an external analog source (sine wave) to drive the DRV8662, follow these instructions to modify
the board.
1. Disconnect the MSP430 output pins from the DRV8662 input pins by removing jumpers JP2 and JP3.
2. Modify the input filter according to the Filtering and Adapting PWM Waveforms section. The default
PWM filter is no longer necessary.
3. Connect the DRV8662 control signals:
(a) Use the onboard MSP430 to control the EN, GAIN0, and GAIN1 pins. Using the onboard push
button (TRIG), select an external analog/PWM input mode and appropriate gain setting from
Table 2. The MSP430 must be set to an even number output mode with a constant voltage on the
DRV8662 EN, GAIN0,and GAIN1 pins; otherwise, the output will pulse during operation. The
ACTIVE LED will glow solid if a constant voltage waveform is selected.
(b) Use an external controller. Remove resistors R15, R16, and R19 to disconnect the MSP430 from
the EN, GAIN0, and GAIN1 pins. Then solder three control wires to the resistor pads.
4. Connect the positive terminal of the input signal source to EXTIN+ and the negative terminal to
EXTIN–.
5. Enable the power supply.
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3.3.4
I2C Input Mode
2
IC
SDA
Low-Pass
Filter
MSP430
SCL
DRV8662
Figure 6. I2C Input Mode
This mode uses a serial bus protocol (I2C) to transfer waveform data points digitally from an external I2C
source to the MSP430. Using the I2C terminal block, the MSP430 receives the I2C values and decodes
them to produce a PWM waveform.
1. Update the firmware on the MSP430 for I2C input mode. To update the firmware, download Code
Composer Studio (or a third-party MSP430 IDE) and connect the DRV8662EVM Spy Bi-Wire to the
computer. The TI website offers an MSP430 USB-to-JTAG hardware interface (MSP-FET430UIF) for
updating and debugging MSP430 code.
2. Connect the SDA, SCL, and GND signals to the I2C header.
3. Enable the power supply.
3.3.5
Single-Ended and Differential Inputs
The input signal can either be a single-ended or differential source. Follow the instructions below for each
input source.
• Single-ended input: Connect the input source to the positive terminal of EXTIN (+) and ground of the
source to the negative terminal of EXTIN (–).
• Differential input: The input should be applied differentially across the EXTIN header.
If using a PWM waveform, it is recommended to use a PWM signal greater than 20 kHz and vary the duty
cycle to produce a sine wave.
3.4
Programming the MSP430
The MSP430 can be reprogrammed to create unique functionality and custom haptic effects. To update
the firmware, the following tools and software are required:
1. An integrated development environment (IDE) for the MSP430, such as Code Composer Studio (CCS)
(free) or the IAR Embedded Workbench Kickstart Edition.
2. MSP-FET430UIF USB Debugging Hardware Interface
3. MSP-JTAG2SBW JTAG to Spy-Bi-Wire adapter (not included in the DRV8662EVM kit)
To reprogram the MSP430, follow this procedure:
1. Connect the DRV8662EVM to a computer using the MSP-FET430UIF and the JTAG-to-Spy-Bi-Wire
adapter. The Spy-Bi-Wire adapter should be attached to the small 6-pin header (SBW) on the
DRV8662EVM.
2. Start the MSP430 IDE.
3. Ensure that the IDE is configured for the MSP430G2553.
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Table 6 lists the MSP430G2553 pinout on the DRV8662EVM.
Table 6. DRV8662EVM MSP430 Pinout
3.5
Pin No.
Label
1
P1.1
GAIN0
Description
2
P1.2
GAIN1
3
P1.3
EN / ACTIVE
12
P3.2
PWM+
13
P3.3
PWM–
17
P2.5
TRIG (Pushbutton)
21
P1.6/SCL
I2C Clock
22
P1.7/SDA
I2C Data
23
SBWTDIO
Spy-Bi-Wire Data
24
SBWTCK
Spy-Bi-Wire Clock
25
P2.7
GAIN1 FET Control
26
P2.6
GAIN0 FET Control
27
AVSS
Analog Ground
28
DVSS
Digital Ground
29
AVCC
Analog Supply
30
DVCC
Digital Supply
Filtering and Adapting PWM Waveforms
The DRV8662EVM has the capability to support many different input filter configurations. Depending on
the input mode, input frequency and input voltage the filter can be adapted to attenuate any undesired
out-of-band content. This section describes the input filter requirements and the various respective
configurations.
3.5.1
PWM Input
When using a PWM input, a low-pass filter is required. The primary parameters for determining the input
filter are the PWM input frequency and sample rate. Because haptic waveforms are typically less than 500
Hz, the input filter must attenuate frequencies above 500 Hz. For samples rates above 20 kHz, a simple
first-order RC filter is recommended; however, for sample rates much lower (such as 8 kHz), a first-order
filter may not sufficiently attenuate the high-frequency content. Thus, for lower sampling rates, a secondorder RC filter may be required. The following sections describe example filter configurations for both firstorder and second-order filters. The DRV8662EVM default configuration uses a second-order, differential
filter, but it can be replaced by a first-order, single-ended or differential filter.
First-order filter
Second-order filter
fIN
fS - fIN
fS
fS + fIN
Figure 7. Filter Response
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3.5.1.1
Filter Selection Criteria
Apply these criteria to select an input filter.
1. First-order RC filters, both single-ended and differential, are recommended for 20 kHz and higher data
sample rates. The first-order filters have adequate settling time and the fewest components.
2. Second-order filters are recommended for noiseless operation when using a lower data sample rate
where a sharper cutoff is necessary.
3. The attenuation at the PWM carrier frequency should be at least –40 dB for haptic applications.
3.5.1.2
First-Order Filter
For sample rates 20 kHz and greater, a first-order filter is recommended. The first-order filter is used in
both single-ended or differential configurations. Figure 8 shows a differential, first-order filter. The PWM
input filter is optimized for a 3.3-V differential PWM input signal (–11-dB attenuation); remove R17 and
R18 when applying a 1.8-V input signal.
R13
4.99 kW
C4
0.1 mF
PWM-
INC13
0.1 mF
R18
7.5 kW
R14
4.99 kW
C5
0.1 mF
PWM+
IN+
C14
0.1 mF
R17
7.5 kW
Figure 8. First-Order Input Filter
The first-order filter in Figure 8 contains one pole with a slope of –20 dB. Figure 9 shows the frequency
response of the first-order filter.
Figure 9. First-Order Frequency Response
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3.5.1.3
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Second-Order Filter, Differential
For data sample rates less than 20 kHz, a second-order filter is recommended. A differential input signal is
recommended for use with a second-order filter because of the longer settling time; however, if a singleended signal is used, see the Second-Order Filter, Single-Ended section. Figure 10 shows the differential,
second-order filter that is the default filter configuration for the EVM. The PWM input filter is optimized for
a 3.3-V differential PWM input signal (–1- dB attenuation); remove R17 and R18 when applying a 1.8-V
input signal.
R6
3.3 kW
R13
3.3 kW
C4
0.1 mF
PWM-
INC8
0.047 mF
R7
3.3 kW
C13
0.047 mF
R18
2.7 kW
R14
3.3 kW
C5
0.1 mF
PWM+
IN+
C9
0.047 mF
C14
0.047 mF
R17
2.7 kW
Figure 10. Second-Order Input Filter
The second-order filter in Figure 10 contains two poles resulting in a slope of –40 dB. Figure 11 shows the
frequency response of the second-order filter.
Figure 11. Second-Order Filter Frequency Response
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3.5.1.4
Second-Order Filter, Single-Ended
Second-order filters take longer to settle than first-order filters. With differential inputs, the inverting and
noninverting inputs settle at the same time. With a single-ended input, they do not. This characteristic is
seen in the waveforms (refer to Figure 12 and Figure 13).
Figure 12. Second-Order, Single-Ended Filter
Figure 13. Second-Order, Differential Filter
To avoid this issue, a dummy filter may be connected to the unused input; the filter input should then be
tied to the DRV8662 enable (EN) signal through a resistor divider, as seen in Figure 14. When the
DRV8662 is enabled, the enable (EN) signal charges this dummy filter.
EN
R9
6.5 kW
R6
0W
R13
3.3 kW
C4
0.1 mF
IN-
R21
6.5 kW
C8
0.047 mF
R7
3.3 kW
C13
0.047 mF
R18
2.7 kW
R14
3.3 kW
C5
0.1 mF
PWM+
IN+
C9
0.047 mF
C14
0.047 mF
R17
2.7 kW
Figure 14. Single-Ended Input with Dummy Filter
SLOU319B – August 2011 – Revised March 2016
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General Operation
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The dummy filter shown in Figure 14 has the same settling time as the active filter; therefore, the offset is
cancelled and the issue is avoided.
Figure 15. Dummy Filter Waveform
3.5.2
Remove Filter for Analog Input
If the input signal is an analog waveform, as opposed to a PWM, then an input filter may not be
necessary. Before removing the filter, ensure that a simple RC filter is not needed to remove any artifacts
from the digital-to-analog converter (DAC) output or other input source. Follow these instructions to
remove the input filter completely.
1. Replace resistors R6, R7, R13, and R14 with 0-Ω resistors.
2. Remove resistors R17 and R18.
3. Remove capacitors C8, C9, C13, and C14. Do not remove ac coupling capacitors C4 and C5.
3.6
Output
The DRV8662 is capable of driving high-voltage piezo loads. When connecting a load, ensure that the
voltage rating of the piezo load is equal to or greater than the maximum output voltage set by the
feedback resistors.
3.6.1
Piezo Actuator Selection
There are several key specifications to consider when choosing a piezo actuator for haptics, including
size, blocking force, and displacement. However, the key electrical specifications are voltage rating and
capacitance. At the maximum frequency of 500 Hz, the DRV8662 is optimized to drive up to 50 nF at 200
VPP, which is the highest voltage swing capability. It is also capable of driving larger capacitances if the
programmed boost voltage is lower or if the user limits the input to lower frequencies. (such as 300 Hz).
Table 7 gives a list of recommended piezo actuators.
Table 7. Piezo Actuator Selection
Manufacturer
4
Part Number
Capacitance (nF)
Voltage Rating
(VPP)
Dimensions (mm)
AAC
MLB3503-G
50
200
35 x 3 x 0.96
AAC
MLB3503B-G
180
100
35 x 3 x 1
AAC
MLB3503C-G
670
48
35 x 3 x 1
Reference
This section includes the DRV8662EVM schematic, PCB layout, and bill of materials.
14
DRV8662 Piezo Haptics Driver Evaluation Module
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4.1
Schematic
Vbat
VBAT
3.6V
POWER
SUPPLY
Green
6A/125V
EXTIN
0.0
0402
C7
C10
100ufd/6.3V
TCT-TANT1206
10ufd/16V
0805
C11
1.0ufd/6.3V
0402
TLV70033DCK
GND
SC70-DCK5
3.3V/200mA
GND
GND
+3.3V
U3
R22
+
GND
GND
EN
PWM-
R9
PWM+
R6
PWM-
3.30K
0402
DNP
0402
C8
R21
DNP
0402
SpyBiWire
JP3
R10
GND
JP2
9.76K
0402
P2.1
P2.0
P3.2
P2.2
P3.3
P2.4
P2.3
P3.4
P3.5
GND
0.047ufd/16V
0402
C9
C5
IN+
3.30K
0402
C14
TRIG
0.1ufd/16V
0402
R17
0.047ufd/16V
0402
GND
R19
P1.5
U2
P1.6/SCL
GND
2.70K
0402
GND
NC
HIGH VOLTAGE WARNING
FOR VOLTAGE POTENTIALS OF
50V OR GREATER
GAIN1
0.0
0402
P1.2
P1.0
DVSS
R16
P1.3
DVCC
AVCC
P2.7
P2.6
SBWTCK
AVSS
SBWTDIO
EN
0.0
0402
P1.4
QFN32-RHB
MSP430G2553RHB
P1.7/SDA
10K
0402
NC
P3.1
P3.7
R20
2.70K
0402
GND
P3.2
P3.6
+3.3V
R18
GND
0.047ufd/16V
0402
P2.5
0.1ufd/16V
0402
R14
3.30K
0402
SBWTCK
C13
GND
R7
PWM+
SBWTDIO
IN-
3.30K
0402
0.047ufd/16V
0402
+3.3V
SBW
C4
R13
R15
P1.1
GAIN0
R3
0.0
0402
C15
C3
7.50K
0402
GND
GND
0.1ufd/6.3V
0402
Green
0603
GND
GND
JP1
0.1ufd/6.3V
0402
R23
R24
511
0402
511
0402
511
0402
QFN20-RGP
DRV8662RGP
0.1ufd/16V
0402
Orange
GND
GAIN1_ FET
R4
R5
R1
R2
20.0K
0402
41.2K
0402
768K
0402
35.7K
0402
D
GND
Vbat
G
C1
S
SDA
VFB Low-side
GAIN1 GAIN0 Resistance
+3.3V
C18
U2
PowerPad
GND
Black
0.1ufd/6.3V
0402
GND
GND
GND
2
1
VBST
0
35.7 kOhms
30V
0
1
19.127 kOhms
54V
1
0
12.819 kOhms
80V
1
1
9.777 kOhms
105V
4.7uH/1.3A
LPS4018
0.1ufd/25V
0603
D
0
C2
GND
0.1ufd/250V
1206
L1
GND
GAIN0_FET
SSOP8-DCT
Green
6A/125V
OUT+
GND
Q1
U4
B1
VCCB
GND
OUT
U1
GND
GND
OUTGND
Orange
Vbat
B2
GND
A2
VCAA
OE
A1
GND
R8
TXS0102DCT
SDA-IN
Green
0603
GND
SCL
SCL-IN
0.1ufd/16V
0402
GND
+3.3V
I2C
Green
0603
GAIN0
C6
C12
C17
0.1ufd/6.3V
0402
GAIN1
ACTIVE
+3.3V
GND
GND
U1
QFN20-RGP
PowerPad
G
S
SC70-6
60V 115mA
GND
GND
QFN32-RHB
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Reference
4.2
www.ti.com
PCB Layout
Figure 16. EVM Top X-Ray
16
DRV8662 Piezo Haptics Driver Evaluation Module
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Figure 17. EVM Top Layer
Figure 18. EVM Layer 2
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Reference
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Figure 19. EVM Layer 3
Figure 20. EVM Bottom Layer
18
DRV8662 Piezo Haptics Driver Evaluation Module
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4.3
Bill Of Materials
SEMICONDUCTORS
ITEM
MANU PART NUM
REF DESIGNATORS
DESCRIPTION
MANUFACTURER
1
2N7002DW
Q1
N CHANNEL FET ENHANCEMENT MODE 60V 115mA
SC70-6 ROHS
FAIRCHILD
2
DRV8662RGP
U1
PIEZO HAPTIC DRIVER W/INTEGRATED DC-DC CONV
QFN20-RGP ROHS
TEXAS INSTRUMENTS
3
TLV70033DCKT
U3
LDO VOLTAGE REGULATOR 3.3V 200mA LOW-IQ SC70DCK5 ROHS
TEXAS INSTRUMENTS
4
TXS0102DCTR
U4
2-BIT BIDIR LEVEL TRANSLATOR SSOP8-DCT ROHS
TEXAS INSTRUMENTS
5
MSP430G2553RHB
U2
MIXED SIGNAL MICRO 16KB FLASH 512B RAM QFN32RHB ROHS
TEXAS INSTRUMENTS
6
LTST-C190KGKT
GAIN0, GAIN1, ACTIVE
LED, GREEN, 2.0V SMD0805603 ROHS
LITE-ON INC.
CAPACITORS
7
C1005X5R0J104K
C12, C15, C17, C18
CAP SMD0402 CERM 0.1UFD 6.3V 10% X5R ROHS
TDK CORP
8
GRM155R71C104KA88D
C3, C4, C5, C6
CAP SMD0402 CERM 0.1UFD 16V X7R 10% ROHS
MURATA
9
06033D104KAT2A
C1
CAP SMD0603 CERM 0.1UFD 25V 10% X5R ROHS
AVX
10
0805YD106KAT2A
C10
CAP SMD0805 CERM 10UFD 16V X5R 10% ROHS
AVX
11
C3216X7R2E104K
C2
CAP SMD1206 CERM 0.1UFD 250V 10% X7R ROHS
TDK
12
GRM155R60J105KE19D
C11
CAP SMD0402 CERM 1.0UFD 6.3V X5R 10% ROHS
MURATA
13
EMK105B7473KV-F
C8, C9, C13, C14
CAP SMD0402 CERM 0.047UFD 16V 10% X7R ROHS
TAIYO YUDEN
14
TCTAL0J107M8R
C7
CAP TANT1206 100UFD 6.3V 20% TCT SERIES ROHS
ROHM
RESISTORS
15
ERJ-2RKF9761X
R10
RESISTOR SMD0402 THICK FILM 9.76K OHMS 1/10W 1%
ROHS
PANASONIC
16
RC0402FR-07768KL
R1
RESISTOR SMD0402 THICK FILM 768K OHM 1% 1/16W
ROHS
YAGEO
17
CRCW040235K7FKED
R2
RESISTOR SMD0402 35.7K OHMS 1% 1/16W ROHS
VISHAY/DALE
18
RC0402FR-077K5L
R3
RESISTOR SMD0402 THICK FILM 7.50K OHM 1% 1/16W
ROHS
YAGEO
19
RMCF0402ZT0R00
R15, R16, R19, R22
ZERO OHM JUMPER SMT 0402 0 OHM 1/16W,5% ROHS
STACKPOLE ELECTRONICS
20
CRCW040210K0JNED
R20
RESISTOR SMD0402 10K OHMS 5% THICK FILM 1/16W
ROHS
VISHAY
21
RC0402FR-072K7L
R17, R18
RESISTOR SMD0402 THICK FILM 2.70K OHMS 1% 1/16W
ROHS
YAGEO
22
RC0402FR-07511RL
R8, R23, R24
RESISTOR SMD0402 THICK FILM 511 OHMS 1% 1/16W
ROHS
YAGEO
23
RC0402FR-073K3L
R6, R7, R13, R14
RESISTOR SMD0402 THICK FILM 3.30K OHM 1% 1/16W
ROHS
YAGEO
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Reference
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SEMICONDUCTORS
ITEM
MANU PART NUM
REF DESIGNATORS
DESCRIPTION
MANUFACTURER
24
CRCW040220K0FKED
R4
RESISTOR SMT 0402 1% 1/16W 20.0K ROHS
VISHAY
25
RMCF0402FT41K2
R5
RESISTOR SMD0402 41.2K OHMS 1% 1/16W ROHS
STACKPOLE ELECTRONICS
INDUCTORS
26
LPS4018-472MLB
L1
SHIELDED POWER INDUCTOR 4.7uH,ROHS
COIL CRAFT
HEADERS, JACKS, AND SHUNTS
27
LPPB061NGCN-RC
SBW
HEADER THRU FEMALE 1X6-RA 50LS GOLD ROHS
SULLINS
28
PBC02SAAN
JP1, JP2, JP3, EXTIN
HEADER THRU MALE 2 PIN 100LS GOLD ROHS
SULLINS
29
PBC03SAAN
I2C
HEADER THRU MALE 3 PIN 100LS GOLD ROHS
SULLINS
30
1725656
OUT, VBAT
TERMINAL BLOCK MPT COMBICON 2PIN 6A/125V
GREEN 100LS ROHS
PHOENIX CONTACT
–
SPN02SYBN-RC
Place on JP1, JP2, JP3
CONN SHUNT 2MM OPEN TOP 2PS GOLD
SULLINS
TEST POINTS AND SWITCHES
31
5001
GND
PC TESTPOINT, BLACK, ROHS
KEYSTONE ELECTRONICS
32
5003
OUT+, OUT–
PC TESTPOINT, ORANGE, ROHS
KEYSTONE ELECTRONICS
33
TL1015AF160QG
TRIG
SWITCH, MOM, 160G SMT 4X3MM ROHS
E-SWITCH
34
R0402_DNP
R9, R21
R0402_DNP
VISHAY
–
SJ61A1
NA
RUBBER BUMPONS CYLINDRICAL 312x200 BLACK
3M
20
DRV8662 Piezo Haptics Driver Evaluation Module
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Related Documentation From Texas Instruments
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5
Related Documentation From Texas Instruments
All
•
•
•
documents are available for download from the TI website at www.ti.com.
DRV8662 Product data sheet. Literature number SLOS737.
Using the USCI I2C Master. Application report. Literature number SLAA382.
Using the USCI I2C Slave. Application report. Literature number SLAA383.
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (December, 2012) to B Revision .......................................................................................... Page
•
•
•
Removed the following sentence – "The DRV8662EVM kit includes a JTAG-to-Spy-Bi-Wire adapter for connecting the
JTAG interface to the DRV8662EVM Spy-Bi-Wire connector. " .................................................................... 7
Deleted ", and the DRV8662EVM kit includes a JTAG-to-Spy-Bi-Wire adapter for connecting the JTAG interface to the
DRV8662EVM Spy-Bi-Wire connector" ................................................................................................ 9
The MSP-JTAG2SBW JTAG to Spy-Bi-Wire adapter is no longer included in the EVM kit. .................................... 9
SLOU319B – August 2011 – Revised March 2016
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Revision History
21
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
SPACER
SPACER
SPACER
SPACER
SPACER
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
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Applications
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